JP7144200B2 - 矩形被加工物の加工方法 - Google Patents

矩形被加工物の加工方法 Download PDF

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Publication number: JP7144200B2
Authority: JP; Japan
Prior art keywords: processing; rectangular workpiece; planned division; holding; hole
Prior art date: 2018-06-05
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2018108062A

Other languages

English (en)

Japanese (ja)

Other versions

JP2019212773A (ja

Inventor

喜洋大室

千悟山田

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Disco Corp

Original Assignee

Disco Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2018-06-05

Filing date

2018-06-05

Publication date

2022-09-29

2018-06-05 Application filed by Disco Corp filed Critical Disco Corp

2018-06-05 Priority to JP2018108062A priority Critical patent/JP7144200B2/ja

2019-05-27 Priority to CN201910444699.3A priority patent/CN110571146B/zh

2019-12-12 Publication of JP2019212773A publication Critical patent/JP2019212773A/ja

2022-09-29 Application granted granted Critical

2022-09-29 Publication of JP7144200B2 publication Critical patent/JP7144200B2/ja

Status Active legal-status Critical Current

2038-06-05 Anticipated expiration legal-status Critical

Links

238000000034 method Methods 0.000 title claims description 29
238000003754 machining Methods 0.000 title claims description 21
239000002184 metal Substances 0.000 claims description 36
229910052751 metal Inorganic materials 0.000 claims description 36
239000011347 resin Substances 0.000 claims description 22
229920005989 resin Polymers 0.000 claims description 22
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
238000001514 detection method Methods 0.000 claims description 15
238000003384 imaging method Methods 0.000 claims description 13
238000007789 sealing Methods 0.000 claims description 2
239000000758 substrate Substances 0.000 description 70
238000010586 diagram Methods 0.000 description 10
230000002093 peripheral effect Effects 0.000 description 6
238000003672 processing method Methods 0.000 description 3
239000006061 abrasive grain Substances 0.000 description 2
239000000919 ceramic Substances 0.000 description 2
238000004590 computer program Methods 0.000 description 2
239000003292 glue Substances 0.000 description 2
239000000463 material Substances 0.000 description 2
229910052582 BN Inorganic materials 0.000 description 1
PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
229910000881 Cu alloy Inorganic materials 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
229910003460 diamond Inorganic materials 0.000 description 1
239000010432 diamond Substances 0.000 description 1
239000011521 glass Substances 0.000 description 1
239000004973 liquid crystal related substance Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
238000005192 partition Methods 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
238000006467 substitution reaction Methods 0.000 description 1
229920005992 thermoplastic resin Polymers 0.000 description 1

Images

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting

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Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Dicing (AREA)
Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

JP2018108062A 2018-06-05 2018-06-05 矩形被加工物の加工方法 Active JP7144200B2 (ja)

Priority Applications (2)

Application Number	Priority Date	Filing Date	Title
JP2018108062A JP7144200B2 (ja)	2018-06-05	2018-06-05	矩形被加工物の加工方法
CN201910444699.3A CN110571146B (zh)	2018-06-05	2019-05-27	矩形被加工物的加工方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2018108062A JP7144200B2 (ja)	2018-06-05	2018-06-05	矩形被加工物の加工方法

Publications (2)

Publication Number	Publication Date
JP2019212773A JP2019212773A (ja)	2019-12-12
JP7144200B2 true JP7144200B2 (ja)	2022-09-29

Family

ID=68772852

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2018108062A Active JP7144200B2 (ja)	2018-06-05	2018-06-05	矩形被加工物の加工方法

Country Status (2)

Country	Link
JP (1)	JP7144200B2 (zh)
CN (1)	CN110571146B (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2004247348A (ja)	2003-02-10	2004-09-02	Murata Mfg Co Ltd	ダイシング方法
JP2015109325A (ja)	2013-12-04	2015-06-11	株式会社ディスコ	パッケージ基板の加工方法
JP6232255B2 (ja)	2013-10-25	2017-11-15	ホーチキ株式会社	放水継手

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH06232255A (ja) *	1993-01-29	1994-08-19	Disco Abrasive Syst Ltd	ウェーハのダイシング方法
JP2013058653A (ja) *	2011-09-09	2013-03-28	Disco Abrasive Syst Ltd	板状物の分割方法
JP6328513B2 (ja) *	2014-07-28	2018-05-23	株式会社ディスコ	ウエーハの加工方法

2018
- 2018-06-05 JP JP2018108062A patent/JP7144200B2/ja active Active
2019
- 2019-05-27 CN CN201910444699.3A patent/CN110571146B/zh active Active

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2004247348A (ja)	2003-02-10	2004-09-02	Murata Mfg Co Ltd	ダイシング方法
JP6232255B2 (ja)	2013-10-25	2017-11-15	ホーチキ株式会社	放水継手
JP2015109325A (ja)	2013-12-04	2015-06-11	株式会社ディスコ	パッケージ基板の加工方法

Also Published As

Publication number	Publication date
JP2019212773A (ja)	2019-12-12
CN110571146A (zh)	2019-12-13
CN110571146B (zh)	2024-03-15

Legal Events

Date	Code	Title	Description
2021-04-01	A621	Written request for application examination	Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210401
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2022-08-25	TRDD	Decision of grant or rejection written
2022-08-30	A01	Written decision to grant a patent or to grant a registration (utility model)	Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220830
2022-09-20	A61	First payment of annual fees (during grant procedure)	Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220915
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