JP7336960B2 - 中心位置づけ方法 - Google Patents

中心位置づけ方法 Download PDF

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Publication number
JP7336960B2
JP7336960B2 JP2019197879A JP2019197879A JP7336960B2 JP 7336960 B2 JP7336960 B2 JP 7336960B2 JP 2019197879 A JP2019197879 A JP 2019197879A JP 2019197879 A JP2019197879 A JP 2019197879A JP 7336960 B2 JP7336960 B2 JP 7336960B2
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JP
Japan
Prior art keywords
center
detection
coordinates
chuck table
unit
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Active
Application number
JP2019197879A
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English (en)
Japanese (ja)
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JP2021071371A (ja
Inventor
彩子 小池
誠 田中
芳昌 小嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2019197879A priority Critical patent/JP7336960B2/ja
Priority to KR1020200129640A priority patent/KR20210052233A/ko
Priority to TW109137576A priority patent/TW202117909A/zh
Publication of JP2021071371A publication Critical patent/JP2021071371A/ja
Application granted granted Critical
Publication of JP7336960B2 publication Critical patent/JP7336960B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/20—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring workpiece characteristics, e.g. contour, dimension, hardness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports
    • B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
    • B23Q1/30—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members controlled in conjunction with the feed mechanism
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B23Q17/2409—Arrangements for indirect observation of the working space using image recording means, e.g. a camera
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/155—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling
    • B23Q3/1552—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling parts of devices for automatically inserting or removing tools
    • B23Q3/1554—Transfer mechanisms, e.g. tool gripping arms; Drive mechanisms therefore
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2019197879A 2019-10-30 2019-10-30 中心位置づけ方法 Active JP7336960B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019197879A JP7336960B2 (ja) 2019-10-30 2019-10-30 中心位置づけ方法
KR1020200129640A KR20210052233A (ko) 2019-10-30 2020-10-07 중심 위치 부여 방법
TW109137576A TW202117909A (zh) 2019-10-30 2020-10-29 中心定位方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019197879A JP7336960B2 (ja) 2019-10-30 2019-10-30 中心位置づけ方法

Publications (2)

Publication Number Publication Date
JP2021071371A JP2021071371A (ja) 2021-05-06
JP7336960B2 true JP7336960B2 (ja) 2023-09-01

Family

ID=75712911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019197879A Active JP7336960B2 (ja) 2019-10-30 2019-10-30 中心位置づけ方法

Country Status (3)

Country Link
JP (1) JP7336960B2 (zh)
KR (1) KR20210052233A (zh)
TW (1) TW202117909A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113720280A (zh) * 2021-09-03 2021-11-30 北京机电研究所有限公司 一种基于机器视觉的棒料圆心定位方法
CN114777618B (zh) * 2022-04-27 2023-07-07 东风柳州汽车有限公司 一种多自由度轴距测量仪及其测量方法
CN115106835B (zh) * 2022-07-25 2023-08-25 上海阿为特精密机械股份有限公司 一种试切试找四轴旋转中心方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005093710A (ja) 2003-09-17 2005-04-07 Disco Abrasive Syst Ltd 切削装置におけるチャックテーブルの回転軸と顕微鏡の中心との位置合わせ方法
JP2011220794A (ja) 2010-04-08 2011-11-04 Seiko Epson Corp キャリブレーション治具およびこれを用いた撮像装置のキャリブレーション方法
JP2015099844A (ja) 2013-11-19 2015-05-28 株式会社ディスコ 加工装置
JP2015102389A (ja) 2013-11-22 2015-06-04 株式会社ディスコ ウェーハの検出方法
JP2015112698A (ja) 2013-12-13 2015-06-22 株式会社ディスコ 加工方法
JP2016219756A (ja) 2015-05-26 2016-12-22 株式会社ディスコ 加工システム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005093710A (ja) 2003-09-17 2005-04-07 Disco Abrasive Syst Ltd 切削装置におけるチャックテーブルの回転軸と顕微鏡の中心との位置合わせ方法
JP2011220794A (ja) 2010-04-08 2011-11-04 Seiko Epson Corp キャリブレーション治具およびこれを用いた撮像装置のキャリブレーション方法
JP2015099844A (ja) 2013-11-19 2015-05-28 株式会社ディスコ 加工装置
JP2015102389A (ja) 2013-11-22 2015-06-04 株式会社ディスコ ウェーハの検出方法
JP2015112698A (ja) 2013-12-13 2015-06-22 株式会社ディスコ 加工方法
JP2016219756A (ja) 2015-05-26 2016-12-22 株式会社ディスコ 加工システム

Also Published As

Publication number Publication date
JP2021071371A (ja) 2021-05-06
TW202117909A (zh) 2021-05-01
KR20210052233A (ko) 2021-05-10

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