JP7337188B2 - 部品実装方法および部品実装システム - Google Patents
部品実装方法および部品実装システム Download PDFInfo
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- JP7337188B2 JP7337188B2 JP2021560787A JP2021560787A JP7337188B2 JP 7337188 B2 JP7337188 B2 JP 7337188B2 JP 2021560787 A JP2021560787 A JP 2021560787A JP 2021560787 A JP2021560787 A JP 2021560787A JP 7337188 B2 JP7337188 B2 JP 7337188B2
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- 238000000034 method Methods 0.000 title claims description 120
- 229910000679 solder Inorganic materials 0.000 claims description 199
- 230000008569 process Effects 0.000 claims description 86
- 238000007689 inspection Methods 0.000 claims description 71
- 239000000758 substrate Substances 0.000 claims description 51
- 238000010438 heat treatment Methods 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 229910000765 intermetallic Inorganic materials 0.000 claims description 21
- 230000000694 effects Effects 0.000 claims description 19
- 238000000576 coating method Methods 0.000 claims description 15
- 238000012546 transfer Methods 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- 238000007650 screen-printing Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 7
- 239000000155 melt Substances 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 7
- 150000002739 metals Chemical class 0.000 claims description 5
- 239000003292 glue Substances 0.000 description 21
- 238000007639 printing Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 14
- 238000012545 processing Methods 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229910020888 Sn-Cu Inorganic materials 0.000 description 2
- 229910019204 Sn—Cu Inorganic materials 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910016347 CuSn Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000004886 head movement Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
SnとSn以外の金属を含む特定のはんだペーストを基板に塗布する塗布工程と、
上面に位置決めの基準を有する上面基準型部品を前記基板上の一以上の基準点に対して位置合わせして配置する配置工程と、
前記基板を加熱して前記部品をリフローはんだ付けするリフロー工程と、
を含む部品実装方法であって、
前記特定のはんだペーストは、前記リフロー工程で前記Snの少なくとも一部が溶融し、溶融したSnと前記Sn以外の金属が金属間化合物を形成することで、前記上面基準型部品を前記基板に固定する
ことを要旨とする。
Claims (9)
- SnとSn以外の金属を含む特定のはんだペーストを基板に塗布する塗布工程と、
上面に位置決めの基準を有する上面基準型部品を前記基板上の一以上の基準点に対して位置合わせして配置する配置工程と、
前記基板を加熱して前記部品をリフローはんだ付けするリフロー工程と、
を含む部品実装方法であって、
前記特定のはんだペーストは、前記リフロー工程で前記Snの少なくとも一部が溶融し、溶融したSnと前記Sn以外の金属が金属間化合物を形成することで、前記上面基準型部品を前記基板に固定するものであり、前記Snの含有量が50質量%以上65質量%以下であり、前記Sn以外の金属の含有量が35質量%以上50質量%以下である
部品実装方法。 - 請求項1に記載の部品実装方法であって、
前記特定のはんだペーストは、前記Sn以外の金属が、前記Snよりも高融点であって前記リフロー工程の加熱温度よりも高融点の金属である
部品実装方法。 - 請求項1または2に記載の部品実装方法であって、
前記上面基準型部品の実装には、前記特定のはんだペーストを用い、
上面に位置決めの基準を有さない他の部品の実装には、前記特定のはんだペーストよりも前記リフロー工程におけるセルフアライメント効果が大きい他のはんだペーストを用いる
部品実装方法。 - 請求項3に記載の部品実装方法であって、
前記塗布工程では、前記特定のはんだペーストと前記他のはんだペーストとを、それぞれスクリーン印刷、ピン転写、ディスペンサ塗布のいずれかで塗布する
