JP7144200B2 - 矩形被加工物の加工方法 - Google Patents
矩形被加工物の加工方法 Download PDFInfo
- Publication number
- JP7144200B2 JP7144200B2 JP2018108062A JP2018108062A JP7144200B2 JP 7144200 B2 JP7144200 B2 JP 7144200B2 JP 2018108062 A JP2018108062 A JP 2018108062A JP 2018108062 A JP2018108062 A JP 2018108062A JP 7144200 B2 JP7144200 B2 JP 7144200B2
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- Prior art keywords
- processing
- rectangular workpiece
- planned division
- holding
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims description 29
- 238000003754 machining Methods 0.000 title claims description 21
- 239000002184 metal Substances 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 238000001514 detection method Methods 0.000 claims description 15
- 238000003384 imaging method Methods 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 70
- 238000010586 diagram Methods 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000003672 processing method Methods 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018108062A JP7144200B2 (ja) | 2018-06-05 | 2018-06-05 | 矩形被加工物の加工方法 |
CN201910444699.3A CN110571146B (zh) | 2018-06-05 | 2019-05-27 | 矩形被加工物的加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018108062A JP7144200B2 (ja) | 2018-06-05 | 2018-06-05 | 矩形被加工物の加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019212773A JP2019212773A (ja) | 2019-12-12 |
JP7144200B2 true JP7144200B2 (ja) | 2022-09-29 |
Family
ID=68772852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018108062A Active JP7144200B2 (ja) | 2018-06-05 | 2018-06-05 | 矩形被加工物の加工方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7144200B2 (zh) |
CN (1) | CN110571146B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004247348A (ja) | 2003-02-10 | 2004-09-02 | Murata Mfg Co Ltd | ダイシング方法 |
JP2015109325A (ja) | 2013-12-04 | 2015-06-11 | 株式会社ディスコ | パッケージ基板の加工方法 |
JP6232255B2 (ja) | 2013-10-25 | 2017-11-15 | ホーチキ株式会社 | 放水継手 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06232255A (ja) * | 1993-01-29 | 1994-08-19 | Disco Abrasive Syst Ltd | ウェーハのダイシング方法 |
JP2013058653A (ja) * | 2011-09-09 | 2013-03-28 | Disco Abrasive Syst Ltd | 板状物の分割方法 |
JP6328513B2 (ja) * | 2014-07-28 | 2018-05-23 | 株式会社ディスコ | ウエーハの加工方法 |
-
2018
- 2018-06-05 JP JP2018108062A patent/JP7144200B2/ja active Active
-
2019
- 2019-05-27 CN CN201910444699.3A patent/CN110571146B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004247348A (ja) | 2003-02-10 | 2004-09-02 | Murata Mfg Co Ltd | ダイシング方法 |
JP6232255B2 (ja) | 2013-10-25 | 2017-11-15 | ホーチキ株式会社 | 放水継手 |
JP2015109325A (ja) | 2013-12-04 | 2015-06-11 | 株式会社ディスコ | パッケージ基板の加工方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2019212773A (ja) | 2019-12-12 |
CN110571146A (zh) | 2019-12-13 |
CN110571146B (zh) | 2024-03-15 |
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