US20200399089A1 - Tape attaching method - Google Patents
Tape attaching method Download PDFInfo
- Publication number
- US20200399089A1 US20200399089A1 US16/898,553 US202016898553A US2020399089A1 US 20200399089 A1 US20200399089 A1 US 20200399089A1 US 202016898553 A US202016898553 A US 202016898553A US 2020399089 A1 US2020399089 A1 US 2020399089A1
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- US
- United States
- Prior art keywords
- workpiece
- adhesive tape
- gas
- tape
- attaching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000002390 adhesive tape Substances 0.000 claims abstract description 157
- 239000012466 permeate Substances 0.000 claims abstract description 16
- 239000007789 gas Substances 0.000 claims description 88
- 239000001307 helium Substances 0.000 claims description 9
- 229910052734 helium Inorganic materials 0.000 claims description 9
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 9
- 238000012545 processing Methods 0.000 description 20
- 238000010438 heat treatment Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
- B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
- Y10T156/1057—Subsequent to assembly of laminae
Definitions
- the present invention relates to a tape attaching method of attaching an adhesive tape to a workpiece.
- a wafer having respective devices formed in a plurality of regions demarcated by a plurality of division lines (streets). Such wafer is divided along the plurality of division lines into individual devices to obtain a plurality of device chips.
- the wafer is subjected to various processing by use of a processing apparatus. Examples of processing a wafer include grinding of grinding a wafer with a grinding apparatus to thin the wafer, cutting of cutting a wafer with a cutting apparatus to divide the wafer, or the like. Also, when a wafer is processed with a processing apparatus, an adhesive tape is attached to the wafer with a view to enhancing wafer handling, protecting a device formed in the wafer, or the like.
- Japanese Patent Laid-Open No. H6-177243 discloses a tape attaching apparatus including a holding table for holding a wafer thereon and a movable roller for attaching an adhesive tape to the wafer.
- This tape attaching apparatus causes the movable roller to be rotated about its axis from one end of the wafer to the other end of the wafer in a state in which the adhesive tape is arranged on the wafer held on the holding table and to press the adhesive tape toward the wafer. Accordingly, the adhesive tape is automatically attached to the wafer.
- fine dense devices such as devices configured through micro electro mechanical systems (MEMS) technology may be formed.
- MEMS micro electro mechanical systems
- a device may be damaged due to a large pressing force applied by the movable roller. Accordingly, depending on a structure, a characteristic, or the like of a device formed in a wafer, there is demanded a method of attaching an adhesive tape to a wafer in such a manner that a load is not applied to the wafer as much as possible.
- a technique of attaching an adhesive tape to a wafer by arranging the wafer onto the adhesive tape which is supported in a flat state may be used in some cases.
- a wafer is not pressed excessively, and accordingly, damages or the like of a device formed in the wafer are less likely to occur.
- the present invention has been made in view of such a problem, and it is therefore an object of the present invention to provide a tape attaching method in which bubbles remaining between an adhesive tape and a workpiece typified by a wafer formed with devices can be removed easily.
- a tape attaching method of attaching an adhesive tape to a workpiece including a tape attaching step of attaching the adhesive tape to the workpiece in gas having a smaller molecular weight than an average molecular weight of the atmosphere, and a gas permeating step of causing the gas remaining between the workpiece and the adhesive tape to permeate the adhesive tape to thereby be removed, after the tape attaching step is carried out.
- the adhesive tape may be heated.
- a pressure may be applied to one of or both the workpiece and the adhesive tape in a direction in which the workpiece and the adhesive tape come in close contact with each other.
- the gas may be helium.
- the tape attaching method includes a tape attaching step of attaching the adhesive tape to the workpiece in gas having a smaller molecular weight than the average molecular weight of the atmosphere, and a gas permeating step of causing the gas remaining between the workpiece and the adhesive tape to permeate the adhesive tape to thereby be removed.
- the gas entering between the workpiece and the adhesive tape is gas having a smaller molecular weight than the average molecular weight of the atmosphere, the gas is likely to permeate the adhesive tape. Accordingly, the bubbles remaining between the workpiece and the adhesive tape are likely to be easily removed.
- FIG. 1 is a perspective view illustrating a workpiece
- FIG. 2A is a perspective view illustrating a manner in which an adhesive tape is attached to the workpiece of FIG. 1 ;
- FIG. 3A is a cross-sectional view illustrating a tape attaching apparatus used in a tape attaching method according to a preferred embodiment of the present invention
- FIG. 3B is a cross-sectional view illustrating the tape attaching apparatus in a state in which the adhesive tape is attached to the workpiece in a tape attaching step in the tape attaching method according to the preferred embodiment of the present invention
- FIG. 4A is a partial enlarged cross-sectional view illustrating the workpiece attached to the adhesive tape and the adhesive tape after the tape attaching step is carried out;
- FIG. 4B is a partial enlarged cross-sectional view illustrating the workpiece attached to the adhesive tape and the adhesive tape after a gas permeating step is carried out;
- FIG. 6 is a cross-sectional view illustrating the workpiece in such a state as to be held on a holding table.
- the workpiece 11 may be formed of a material such as a semiconductor other than silicon (gallium arsenide (GaAs), indium phosphide (InP), gallium nitride (GaN), silicon carbide (SiC), or the like), glass, ceramic, resin, or metal.
- the devices 15 are not limited in kind, number, shape, structure, size, and layout, for example.
- the device 15 may be an integrated circuit (IC), a large scale integration (LSI), or the like.
- the workpiece 11 may not have any of the devices 15 formed therein.
- each device chip includes each of the devices 15 .
- a cutting apparatus which cuts the workpiece 11 with an annular blade
- a laser processing apparatus which processes the workpiece 11 with irradiation of a laser beam, for example.
- the workpiece 11 before being divided may be thinned, in some cases.
- a grinding apparatus which grinds the workpiece 11 with grindstones
- a polishing apparatus which polishes the workpiece 11 with a polishing pad, for example.
- an adhesive tape is attached to the workpiece 11 .
- the workpiece 11 may be supported by an annular frame through the adhesive tape.
- FIG. 2A is a perspective view illustrating a manner in which an adhesive tape 17 is attached to the workpiece 11 .
- the circular adhesive tape 17 having a diameter larger than the workpiece 11 is attached to the workpiece 11 , for example.
