JP7034700B2 - 搬送装置、樹脂成形装置及び樹脂成形品製造方法 - Google Patents

搬送装置、樹脂成形装置及び樹脂成形品製造方法 Download PDF

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Publication number
JP7034700B2
JP7034700B2 JP2017245003A JP2017245003A JP7034700B2 JP 7034700 B2 JP7034700 B2 JP 7034700B2 JP 2017245003 A JP2017245003 A JP 2017245003A JP 2017245003 A JP2017245003 A JP 2017245003A JP 7034700 B2 JP7034700 B2 JP 7034700B2
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Japan
Prior art keywords
edge
molding
molded
molding target
mounting portion
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JP2017245003A
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English (en)
Japanese (ja)
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JP2019111673A (ja
Inventor
俊洋 八木
佳久 川本
範行 高橋
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Towa Corp
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Towa Corp
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Priority to JP2017245003A priority Critical patent/JP7034700B2/ja
Priority to CN201811024562.4A priority patent/CN109940792B/zh
Priority to TW107132286A priority patent/TWI734026B/zh
Priority to KR1020180117431A priority patent/KR102198457B1/ko
Publication of JP2019111673A publication Critical patent/JP2019111673A/ja
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Publication of JP7034700B2 publication Critical patent/JP7034700B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/26—Component parts, details or accessories; Auxiliary operations
    • B29C51/261—Handling means, e.g. transfer means, feeding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/10—Forming by pressure difference, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/14—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor using multilayered preforms or sheets

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2017245003A 2017-12-21 2017-12-21 搬送装置、樹脂成形装置及び樹脂成形品製造方法 Active JP7034700B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017245003A JP7034700B2 (ja) 2017-12-21 2017-12-21 搬送装置、樹脂成形装置及び樹脂成形品製造方法
CN201811024562.4A CN109940792B (zh) 2017-12-21 2018-09-04 搬送装置、树脂成形装置以及树脂成形品制造方法
TW107132286A TWI734026B (zh) 2017-12-21 2018-09-13 搬送裝置、樹脂成形裝置以及樹脂成形品製造方法
KR1020180117431A KR102198457B1 (ko) 2017-12-21 2018-10-02 반송 장치, 수지 성형 장치 및 수지 성형품 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017245003A JP7034700B2 (ja) 2017-12-21 2017-12-21 搬送装置、樹脂成形装置及び樹脂成形品製造方法

Publications (2)

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JP2019111673A JP2019111673A (ja) 2019-07-11
JP7034700B2 true JP7034700B2 (ja) 2022-03-14

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JP2017245003A Active JP7034700B2 (ja) 2017-12-21 2017-12-21 搬送装置、樹脂成形装置及び樹脂成形品製造方法

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Country Link
JP (1) JP7034700B2 (zh)
KR (1) KR102198457B1 (zh)
CN (1) CN109940792B (zh)
TW (1) TWI734026B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7377189B2 (ja) * 2020-12-14 2023-11-09 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置、及び、樹脂成形品の製造方法
CN118024485B (zh) * 2024-04-15 2024-06-14 福建荣阳鞋业有限公司 一种鞋底成型模具及其制作工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068830A (ja) 2001-08-23 2003-03-07 Advantest Corp ウエハ搬送用の位置決め固定装置
US20040101631A1 (en) 2002-11-26 2004-05-27 Towa Corporation Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material
JP2013153146A (ja) 2011-12-27 2013-08-08 Apic Yamada Corp 樹脂封止方法及び樹脂封止装置
JP2015041640A (ja) 2013-08-20 2015-03-02 Ｔｏｗａ株式会社 基板の搬送供給方法及び基板の搬送供給装置
JP2016111323A (ja) 2014-11-26 2016-06-20 株式会社デンソー 基板固定装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0691151B2 (ja) * 1987-11-27 1994-11-14 富士電機株式会社 半導体ウエハ搬送機器のウエハセンタリング位置決め装置
JPH0644941Y2 (ja) * 1992-02-13 1994-11-16 株式会社壬生電機製作所 束輪状チューブ及び束輪状線材等の束輪状体の支持ドラム
JP4162282B2 (ja) * 1997-12-24 2008-10-08 アピックヤマダ株式会社 樹脂モールド装置
KR101077075B1 (ko) * 2008-11-25 2011-10-26 세크론 주식회사 반도체소자 몰딩 금형장치용 로더, 이를 구비한 반도체소자몰딩 금형장치 및 이를 이용한 반도체소자 몰딩방법
US20100194009A1 (en) * 2009-02-03 2010-08-05 Wkk Distribution, Ltd. Substrate holding platen with adjustable shims
CN202985183U (zh) * 2012-12-14 2013-06-12 铜陵市金利电子有限公司 用于钻床的三爪盘式夹具
DE202014004713U1 (de) * 2014-06-06 2015-04-13 Klingelnberg Ag Spannsystem für ein Werkstück auf einer Messmaschine
JP6612024B2 (ja) * 2014-09-30 2019-11-27 Ｔｏｗａ株式会社 樹脂成形装置、樹脂成形方法及び樹脂成形品の製造方法
CN205058373U (zh) * 2015-10-14 2016-03-02 巢湖市荣达塑业有限公司 一种振动装置
JP2017212419A (ja) * 2016-05-27 2017-11-30 Ｔｏｗａ株式会社 樹脂封止品製造方法及び樹脂封止装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068830A (ja) 2001-08-23 2003-03-07 Advantest Corp ウエハ搬送用の位置決め固定装置
US20040101631A1 (en) 2002-11-26 2004-05-27 Towa Corporation Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material
JP2013153146A (ja) 2011-12-27 2013-08-08 Apic Yamada Corp 樹脂封止方法及び樹脂封止装置
JP2015041640A (ja) 2013-08-20 2015-03-02 Ｔｏｗａ株式会社 基板の搬送供給方法及び基板の搬送供給装置
JP2016111323A (ja) 2014-11-26 2016-06-20 株式会社デンソー 基板固定装置

Also Published As

Publication number Publication date
KR20190075790A (ko) 2019-07-01
CN109940792A (zh) 2019-06-28
KR102198457B1 (ko) 2021-01-06
TW201929101A (zh) 2019-07-16
CN109940792B (zh) 2022-03-08
TWI734026B (zh) 2021-07-21
JP2019111673A (ja) 2019-07-11

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