JP6670940B2 - 高温化学薬品及び超音波装置を用いた基板の洗浄方法及び装置 - Google Patents
高温化学薬品及び超音波装置を用いた基板の洗浄方法及び装置 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims description 162
- 239000000126 substance Substances 0.000 title claims description 122
- 238000004140 cleaning Methods 0.000 title claims description 99
- 238000000034 method Methods 0.000 title description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 32
- 238000009423 ventilation Methods 0.000 claims description 29
- 239000008367 deionised water Substances 0.000 claims description 28
- 229910021641 deionized water Inorganic materials 0.000 claims description 28
- 239000002245 particle Substances 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 238000002604 ultrasonography Methods 0.000 description 7
- 238000004581 coalescence Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
- B01D19/0036—Flash degasification
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
- B01D19/0031—Degasification of liquids by filtration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B15/00—Pumps adapted to handle specific fluids, e.g. by selection of specific materials for pumps or pump parts
- F04B15/04—Pumps adapted to handle specific fluids, e.g. by selection of specific materials for pumps or pump parts the fluids being hot or corrosive
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B23/00—Pumping installations or systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/007—Heating the liquid
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B23/00—Pumping installations or systems
- F04B23/04—Combinations of two or more pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Detergent Compositions (AREA)
Description
Claims (12)
- 高温化学溶液を含む溶液タンクと、
タンク本体と、通気管路と、ニードル弁とを有するバッファタンクであって、前記タンク本体には前記高温化学溶液が含まれており、前記通気管路の一端が前記タンク本体に接続されており、前記通気管路の他端が前記溶液タンクに接続されており、前記ニードル弁が前記通気管路に取り付けられており、前記ニードル弁を調節することにより前記高温化学溶液内の気泡が前記通気管路を介して前記バッファタンクから排出されるように流量を調整する前記タンク本体と、
吸込口が前記溶液タンクに接続され、送出口が前記バッファタンクに接続されている第1のポンプと、
吸込口が前記バッファタンクに接続され、送出口が基板の洗浄が行われる洗浄室に接続されている第2のポンプとを備えており、
前記バッファタンクは、流入管と排出管とを更に備え、前記流入管と前記排出管とは、前記タンク本体の前記底部近傍の位置まで挿入され、前記通気管路は前記バッファタンクの上部に取り付けられ、前記高温化学溶液内の気泡が上昇して前記バッファタンクから前記通気管路を介して排出されることを特徴とする基板洗浄用高温化学溶液供給システム。 - 高温化学溶液を含む溶液タンクと、
タンク本体と、通気管路と、ニードル弁とを有するバッファタンクであって、前記タンク本体には前記高温化学溶液が含まれており、前記通気管路の一端が前記タンク本体に接続されており、前記通気管路の他端が前記溶液タンクに接続されており、前記ニードル弁が前記通気管路に取り付けられており、前記ニードル弁を調節することにより前記高温化学溶液内の気泡が前記通気管路を介して前記バッファタンクから排出されるように流量を調整する前記タンク本体と、
吸込口が前記溶液タンクに接続され、送出口が前記バッファタンクに接続されている第1のポンプと、
吸込口が前記バッファタンクに接続され、送出口が基板の洗浄が行われる洗浄室に接続されている第2のポンプとを備えており、
前記第2のポンプの前記送出口と前記洗浄室との間に設置された、少なくとも1つの第2のバッファタンクと少なくとも1つの第4のポンプとをさらに備えることを特徴とする基板洗浄用高温化学溶液供給システム。 - 第3のポンプと、ヒータとをさらに備え、前記第3のポンプが前記溶液タンクと前記ヒータに接続され、前記ヒータが前記溶液タンクに接続されていることを特徴とする請求項1又は2に記載の基板洗浄用高温化学溶液供給システム。
- 温度計と制御装置とをさらに備えることを特徴とする請求項1又は2に記載の基板洗浄用高温化学溶液供給システム。
- 前記溶液タンクは、脱イオン水が供給される第1の吸込口と、第1の化学物質が供給される第2の吸込口と、第2の化学物質が供給される第3の吸込口とを備えることを特徴とする請求項1又は2に記載の基板洗浄用高温化学溶液供給システム。
- 前記第1の化学物質はH2O2であり、前記第2の化学物質はNH4OHであることを特徴とする請求項5に記載の基板洗浄用高温化学溶液供給システム。