- the adhesive tape 17 is formed of a gas permeable polymer film or the like.
- An annular frame 19 has a circular opening 19 a with a diameter larger than the workpiece 11 in a central portion thereof, and the annular frame 19 is attached to a peripheral portion of the adhesive tape 17 . Then, the workpiece 11 is arranged onto the adhesive tape 17 in such a way that the back surface 11 b of the workpiece 11 comes in contact with the adhesive tape 17 which is exposed inside the opening 19 a, for example.
- FIG. 2B is a cross-sectional view illustrating the workpiece 11 to which the adhesive tape 17 is attached.
- the adhesive tape 17 When the adhesive tape 17 is attached to the workpiece 11 , gas is enclosed between the workpiece 11 and the adhesive tape 17 , and bubbles may be formed therebetween.
- the air When attachment of the adhesive tape 17 is carried out in the atmosphere, the air enters a gap between the workpiece 11 and the adhesive tape 17 , and after the adhesive tape 17 is attached to the workpiece 11 , bubbles containing the air may remain between the workpiece 11 and the adhesive tape 17 . These remaining bubbles prevent appropriate adhesion between the workpiece 11 and the adhesive tape 17 , causing occurrence of processing defects upon processing the workpiece 11 .
- Removal of the bubbles is carried out, for example, by heating the adhesive tape 17 to increase gas permeability of the gas contained in the bubbles with respect to the adhesive tape 17 . Accordingly, the gas is more likely to permeate the adhesive tape 17 , and as a result, the gas easily goes out from between the workpiece 11 and the adhesive tape 17 . It is to be noted that, however, in a case in which the gas contained in the bubbles is air, even if the heating process described above is carried out, the bubbles may not be sufficiently removed, or it may take a long period of time to remove the bubbles.
- the adhesive tape 17 is attached to the workpiece 11 in the gas having a smaller molecular weight than the average molecular weight of the atmosphere.
- the average molecular weight of the atmosphere corresponds to an average value of the molecular weight of gas contained in the atmosphere (air) on the ground.
- the gas having a smaller molecular weight than the average molecular weight of the atmosphere is more likely to permeate the adhesive tape 17 than the air. Accordingly, even if this gas enters the gap between the workpiece 11 and the adhesive tape 17 and the bubbles are formed therein upon attachment of the adhesive tape 17 , these bubbles are likely to permeate the adhesive tape 17 going out from the gap between the workpiece 11 and the adhesive tape 17 . As a result, the gas remaining between the workpiece 11 and the adhesive tape 17 is easily removed.
- Examples of the gas having a smaller molecular weight than the average molecular weight of the atmosphere include hydrogen, helium (monatomic molecule), nitrogen, neon (monatomic molecule), methane, ammonia, hydrogen fluoride, acetylene, carbon monoxide, ethylene, or the like.
- helium has a small molecular weight (atomic weight) and high safety, helium is preferable as gas (gaseous atmosphere) to be used in attachment between the workpiece 11 and the adhesive tape 17 .
- FIG. 3A is a cross-sectional view illustrating a tape attaching apparatus 2 , and this tape attaching apparatus 2 is used to automatically carry out a tape attaching method according to the preferred embodiment of the present invention.
- the tape attaching apparatus 2 includes a cylindrical chamber 4 capable of accommodating the workpiece 11 and the adhesive tape 17 attached to the workpiece 11 .
- the chamber 4 includes a cylindrical main body portion 6 which is opened on an upper side thereof, and a lid portion 8 which opens/closes the opening of the main body portion 6 .
- Inside the chamber 4 there are formed a tape holding portion 4 a in which the adhesive tape 17 is held, and a workpiece holding portion 4 b on which the workpiece 11 is held.
- the tape holding portion 4 a is a cylindrical space formed inside the chamber 4 .
- the workpiece holding portion 4 b is a cylindrical space (recess) formed downward from a bottom of the tape holding portion 4 a. Note that the workpiece holding portion 4 b is smaller in diameter than the tape holding portion 4 a, and a T-shaped space in cross-sectional view is formed inside the chamber 4 .
- An annular frame supporting portion 10 is provided in the tape holding portion 4 a to support the annular frame 19 with the adhesive tape 17 being attached thereto.
- the frame supporting portion 10 includes a circular opening 10 a vertically extending in a central portion of the frame supporting portion 10 , and the opening 10 a is arranged so as to overlap with the workpiece holding portion 4 b.
- a diameter of the opening 10 a is set substantially equal to the diameter of the opening 19 a of the annular frame 19 , for example.
- the workpiece holding portion 4 b has a holding table 12 holding the workpiece 11 provided therein.
- the holding table 12 is formed so as to have a diameter substantially equal to the diameter of the workpiece holding portion 4 b .
- the tape holding portion 4 a is connected to a gas supplying source 18 through a flow path 14 a formed in the main body portion 6 and a valve 16 a.
- the gas supplying source 18 supplies gas having a smaller molecular weight than the average molecular weight of the atmosphere to the tape holding portion 4 a through the valve 16 a and the flow path 14 a.
- the tape holding portion 4 a is connected to a valve 16 b through a flow path 14 b formed in the main body portion 6 . When the valve 16 b is opened, the tape holding portion 4 a is opened to the atmosphere.
- a lower region of the holding table 12 of the workpiece holding portion 4 b is connected to an air supplying source 20 through a flow path 14 c formed in the main body portion 6 and a valve 16 c.
- the air supplying source 20 supplies air to the workpiece holding portion 4 b through the valve 16 c and the flow path 14 c.
- the lower region of the holding table 12 of the workpiece holding portion 4 b is connected to a valve 16 d through a flow path 14 d formed in the main body portion 6 .
- the valve 16 d is opened, the workpiece holding portion 4 b is opened to the atmosphere.
- the tape holding portion 4 a and the lower region of the holding table 12 of the workpiece holding portion 4 b are separated from each other by the holding table 12 . Thus, communication of the gas between these two regions is blocked.
- the lid portion 8 is opened, and the workpiece 11 is held on the holding table 12 in such a way that a surface of the workpiece 11 to which the adhesive tape 17 is attached is exposed upward.
- the workpiece 11 is arranged onto the holding table 12 such that the front surface 11 a of the workpiece 11 faces the holding surface 12 a.
- the annular frame 19 with the adhesive tape 17 being attached thereto is supported on the frame supporting portion 10 .