部品実装方法。 - 請求項3または4に記載の部品実装方法であって、
前記基板の外観の検査工程を含み、
前記配置工程における前記部品の配置に関するパラメータと、前記リフロー工程における前記基板の加熱に関するパラメータと、前記検査工程における検査の基準に関するパラメータとのうち少なくともいずれかのパラメータが選択的に設定可能とされており、
前記部品の実装に用いられるはんだペーストの種類が前記特定のはんだペーストおよび前記他のはんだペーストのいずれであるかに基づいて、前記パラメータが選択される
部品実装方法。 - 請求項1ないし5のいずれか1項に記載の部品実装方法であって、
前記上面基準型部品は、SMD-LEDである
部品実装方法。 - SnとSn以外の金属を含む特定のはんだペーストおよび該特定のはんだペーストとは異なる他のはんだペーストの少なくとも一方を用いて、基板に部品を実装する部品実装方法であって、
前記部品の実装に関するパラメータが選択的に設定可能とされており、
前記部品の実装に用いられるはんだペーストの種類が前記特定のはんだペーストおよび前記他のはんだペーストのいずれであるかに基づいて、前記パラメータが選択され、
前記特定のはんだペーストは、前記Snの含有量が50質量%以上65質量%以下であり、前記Sn以外の金属の含有量が35質量%以上50質量%以下である
部品実装方法。 - SnとSn以外の金属を含む特定のはんだペーストを基板に塗布し、上面に位置決めの基準を有する上面基準型部品を前記基板上の一以上の基準点に対して位置合わせして配置し、前記基板を加熱して前記部品をリフローはんだ付けする部品実装システムであって、
前記特定のはんだペーストは、前記リフローはんだ付けする際に前記Snの少なくとも一部が溶融し、溶融したSnと前記Sn以外の金属が金属間化合物を形成することで、前記上面基準型部品を前記基板に固定するものであり、前記Snの含有量が50質量%以上65質量%以下であり、前記Sn以外の金属の含有量が35質量%以上50質量%以下である
部品実装システム。 - はんだペーストを基板に塗布する塗布部と、
SMD-LEDを含む部品を前記基板上の一以上の基準点に対して位置合わせして配置する配置部と、
前記基板を加熱して前記部品をリフローはんだ付けするリフロー部と、
前記基板の外観検査を行う検査部と、
を備える部品実装システムであって、
前記SMD-LEDの実装には、SnとSn以外の金属を含む特定のはんだペーストを用い、前記SMD-LED以外の他の部品の実装には、前記特定のはんだペーストよりも前記リフロー部のリフローにおけるセルフアライメント効果が大きい他のはんだペーストを用い、
前記配置部における前記部品の配置に関するパラメータと、前記塗布部における前記はんだペーストの塗布に関するパラメータと、前記リフロー部における前記基板の加熱に関するパラメータと、前記検査部における検査の基準に関するパラメータとのうち少なくともいずれかのパラメータが選択的に設定可能とされており、
前記部品の実装に用いられるはんだペーストの種類が前記特定のはんだペーストおよび前記他のはんだペーストのいずれであるかに基づいて、前記パラメータが選択され、
前記特定のはんだペーストは、前記Snの含有量が50質量%以上65質量%以下であり、前記Sn以外の金属の含有量が35質量%以上50質量%以下である
部品実装システム。
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PCT/JP2019/046056 WO2021106056A1 (ja) | 2019-11-26 | 2019-11-26 | 部品実装方法および部品実装システム |
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JPWO2021106056A1 JPWO2021106056A1 (ja) | 2021-06-03 |
JP7337188B2 true JP7337188B2 (ja) | 2023-09-01 |
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US (1) | US20220416118A1 (ja) |
EP (1) | EP4066976A4 (ja) |
JP (1) | JP7337188B2 (ja) |
CN (1) | CN114728359A (ja) |
WO (1) | WO2021106056A1 (ja) |
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WO2011027659A1 (ja) | 2009-09-03 | 2011-03-10 | 株式会社村田製作所 | ソルダペースト、それを用いた接合方法、および接合構造 |
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EP2874780B1 (en) * | 2012-07-18 | 2019-05-15 | Lumileds Holding B.V. | Method of soldering an electronic component with a high lateral accuracy |
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US20180102464A1 (en) * | 2016-10-06 | 2018-04-12 | Alpha Assembly Solutions Inc. | Advanced Solder Alloys For Electronic Interconnects |
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WO2011027659A1 (ja) | 2009-09-03 | 2011-03-10 | 株式会社村田製作所 | ソルダペースト、それを用いた接合方法、および接合構造 |
WO2015152387A1 (ja) | 2014-04-02 | 2015-10-08 | 千住金属工業株式会社 | Led用はんだ合金およびledモジュール |
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