JP7400146B2 - 部品実装機およびノズル撮像方法 - Google Patents

部品実装機およびノズル撮像方法 Download PDF

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Publication number
JP7400146B2
JP7400146B2 JP2023509989A JP2023509989A JP7400146B2 JP 7400146 B2 JP7400146 B2 JP 7400146B2 JP 2023509989 A JP2023509989 A JP 2023509989A JP 2023509989 A JP2023509989 A JP 2023509989A JP 7400146 B2 JP7400146 B2 JP 7400146B2
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light
light emitting
imaging
intensity
background member
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Japanese (ja)
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JPWO2022208689A1 (zh
Inventor
悠節 小林
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Yamaha Motor Co Ltd
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Yamaha Motor Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Studio Devices (AREA)
JP2023509989A 2021-03-30 2021-03-30 部品実装機およびノズル撮像方法 Active JP7400146B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/013670 WO2022208689A1 (ja) 2021-03-30 2021-03-30 部品実装機およびノズル撮像方法

Publications (2)

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JPWO2022208689A1 JPWO2022208689A1 (zh) 2022-10-06
JP7400146B2 true JP7400146B2 (ja) 2023-12-18

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JP2023509989A Active JP7400146B2 (ja) 2021-03-30 2021-03-30 部品実装機およびノズル撮像方法

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JP (1) JP7400146B2 (zh)
CN (1) CN116602069A (zh)
DE (1) DE112021006781T5 (zh)
WO (1) WO2022208689A1 (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014220269A (ja) 2013-05-01 2014-11-20 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
WO2017056239A1 (ja) 2015-09-30 2017-04-06 ヤマハ発動機株式会社 部品実装機、部品保持部材撮像方法
WO2017094167A1 (ja) 2015-12-03 2017-06-08 ヤマハ発動機株式会社 部品実装装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013149171A (ja) 2012-01-20 2013-08-01 Panasonic Corp プログラム実行方法およびその装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014220269A (ja) 2013-05-01 2014-11-20 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
WO2017056239A1 (ja) 2015-09-30 2017-04-06 ヤマハ発動機株式会社 部品実装機、部品保持部材撮像方法
WO2017094167A1 (ja) 2015-12-03 2017-06-08 ヤマハ発動機株式会社 部品実装装置

Also Published As

Publication number Publication date
CN116602069A (zh) 2023-08-15
WO2022208689A1 (ja) 2022-10-06
DE112021006781T5 (de) 2023-10-26
JPWO2022208689A1 (zh) 2022-10-06

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