- the annular frame 19 is supported such that a surface to which the adhesive tape 17 is not attached comes in contact with the frame supporting portion 10 .
- the workpiece 11 and the annular frame 19 are arranged such that a center of the workpiece 11 and a center of the opening 19 a of the annular frame 19 overlap with each other in plan view.
- the lid portion 8 is closed to hermetically seal the tape holding portion 4 a.
- the valves 16 a and 16 b are opened, and helium gas is supplied by a predetermined flow rate to the tape holding portion 4 a from the gas supplying source 18 , while the atmosphere remaining inside the tape holding portion 4 a is discharged through the flow path 14 b and the valve 16 b . Accordingly, the tape holding portion 4 a is filled with helium gas.
- the valve 16 d being closed, the valve 16 c is opened, so that air is supplied by a predetermined flow rate to the workpiece holding portion 4 b from the air supplying source 20 .
- FIG. 3B is a cross-sectional view illustrating the tape attaching apparatus 2 in a state in which the adhesive tape 17 is attached to the workpiece 11 in the tape attaching step in the tape attaching method according to the preferred embodiment of the present invention.
- valve 16 c is closed while the valve 16 d is opened, so that the workpiece holding portion 4 b is opened to the atmosphere. Accordingly, the pressure in the lower region of the holding table 12 of the workpiece holding portion 4 b decreases, so that the holding table 12 is lowered. At this time, the workpiece 11 is kept being attached to the adhesive tape 17 and held thereon.
- FIGS. 3A and 3B illustrate configuration examples in which the air supplying source 20 is connected to the workpiece holding portion 4 b
- the workpiece holding portion 4 b may be connected to the gas supplying source 18 through the flow path 14 c and the valve 16 c, for example.
- gas to be supplied through the gas supplying source 18 controls vertical movement of the holding table 12 , so that the air supplying source 20 can be omitted.
- the adhesive tape 17 is attached to the workpiece 11 in the gas having a smaller molecular weight than the average molecular weight of the atmosphere.
- FIG. 4A is a partial enlarged cross-sectional view illustrating the workpiece 11 attached to the adhesive tape 17 and the adhesive tape 17 after the tape attaching step is carried out.
- the adhesive tape 17 includes a base sheet 17 a in a circular film shape, and an adhesive layer (sticking layer) 17 b formed on the base sheet 17 a.
- the base sheet 17 a is formed of a resin such as polyolefin, polyvinyl chloride, or polyethylene terephthalate, for example.
- the adhesive layer 17 b is formed of an ultraviolet curable resin that can be cured by applying ultraviolet light thereto, for example.
- the base sheet 17 a and the adhesive layer 17 b are each formed of a permeable material through which gas having a smaller molecular weight than the average molecular weight of the atmosphere can pass.
- the air enters a gap between the workpiece 11 and the adhesive tape 17 , and bubbles 21 may be formed between the workpiece 11 and the adhesive layer 17 b of the adhesive tape 17 , in some cases.
- attachment of the workpiece 11 and the adhesive tape 17 is carried out in the gas having a smaller molecular weight than the average molecular weight of the atmosphere.
- the gas contained in the bubbles 21 is gas having a smaller molecular weight than the average molecular weight of the atmosphere.
- this gas is more likely to permeate the adhesive tape 17 than the air, the gas is easily removed from between the workpiece 11 and the adhesive tape 17 .
- FIG. 4 B is a partial enlarged cross-sectional view illustrating the workpiece 11 attached to the adhesive tape 17 and the adhesive tape 17 after the gas permeating step is carried out.
- FIG. 5 is a cross-sectional view illustrating a manner in which the adhesive tape 17 is heated.
- Heating the adhesive tape 17 is carried out by use of a hot plate 30 , for example.
- the hot plate 30 is a plate which generates heat due to supply of electric power, and its upper surface constitutes a holding surface 30 a for holding the adhesive tape 17 .
- a heating temperature of the adhesive tape 17 can be set appropriately in a range not causing degradation of the adhesive tape 17 depending on a material of the adhesive tape 17 .
- heating of the adhesive tape 17 may be carried out by use of an oven or a heater.
- a pressure may be applied to one of or both the workpiece 11 and the adhesive tape 17 in a direction in which the workpiece 11 and the adhesive tape 17 come in close contact with each other.
- the workpiece 11 is pressed toward the adhesive tape 17 , and the bubbles 21 may be pressed into the adhesive tape 17 .
- a strength to press the workpiece 11 is set in a range not causing any damages or the like of the devices 15 .
- FIG. 6 is a cross-sectional view illustrating the workpiece 11 in such a state as to be held on a holding table 40 .
- the holding table 40 applies a pressure by effecting a suction force on the workpiece 11 .
- the holding table 40 is formed into a cylindrical shape larger in diameter than the workpiece 11 , for example, and its upper surface constitutes a holding surface 40 a for holding the workpiece 11 .
- the holding table 40 includes a porous member 42 which is formed of a porous ceramic material or the like on the holding surface 40 a side.
- the porous member 42 is formed into a disc shape smaller in diameter than the holding table 40 , for example, and is fit in the holding surface 40 a of the holding table 40 .
- an upper surface of the porous member 42 constitutes part of the holding surface 40 a.
- the porous member 42 is connected to a suction source 46 such as an ejector through a flow path 40 b formed inside the holding table 40 and a valve 44 .
- a plurality of clamps 48 for gripping the annular frame 19 which supports the workpiece 11 to be fixed thereto are provided in the periphery of the holding table 40 .
- the workpiece 11 is arranged on the holding table 40 in such a way that the surface of the workpiece 11 to which the adhesive tape 17 is attached (the back surface 11 b side) faces the holding surface 40 a.
- the annular frame 19 is fixed with the plurality of clamps 48 .
- a negative pressure from the suction source 46 is applied to the holding surface 40 a through the valve 44 , the flow path 40 b, and the porous member 42 .
- a suction force is applied to the workpiece 11 through the adhesive tape 17 , and accordingly, a pressure toward the adhesive tape 17 side (holding surface 40 a side) is applied to the workpiece 11 .
- the bubbles 21 see FIG.
- FIG. 7 is a cross-sectional view illustrating the workpiece 11 in such a state as to be held on the holding table 40 provided with a heater 50 .
