JP6528200B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6528200B2 JP6528200B2 JP2015115753A JP2015115753A JP6528200B2 JP 6528200 B2 JP6528200 B2 JP 6528200B2 JP 2015115753 A JP2015115753 A JP 2015115753A JP 2015115753 A JP2015115753 A JP 2015115753A JP 6528200 B2 JP6528200 B2 JP 6528200B2
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- 239000004065 semiconductor Substances 0.000 title claims description 194
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 86
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 84
- 239000000758 substrate Substances 0.000 claims description 53
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 11
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 10
- 230000005669 field effect Effects 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 110
- 230000005684 electric field Effects 0.000 description 35
- 239000011229 interlayer Substances 0.000 description 25
- 239000012535 impurity Substances 0.000 description 18
- 210000000746 body region Anatomy 0.000 description 12
- 230000015556 catabolic process Effects 0.000 description 9
- 150000002500 ions Chemical class 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000002161 passivation Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- 238000002513 implantation Methods 0.000 description 6
- 230000006872 improvement Effects 0.000 description 6
- 238000005468 ion implantation Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000011960 computer-aided design Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910021334 nickel silicide Inorganic materials 0.000 description 1
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
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Description
図1(a)は、半導体装置100全体における半導体素子領域および終端領域の平面的な配置を示す図である。図1(b)は、本開示の第1の実施形態に係る半導体装置100を模式的に示す断面図である。図1(b)は、図1(a)に示す線E−Fでの断面図である。
以下、図6から図10を参照しながら、本開示の第2の実施形態に係る半導体装置400について説明する。図6(a)は、本実施形態に係る半導体装置400を模式的に示す断面図、図6(b)は、本実施形態に係る半導体装置400を模式的に示す平面図である。図6(a)は、図6(b)に示す線G−Hでの断面図である。
域420’に、例えば窒素をイオン注入することによってソース注入領域404’を形成する。または、マスク501の一部を残したままで、さらにSiO2等を堆積し、部分的に加工することにより、マスク501の側壁にマスクを形成して、マスク502に相当するマスクを形成しても良い。つまり、ボディ注入領域420’に対してソース注入領域404’を自己整合的に形成する、いわゆるセルフアラインプロセスを適用しても良い。ソース注入領域404’の深さは例えば250nm、平均的な不純物濃度は約5×1019cm-3となるように、イオン注入プロファイルを調整する。
VD法によって堆積する。層間絶縁膜410の厚さは、例えば1μmである。
2、102 炭化珪素バッファ層
3、103、403、603 ドリフト層
6 コンタクト電極
10、110、610 第1の絶縁膜
11、406 ソース電極
12、412 ドレイン電極
14、114 第2の絶縁膜
17 半導体素子領域
18、418 終端領域
20、120 終端構造
20a、120a リング状領域
21、421 コンタクト領域
22、422 積層構造
100、400、600 半導体装置
404 ソース領域
407 ゲート絶縁膜
408 ゲート電極
410 層間絶縁膜
411、611 上部電極
414、614 パッシベーション膜
417 トランジスタ領域
420 ボディ領域
606 ショットキー電極
612 オーミック電極
Claims (7)
- 主面を有する半導体基板と、
前記半導体基板の前記主面上に位置する第1導電型の炭化珪素半導体層と、
前記半導体基板の一部および前記炭化珪素半導体層の一部を含む半導体素子領域と、
前記半導体基板の他の一部および前記炭化珪素半導体層の他の一部を含み、前記半導体基板の前記主面に垂直な方向からみて、前記半導体素子領域を囲むように前記炭化珪素半導体層内に配置された第2導電型のリング状領域を含む終端構造を有する終端領域と、
前記終端領域において、前記炭化珪素半導体層の一部に接するように配置された第1の絶縁膜と、
前記第1の絶縁膜よりも大きい比誘電率を有し、前記終端領域において、前記リング状領域の一部に接するように配置された第2の絶縁膜と、
前記半導体素子領域 において、前記炭化珪素半導体層上に配置された第1電極と、
前記半導体基板の前記主面と反対側の裏面上に配置された第2電極と、
を備え、
前記第2の絶縁膜は、前記終端領域において、前記第1の絶縁膜上に位置する部分と前記炭化珪素半導体層に接する部分とを含み、
前記終端構造は、複数の前記リング状領域を含み、
前記第2の絶縁膜は、前記半導体基板の前記主面に垂直な断面において、前記複数のリング状領域のうち、前記半導体素子領域から最も近くに配置されたリング状領域と前記炭化珪素半導体層との2つの境界のうち、前記半導体素子領域から遠い方の境界と接するように、前記半導体素子領域から最も近くに配置されたリング状領域および前記炭化珪素半導体層と接しており、
