JP7034700B2 - 搬送装置、樹脂成形装置及び樹脂成形品製造方法 - Google Patents
搬送装置、樹脂成形装置及び樹脂成形品製造方法 Download PDFInfo
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- JP7034700B2 JP7034700B2 JP2017245003A JP2017245003A JP7034700B2 JP 7034700 B2 JP7034700 B2 JP 7034700B2 JP 2017245003 A JP2017245003 A JP 2017245003A JP 2017245003 A JP2017245003 A JP 2017245003A JP 7034700 B2 JP7034700 B2 JP 7034700B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/26—Component parts, details or accessories; Auxiliary operations
- B29C51/261—Handling means, e.g. transfer means, feeding means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/10—Forming by pressure difference, e.g. vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/14—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor using multilayered preforms or sheets
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017245003A JP7034700B2 (ja) | 2017-12-21 | 2017-12-21 | 搬送装置、樹脂成形装置及び樹脂成形品製造方法 |
CN201811024562.4A CN109940792B (zh) | 2017-12-21 | 2018-09-04 | 搬送装置、树脂成形装置以及树脂成形品制造方法 |
TW107132286A TWI734026B (zh) | 2017-12-21 | 2018-09-13 | 搬送裝置、樹脂成形裝置以及樹脂成形品製造方法 |
KR1020180117431A KR102198457B1 (ko) | 2017-12-21 | 2018-10-02 | 반송 장치, 수지 성형 장치 및 수지 성형품 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017245003A JP7034700B2 (ja) | 2017-12-21 | 2017-12-21 | 搬送装置、樹脂成形装置及び樹脂成形品製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019111673A JP2019111673A (ja) | 2019-07-11 |
JP7034700B2 true JP7034700B2 (ja) | 2022-03-14 |
Family
ID=67006360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017245003A Active JP7034700B2 (ja) | 2017-12-21 | 2017-12-21 | 搬送装置、樹脂成形装置及び樹脂成形品製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7034700B2 (zh) |
KR (1) | KR102198457B1 (zh) |
CN (1) | CN109940792B (zh) |
TW (1) | TWI734026B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7377189B2 (ja) * | 2020-12-14 | 2023-11-09 | Towa株式会社 | 搬送装置、樹脂成形装置、及び、樹脂成形品の製造方法 |
CN118024485B (zh) * | 2024-04-15 | 2024-06-14 | 福建荣阳鞋业有限公司 | 一种鞋底成型模具及其制作工艺 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003068830A (ja) | 2001-08-23 | 2003-03-07 | Advantest Corp | ウエハ搬送用の位置決め固定装置 |
US20040101631A1 (en) | 2002-11-26 | 2004-05-27 | Towa Corporation | Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material |
JP2013153146A (ja) | 2011-12-27 | 2013-08-08 | Apic Yamada Corp | 樹脂封止方法及び樹脂封止装置 |
JP2015041640A (ja) | 2013-08-20 | 2015-03-02 | Towa株式会社 | 基板の搬送供給方法及び基板の搬送供給装置 |
JP2016111323A (ja) | 2014-11-26 | 2016-06-20 | 株式会社デンソー | 基板固定装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0691151B2 (ja) * | 1987-11-27 | 1994-11-14 | 富士電機株式会社 | 半導体ウエハ搬送機器のウエハセンタリング位置決め装置 |
JPH0644941Y2 (ja) * | 1992-02-13 | 1994-11-16 | 株式会社壬生電機製作所 | 束輪状チューブ及び束輪状線材等の束輪状体の支持ドラム |
JP4162282B2 (ja) * | 1997-12-24 | 2008-10-08 | アピックヤマダ株式会社 | 樹脂モールド装置 |
KR101077075B1 (ko) * | 2008-11-25 | 2011-10-26 | 세크론 주식회사 | 반도체소자 몰딩 금형장치용 로더, 이를 구비한 반도체소자몰딩 금형장치 및 이를 이용한 반도체소자 몰딩방법 |
US20100194009A1 (en) * | 2009-02-03 | 2010-08-05 | Wkk Distribution, Ltd. | Substrate holding platen with adjustable shims |
CN202985183U (zh) * | 2012-12-14 | 2013-06-12 | 铜陵市金利电子有限公司 | 用于钻床的三爪盘式夹具 |
DE202014004713U1 (de) * | 2014-06-06 | 2015-04-13 | Klingelnberg Ag | Spannsystem für ein Werkstück auf einer Messmaschine |
JP6612024B2 (ja) * | 2014-09-30 | 2019-11-27 | Towa株式会社 | 樹脂成形装置、樹脂成形方法及び樹脂成形品の製造方法 |
CN205058373U (zh) * | 2015-10-14 | 2016-03-02 | 巢湖市荣达塑业有限公司 | 一种振动装置 |
JP2017212419A (ja) * | 2016-05-27 | 2017-11-30 | Towa株式会社 | 樹脂封止品製造方法及び樹脂封止装置 |
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2017
- 2017-12-21 JP JP2017245003A patent/JP7034700B2/ja active Active
-
2018
- 2018-09-04 CN CN201811024562.4A patent/CN109940792B/zh active Active
- 2018-09-13 TW TW107132286A patent/TWI734026B/zh active
- 2018-10-02 KR KR1020180117431A patent/KR102198457B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003068830A (ja) | 2001-08-23 | 2003-03-07 | Advantest Corp | ウエハ搬送用の位置決め固定装置 |
US20040101631A1 (en) | 2002-11-26 | 2004-05-27 | Towa Corporation | Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material |
JP2013153146A (ja) | 2011-12-27 | 2013-08-08 | Apic Yamada Corp | 樹脂封止方法及び樹脂封止装置 |
JP2015041640A (ja) | 2013-08-20 | 2015-03-02 | Towa株式会社 | 基板の搬送供給方法及び基板の搬送供給装置 |
JP2016111323A (ja) | 2014-11-26 | 2016-06-20 | 株式会社デンソー | 基板固定装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20190075790A (ko) | 2019-07-01 |
CN109940792A (zh) | 2019-06-28 |
KR102198457B1 (ko) | 2021-01-06 |
TW201929101A (zh) | 2019-07-16 |
CN109940792B (zh) | 2022-03-08 |
TWI734026B (zh) | 2021-07-21 |
JP2019111673A (ja) | 2019-07-11 |
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