- the heater 50 is formed in a disc shape having a diameter equal to or larger than the diameter of the workpiece 11 , and is embedded inside the holding table 40 . With the workpiece 11 being held under suction on the holding table 40 , electric power is supplied to the heater 50 , and the heater 50 is caused to generate heat, so that the adhesive tape 17 is heated. In this manner, both applying of a pressure (suction force) to the workpiece 11 and heating of the adhesive tape 17 are carried out, thereby removing the bubbles 21 rapidly.
- a pressure suction force
- processing with a processing apparatus or cleaning with a cleaning apparatus are carried out on the workpiece 11 held on the annular frame 19 through the adhesive tape 17 .
- details of processing on the workpiece 11 are not limited.
- the workpiece 11 is processed by a cutting apparatus which cuts the workpiece 11 with an annular blade, by a grinding apparatus which grinds the workpiece with grindstones, by a polishing apparatus which polishes the workpiece 11 with a polishing pad, by a laser processing apparatus which processes the workpiece 11 by irradiation of a laser beam, or the like.
- the minute bubbles 21 may remain between the workpiece 11 and the adhesive tape 17 in a range not affecting processing or cleaning of the workpiece 11 .
- gas is removed from between the workpiece 11 and the adhesive tape 17 and the bubbles 21 are decreased to such an extent that there is no bad influence on processing or cleaning of the workpiece 11 .
- the tape attaching step is preferably carried out under gaseous atmosphere only containing gas having a smaller molecular weight than the average molecular weight of the atmosphere (first gas).
- the adhesive tape 17 may be attached to the workpiece 11 under the gaseous atmosphere in which a small amount of another gas (second gas) is mixed into the first gas, in some cases.
- the bubbles 21 may contain the first gas and the second gas.
- the second gas contained in the bubbles 21 is in small amounts, the first gas is removed properly in the gas permeating step, so that the size of each of the bubbles 21 can be efficiently reduced.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Textile Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
- The present invention relates to a tape attaching method of attaching an adhesive tape to a workpiece.
- In a manufacturing process for device chips, there is used a wafer having respective devices formed in a plurality of regions demarcated by a plurality of division lines (streets). Such wafer is divided along the plurality of division lines into individual devices to obtain a plurality of device chips. The wafer is subjected to various processing by use of a processing apparatus. Examples of processing a wafer include grinding of grinding a wafer with a grinding apparatus to thin the wafer, cutting of cutting a wafer with a cutting apparatus to divide the wafer, or the like. Also, when a wafer is processed with a processing apparatus, an adhesive tape is attached to the wafer with a view to enhancing wafer handling, protecting a device formed in the wafer, or the like.
- In recent years, a technique of automatically attaching an adhesive tape to a wafer has been widely used. For example, Japanese Patent Laid-Open No. H6-177243 discloses a tape attaching apparatus including a holding table for holding a wafer thereon and a movable roller for attaching an adhesive tape to the wafer. This tape attaching apparatus causes the movable roller to be rotated about its axis from one end of the wafer to the other end of the wafer in a state in which the adhesive tape is arranged on the wafer held on the holding table and to press the adhesive tape toward the wafer. Accordingly, the adhesive tape is automatically attached to the wafer.
- In a wafer, fine dense devices such as devices configured through micro electro mechanical systems (MEMS) technology may be formed. In a case where the above-described tape attaching apparatus is used in attaching an adhesive tape to such a wafer formed with the devices described above, a device may be damaged due to a large pressing force applied by the movable roller. Accordingly, depending on a structure, a characteristic, or the like of a device formed in a wafer, there is demanded a method of attaching an adhesive tape to a wafer in such a manner that a load is not applied to the wafer as much as possible. In view of this, a technique of attaching an adhesive tape to a wafer by arranging the wafer onto the adhesive tape which is supported in a flat state may be used in some cases. In this technique, a wafer is not pressed excessively, and accordingly, damages or the like of a device formed in the wafer are less likely to occur.
- However, when a method of arranging a wafer on an adhesive tape is used, gas is enclosed between the wafer and the adhesive tape, resulting in generation of bubbles, in some cases. The remaining bubbles prevent appropriate adhesion between the wafer and the adhesive tape, causing occurrence of processing defects upon processing the wafer. For example, the bubbles prevent the wafer from being held in a flat state, and as a result, it may be difficult to grind the entire wafer uniformly upon subjecting grinding processing on the wafer, in some cases. Also, when the wafer is cut and divided into a plurality of device chips, adhesion between each device chip and the adhesive tape is prevented due to the bubbles, resulting in scattering of the chip, in some cases.
- The present invention has been made in view of such a problem, and it is therefore an object of the present invention to provide a tape attaching method in which bubbles remaining between an adhesive tape and a workpiece typified by a wafer formed with devices can be removed easily.
- In accordance with an aspect of the present invention, there is provided a tape attaching method of attaching an adhesive tape to a workpiece, including a tape attaching step of attaching the adhesive tape to the workpiece in gas having a smaller molecular weight than an average molecular weight of the atmosphere, and a gas permeating step of causing the gas remaining between the workpiece and the adhesive tape to permeate the adhesive tape to thereby be removed, after the tape attaching step is carried out.
- Preferably, in the gas permeating step, the adhesive tape may be heated. Preferably, in the gas permeating step, a pressure may be applied to one of or both the workpiece and the adhesive tape in a direction in which the workpiece and the adhesive tape come in close contact with each other. Still preferably, the gas may be helium.
- The tape attaching method according to a preferred embodiment of the present invention includes a tape attaching step of attaching the adhesive tape to the workpiece in gas having a smaller molecular weight than the average molecular weight of the atmosphere, and a gas permeating step of causing the gas remaining between the workpiece and the adhesive tape to permeate the adhesive tape to thereby be removed. In this tape attaching method, since the gas entering between the workpiece and the adhesive tape is gas having a smaller molecular weight than the average molecular weight of the atmosphere, the gas is likely to permeate the adhesive tape. Accordingly, the bubbles remaining between the workpiece and the adhesive tape are likely to be easily removed.
- The above and other objects, features and advantages of the present invention and the manner of realizing them will become more apparent, and the invention itself will best be understood from a study of the following description and appended claims with reference to the attached drawings showing a preferred embodiment of the invention.
