JP6974087B2 - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP6974087B2 JP6974087B2 JP2017176633A JP2017176633A JP6974087B2 JP 6974087 B2 JP6974087 B2 JP 6974087B2 JP 2017176633 A JP2017176633 A JP 2017176633A JP 2017176633 A JP2017176633 A JP 2017176633A JP 6974087 B2 JP6974087 B2 JP 6974087B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- blade
- light receiving
- face
- cleaning liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/007—Cleaning of grinding wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
18:チャックテーブル
24:切削手段
26:スピンドル
28:切削ブレード
28a:切り刃
50:ブレード監視器
56:調整ねじ
60:移動ブロック
70:発光部
71:発光素子
72:光ファイバ
74:出射端面
75:第1リング部材
75a:凹み部
80:受光部
81:受光素子
82:光ファイバ
84:受光端面
85:第2リング部材
85a:凹み部
90:洗浄液供給機構
91:洗浄液貯留タンク
92:チューブ
93、94:開閉バルブ
100:制御手段
Claims (2)
- 被加工物を保持する保持手段と、該保持手段に保持された被加工物に切削水を供給しながら切削ブレードを回転させて切削加工を施す切削手段と、該保持手段と該切削手段とを相対的に加工送りする加工送り手段と、から少なくとも構成される切削装置であって、
該切削手段は、切削ブレードを回転可能に装着したスピンドルと、該スピンドルを回転可能に支持するスピンドルハウジングと、該スピンドルハウジングに装着され該切削ブレードを覆うブレードカバーと、該切削ブレードに切削水を供給する切削水供給ノズルと、切削ブレードの切り刃を監視する端面を有するブレード監視器とを備え、
該ブレード監視器は、出射端面を備えた発光部と、受光端面を備えた受光部とを備え、
該出射端面の表面と該受光端面の表面のそれぞれに凹み部を備え、
該出射端面の凹み部と、該受光端面の凹み部には、該切削ブレードの回転が停止している際に該出射端面と該受光端面とを浄化する洗浄液が供給されて、表面張力の作用により該出射端面の凹み部と該受光端面の凹み部とに保持され、切削加工が実施される際に該洗浄液の供給がされず該凹み部から該洗浄液が除去される切削装置。 - 該洗浄液は、希釈フッ酸、界面活性剤のいずれかを含む請求項1に記載の切削装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017176633A JP6974087B2 (ja) | 2017-09-14 | 2017-09-14 | 切削装置 |
CN201811049756.XA CN109501015B (zh) | 2017-09-14 | 2018-09-10 | 切削装置 |
US16/128,874 US11389920B2 (en) | 2017-09-14 | 2018-09-12 | Cutting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017176633A JP6974087B2 (ja) | 2017-09-14 | 2017-09-14 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019054081A JP2019054081A (ja) | 2019-04-04 |
JP6974087B2 true JP6974087B2 (ja) | 2021-12-01 |
Family
ID=65630337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017176633A Active JP6974087B2 (ja) | 2017-09-14 | 2017-09-14 | 切削装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11389920B2 (ja) |
JP (1) | JP6974087B2 (ja) |
CN (1) | CN109501015B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112606234A (zh) * | 2020-12-28 | 2021-04-06 | 郑州光力瑞弘电子科技有限公司 | 划片机刀片监测装置及划片机 |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59122209U (ja) * | 1983-02-07 | 1984-08-17 | 株式会社デイスコ | 切断機 |
JP2627913B2 (ja) | 1988-02-17 | 1997-07-09 | 株式会社デイスコ | 加工装置 |
JPH08288244A (ja) * | 1995-04-11 | 1996-11-01 | Disco Abrasive Syst Ltd | 光学検出手段 |
CN2262365Y (zh) * | 1996-06-26 | 1997-09-17 | 中国石油化工总公司抚顺石油化工研究院 | 取用方便的隐型眼镜保存器具 |
KR100225909B1 (ko) * | 1997-05-29 | 1999-10-15 | 윤종용 | 웨이퍼 소잉 장치 |
JPH11179659A (ja) * | 1997-12-16 | 1999-07-06 | Disco Abrasive Syst Ltd | 切削水供給装置 |
US6139591A (en) * | 1998-03-04 | 2000-10-31 | Tokyo Seimitsu Co., Ltd. | Wafer separating and cleaning apparatus and process |
US6692339B1 (en) * | 1999-11-05 | 2004-02-17 | Strasbaugh | Combined chemical mechanical planarization and cleaning |
JP4590058B2 (ja) * | 2000-04-12 | 2010-12-01 | 株式会社ディスコ | 切削装置の切削ブレード検出機構 |
JP3330590B2 (ja) * | 2000-05-09 | 2002-09-30 | 松下電器産業株式会社 | 放電ランプ用の透光性の管の洗浄方法および、放電ランプ |
US6719613B2 (en) * | 2000-08-10 | 2004-04-13 | Nanoclean Technologies, Inc. | Methods for cleaning surfaces substantially free of contaminants utilizing filtered carbon dioxide |
US6579149B2 (en) * | 2001-02-06 | 2003-06-17 | International Business Machines Corporation | Support and alignment device for enabling chemical mechanical polishing rinse and film measurements |
JP2002343745A (ja) * | 2001-05-14 | 2002-11-29 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
DK2461156T3 (da) * | 2001-06-29 | 2020-08-03 | Meso Scale Technologies Llc | Indretning til luminescenstestmålinger |
US6666749B2 (en) * | 2001-08-30 | 2003-12-23 | Micron Technology, Inc. | Apparatus and method for enhanced processing of microelectronic workpieces |
US20040242121A1 (en) * | 2003-05-16 | 2004-12-02 | Kazuto Hirokawa | Substrate polishing apparatus |
EP1708249A2 (en) * | 2005-03-31 | 2006-10-04 | Kaijo Corporation | Cleaning device and cleaning method |
JP4704816B2 (ja) * | 2005-06-29 | 2011-06-22 | 株式会社ディスコ | 切削装置 |
JP5068621B2 (ja) * | 2007-10-03 | 2012-11-07 | 株式会社ディスコ | 切削装置 |
JP2009083077A (ja) * | 2007-10-03 | 2009-04-23 | Disco Abrasive Syst Ltd | 切削ブレード検出機構 |
DE102007048295A1 (de) * | 2007-10-08 | 2009-04-16 | Precitec Optronik Gmbh | Vorrichtung und Verfahren zur Dickenmessung |
US7495759B1 (en) * | 2007-10-23 | 2009-02-24 | Asm Assembly Automation Ltd. | Damage and wear detection for rotary cutting blades |
JP2010114251A (ja) * | 2008-11-06 | 2010-05-20 | Disco Abrasive Syst Ltd | 切削装置 |
JP5123329B2 (ja) * | 2010-01-07 | 2013-01-23 | 株式会社岡本工作機械製作所 | 半導体基板の平坦化加工装置および平坦化加工方法 |
CN201997532U (zh) * | 2011-01-25 | 2011-10-05 | 王慧 | 油镜镜片清洁装置 |
CN102214553A (zh) * | 2011-05-23 | 2011-10-12 | 叶伟清 | 晶圆端面清洗方法 |
TW201311882A (zh) * | 2011-09-13 | 2013-03-16 | Anji Microelectronics Co Ltd | 含氟清洗液 |
JP2014041411A (ja) * | 2012-08-21 | 2014-03-06 | Nexco-Engineering Hokkaido Co Ltd | 車両検出器 |
JP2014108463A (ja) * | 2012-11-30 | 2014-06-12 | Disco Abrasive Syst Ltd | 切削装置 |
CN104493988B (zh) * | 2014-12-30 | 2016-03-02 | 晶伟电子材料有限公司 | 一种用于硅片切割的高粘度砂浆切割工艺 |
JP6441704B2 (ja) * | 2015-02-10 | 2018-12-19 | 株式会社ディスコ | 切削装置 |
JP6462422B2 (ja) * | 2015-03-03 | 2019-01-30 | 株式会社ディスコ | 切削装置及びウエーハの加工方法 |
JP6487800B2 (ja) * | 2015-07-28 | 2019-03-20 | 株式会社ディスコ | 基板の加工方法及び加工装置 |
GB2542630A (en) * | 2015-09-28 | 2017-03-29 | Medimauve Ltd | Sachet system |
JP6605976B2 (ja) * | 2016-02-08 | 2019-11-13 | 株式会社ディスコ | 切削装置 |
CN206178276U (zh) * | 2016-08-04 | 2017-05-17 | 胡瀚 | 一种全自动隐形眼镜清洗装置 |
CN206224085U (zh) * | 2016-11-18 | 2017-06-06 | 苏州三个臭皮匠生物科技有限公司 | 可拆卸清洗槽的隐形眼镜还原仪 |
DE102017126310A1 (de) * | 2017-11-09 | 2019-05-09 | Precitec Optronik Gmbh | Abstandsmessvorrichtung |
KR102538861B1 (ko) * | 2017-12-26 | 2023-06-01 | 가부시키가이샤 에바라 세이사꾸쇼 | 자성 소자 및 그것을 사용한 와전류식 센서 |
-
2017
- 2017-09-14 JP JP2017176633A patent/JP6974087B2/ja active Active
-
2018
- 2018-09-10 CN CN201811049756.XA patent/CN109501015B/zh active Active
- 2018-09-12 US US16/128,874 patent/US11389920B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN109501015A (zh) | 2019-03-22 |
CN109501015B (zh) | 2022-05-17 |
JP2019054081A (ja) | 2019-04-04 |
US20190076981A1 (en) | 2019-03-14 |
US11389920B2 (en) | 2022-07-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5068621B2 (ja) | 切削装置 | |
US11171056B2 (en) | Wafer processing method | |
JP4827576B2 (ja) | 切削装置 | |
JP2009083077A (ja) | 切削ブレード検出機構 | |
US6552811B2 (en) | Cutting blade detection mechanism for a cutting machine | |
US7608523B2 (en) | Wafer processing method and adhesive tape used in the wafer processing method | |
JP5172383B2 (ja) | 切削ブレード検出機構 | |
JP2011108979A (ja) | 被加工物の切削方法 | |
JP2010123823A (ja) | 切削装置 | |
JP2014108463A (ja) | 切削装置 | |
JP5892831B2 (ja) | 切削装置 | |
TWI788505B (zh) | 切削刀的管理方法及切削裝置 | |
JP5220513B2 (ja) | ノズル調整治具 | |
JP6974087B2 (ja) | 切削装置 | |
JP5769475B2 (ja) | 加工液供給ノズルの品質管理方法 | |
JP2009018368A (ja) | 加工装置 | |
JP2012040651A (ja) | 切削ブレード検出機構 | |
CN110193752B (zh) | 拍摄图像形成单元 | |
JP5465064B2 (ja) | ノズル調整治具 | |
JP5611012B2 (ja) | 切削ブレード検出機構 | |
JP5603175B2 (ja) | 切削装置の切削ブレード検出機構 | |
JP5528245B2 (ja) | 切削方法 | |
JP7058908B2 (ja) | 切削装置 | |
JP2013219215A (ja) | サファイアウエーハの加工方法 | |
JP2012111003A (ja) | 切削ブレード検出機構 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200703 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20210618 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210727 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210924 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20211012 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20211104 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6974087 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |