JP6809334B2 - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
- Publication number
- JP6809334B2 JP6809334B2 JP2017064123A JP2017064123A JP6809334B2 JP 6809334 B2 JP6809334 B2 JP 6809334B2 JP 2017064123 A JP2017064123 A JP 2017064123A JP 2017064123 A JP2017064123 A JP 2017064123A JP 6809334 B2 JP6809334 B2 JP 6809334B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- semiconductor device
- forming surface
- electrode forming
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 88
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 239000000758 substrate Substances 0.000 claims description 37
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 claims description 36
- 229910001195 gallium oxide Inorganic materials 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 23
- 230000001681 protective effect Effects 0.000 claims description 10
- 238000005498 polishing Methods 0.000 claims description 7
- 238000009751 slip forming Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 50
- 238000005530 etching Methods 0.000 description 10
- 238000003776 cleavage reaction Methods 0.000 description 9
- 230000007017 scission Effects 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 239000010936 titanium Substances 0.000 description 8
- 239000007772 electrode material Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 5
- 238000000227 grinding Methods 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- 238000005336 cracking Methods 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- -1 Si 3 N 4 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/47—Schottky barrier electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
- H01L21/048—Making electrodes
- H01L21/0495—Schottky electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3185—Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0661—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body specially adapted for altering the breakdown voltage by removing semiconductor material at, or in the neighbourhood of, a reverse biased junction, e.g. by bevelling, moat etching, depletion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/24—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
- Formation Of Insulating Films (AREA)
Description
20 半導体層
20a 第1の電極形成面
20b 第2の電極形成面
20c 側面
21 半導体基板
22 エピタキシャル層
30 絶縁膜
30a 開口部
31 第1の部分
32 第2の部分
40 アノード電極
50 カソード電極
60 スリット
61 内壁
70 支持部材
80 保護部材
E1 第1のエッジ
E2 第2のエッジ
M1 エッチング用マスク
W 酸化ガリウムウェーハ
Claims (8)
- 第1の電極形成面と、前記第1の電極形成面の反対側に位置する第2の電極形成面と、前記第1の電極形成面との境界である第1のエッジ及び前記第2の電極形成面との境界である第2のエッジを有する側面とを有する半導体層と、
前記第1の電極形成面に形成された第1の電極と、
前記第2の電極形成面に形成された第2の電極と、
前記第1のエッジを覆うよう、前記第1の電極形成面から前記側面に亘って連続的に形成された絶縁膜と、を備え、
前記半導体層の前記側面は、露出することなく前記絶縁膜によって全面が覆われ、
前記第2の電極の側面は、前記絶縁膜によって覆われることなく露出していることを特徴とする半導体装置。 - 前記半導体層は、前記第2の電極形成面を構成する半導体基板と、前記半導体基板上に設けられ前記第1の電極形成面を構成するエピタキシャル層とを含み、
前記第1の電極の少なくとも一部は前記エピタキシャル層とショットキー接触し、前記第2の電極は前記半導体基板とオーミック接触すること特徴とする請求項1に記載の半導体装置。 - 前記第1の電極の別の一部は、前記第1の電極形成面に形成された前記絶縁膜上に形成されていることを特徴とする請求項2に記載の半導体装置。
- 前記半導体層は、酸化ガリウムからなること特徴とする請求項1乃至3のいずれか一項に記載の半導体装置。
- 前記半導体層は、前記第1の電極形成面から前記第2の電極形成面に向かって断面が拡大するテーパー形状を有していることを特徴とする請求項1乃至4のいずれか一項に記載の半導体装置。
- 酸化ガリウムウェーハの表面にエピタキシャル層を形成する第1の工程と、
前記エピタキシャル層を貫通し、前記酸化ガリウムウェーハに達する深さのスリットを形成する第2の工程と、
前記スリットの開口部であるエッジが覆われるよう、前記エピタキシャル層の表面及び前記スリットの内壁に絶縁膜を形成する第3の工程と、
前記絶縁膜に開口部を形成することによって前記エピタキシャル層の表面を露出させた後、前記エピタキシャル層と接するアノード電極を形成する第4の工程と、
前記第4の工程を行った後、前記スリットに達するまで前記酸化ガリウムウェーハの下面を研磨することによって個片化する第5の工程と、
前記第5の工程を行った後、前記酸化ガリウムウェーハの下面にカソード電極を形成する第6の工程と、を備えることを特徴とする半導体装置の製造方法。
- 前記スリットの一部を保護部材で埋め込んだ状態で前記第6の工程を行うこと特徴とする請求項6に記載の半導体装置の製造方法。
- 前記第6の工程を行う前に、可撓性を有する支持部材を前記エピタキシャル層側に貼り付け、前記支持部材に圧力を加えることによって変形した前記支持部材の一部を前記保護部材として用いること特徴とする請求項7に記載の半導体装置の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017064123A JP6809334B2 (ja) | 2017-03-29 | 2017-03-29 | 半導体装置及びその製造方法 |
PCT/JP2018/002438 WO2018179768A1 (ja) | 2017-03-29 | 2018-01-26 | 半導体装置 |
US16/496,715 US11164953B2 (en) | 2017-03-29 | 2018-01-26 | Semiconductor device |
CN201880022742.0A CN110521004B (zh) | 2017-03-29 | 2018-01-26 | 半导体装置 |
EP18778040.8A EP3608972B1 (en) | 2017-03-29 | 2018-01-26 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017064123A JP6809334B2 (ja) | 2017-03-29 | 2017-03-29 | 半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018170305A JP2018170305A (ja) | 2018-11-01 |