-
FIG. 1 is a perspective view illustrating a workpiece; -
FIG. 2A is a perspective view illustrating a manner in which an adhesive tape is attached to the workpiece ofFIG. 1 ; -
FIG. 2B is a cross-sectional view illustrating the workpiece to which the adhesive tape is attached; -
FIG. 3A is a cross-sectional view illustrating a tape attaching apparatus used in a tape attaching method according to a preferred embodiment of the present invention; -
FIG. 3B is a cross-sectional view illustrating the tape attaching apparatus in a state in which the adhesive tape is attached to the workpiece in a tape attaching step in the tape attaching method according to the preferred embodiment of the present invention; -
FIG. 4A is a partial enlarged cross-sectional view illustrating the workpiece attached to the adhesive tape and the adhesive tape after the tape attaching step is carried out; -
FIG. 4B is a partial enlarged cross-sectional view illustrating the workpiece attached to the adhesive tape and the adhesive tape after a gas permeating step is carried out; -
FIG. 5 is a cross-sectional view illustrating a manner in which the adhesive tape is heated; -
FIG. 6 is a cross-sectional view illustrating the workpiece in such a state as to be held on a holding table; and -
FIG. 7 is a cross-sectional view illustrating the workpiece in such a state as to be held on the holding table provided with a heater. - Hereinafter, a detailed description will be given regarding a preferred embodiment of the present invention with reference to the drawings. First, there will be described a configuration example of a workpiece to which an adhesive tape is attached in a tape attaching method according to the preferred embodiment of the present invention.
FIG. 1 is a perspective view illustrating aworkpiece 11. Theworkpiece 11 is a member (an object to be processed or an object to be cleaned) being subjected to processing, cleaning, or other processes in a state in which an adhesive tape is attached to theworkpiece 11. - The
workpiece 11 is a disc-shaped silicon wafer, for example, and has afront surface 11 a and aback surface 11 b. Theworkpiece 11 is demarcated into a plurality of regions by a plurality of division lines (streets) 13 which are arrayed in a grid pattern so as to cross each other, and each region on thefront surface 11 a side has adevice 15 including a MEMS device formed therein. In other words, theworkpiece 11 is a MEMS wafer including a plurality of MEMS devices. It is to be noted that, however, theworkpiece 11 is not limited in material, shape, structure, size, or the like. For example, theworkpiece 11 may be formed of a material such as a semiconductor other than silicon (gallium arsenide (GaAs), indium phosphide (InP), gallium nitride (GaN), silicon carbide (SiC), or the like), glass, ceramic, resin, or metal. In addition, thedevices 15 are not limited in kind, number, shape, structure, size, and layout, for example. For example, thedevice 15 may be an integrated circuit (IC), a large scale integration (LSI), or the like. Moreover, theworkpiece 11 may not have any of thedevices 15 formed therein. - When the
workpiece 11 is divided along thedivision lines 13, a plurality of device chips are obtained, and each device chip includes each of thedevices 15. Note that, in the case of dividing theworkpiece 11, used are a cutting apparatus which cuts theworkpiece 11 with an annular blade and a laser processing apparatus which processes theworkpiece 11 with irradiation of a laser beam, for example. In addition, with a view to thinning the device chips, theworkpiece 11 before being divided may be thinned, in some cases. In the case of thinning theworkpiece 11, used are a grinding apparatus which grinds theworkpiece 11 with grindstones and a polishing apparatus which polishes theworkpiece 11 with a polishing pad, for example. - When various types of processing apparatuses described above are used to process the
workpiece 11, with a view to enhancing a handling property of theworkpiece 11, protecting the devices 16 formed in theworkpiece 11, or the like, an adhesive tape is attached to theworkpiece 11. For example, in order to facilitate transfer and holding of theworkpiece 11, theworkpiece 11 may be supported by an annular frame through the adhesive tape. -
FIG. 2A is a perspective view illustrating a manner in which anadhesive tape 17 is attached to theworkpiece 11. The circularadhesive tape 17 having a diameter larger than theworkpiece 11 is attached to theworkpiece 11, for example. Note that theadhesive tape 17 is formed of a gas permeable polymer film or the like. Anannular frame 19 has acircular opening 19 a with a diameter larger than theworkpiece 11 in a central portion thereof, and theannular frame 19 is attached to a peripheral portion of theadhesive tape 17. Then, theworkpiece 11 is arranged onto theadhesive tape 17 in such a way that theback surface 11 b of theworkpiece 11 comes in contact with theadhesive tape 17 which is exposed inside the opening 19 a, for example. As a result, theadhesive tape 17 is attached to theback surface 11 b side of theworkpiece 11, and theworkpiece 11 is supported by theannular frame 19 through theadhesive tape 17.FIG. 2B is a cross-sectional view illustrating theworkpiece 11 to which theadhesive tape 17 is attached. - When the
adhesive tape 17 is attached to theworkpiece 11, gas is enclosed between the workpiece 11 and theadhesive tape 17, and bubbles may be formed therebetween. For example, when attachment of theadhesive tape 17 is carried out in the atmosphere, the air enters a gap between the workpiece 11 and theadhesive tape 17, and after theadhesive tape 17 is attached to theworkpiece 11, bubbles containing the air may remain between the workpiece 11 and theadhesive tape 17. These remaining bubbles prevent appropriate adhesion between the workpiece 11 and theadhesive tape 17, causing occurrence of processing defects upon processing theworkpiece 11. For example, there may be a case in which theworkpiece 11 is not held in a flat state due to the bubbles and it becomes difficult to grind theentire workpiece 11 uniformly in carrying out grinding processing on theworkpiece 11. Also, when theworkpiece 11 is cut to be divided into a plurality of device chips, adhesion between each device chip and theadhesive tape 17 is hindered by the bubbles, causing a risk of scattering of the chips. To cope with this problem, it is desirable to remove the bubbles remaining between the workpiece 11 and theadhesive tape 17. - Removal of the bubbles is carried out, for example, by heating the
adhesive tape 17 to increase gas permeability of the gas contained in the bubbles with respect to theadhesive tape 17. Accordingly, the gas is more likely to permeate theadhesive tape 17, and as a result, the gas easily goes out from between the workpiece 11 and theadhesive tape 17. It is to be noted that, however, in a case in which the gas contained in the bubbles is air, even if the heating process described above is carried out, the bubbles may not be sufficiently removed, or it may take a long period of time to remove the bubbles. - In view of this, in the preferred embodiment of the present invention, the
adhesive tape 17 is attached to theworkpiece 11 in the gas having a smaller molecular weight than the average molecular weight of the atmosphere. Note that the average molecular weight of the atmosphere corresponds to an average value of the molecular weight of gas contained in the atmosphere (air) on the ground. When theadhesive tape 17 is attached to theworkpiece 11 in this gas, in a case in which the bubbles remain between the workpiece 11 and theadhesive tape 17, the molecular weight of the gas contained in the bubbles becomes smaller than the average molecular weight of the atmosphere. - The gas having a smaller molecular weight than the average molecular weight of the atmosphere is more likely to permeate the
adhesive tape 17 than the air. Accordingly, even if this gas enters the gap between the workpiece 11 and theadhesive tape 17 and the bubbles are formed therein upon attachment of theadhesive tape 17, these bubbles are likely to permeate theadhesive tape 17 going out from the gap between the workpiece 11 and theadhesive tape 17. As a result, the gas remaining between the workpiece 11 and theadhesive tape 17 is easily removed. Examples of the gas having a smaller molecular weight than the average molecular weight of the atmosphere include hydrogen, helium (monatomic molecule), nitrogen, neon (monatomic molecule), methane, ammonia, hydrogen fluoride, acetylene, carbon monoxide, ethylene, or the like. In particular, since helium has a small molecular weight (atomic weight) and high safety, helium is preferable as gas (gaseous atmosphere) to be used in attachment between the workpiece 11 and theadhesive tape 17. - Note that the attachment of the
adhesive tape 17 to theworkpiece 11 may be carried out with hands or by use of a dedicated apparatus (tape attaching apparatus).FIG. 3A is a cross-sectional view illustrating atape attaching apparatus 2, and thistape attaching apparatus 2 is used to automatically carry out a tape attaching method according to the preferred embodiment of the present invention. - The
tape attaching apparatus 2 includes a cylindrical chamber 4 capable of accommodating theworkpiece 11 and theadhesive tape 17 attached to theworkpiece 11. The chamber 4 includes a cylindricalmain body portion 6 which is opened on an upper side thereof, and alid portion 8 which opens/closes the opening of themain body portion 6. Inside the chamber 4, there are formed atape holding portion 4 a in which theadhesive tape 17 is held, and aworkpiece holding portion 4 b on which theworkpiece 11 is held. Thetape holding portion 4 a is a cylindrical space formed inside the chamber 4. Also, theworkpiece holding portion 4 b is a cylindrical space (recess) formed downward from a bottom of thetape holding portion 4 a. Note that theworkpiece holding portion 4 b is smaller in diameter than thetape holding portion 4 a, and a T-shaped space in cross-sectional view is formed inside the chamber 4. - An annular
frame supporting portion 10 is provided in thetape holding portion 4 a to support theannular frame 19 with theadhesive tape 17 being attached thereto. Theframe supporting portion 10 includes acircular opening 10 a vertically extending in a central portion of theframe supporting portion 10, and theopening 10 a is arranged so as to overlap with theworkpiece holding portion 4 b. Note that a diameter of the opening 10 a is set substantially equal to the diameter of the opening 19 a of theannular frame 19, for example. In addition, theworkpiece holding portion 4 b has a holding table 12 holding theworkpiece 11 provided therein. The holding table 12 is formed so as to have a diameter substantially equal to the diameter of theworkpiece holding portion 4 b. The holding table 12 is accommodated in theworkpiece holding portion 4 b in such a state as to be movable in a vertical direction and supported by themain body portion 6 of the chamber 4. Note that a height of the holding table 12 is smaller than a height of theworkpiece holding portion 4 b, and a gap is secured on a lower side of the holding table 12. Also, an upper surface of the holding table 12 constitutes a holdingsurface 12 a for holding theworkpiece 11. - The
tape holding portion 4 a is connected to agas supplying source 18 through aflow path 14 a formed in themain body portion 6 and avalve 16 a. Thegas supplying source 18 supplies gas having a smaller molecular weight than the average molecular weight of the atmosphere to thetape holding portion 4 a through thevalve 16 a and theflow path 14 a. Also, thetape holding portion 4 a is connected to avalve 16 b through aflow path 14 b formed in themain body portion 6. When thevalve 16 b is opened, thetape holding portion 4 a is opened to the atmosphere. A lower region of the holding table 12 of theworkpiece holding portion 4 b is connected to anair supplying source 20 through aflow path 14 c formed in themain body portion 6 and avalve 16 c. Theair supplying source 20 supplies air to theworkpiece holding portion 4 b through thevalve 16 c and theflow path 14 c. In addition, the lower region of the holding table 12 of theworkpiece holding portion 4 b is connected to avalve 16 d through aflow path 14 d formed in themain body portion 6. When thevalve 16 d is opened, theworkpiece holding portion 4 b is opened to the atmosphere. Note that thetape holding portion 4 a and the lower region of the holding table 12 of theworkpiece holding portion 4 b are separated from each other by the holding table 12. Thus, communication of the gas between these two regions is blocked. - Next, an operational example of the
tape attaching apparatus 2 in a tape attaching step of attaching theadhesive tape 17 to theworkpiece 11 in the tape attaching method according to the preferred embodiment of the present invention will be described. Note that a case in which helium is supplied from thegas supplying source 18 will be described below by way of example. However, the gas to be supplied from the gas supplying source 18 (the gas having a smaller molecular weight than the average molecular weight of the atmosphere) can be changed appropriately. - First, the
lid portion 8 is opened, and theworkpiece 11 is held on the holding table 12 in such a way that a surface of theworkpiece 11 to which theadhesive tape 17 is attached is exposed upward. For example, in a case in which theadhesive tape 17 is attached to theback surface 11 b side of theworkpiece 11, theworkpiece 11 is arranged onto the holding table 12 such that thefront surface 11 a of theworkpiece 11 faces the holdingsurface 12 a. In addition, theannular frame 19 with theadhesive tape 17 being attached thereto is supported on theframe supporting portion 10. Theannular frame 19 is supported such that a surface to which theadhesive tape 17 is not attached comes in contact with theframe supporting portion 10. Note that theworkpiece 11 and theannular frame 19 are arranged such that a center of theworkpiece 11 and a center of the opening 19 a of theannular frame 19 overlap with each other in plan view. - Next, the