- 前記バッファタンクは、前記流入管から出た気泡が前記排出管に流入することを防ぐ気泡仕切部をさらに備えていることを特徴とする請求項1に記載の基板洗浄用高温化学溶液供給システム。
- 前記バッファタンクは、流入管と排出管とを更に備え、前記流入管と前記排出管とは、前記タンク本体の前記底部近傍の位置まで挿入され、前記通気管路は前記バッファタンクの上部に取り付けられ、前記高温化学溶液内の気泡が上昇して前記バッファタンクから前記通気管路を介して排出されることを特徴とする請求項2に記載の基板洗浄用高温化学溶液供給システム。
- 前記バッファタンクは、前記流入管から出た気泡が前記排出管に流入することを防ぐ気泡仕切部をさらに備えていることを特徴とする請求項8に記載の基板洗浄用高温化学溶液供給システム。
- 前記バッファタンクは、流入管と、排出管と、粒子フィルタとを更に備え、前記流入管は、前記タンク本体の前記底部近傍であって前記粒子フィルタの吸込口の位置まで挿入されており、前記排出管は前記バッファタンクの上部であって前記粒子フィルタの排出口の位置に取り付けられており、前記通気管路は前記バッファタンク上部であって前記粒子フィルタの吸込口の位置に取り付けられていることを特徴とする請求項2に記載の基板洗浄用高温化学溶液供給システム。
- 前記溶液タンクの外面が断熱材で覆われていることを特徴とする請求項1又は2に記載の基板洗浄用高温化学溶液供給システム。
- 請求項1又は2に記載の基板洗浄用高温化学溶液供給システムと、
前記基板を把持する基板チャックと、
前記基板チャックに接続され、前記基板チャックを回転させる回転駆動機構と、
前記基板の表面に前記高温化学溶液又は脱イオン水を供給するノズルと、
前記基板から隙間を空けて、前記基板に隣接して配置される超音波/高周波超音波装置と、
前記超音波/高周波超音波装置を昇降させ、前記基板と前記超音波/高周波超音波装置との間の前記隙間を変化させる垂直アクチュエータとを備えることを特徴とする基板洗浄装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/CN2015/096788 WO2017096553A1 (en) | 2015-12-09 | 2015-12-09 | Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic device |
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JP2019226425A Division JP6843402B2 (ja) | 2019-12-16 | 2019-12-16 | 基板洗浄方法 |
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US (3) | US11000782B2 (ja) |
JP (1) | JP6670940B2 (ja) |
KR (2) | KR102637965B1 (ja) |
CN (2) | CN108472558A (ja) |
SG (1) | SG11201804657QA (ja) |
WO (1) | WO2017096553A1 (ja) |
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US20210233782A1 (en) * | 2018-04-27 | 2021-07-29 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
JP2020165017A (ja) * | 2019-03-28 | 2020-10-08 | ブラザー工業株式会社 | 接着装置 |
US20230183098A1 (en) | 2021-12-10 | 2023-06-15 | Mage Llc | Method and apparatus for removing solids from a fluid stream |
US20230183101A1 (en) * | 2021-12-10 | 2023-06-15 | Mage Llc | Method and apparatus for removing contaminants from a fluid stream |
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US9044794B2 (en) * | 2009-12-31 | 2015-06-02 | Lam Research Ag | Ultrasonic cleaning fluid, method and apparatus |
JP2011210933A (ja) * | 2010-03-30 | 2011-10-20 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
SG11201400619QA (en) * | 2011-09-22 | 2014-04-28 | Acm Res Shanghai Inc | Methods and apparatus for cleaning flip chip assemblies |
JP5977058B2 (ja) * | 2012-03-28 | 2016-08-24 | 株式会社Screenホールディングス | 処理液供給装置および処理液供給方法 |
JP5967045B2 (ja) * | 2013-10-02 | 2016-08-10 | 東京エレクトロン株式会社 | 処理液供給装置及び処理液供給方法 |
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US11925881B2 (en) | 2024-03-12 |
US11000782B2 (en) | 2021-05-11 |
JP2019504483A (ja) | 2019-02-14 |
US20180353876A1 (en) | 2018-12-13 |
KR20180090841A (ko) | 2018-08-13 |
US20240207760A1 (en) | 2024-06-27 |
CN108472558A (zh) | 2018-08-31 |
SG11201804657QA (en) | 2018-06-28 |
WO2017096553A1 (en) | 2017-06-15 |
US20210236961A1 (en) | 2021-08-05 |
KR102509747B1 (ko) | 2023-03-15 |
KR102637965B1 (ko) | 2024-02-20 |
KR20230038319A (ko) | 2023-03-17 |
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