前記半導体素子領域から最も近くに配置されたリング状領域は、前記第1電極と接している、半導体装置。 - 前記第2の絶縁膜は、前記半導体基板の前記主面に垂直な断面において、前記複数のリング状領域の各々と前記炭化珪素半導体層との2つの境界のうち、前記半導体素子領域から遠い方の境界を含むように、前記複数のリング状領域の各々および前記炭化珪素半導体層と接している、請求項1に記載の半導体装置。
- 前記第2の絶縁膜は、窒化珪素を含む絶縁材料から構成されている、請求項1または2に記載の半導体装置。
- 前記第1の絶縁膜は、酸化珪素を含む絶縁材料から構成されている、請求項1から3のいずれかに記載の半導体装置。
- 前記終端構造は電界制限リング構造である、請求項1から4のいずれかに記載の半導体装置。
- 前記半導体素子領域に位置するダイオードをさらに含む、請求項1から5のいずれかに記載の半導体装置。
- 前記半導体素子領域に位置する電界効果トランジスタをさらに含む、請求項1から6のいずれかに記載の半導体装置。
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US9397205B1 (en) * | 2015-07-22 | 2016-07-19 | Macronix International Co., Ltd. | Semiconductor device |
US10096681B2 (en) * | 2016-05-23 | 2018-10-09 | General Electric Company | Electric field shielding in silicon carbide metal-oxide-semiconductor (MOS) device cells |
WO2017201703A1 (zh) * | 2016-05-26 | 2017-11-30 | 中山港科半导体科技有限公司 | 一种功率半导体芯片背面金属结构及其制备方法 |
JP6611943B2 (ja) | 2016-07-20 | 2019-11-27 | 三菱電機株式会社 | 炭化珪素半導体装置およびその製造方法 |
JP6719090B2 (ja) * | 2016-12-19 | 2020-07-08 | パナソニックIpマネジメント株式会社 | 半導体素子 |
US10770296B2 (en) * | 2017-01-26 | 2020-09-08 | Mitsubishi Electric Corporation | Method of manufacturing semiconductor device |
JP7113220B2 (ja) * | 2018-02-06 | 2022-08-05 | パナソニックIpマネジメント株式会社 | 半導体素子およびその製造方法 |
DE102019100130B4 (de) * | 2018-04-10 | 2021-11-04 | Infineon Technologies Ag | Ein halbleiterbauelement und ein verfahren zum bilden eines halbleiterbauelements |
US11387156B2 (en) | 2018-07-11 | 2022-07-12 | Sumitomo Electric Industries, Ltd. | Silicon carbide semiconductor device including a resin covering a silicon carbide semiconductor chip |
JP7249921B2 (ja) * | 2019-09-20 | 2023-03-31 | 株式会社東芝 | 半導体装置 |
JP6887541B1 (ja) * | 2020-02-21 | 2021-06-16 | 三菱電機株式会社 | 半導体装置 |
JPWO2021261102A1 (ja) * | 2020-06-26 | 2021-12-30 | ||
JP7381424B2 (ja) * | 2020-09-10 | 2023-11-15 | 株式会社東芝 | 半導体装置 |
JP7450516B2 (ja) | 2020-10-22 | 2024-03-15 | 三菱電機株式会社 | 電力用半導体装置 |
CN113921588A (zh) * | 2021-09-01 | 2022-01-11 | 格力电器(合肥)有限公司 | 半导体器件及其制备方法 |
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JPS62291121A (ja) | 1986-06-11 | 1987-12-17 | Nec Corp | プレ−ナ型半導体装置 |
JP3385938B2 (ja) | 1997-03-05 | 2003-03-10 | 株式会社デンソー | 炭化珪素半導体装置及びその製造方法 |
US9515135B2 (en) | 2003-01-15 | 2016-12-06 | Cree, Inc. | Edge termination structures for silicon carbide devices |
JP4865194B2 (ja) | 2004-03-29 | 2012-02-01 | ルネサスエレクトロニクス株式会社 | 超接合半導体素子 |
JP2009088345A (ja) | 2007-10-01 | 2009-04-23 | Toshiba Corp | 半導体装置 |
JP5477681B2 (ja) * | 2008-07-29 | 2014-04-23 | 三菱電機株式会社 | 半導体装置 |
JP2010050147A (ja) | 2008-08-19 | 2010-03-04 | Panasonic Corp | 半導体装置 |
CN102217070B (zh) * | 2009-09-03 | 2013-09-25 | 松下电器产业株式会社 | 半导体装置及其制造方法 |
JP2012146832A (ja) | 2011-01-13 | 2012-08-02 | Mitsubishi Electric Corp | 半導体装置 |
JP5858934B2 (ja) | 2011-02-02 | 2016-02-10 | ローム株式会社 | 半導体パワーデバイスおよびその製造方法 |
US8937319B2 (en) * | 2011-03-07 | 2015-01-20 | Shindengen Electric Manufacturing Co., Ltd. | Schottky barrier diode |
JP6143490B2 (ja) * | 2013-02-19 | 2017-06-07 | ローム株式会社 | 半導体装置およびその製造方法 |
US9773863B2 (en) * | 2014-05-14 | 2017-09-26 | Infineon Technologies Austria Ag | VDMOS having a non-depletable extension zone formed between an active area and side surface of semiconductor body |
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