lid portion 8 is closed to hermetically seal thetape holding portion 4 a. Then, thevalves tape holding portion 4 a from thegas supplying source 18, while the atmosphere remaining inside thetape holding portion 4 a is discharged through theflow path 14 b and thevalve 16 b. Accordingly, thetape holding portion 4 a is filled with helium gas. Next, with thevalve 16 d being closed, thevalve 16 c is opened, so that air is supplied by a predetermined flow rate to theworkpiece holding portion 4 b from theair supplying source 20. Accordingly, a pressure in the lower region of the holding table 12 of theworkpiece holding portion 4 b increases, so that the holding table 12 is pushed upward. As a result, theworkpiece 11 moves toward theadhesive tape 17. Then, theback surface 11 b side of theworkpiece 11 and theadhesive tape 17 come in contact with each other under helium gas, and then, theadhesive tape 17 is attached to theworkpiece 11.FIG. 3B is a cross-sectional view illustrating thetape attaching apparatus 2 in a state in which theadhesive tape 17 is attached to theworkpiece 11 in the tape attaching step in the tape attaching method according to the preferred embodiment of the present invention. - Subsequently, the
valve 16 c is closed while thevalve 16 d is opened, so that theworkpiece holding portion 4 b is opened to the atmosphere. Accordingly, the pressure in the lower region of the holding table 12 of theworkpiece holding portion 4 b decreases, so that the holding table 12 is lowered. At this time, theworkpiece 11 is kept being attached to theadhesive tape 17 and held thereon. - Note that, although
FIGS. 3A and 3B illustrate configuration examples in which theair supplying source 20 is connected to theworkpiece holding portion 4 b, theworkpiece holding portion 4 b may be connected to thegas supplying source 18 through theflow path 14 c and thevalve 16 c, for example. In this case, gas to be supplied through thegas supplying source 18 controls vertical movement of the holding table 12, so that theair supplying source 20 can be omitted. - As described above, in the tape attaching step of the preferred embodiment of the present invention, the
adhesive tape 17 is attached to theworkpiece 11 in the gas having a smaller molecular weight than the average molecular weight of the atmosphere.FIG. 4A is a partial enlarged cross-sectional view illustrating theworkpiece 11 attached to theadhesive tape 17 and theadhesive tape 17 after the tape attaching step is carried out. For example, theadhesive tape 17 includes abase sheet 17 a in a circular film shape, and an adhesive layer (sticking layer) 17 b formed on thebase sheet 17 a. Thebase sheet 17 a is formed of a resin such as polyolefin, polyvinyl chloride, or polyethylene terephthalate, for example. Also, theadhesive layer 17 b is formed of an ultraviolet curable resin that can be cured by applying ultraviolet light thereto, for example. Note that thebase sheet 17 a and theadhesive layer 17 b are each formed of a permeable material through which gas having a smaller molecular weight than the average molecular weight of the atmosphere can pass. - When the
adhesive tape 17 is attached to theworkpiece 11, the air enters a gap between the workpiece 11 and theadhesive tape 17, and bubbles 21 may be formed between the workpiece 11 and theadhesive layer 17 b of theadhesive tape 17, in some cases. In the preferred embodiment of the present invention, attachment of theworkpiece 11 and theadhesive tape 17 is carried out in the gas having a smaller molecular weight than the average molecular weight of the atmosphere. Accordingly, the gas contained in thebubbles 21 is gas having a smaller molecular weight than the average molecular weight of the atmosphere. In addition, this gas is more likely to permeate theadhesive tape 17 than the air, the gas is easily removed from between the workpiece 11 and theadhesive tape 17. - For example, after the tape attaching step is carried out, the
workpiece 11 and theadhesive tape 17 are left for a given period of time in a state in which theworkpiece 11 is arranged onto the adhesive tape 17 (seeFIG. 2B ). At this time, self-weight of theworkpiece 11 causes thebubbles 21 to be depressed into theadhesive tape 17. Then, the gas remaining between the workpiece 11 and theadhesive tape 17 permeates theadhesive tape 17 to be removed (gas permeating step). FIG. 4B is a partial enlarged cross-sectional view illustrating theworkpiece 11 attached to theadhesive tape 17 and theadhesive tape 17 after the gas permeating step is carried out. When the gas contained in thebubbles 21 permeates theadhesive tape 17 and are removed, theentire back surface 11 b side of theworkpiece 11 comes in close contact with theadhesive layer 17 b of theadhesive tape 17 in a flat manner. Accordingly, when theworkpiece 11 is processed in a subsequent step, occurrence of processing defects can be prevented. - Note that, in order to enhance removal of the
bubbles 21 in the gas permeating step, a predetermined process may be carried out. For example, theadhesive tape 17 is heated, thereby causing the gas contained in thebubbles 21 to easily permeate theadhesive tape 17.FIG. 5 is a cross-sectional view illustrating a manner in which theadhesive tape 17 is heated. Heating theadhesive tape 17 is carried out by use of ahot plate 30, for example. Thehot plate 30 is a plate which generates heat due to supply of electric power, and its upper surface constitutes a holdingsurface 30 a for holding theadhesive tape 17. By heating thehot plate 30 in a state in which theadhesive tape 17 is in contact with the holdingsurface 30 a of thehot plate 30, theadhesive tape 17 is heated. It has been confirmed that a period of time required for removal of thebubbles 21 is reduced after theadhesive tape 17 is heated. It is inferred that reduction in time required for removal of thebubbles 21 is because the gas more easily permeates theadhesive tape 17 resulted from a tendency of increasing in width of a gap between adjacent ones of polymer chains of polymer material constituting theadhesive tape 17 due to heating of theadhesive tape 17 and from activation of movement of the gas contained in thebubbles 21 due to heating of thebubbles 21. Theadhesive tape 17 is heated to a temperature in a range of substantially 80° C. to 90° C., for example. It is to be noted that, however, a heating temperature of theadhesive tape 17 can be set appropriately in a range not causing degradation of theadhesive tape 17 depending on a material of theadhesive tape 17. Moreover, heating of theadhesive tape 17 may be carried out by use of an oven or a heater. - In addition, in the gas permeating step, a pressure may be applied to one of or both the
workpiece 11 and theadhesive tape 17 in a direction in which theworkpiece 11 and theadhesive tape 17 come in close contact with each other. For example, in a state in which theworkpiece 11 is supported by the annular frame 19 (seeFIG. 2B ), theworkpiece 11 is pressed toward theadhesive tape 17, and thebubbles 21 may be pressed into theadhesive tape 17. Note that a strength to press theworkpiece 11 is set in a range not causing any damages or the like of thedevices 15. - In addition, applying the pressure on the
