JP6678516B2 - シート貼付装置および貼付方法 - Google Patents

シート貼付装置および貼付方法 Download PDF

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Publication number
JP6678516B2
JP6678516B2 JP2016108817A JP2016108817A JP6678516B2 JP 6678516 B2 JP6678516 B2 JP 6678516B2 JP 2016108817 A JP2016108817 A JP 2016108817A JP 2016108817 A JP2016108817 A JP 2016108817A JP 6678516 B2 JP6678516 B2 JP 6678516B2
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JP
Japan
Prior art keywords
adherend
sheet
adhesive sheet
support means
supporting
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Active
Application number
JP2016108817A
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English (en)
Japanese (ja)
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JP2017216345A (ja
Inventor
高野　健
健 高野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2016108817A priority Critical patent/JP6678516B2/ja
Priority to TW106117053A priority patent/TWI735578B/zh
Priority to KR1020170065453A priority patent/KR102329907B1/ko
Priority to CN201710383516.2A priority patent/CN107452667B/zh
Publication of JP2017216345A publication Critical patent/JP2017216345A/ja
Application granted granted Critical
Publication of JP6678516B2 publication Critical patent/JP6678516B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Textile Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2016108817A 2016-05-31 2016-05-31 シート貼付装置および貼付方法 Active JP6678516B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016108817A JP6678516B2 (ja) 2016-05-31 2016-05-31 シート貼付装置および貼付方法
TW106117053A TWI735578B (zh) 2016-05-31 2017-05-23 薄片貼附裝置及貼附方法
KR1020170065453A KR102329907B1 (ko) 2016-05-31 2017-05-26 시트 부착 장치 및 부착 방법
CN201710383516.2A CN107452667B (zh) 2016-05-31 2017-05-26 片材粘附装置及粘附方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016108817A JP6678516B2 (ja) 2016-05-31 2016-05-31 シート貼付装置および貼付方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020046238A Division JP6857763B2 (ja) 2020-03-17 2020-03-17 シート貼付装置および貼付方法

Publications (2)

Publication Number Publication Date
JP2017216345A JP2017216345A (ja) 2017-12-07
JP6678516B2 true JP6678516B2 (ja) 2020-04-08

Family

ID=60486478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016108817A Active JP6678516B2 (ja) 2016-05-31 2016-05-31 シート貼付装置および貼付方法

Country Status (4)

Country Link
JP (1) JP6678516B2 (zh)
KR (1) KR102329907B1 (zh)
CN (1) CN107452667B (zh)
TW (1) TWI735578B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI815066B (zh) * 2020-12-14 2023-09-11 萬潤科技股份有限公司 待濺鍍物件定位方法、裝置及施作設備

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4475772B2 (ja) * 2000-08-08 2010-06-09 日東電工株式会社 保護テープ貼付け方法および保護テープ貼付け装置
CN100547752C (zh) * 2005-05-19 2009-10-07 琳得科株式会社 粘附装置
JP4890873B2 (ja) * 2006-02-06 2012-03-07 リンテック株式会社 シート貼付装置
JP5113599B2 (ja) * 2008-04-08 2013-01-09 リンテック株式会社 シート貼付装置及び貼付方法
JP5607965B2 (ja) * 2010-03-23 2014-10-15 日東電工株式会社 半導体ウエハマウント方法および半導体ウエハマウント装置
JP5562091B2 (ja) * 2010-03-29 2014-07-30 リンテック株式会社 押圧ローラ
JP5801811B2 (ja) * 2010-08-10 2015-10-28 リンテック株式会社 シート剥離装置および剥離方法ならびにシート貼付装置および貼付方法
JP6078233B2 (ja) * 2012-01-31 2017-02-08 リンテック株式会社 シート貼付装置
JP6328874B2 (ja) * 2012-07-18 2018-05-23 リンテック株式会社 シート貼付装置および装置の大型化防止方法
JP6100600B2 (ja) * 2013-04-26 2017-03-22 リンテック株式会社 シート貼付装置および貼付方法

Also Published As

Publication number Publication date
CN107452667B (zh) 2022-10-21
TW201810409A (zh) 2018-03-16
TWI735578B (zh) 2021-08-11
JP2017216345A (ja) 2017-12-07
KR20170135721A (ko) 2017-12-08
CN107452667A (zh) 2017-12-08
KR102329907B1 (ko) 2021-11-22

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