JP6774589B1 - 樹脂組成物のエッチング液及びエッチング方法 - Google Patents

樹脂組成物のエッチング液及びエッチング方法 Download PDF

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JP6774589B1
JP6774589B1 JP2020526634A JP2020526634A JP6774589B1 JP 6774589 B1 JP6774589 B1 JP 6774589B1 JP 2020526634 A JP2020526634 A JP 2020526634A JP 2020526634 A JP2020526634 A JP 2020526634A JP 6774589 B1 JP6774589 B1 JP 6774589B1
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etching
resin composition
mass
resin
etching solution
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JPWO2020158610A1 (ja
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寛彦 後閑
寛彦 後閑
昌大 田邉
昌大 田邉
隆 宮崎
隆 宮崎
豊田 裕二
裕二 豊田
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Mitsubishi Paper Mills Ltd
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Mitsubishi Paper Mills Ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00Etching, surface-brightening or pickling compositions
    • C09K13/02Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/02Chemical treatment or coating of shaped articles made of macromolecular substances with solvents, e.g. swelling agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308Chemical or electrical treatment, e.g. electrolytic etching using masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2020526634A 2019-01-28 2020-01-24 樹脂組成物のエッチング液及びエッチング方法 Active JP6774589B1 (ja)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP2019012382 2019-01-28
JP2019012382 2019-01-28
JP2019154892 2019-08-27
JP2019154892 2019-08-27
JP2019177681 2019-09-27
JP2019177681 2019-09-27
JP2019211150 2019-11-22
JP2019211150 2019-11-22
JP2019227548 2019-12-17
JP2019227548 2019-12-17
PCT/JP2020/002551 WO2020158610A1 (ja) 2019-01-28 2020-01-24 樹脂組成物のエッチング液及びエッチング方法

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JP6774589B1 true JP6774589B1 (ja) 2020-10-28
JPWO2020158610A1 JPWO2020158610A1 (ja) 2021-02-18

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JP (1) JP6774589B1 (ko)
KR (1) KR102376557B1 (ko)
CN (1) CN113348226A (ko)
TW (1) TW202039660A (ko)
WO (1) WO2020158610A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI780783B (zh) * 2021-06-18 2022-10-11 大陸商律勝科技(蘇州)有限公司 印刷電路板之製造方法及具保護層之印刷電路板
CN115011348B (zh) * 2022-06-30 2023-12-29 湖北兴福电子材料股份有限公司 一种氮化铝蚀刻液及其应用

Citations (8)

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JP2001310959A (ja) * 2000-02-23 2001-11-06 Toray Ind Inc 樹脂膜のウエットエッチング用エッチング液及びそれを用いて成るエッチング方法
JP2001358428A (ja) * 2000-06-14 2001-12-26 Toray Ind Inc エッチング方法
JP2006324452A (ja) * 2005-05-19 2006-11-30 Wako Pure Chem Ind Ltd 半導体基板表面処理剤及び処理方法
US20070120089A1 (en) * 2005-11-28 2007-05-31 3M Innovative Properties Company Polymer etchant and method of using same
JP2010524266A (ja) * 2007-04-13 2010-07-15 スリーエム イノベイティブ プロパティズ カンパニー カバー層を有するフレキシブル回路
JP2010539705A (ja) * 2007-09-13 2010-12-16 スリーエム イノベイティブ プロパティズ カンパニー 部分的に剛性のフレキシブル回路及びそれらの作製方法
WO2015002272A1 (ja) * 2013-07-05 2015-01-08 和光純薬工業株式会社 エッチング剤、エッチング方法およびエッチング剤調製液
WO2018186362A1 (ja) * 2017-04-06 2018-10-11 三菱製紙株式会社 樹脂組成物用のエッチング液及びエッチング方法

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US3481877A (en) * 1967-02-27 1969-12-02 Amchem Prod Cleaning solution concentrate and method of preparing same
JPS6330540A (ja) * 1986-07-23 1988-02-09 Canon Electronics Inc 樹脂表面の改質方法
JP2003101244A (ja) 2001-09-27 2003-04-04 Ibiden Co Ltd 多層プリント配線板の製造方法および多層プリント配線板
JP4519548B2 (ja) 2004-07-12 2010-08-04 ポリプラスチックス株式会社 液晶性ポリマー成形品のメッキ前処理方法
JP5138277B2 (ja) 2007-05-31 2013-02-06 京セラSlcテクノロジー株式会社 配線基板およびその製造方法
CN101878452B (zh) * 2007-10-17 2015-01-07 汉高知识产权及控股有限公司 剥离液组合物、使用了该剥离液组合物的树脂层的剥离方法
WO2017038713A1 (ja) 2015-08-31 2017-03-09 住友ベークライト株式会社 プリント配線板の製造方法、半導体装置の製造方法
JP6109896B2 (ja) * 2015-09-03 2017-04-05 日新製鋼株式会社 金属板からレジスト膜を除去する方法およびエッチングされた金属板の製造方法
WO2018088345A1 (ja) 2016-11-11 2018-05-17 住友ベークライト株式会社 金属箔付き樹脂膜、構造体、配線基板の製造方法、半導体装置の製造方法
WO2020085447A1 (ja) * 2018-10-24 2020-04-30 三菱製紙株式会社 樹脂組成物のエッチング液及びエッチング方法
KR102364004B1 (ko) * 2019-04-03 2022-02-16 미쓰비시 세이시 가부시키가이샤 액정 폴리머용 에칭액 및 액정 폴리머의 에칭 방법

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001310959A (ja) * 2000-02-23 2001-11-06 Toray Ind Inc 樹脂膜のウエットエッチング用エッチング液及びそれを用いて成るエッチング方法
JP2001358428A (ja) * 2000-06-14 2001-12-26 Toray Ind Inc エッチング方法
JP2006324452A (ja) * 2005-05-19 2006-11-30 Wako Pure Chem Ind Ltd 半導体基板表面処理剤及び処理方法
US20070120089A1 (en) * 2005-11-28 2007-05-31 3M Innovative Properties Company Polymer etchant and method of using same
JP2010524266A (ja) * 2007-04-13 2010-07-15 スリーエム イノベイティブ プロパティズ カンパニー カバー層を有するフレキシブル回路
JP2010539705A (ja) * 2007-09-13 2010-12-16 スリーエム イノベイティブ プロパティズ カンパニー 部分的に剛性のフレキシブル回路及びそれらの作製方法
WO2015002272A1 (ja) * 2013-07-05 2015-01-08 和光純薬工業株式会社 エッチング剤、エッチング方法およびエッチング剤調製液
WO2018186362A1 (ja) * 2017-04-06 2018-10-11 三菱製紙株式会社 樹脂組成物用のエッチング液及びエッチング方法

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JPWO2020158610A1 (ja) 2021-02-18
KR20210097219A (ko) 2021-08-06
KR102376557B1 (ko) 2022-03-18
TW202039660A (zh) 2020-11-01
CN113348226A (zh) 2021-09-03
WO2020158610A1 (ja) 2020-08-06

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