workpiece 11 can be also carried out by use of a holding table for holding under suction theworkpiece 11.FIG. 6 is a cross-sectional view illustrating theworkpiece 11 in such a state as to be held on a holding table 40. The holding table 40 applies a pressure by effecting a suction force on theworkpiece 11. - The holding table 40 is formed into a cylindrical shape larger in diameter than the
workpiece 11, for example, and its upper surface constitutes a holdingsurface 40 a for holding theworkpiece 11. In addition, the holding table 40 includes aporous member 42 which is formed of a porous ceramic material or the like on the holdingsurface 40 a side. Theporous member 42 is formed into a disc shape smaller in diameter than the holding table 40, for example, and is fit in the holdingsurface 40 a of the holding table 40. Note that an upper surface of theporous member 42 constitutes part of the holdingsurface 40 a. Theporous member 42 is connected to asuction source 46 such as an ejector through aflow path 40 b formed inside the holding table 40 and avalve 44. In addition, a plurality ofclamps 48 for gripping theannular frame 19 which supports theworkpiece 11 to be fixed thereto are provided in the periphery of the holding table 40. - The
workpiece 11 is arranged on the holding table 40 in such a way that the surface of theworkpiece 11 to which theadhesive tape 17 is attached (theback surface 11 b side) faces the holdingsurface 40 a. In addition, theannular frame 19 is fixed with the plurality ofclamps 48. In this state, a negative pressure from thesuction source 46 is applied to the holdingsurface 40 a through thevalve 44, theflow path 40 b, and theporous member 42. Then, a suction force is applied to theworkpiece 11 through theadhesive tape 17, and accordingly, a pressure toward theadhesive tape 17 side (holdingsurface 40 a side) is applied to theworkpiece 11. As a result, the bubbles 21 (seeFIG. 4A ) are pressed in theadhesive tape 17, while at the same time, thebubbles 21 are sucked into the holdingsurface 40 a. Accordingly, the gas contained in thebubbles 21 permeates theadhesive tape 17 and is more likely to be removed. As a result, a period of time required for removal of thebubbles 21 is reduced. Note that, although an example in which a pressure toward theadhesive tape 17 is applied to theworkpiece 11 has been described above, a pressure toward theworkpiece 11 may be applied to theadhesive tape 17. - Also, the holding table 40 may further include a heater for heating the
adhesive tape 17.FIG. 7 is a cross-sectional view illustrating theworkpiece 11 in such a state as to be held on the holding table 40 provided with aheater 50. For example, theheater 50 is formed in a disc shape having a diameter equal to or larger than the diameter of theworkpiece 11, and is embedded inside the holding table 40. With theworkpiece 11 being held under suction on the holding table 40, electric power is supplied to theheater 50, and theheater 50 is caused to generate heat, so that theadhesive tape 17 is heated. In this manner, both applying of a pressure (suction force) to theworkpiece 11 and heating of theadhesive tape 17 are carried out, thereby removing thebubbles 21 rapidly. - After the gas permeating step is carried out, subsequent processes such as processing with a processing apparatus or cleaning with a cleaning apparatus are carried out on the
workpiece 11 held on theannular frame 19 through theadhesive tape 17. Note that details of processing on theworkpiece 11 are not limited. For example, theworkpiece 11 is processed by a cutting apparatus which cuts theworkpiece 11 with an annular blade, by a grinding apparatus which grinds the workpiece with grindstones, by a polishing apparatus which polishes theworkpiece 11 with a polishing pad, by a laser processing apparatus which processes theworkpiece 11 by irradiation of a laser beam, or the like. - As described above, the tape attaching method according to the preferred embodiment of the present invention includes the tape attaching step of attaching the
adhesive tape 17 to theworkpiece 11 in the gas having a smaller molecular weight than the average molecular weight of the atmosphere, and the gas permeating step of causing the gas remaining between the workpiece 11 and theadhesive tape 17 to permeate theadhesive tape 17 and to be removed. In this tape attaching method, the gas entering between the workpiece 11 and theadhesive tape 17 is gas having a smaller molecular weight than the average molecular weight of the atmosphere, and accordingly, the gas is likely to permeate theadhesive tape 17. As a result, the bubbles remaining between the workpiece 11 and theadhesive tape 17 are likely to be easily removed. - Note that, after the gas permeating step is carried out, the minute bubbles 21 may remain between the workpiece 11 and the
adhesive tape 17 in a range not affecting processing or cleaning of theworkpiece 11. In other words, in the gas permeating step, gas is removed from between the workpiece 11 and theadhesive tape 17 and thebubbles 21 are decreased to such an extent that there is no bad influence on processing or cleaning of theworkpiece 11. For example, the tape attaching step is preferably carried out under gaseous atmosphere only containing gas having a smaller molecular weight than the average molecular weight of the atmosphere (first gas). However, in practice, theadhesive tape 17 may be attached to theworkpiece 11 under the gaseous atmosphere in which a small amount of another gas (second gas) is mixed into the first gas, in some cases. In such cases, thebubbles 21 may contain the first gas and the second gas. However, if the second gas contained in thebubbles 21 is in small amounts, the first gas is removed properly in the gas permeating step, so that the size of each of thebubbles 21 can be efficiently reduced. - Besides, a structure, a method, and the like according to the above embodiment may be appropriately modified, and various modifications can be implemented without departing from the scope of the object of the present invention.
- The present invention is not limited to the details of the above described preferred embodiment. The scope of the invention is defined by the appended claims and all changes and modifications as fall within the equivalence of the scope of the claims are therefore to be embraced by the invention.
Claims (4)
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JP2019112537A JP7427325B2 (en) | 2019-06-18 | 2019-06-18 | Tape attachment method |
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US20200399089A1 true US20200399089A1 (en) | 2020-12-24 |
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JP6329782B2 (en) | 2014-02-28 | 2018-05-23 | 株式会社ディスコ | Attaching the protective tape |
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