JP6809334B2 true JP6809334B2 (ja) | 2021-01-06 |
Family
ID=63674938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017064123A Active JP6809334B2 (ja) | 2017-03-29 | 2017-03-29 | 半導体装置及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11164953B2 (ja) |
EP (1) | EP3608972B1 (ja) |
JP (1) | JP6809334B2 (ja) |
CN (1) | CN110521004B (ja) |
WO (1) | WO2018179768A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112018003362B4 (de) * | 2017-06-29 | 2023-08-10 | Mitsubishi Electric Corporation | Oxid-Halbleitereinheiten und Verfahren zur Herstellung von Oxid-Halbleitereinheiten |
JP7279354B2 (ja) * | 2018-12-17 | 2023-05-23 | 富士電機株式会社 | 半導体素子及び半導体素子の識別方法 |
CN111540788A (zh) * | 2020-06-18 | 2020-08-14 | 中国科学院半导体研究所 | 一种肖特基二极管及制备方法 |
CN114497234B (zh) * | 2022-01-25 | 2022-12-06 | 先之科半导体科技(东莞)有限公司 | 一种低损耗小体积的肖特基二极管 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09116133A (ja) * | 1995-10-13 | 1997-05-02 | Toyo Electric Mfg Co Ltd | 高耐圧半導体装置 |
JP2002353227A (ja) | 2001-05-28 | 2002-12-06 | Sanken Electric Co Ltd | 半導体素子 |
JP2004119472A (ja) * | 2002-09-24 | 2004-04-15 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
JP4697397B2 (ja) * | 2005-02-16 | 2011-06-08 | サンケン電気株式会社 | 複合半導体装置 |
JP4945969B2 (ja) * | 2005-09-07 | 2012-06-06 | 横河電機株式会社 | 半導体装置及び半導体装置の製造方法 |
JP2009267032A (ja) * | 2008-04-24 | 2009-11-12 | Toyota Motor Corp | 半導体装置とその製造方法 |
JP2013102081A (ja) * | 2011-11-09 | 2013-05-23 | Tamura Seisakusho Co Ltd | ショットキーバリアダイオード |
JP5914060B2 (ja) * | 2012-03-09 | 2016-05-11 | 三菱電機株式会社 | 炭化珪素半導体装置の製造方法 |
JP2014107499A (ja) * | 2012-11-29 | 2014-06-09 | Sumitomo Electric Ind Ltd | 炭化珪素半導体装置およびその製造方法 |
JP2014225557A (ja) * | 2013-05-16 | 2014-12-04 | 住友電気工業株式会社 | 炭化珪素半導体装置および半導体モジュールの製造方法、ならびに炭化珪素半導体装置および半導体モジュール |
-
2017
- 2017-03-29 JP JP2017064123A patent/JP6809334B2/ja active Active
-
2018
- 2018-01-26 EP EP18778040.8A patent/EP3608972B1/en active Active
- 2018-01-26 US US16/496,715 patent/US11164953B2/en active Active
- 2018-01-26 WO PCT/JP2018/002438 patent/WO2018179768A1/ja unknown
- 2018-01-26 CN CN201880022742.0A patent/CN110521004B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
WO2018179768A1 (ja) | 2018-10-04 |
JP2018170305A (ja) | 2018-11-01 |
EP3608972B1 (en) | 2024-03-20 |
CN110521004B (zh) | 2023-01-10 |
EP3608972A1 (en) | 2020-02-12 |
CN110521004A (zh) | 2019-11-29 |
US11164953B2 (en) | 2021-11-02 |
EP3608972A4 (en) | 2020-12-16 |
US20200111882A1 (en) | 2020-04-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6809334B2 (ja) | 半導体装置及びその製造方法 | |
KR101542026B1 (ko) | Ⅲ족 질화물 반도체 수직형 구조 led 칩 및 그 제조 방법 | |
US8859315B2 (en) | Epitaxial wafer and manufacturing method thereof | |
JP5774712B2 (ja) | 半導体素子およびその製造方法 | |
JP6794896B2 (ja) | 酸化ガリウム半導体装置の製造方法 | |
JP2008124409A (ja) | 化合物半導体素子 | |
CN113939918A (zh) | 半导体装置及其制造方法 | |
US20150200265A1 (en) | Solder-containing semiconductor device, mounted solder-containing semiconductor device, producing method and mounting method of solder-containing semiconductor device | |
KR20070044099A (ko) | 질화물 반도체 발광 다이오드 및 그 제조방법 | |
US9257574B2 (en) | Diode and method of manufacturing diode | |
JP5564799B2 (ja) | 窒化ガリウム系半導体電子デバイスを作製する方法 | |
KR101841631B1 (ko) | 고전자이동도 트랜지스터 및 그의 제조방법 | |
WO2021124650A1 (ja) | ショットキーバリアダイオード | |
US20230030874A1 (en) | Semiconductor element, method for manufacturing semiconductor element, semiconductor device, and method for manufacturing semiconductor device | |
TWI570957B (zh) | 半導體發光元件之製造方法 | |
KR102526716B1 (ko) | 갈륨나이트라이드계 접합형 전계 효과 트랜지스터 및 그 제조 방법 | |
TWI803189B (zh) | 肖特基能障二極體 | |
WO2023095396A1 (ja) | ジャンクションバリアショットキーダイオード | |
WO2021186936A1 (ja) | ショットキーバリアダイオード | |
TW202412325A (zh) | 肖特基能障二極體 | |
KR101432908B1 (ko) | 반도체 기판 및 이를 이용한 반도체 소자의 제조 방법 | |
JP5723431B2 (ja) | Iii族窒化物半導体縦型構造ledチップ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20191212 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200804 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200928 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20201027 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201029 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20201110 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20201123 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6809334 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |