JP7273568B2 - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP7273568B2 JP7273568B2 JP2019051282A JP2019051282A JP7273568B2 JP 7273568 B2 JP7273568 B2 JP 7273568B2 JP 2019051282 A JP2019051282 A JP 2019051282A JP 2019051282 A JP2019051282 A JP 2019051282A JP 7273568 B2 JP7273568 B2 JP 7273568B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- grinding
- size
- cassette
- chuck table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Quality & Reliability (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Feeding Of Workpieces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Multi-Process Working Machines And Systems (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Description
4:チャックテーブル
6:加工手段
8:カセット
8a:第一のカセット
8b:第二のカセット
8’:6インチ用カセット
8”:8インチ用カセット
10:カセット載置部
10a:第一のカセット載置部
10b:第二のカセット載置部
12:搬出手段
14:仮置き手段
16:搬送手段
60:搬出手段の保持片
60’:6インチ用保持片
60”:8インチ用保持片
72:搬送手段の吸着片
72’:6インチ用吸着片
72”:8インチ用吸着片
88:カメラ
90:制御手段
96:サイズ選定部
98:画像記憶部
100:判断部
Claims (3)
- 少なくとも2種類のサイズの被加工物を選択的に保持できるチャックテーブルと、該チャックテーブルに保持された被加工物に加工を施す加工手段と、複数の被加工物を収容するカセットが載置されるカセット載置部と、該カセット載置部に載置されたカセットから被加工物を搬出する搬出手段と、該搬出手段によって搬出された被加工物が仮置きされる仮置き手段と、該仮置き手段に仮置きされた被加工物を該チャックテーブルまで搬送する搬送手段と、を構成要素として少なくとも備えた加工装置であって、
複数の構成要素を撮像するカメラと、
被加工物のサイズを選定するサイズ選定部と、該サイズ選定部によって選定された被加工物のサイズに応じた複数の構成要素の画像を記憶する画像記憶部と、を少なくとも備えた制御手段と、を備え、
該制御手段は、該カメラが撮像した複数の構成要素の画像と該画像記憶部に記憶された複数の構成要素の画像とを比較し、該カメラが撮像した複数の構成要素が、該サイズ選定部によって選定された被加工物のサイズに応じた複数の構成要素であるか否かを判断する判断部を備えている加工装置。 - 該判断部は、被加工物のサイズに応じていない構成要素を指摘して交換を指示する請求項1記載の加工装置。
- 該加工手段は、該チャックテーブルに保持された被加工物を研削砥石で研削する研削手段または該チャックテーブルに保持された被加工物を研磨パッドで研磨する研磨手段である請求項1記載の加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019051282A JP7273568B2 (ja) | 2019-03-19 | 2019-03-19 | 加工装置 |
KR1020200027757A KR20200111624A (ko) | 2019-03-19 | 2020-03-05 | 가공 장치 |
CN202010146502.0A CN111725093A (zh) | 2019-03-19 | 2020-03-05 | 加工装置 |
TW109108702A TWI833929B (zh) | 2019-03-19 | 2020-03-17 | 加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019051282A JP7273568B2 (ja) | 2019-03-19 | 2019-03-19 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020151795A JP2020151795A (ja) | 2020-09-24 |
JP7273568B2 true JP7273568B2 (ja) | 2023-05-15 |
Family
ID=72557103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019051282A Active JP7273568B2 (ja) | 2019-03-19 | 2019-03-19 | 加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7273568B2 (ja) |
KR (1) | KR20200111624A (ja) |
CN (1) | CN111725093A (ja) |
TW (1) | TWI833929B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102411440B1 (ko) * | 2021-10-21 | 2022-06-22 | 주식회사 기가레인 | 웨이퍼 처리 시스템 및 웨이퍼 처리 방법 |
CN115302246A (zh) * | 2022-09-06 | 2022-11-08 | 无锡市锡山区半导体先进制造创新中心 | 一种复合加工机床 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003077982A (ja) | 2001-09-05 | 2003-03-14 | Disco Abrasive Syst Ltd | 搬送装置 |
JP2003133392A (ja) | 2001-10-23 | 2003-05-09 | Disco Abrasive Syst Ltd | 被加工物の中心位置合わせ機構および中心位置合わせ機構を備えた研削装置 |
JP2006222132A (ja) | 2005-02-08 | 2006-08-24 | Disco Abrasive Syst Ltd | 研削装置,被加工物保持部のサイズ判別方法 |
JP2016021492A (ja) | 2014-07-14 | 2016-02-04 | 株式会社ディスコ | 加工装置 |
JP2018056256A (ja) | 2016-09-28 | 2018-04-05 | 川崎重工業株式会社 | 基板搬送ハンドの診断システム |
JP2019029374A (ja) | 2017-07-25 | 2019-02-21 | 株式会社ディスコ | ウエーハの加工方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08320929A (ja) * | 1995-05-24 | 1996-12-03 | Sankyo Seiki Mfg Co Ltd | ワーク検出装置 |
JPH11241913A (ja) * | 1998-02-25 | 1999-09-07 | Hitachi Metals Ltd | ワークの品種判別方法 |
JP4464113B2 (ja) | 2003-11-27 | 2010-05-19 | 株式会社ディスコ | ウエーハの加工装置 |
-
2019
- 2019-03-19 JP JP2019051282A patent/JP7273568B2/ja active Active
-
2020
- 2020-03-05 KR KR1020200027757A patent/KR20200111624A/ko not_active Application Discontinuation
- 2020-03-05 CN CN202010146502.0A patent/CN111725093A/zh active Pending
- 2020-03-17 TW TW109108702A patent/TWI833929B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003077982A (ja) | 2001-09-05 | 2003-03-14 | Disco Abrasive Syst Ltd | 搬送装置 |
JP2003133392A (ja) | 2001-10-23 | 2003-05-09 | Disco Abrasive Syst Ltd | 被加工物の中心位置合わせ機構および中心位置合わせ機構を備えた研削装置 |
JP2006222132A (ja) | 2005-02-08 | 2006-08-24 | Disco Abrasive Syst Ltd | 研削装置,被加工物保持部のサイズ判別方法 |
JP2016021492A (ja) | 2014-07-14 | 2016-02-04 | 株式会社ディスコ | 加工装置 |
JP2018056256A (ja) | 2016-09-28 | 2018-04-05 | 川崎重工業株式会社 | 基板搬送ハンドの診断システム |
JP2019029374A (ja) | 2017-07-25 | 2019-02-21 | 株式会社ディスコ | ウエーハの加工方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2020151795A (ja) | 2020-09-24 |
CN111725093A (zh) | 2020-09-29 |
TWI833929B (zh) | 2024-03-01 |
TW202035068A (zh) | 2020-10-01 |
KR20200111624A (ko) | 2020-09-29 |
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