JP7422664B2 - 感光性樹脂組成物及びレジストパターンの形成方法 - Google Patents

感光性樹脂組成物及びレジストパターンの形成方法 Download PDF

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JP7422664B2
JP7422664B2 JP2020535851A JP2020535851A JP7422664B2 JP 7422664 B2 JP7422664 B2 JP 7422664B2 JP 2020535851 A JP2020535851 A JP 2020535851A JP 2020535851 A JP2020535851 A JP 2020535851A JP 7422664 B2 JP7422664 B2 JP 7422664B2
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photosensitive resin
group
mass
resin composition
exposure
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JPWO2020032133A1 (ja
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隼也 小坂
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Asahi Kasei Corp
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Asahi Kasei Corp
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/38Treatment before imagewise removal, e.g. prebaking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laminated Bodies (AREA)
  • Polymerisation Methods In General (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2020535851A 2018-08-09 2019-08-07 感光性樹脂組成物及びレジストパターンの形成方法 Active JP7422664B2 (ja)

Priority Applications (1)

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JP2023014176A JP2023061998A (ja) 2018-08-09 2023-02-01 感光性樹脂組成物及びレジストパターンの形成方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018149985 2018-08-09
JP2018149985 2018-08-09
PCT/JP2019/031219 WO2020032133A1 (ja) 2018-08-09 2019-08-07 感光性樹脂組成物及びレジストパターンの形成方法

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JP2023014176A Division JP2023061998A (ja) 2018-08-09 2023-02-01 感光性樹脂組成物及びレジストパターンの形成方法

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JPWO2020032133A1 JPWO2020032133A1 (ja) 2021-05-13
JP7422664B2 true JP7422664B2 (ja) 2024-01-26

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JP2020535851A Active JP7422664B2 (ja) 2018-08-09 2019-08-07 感光性樹脂組成物及びレジストパターンの形成方法
JP2023014176A Withdrawn JP2023061998A (ja) 2018-08-09 2023-02-01 感光性樹脂組成物及びレジストパターンの形成方法

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JP (2) JP7422664B2 (zh)
KR (1) KR102509152B1 (zh)
CN (1) CN112534351A (zh)
TW (2) TWI812546B (zh)
WO (1) WO2020032133A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI780648B (zh) * 2020-04-03 2022-10-11 日商旭化成股份有限公司 感光性元件、及抗蝕圖案之形成方法
KR20230096046A (ko) * 2021-01-29 2023-06-29 아사히 가세이 가부시키가이샤 감광성 엘리먼트, 및 레지스트 패턴의 형성 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006163339A (ja) 2004-05-12 2006-06-22 Fuji Photo Film Co Ltd パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2011213925A (ja) 2010-03-31 2011-10-27 Fujifilm Corp 着色組成物、インクジェット用インク、カラーフィルタ及びその製造方法、固体撮像素子、並びに表示装置
JP2015102756A (ja) 2013-11-26 2015-06-04 富士フイルム株式会社 タッチパネル又はディスプレイパネルの製造方法、タッチパネル、ディスプレイパネル、及び、表示装置

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Publication number Priority date Publication date Assignee Title
CN1950750B (zh) * 2004-05-12 2012-10-24 旭化成电子材料株式会社 图案形成材料、图案形成设备和图案形成方法
JP4410134B2 (ja) * 2005-03-24 2010-02-03 日立ビアメカニクス株式会社 パターン露光方法及び装置
JP2007256832A (ja) * 2006-03-24 2007-10-04 Fujifilm Corp パターン形成材料及びパターン形成方法
JP2009145613A (ja) * 2007-12-13 2009-07-02 Nippon Synthetic Chem Ind Co Ltd:The フォトレジストフィルム、感光性樹脂組成物層およびレジストパターンの形成方法
JP2010091662A (ja) * 2008-10-06 2010-04-22 Hitachi Chem Co Ltd 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP5287397B2 (ja) * 2009-03-18 2013-09-11 Jsr株式会社 アルミニウム含有感光性樹脂組成物およびパターン形成方法
JP2010249884A (ja) 2009-04-10 2010-11-04 Dupont Mrc Dryfilm Ltd 光重合性樹脂組成物およびこれを用いた感光性フィルム
WO2015099137A1 (ja) * 2013-12-26 2015-07-02 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及び感光性樹脂積層体
KR20210102494A (ko) * 2014-05-21 2021-08-19 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 회로 패턴의 형성 방법
JPWO2016163540A1 (ja) * 2015-04-08 2017-11-02 旭化成株式会社 感光性樹脂組成物
JP2016224161A (ja) * 2015-05-28 2016-12-28 日立化成株式会社 レジストパターンの形成方法、プリント配線板の製造方法及び感光性エレメント
TWI662367B (zh) * 2015-06-30 2019-06-11 日商富士軟片股份有限公司 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法及半導體元件
KR102600211B1 (ko) * 2015-09-11 2023-11-08 아사히 가세이 가부시키가이샤 감광성 수지 조성물
JP6896383B2 (ja) * 2016-07-22 2021-06-30 東京応化工業株式会社 感光性樹脂組成物、硬化膜、カラーフィルタ、及び硬化膜の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006163339A (ja) 2004-05-12 2006-06-22 Fuji Photo Film Co Ltd パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2011213925A (ja) 2010-03-31 2011-10-27 Fujifilm Corp 着色組成物、インクジェット用インク、カラーフィルタ及びその製造方法、固体撮像素子、並びに表示装置
JP2015102756A (ja) 2013-11-26 2015-06-04 富士フイルム株式会社 タッチパネル又はディスプレイパネルの製造方法、タッチパネル、ディスプレイパネル、及び、表示装置

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Publication number Publication date
TWI811423B (zh) 2023-08-11
WO2020032133A1 (ja) 2020-02-13
KR20200139768A (ko) 2020-12-14
TWI812546B (zh) 2023-08-11
JP2023061998A (ja) 2023-05-02
TW202309103A (zh) 2023-03-01
CN112534351A (zh) 2021-03-19
KR102509152B1 (ko) 2023-03-10
TW202016154A (zh) 2020-05-01
JPWO2020032133A1 (ja) 2021-05-13

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