JP7148541B2 - 電気接触検出を含むプローブシステム及びその利用方法 - Google Patents

電気接触検出を含むプローブシステム及びその利用方法 Download PDF

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Publication number
JP7148541B2
JP7148541B2 JP2019554665A JP2019554665A JP7148541B2 JP 7148541 B2 JP7148541 B2 JP 7148541B2 JP 2019554665 A JP2019554665 A JP 2019554665A JP 2019554665 A JP2019554665 A JP 2019554665A JP 7148541 B2 JP7148541 B2 JP 7148541B2
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probe
dut
contact
conductor
test
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Japanese (ja)
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JP2020515865A (ja
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ベン シア チョン
一樹 根岸
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FormFactor Beaverton Inc
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Cascade Microtech Inc
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06777—High voltage probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2019554665A 2017-04-04 2018-03-26 電気接触検出を含むプローブシステム及びその利用方法 Active JP7148541B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762481245P 2017-04-04 2017-04-04
US62/481,245 2017-04-04
US15/934,672 US10330703B2 (en) 2017-04-04 2018-03-23 Probe systems and methods including electric contact detection
US15/934,672 2018-03-23
PCT/US2018/024290 WO2018187068A1 (en) 2017-04-04 2018-03-26 Probe systems and methods including electric contact detection

Publications (2)

Publication Number Publication Date
JP2020515865A JP2020515865A (ja) 2020-05-28
JP7148541B2 true JP7148541B2 (ja) 2022-10-05

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JP2019554665A Active JP7148541B2 (ja) 2017-04-04 2018-03-26 電気接触検出を含むプローブシステム及びその利用方法

Country Status (6)

Country Link
US (2) US10330703B2 (ko)
JP (1) JP7148541B2 (ko)
KR (1) KR102298270B1 (ko)
DE (1) DE112018001869T5 (ko)
TW (1) TWI688773B (ko)
WO (1) WO2018187068A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10330703B2 (en) * 2017-04-04 2019-06-25 Formfactor Beaverton, Inc. Probe systems and methods including electric contact detection
US11047880B2 (en) 2019-01-16 2021-06-29 Star Technologies, Inc. Probing device
TWI704354B (zh) * 2019-03-21 2020-09-11 創意電子股份有限公司 探針卡、具有其的晶圓檢測設備及使用其的裸晶測試流程
KR20210022278A (ko) 2019-08-20 2021-03-03 삼성전자주식회사 적외선 카메라를 이용한 불량 부품 검출 장치 및 방법
US11346883B2 (en) * 2019-11-05 2022-05-31 Formfactor, Inc. Probe systems and methods for testing a device under test
TWI775649B (zh) * 2021-10-21 2022-08-21 國立屏東科技大學 探針結構
CN116773994B (zh) * 2023-08-21 2023-12-01 珠海格力电子元器件有限公司 晶圆测试的控制方法、控制装置、存储介质和电子设备

Citations (14)

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JP2003309153A (ja) 2002-04-08 2003-10-31 Micromanipulator Co Inc 高解像分析プローブステーション
JP2006058157A (ja) 2004-08-20 2006-03-02 Toyota Motor Corp プローブカード
JP2006510028A (ja) 2002-12-16 2006-03-23 フォームファクター，インコーポレイテッド プローブカードアセンブリにおいてオーバートラベルを制限する装置及び方法
JP2007064772A (ja) 2005-08-31 2007-03-15 Yokogawa Electric Corp 半導体検査装置
JP2007129090A (ja) 2005-11-04 2007-05-24 Tokyo Seimitsu Co Ltd ウエハテストシステム、プローバ、ウエハテスト方法及びプローブカード
JP2009538428A (ja) 2006-05-23 2009-11-05 インテグレーテッド テクノロジー コーポレーション パワーデバイスの高電流プローブ試験用プローブ針の保護方法
JP2010133954A (ja) 2008-11-24 2010-06-17 Cascade Microtech Inc フリッカ雑音のテストシステム
JP2012141325A (ja) 2012-04-27 2012-07-26 Hioki Ee Corp 検査プローブ接触検知機構および回路基板検査装置
JP2014160851A (ja) 2014-04-18 2014-09-04 Renesas Electronics Corp 半導体装置
JP2015035577A (ja) 2013-07-11 2015-02-19 東京エレクトロン株式会社 プローブ装置
CN204649917U (zh) 2015-04-02 2015-09-16 北京华峰测控技术有限公司 一种mosfet晶圆导通电阻的测量装置
US20160041220A1 (en) 2014-08-05 2016-02-11 Infineon Technologies Austria Ag Probe Card and Method for Performing an Unclamped Inductive Switching Test
JP2016205906A (ja) 2015-04-17 2016-12-08 株式会社東芝 プローブ、半導体検査装置、プローブの製造方法、半導体検査装置の製造方法、半導体検査方法および半導体製造方法
JP2017503335A (ja) 2014-02-25 2017-01-26 カスケード マイクロテック インコーポレイテッドＣａｓｃａｄｅ Ｍｉｃｒｏｔｅｃｈ，Ｉｎｃｏｒｐｏｒａｔｅｄ 電子デバイスのオンウェーハ動的検査のためのシステムおよび方法。

