JPWO2022208689A1 - - Google Patents
Info
- Publication number
- JPWO2022208689A1 JPWO2022208689A1 JP2023509989A JP2023509989A JPWO2022208689A1 JP WO2022208689 A1 JPWO2022208689 A1 JP WO2022208689A1 JP 2023509989 A JP2023509989 A JP 2023509989A JP 2023509989 A JP2023509989 A JP 2023509989A JP WO2022208689 A1 JPWO2022208689 A1 JP WO2022208689A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Studio Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/013670 WO2022208689A1 (ja) | 2021-03-30 | 2021-03-30 | 部品実装機およびノズル撮像方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022208689A1 true JPWO2022208689A1 (zh) | 2022-10-06 |
JP7400146B2 JP7400146B2 (ja) | 2023-12-18 |
Family
ID=83458434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023509989A Active JP7400146B2 (ja) | 2021-03-30 | 2021-03-30 | 部品実装機およびノズル撮像方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7400146B2 (zh) |
CN (1) | CN116602069A (zh) |
DE (1) | DE112021006781T5 (zh) |
WO (1) | WO2022208689A1 (zh) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013149171A (ja) | 2012-01-20 | 2013-08-01 | Panasonic Corp | プログラム実行方法およびその装置 |
JP6153375B2 (ja) | 2013-05-01 | 2017-06-28 | ヤマハ発動機株式会社 | 電子部品装着装置 |
DE112015006993T5 (de) | 2015-09-30 | 2018-07-05 | Yamaha Hatsudoki Kabushiki Kaisha | Bauteilmontagegerät und Bauteilhalter-Abbildungsverfahren |
WO2017094167A1 (ja) | 2015-12-03 | 2017-06-08 | ヤマハ発動機株式会社 | 部品実装装置 |
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2021
- 2021-03-30 WO PCT/JP2021/013670 patent/WO2022208689A1/ja active Application Filing
- 2021-03-30 CN CN202180082003.2A patent/CN116602069A/zh active Pending
- 2021-03-30 JP JP2023509989A patent/JP7400146B2/ja active Active
- 2021-03-30 DE DE112021006781.8T patent/DE112021006781T5/de active Pending
Also Published As
Publication number | Publication date |
---|---|
CN116602069A (zh) | 2023-08-15 |
JP7400146B2 (ja) | 2023-12-18 |
WO2022208689A1 (ja) | 2022-10-06 |
DE112021006781T5 (de) | 2023-10-26 |
Similar Documents
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