CN101879511B - 半导体衬底的清洗方法和装置 - Google Patents
半导体衬底的清洗方法和装置 Download PDFInfo
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- CN101879511B CN101879511B CN 200910050834 CN200910050834A CN101879511B CN 101879511 B CN101879511 B CN 101879511B CN 200910050834 CN200910050834 CN 200910050834 CN 200910050834 A CN200910050834 A CN 200910050834A CN 101879511 B CN101879511 B CN 101879511B
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- semiconductor substrate
- mega sonic
- sonic wave
- ultrasonic wave
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- 238000000034 method Methods 0.000 title claims abstract description 52
- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 238000004140 cleaning Methods 0.000 title claims abstract description 38
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract description 104
- 229910052710 silicon Inorganic materials 0.000 title abstract description 104
- 239000010703 silicon Substances 0.000 title abstract description 104
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 239000007788 liquid Substances 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims abstract 7
- -1 and simultaneously Substances 0.000 claims 2
- 238000005507 spraying Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 239000003153 chemical reaction reagent Substances 0.000 description 10
- 239000008367 deionised water Substances 0.000 description 10
- 229910021641 deionized water Inorganic materials 0.000 description 10
- 239000012530 fluid Substances 0.000 description 7
- 239000000523 sample Substances 0.000 description 4
- 208000036829 Device dislocation Diseases 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000007115 recruitment Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (28)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200910050834 CN101879511B (zh) | 2009-05-08 | 2009-05-08 | 半导体衬底的清洗方法和装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200910050834 CN101879511B (zh) | 2009-05-08 | 2009-05-08 | 半导体衬底的清洗方法和装置 |
Publications (2)
Publication Number | Publication Date |
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CN101879511A CN101879511A (zh) | 2010-11-10 |
CN101879511B true CN101879511B (zh) | 2013-01-02 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 200910050834 Active CN101879511B (zh) | 2009-05-08 | 2009-05-08 | 半导体衬底的清洗方法和装置 |
Country Status (1)
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CN (1) | CN101879511B (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103736690B (zh) * | 2013-12-31 | 2018-12-18 | 上海集成电路研发中心有限公司 | 硅片清洗方法 |
CN104889102A (zh) * | 2014-03-03 | 2015-09-09 | 盛美半导体设备(上海)有限公司 | 晶圆清洗方法 |
CN104900480A (zh) * | 2014-03-03 | 2015-09-09 | 盛美半导体设备(上海)有限公司 | 晶圆清洗方法 |
US11141762B2 (en) | 2015-05-15 | 2021-10-12 | Acm Research (Shanghai), Inc. | System for cleaning semiconductor wafers |
WO2017173588A1 (en) * | 2016-04-06 | 2017-10-12 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
CN107636799B (zh) * | 2015-05-20 | 2021-12-03 | 盛美半导体设备(上海)股份有限公司 | 清洗半导体衬底的方法和装置 |
SG11201804657QA (en) | 2015-12-09 | 2018-06-28 | Acm Res Shanghai Inc | Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic device |
JP7032816B2 (ja) | 2016-09-19 | 2022-03-09 | エーシーエム リサーチ (シャンハイ) インコーポレーテッド | 基板の洗浄方法及び洗浄装置 |
US11037804B2 (en) | 2016-09-20 | 2021-06-15 | Acm Research, Inc. | Methods and apparatus for cleaning substrates |
SG11201903503TA (en) * | 2016-10-25 | 2019-05-30 | Acm Res Shanghai Inc | Apparatus and method for cleaning semiconductor wafers |
TWI721080B (zh) * | 2017-01-09 | 2021-03-11 | 大陸商盛美半導體設備(上海)股份有限公司 | 用來清洗襯底的裝置以及高溫化學溶液供液系統 |
SG11202004432SA (en) * | 2017-11-15 | 2020-06-29 | Acm Res Shanghai Inc | Method for cleaning semiconductor wafers |
KR102517666B1 (ko) * | 2017-11-15 | 2023-04-05 | 에이씨엠 리서치 (상하이), 인코포레이티드 | 반도체 웨이퍼를 세정하는 시스템 |
US11581205B2 (en) | 2017-11-20 | 2023-02-14 | Acm Research, Inc. | Methods and system for cleaning semiconductor wafers |
TWI776884B (zh) * | 2018-04-24 | 2022-09-11 | 大陸商盛美半導體設備(上海)股份有限公司 | 清洗半導體矽片的裝置和方法 |
US20210233782A1 (en) * | 2018-04-27 | 2021-07-29 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101069888A (zh) * | 2007-06-14 | 2007-11-14 | 北京七星华创电子股份有限公司 | 一种清洗单硅片的方法及装置 |
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2009
- 2009-05-08 CN CN 200910050834 patent/CN101879511B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101069888A (zh) * | 2007-06-14 | 2007-11-14 | 北京七星华创电子股份有限公司 | 一种清洗单硅片的方法及装置 |
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Publication number | Publication date |
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CN101879511A (zh) | 2010-11-10 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Method and device for cleaning semiconductor silicon wafer Effective date of registration: 20131021 Granted publication date: 20130102 Pledgee: Bank of Communications Ltd Shanghai New District Branch Pledgor: ACM (SHANGHAI) Inc. Registration number: 2013990000760 |
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PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20150521 Granted publication date: 20130102 Pledgee: Bank of Communications Ltd Shanghai New District Branch Pledgor: ACM (SHANGHAI) Inc. Registration number: 2013990000760 |
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CP03 | Change of name, title or address |
Address after: 201203 building 4, No. 1690, Cailun Road, free trade zone, Pudong New Area, Shanghai Patentee after: Shengmei semiconductor equipment (Shanghai) Co., Ltd Address before: 201203 Shanghai Zhangjiang hi tech park, building 4, No. 1690 Cailun Road Patentee before: ACM (SHANGHAI) Inc. |
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