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GB2303963B (en) * 1995-07-31 1997-08-06 Toshiba Cambridge Res Center Semiconductor device
JPH09246332A (ja) * 1996-03-07 1997-09-19 Sony Corp 半導体チップの測定方法
US6255827B1 (en) * 1999-04-30 2001-07-03 International Business Machines Corporation Search routine for 2-point electrical tester
US7573283B2 (en) 2007-06-19 2009-08-11 Suss Micro Tec Test Systems Gmbh Method for measurement of a device under test
US7804292B2 (en) 2008-08-19 2010-09-28 Silverbrook Research Pty Ltd Method for testing integrated circuits mounted on a carrier
TWI442069B (zh) 2011-04-27 2014-06-21 Sharp Kk High voltage inspection device
US9244099B2 (en) * 2011-05-09 2016-01-26 Cascade Microtech, Inc. Probe head assemblies, components thereof, test systems including the same, and methods of operating the same
TW201319592A (zh) * 2011-11-04 2013-05-16 Chroma Ate Inc 用於檢測機台之溫度調控系統
CN103163361B (zh) * 2011-12-13 2015-10-21 英业达股份有限公司 电子元件与检测***的组合与电子元件的检测方法
US9372227B2 (en) 2013-03-11 2016-06-21 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit test system and method
US10330703B2 (en) * 2017-04-04 2019-06-25 Formfactor Beaverton, Inc. Probe systems and methods including electric contact detection

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003309153A (ja) 2002-04-08 2003-10-31 Micromanipulator Co Inc 高解像分析プローブステーション
JP2006510028A (ja) 2002-12-16 2006-03-23 フォームファクター，インコーポレイテッド プローブカードアセンブリにおいてオーバートラベルを制限する装置及び方法
JP2006058157A (ja) 2004-08-20 2006-03-02 Toyota Motor Corp プローブカード
JP2007064772A (ja) 2005-08-31 2007-03-15 Yokogawa Electric Corp 半導体検査装置
JP2007129090A (ja) 2005-11-04 2007-05-24 Tokyo Seimitsu Co Ltd ウエハテストシステム、プローバ、ウエハテスト方法及びプローブカード
JP2009538428A (ja) 2006-05-23 2009-11-05 インテグレーテッド テクノロジー コーポレーション パワーデバイスの高電流プローブ試験用プローブ針の保護方法
JP2010133954A (ja) 2008-11-24 2010-06-17 Cascade Microtech Inc フリッカ雑音のテストシステム
JP2012141325A (ja) 2012-04-27 2012-07-26 Hioki Ee Corp 検査プローブ接触検知機構および回路基板検査装置
JP2015035577A (ja) 2013-07-11 2015-02-19 東京エレクトロン株式会社 プローブ装置
JP2017503335A (ja) 2014-02-25 2017-01-26 カスケード マイクロテック インコーポレイテッドＣａｓｃａｄｅ Ｍｉｃｒｏｔｅｃｈ，Ｉｎｃｏｒｐｏｒａｔｅｄ 電子デバイスのオンウェーハ動的検査のためのシステムおよび方法。
JP2014160851A (ja) 2014-04-18 2014-09-04 Renesas Electronics Corp 半導体装置
US20160041220A1 (en) 2014-08-05 2016-02-11 Infineon Technologies Austria Ag Probe Card and Method for Performing an Unclamped Inductive Switching Test
CN204649917U (zh) 2015-04-02 2015-09-16 北京华峰测控技术有限公司 一种mosfet晶圆导通电阻的测量装置
JP2016205906A (ja) 2015-04-17 2016-12-08 株式会社東芝 プローブ、半導体検査装置、プローブの製造方法、半導体検査装置の製造方法、半導体検査方法および半導体製造方法

Also Published As

Publication number Publication date
KR20190132474A (ko) 2019-11-27
DE112018001869T5 (de) 2019-12-19
TWI688773B (zh) 2020-03-21
TW201903414A (zh) 2019-01-16
WO2018187068A1 (en) 2018-10-11
US10330703B2 (en) 2019-06-25
KR102298270B1 (ko) 2021-09-03
US20190277885A1 (en) 2019-09-12
US20180284155A1 (en) 2018-10-04
US11181550B2 (en) 2021-11-23
JP2020515865A (ja) 2020-05-28

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