JP6524879B2 - 付加一液硬化型熱伝導性シリコーングリース組成物 - Google Patents
付加一液硬化型熱伝導性シリコーングリース組成物 Download PDFInfo
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- JP6524879B2 JP6524879B2 JP2015201832A JP2015201832A JP6524879B2 JP 6524879 B2 JP6524879 B2 JP 6524879B2 JP 2015201832 A JP2015201832 A JP 2015201832A JP 2015201832 A JP2015201832 A JP 2015201832A JP 6524879 B2 JP6524879 B2 JP 6524879B2
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- Prior art keywords
- platinum complex
- group
- component
- complex
- conductive silicone
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M171/00—Lubricating compositions characterised by purely physical criteria, e.g. containing as base-material, thickener or additive, ingredients which are characterised exclusively by their numerically specified physical properties, i.e. containing ingredients which are physically well-defined but for which the chemical nature is either unspecified or only very vaguely indicated
- C10M171/02—Specified values of viscosity or viscosity index
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
- B01J31/16—Catalysts comprising hydrides, coordination complexes or organic compounds containing coordination complexes
- B01J31/1616—Coordination complexes, e.g. organometallic complexes, immobilised on an inorganic support, e.g. ship-in-a-bottle type catalysts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/28—Treatment by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M107/00—Lubricating compositions characterised by the base-material being a macromolecular compound
- C10M107/50—Lubricating compositions characterised by the base-material being a macromolecular compound containing silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2050/00—Form in which the lubricant is applied to the material being lubricated
- C10N2050/10—Semi-solids; greasy
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Combustion & Propulsion (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015201832A JP6524879B2 (ja) | 2015-10-13 | 2015-10-13 | 付加一液硬化型熱伝導性シリコーングリース組成物 |
EP16192979.9A EP3156456B1 (en) | 2015-10-13 | 2016-10-10 | One-part addition-curing heat-conductive silicone grease composition |
ES16192979T ES2854448T3 (es) | 2015-10-13 | 2016-10-10 | Composición de grasa de silicona termoconductora de curado por adición de un solo componente |
KR1020160131414A KR102084526B1 (ko) | 2015-10-13 | 2016-10-11 | 부가 일액 경화형 열전도성 실리콘 그리스 조성물 |
US15/291,165 US10030184B2 (en) | 2015-10-13 | 2016-10-12 | Addition one part curing type heat-conductive silicone grease composition |
TW105132899A TWI682030B (zh) | 2015-10-13 | 2016-10-12 | 加成式單一配方固化型導熱聚矽氧潤滑脂組成物 |
CN201610892074.XA CN106566253A (zh) | 2015-10-13 | 2016-10-13 | 加成单组分固化型导热有机硅润滑脂组合物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015201832A JP6524879B2 (ja) | 2015-10-13 | 2015-10-13 | 付加一液硬化型熱伝導性シリコーングリース組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017075202A JP2017075202A (ja) | 2017-04-20 |
JP6524879B2 true JP6524879B2 (ja) | 2019-06-05 |
Family
ID=57136691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015201832A Active JP6524879B2 (ja) | 2015-10-13 | 2015-10-13 | 付加一液硬化型熱伝導性シリコーングリース組成物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10030184B2 (zh) |
EP (1) | EP3156456B1 (zh) |
JP (1) | JP6524879B2 (zh) |
KR (1) | KR102084526B1 (zh) |
CN (1) | CN106566253A (zh) |
ES (1) | ES2854448T3 (zh) |
TW (1) | TWI682030B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170283677A1 (en) * | 2014-09-25 | 2017-10-05 | Shin-Etsu Chemical Co., Ltd. | Uv-thickening thermally conductive silicone grease composition |
JP2017161779A (ja) * | 2016-03-10 | 2017-09-14 | 富士ゼロックス株式会社 | 定着部材、定着装置、及び画像形成装置 |
JP6642145B2 (ja) * | 2016-03-14 | 2020-02-05 | 信越化学工業株式会社 | 付加一液加熱硬化型熱伝導性シリコーングリース組成物の硬化物の製造方法 |
AU2018219251B2 (en) | 2017-02-08 | 2023-09-21 | Elkem Silicones USA Corp. | Secondary battery pack with improved thermal management |
KR102149452B1 (ko) | 2018-10-23 | 2020-08-31 | (주)해인디지탈 | 써멀 그리스 및 그의 제조방법 |
JP7003029B2 (ja) * | 2018-11-16 | 2022-01-20 | 信越化学工業株式会社 | 導電性シリコーン組成物、硬化物、積層体、及び、電子回路 |
JP2021075655A (ja) * | 2019-11-12 | 2021-05-20 | 信越化学工業株式会社 | 導電性シリコーン組成物、導電性シリコーン硬化物、導電性シリコーン硬化物の製造方法、及び導電性シリコーン積層体 |
WO2023087233A1 (en) * | 2021-11-19 | 2023-05-25 | Dow Silicones Corporation | Silicone rubber composition |
CN115746648B (zh) * | 2022-12-20 | 2024-03-15 | 长飞光纤光缆股份有限公司 | 气吹光缆用低摩擦自润滑控形树脂、其制备方法及光缆 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2393981A1 (fr) | 1977-06-06 | 1979-01-05 | Dba | Frein a disque |
JPS61157569A (ja) | 1984-12-28 | 1986-07-17 | Shin Etsu Polymer Co Ltd | 熱伝導性接着組成物 |
US5132385A (en) * | 1990-12-14 | 1992-07-21 | General Electric Company | One part heat curable organopolysiloxane compositions |
JP3543863B2 (ja) | 1994-12-16 | 2004-07-21 | ダイキン工業株式会社 | 1,1,1,2,3,3−ヘキサフルオロプロパンの製造方法 |
JPH08208993A (ja) | 1995-11-27 | 1996-08-13 | Toshiba Silicone Co Ltd | 熱伝導性シリコーン組成物 |
JP3543663B2 (ja) | 1999-03-11 | 2004-07-14 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及びその製造方法 |
JP3580366B2 (ja) | 2001-05-01 | 2004-10-20 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
EP1403326B1 (en) | 2001-05-14 | 2008-12-03 | Dow Corning Toray Co., Ltd. | Heat-conductive silicone composition |
JP3803058B2 (ja) * | 2001-12-11 | 2006-08-02 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体 |
JP3865638B2 (ja) | 2002-01-23 | 2007-01-10 | 信越化学工業株式会社 | オルガノポリシロキサンゲル組成物 |
JP4130091B2 (ja) | 2002-04-10 | 2008-08-06 | 信越化学工業株式会社 | 放熱用シリコーングリース組成物 |
JP2004352947A (ja) | 2003-05-30 | 2004-12-16 | Shin Etsu Chem Co Ltd | 室温硬化型熱伝導性シリコーンゴム組成物 |
JP4775993B2 (ja) * | 2004-03-31 | 2011-09-21 | 東レ・ダウコーニング株式会社 | 半導体素子封止剤、半導体装置および半導体装置の実装方法 |
JP4557136B2 (ja) * | 2004-05-13 | 2010-10-06 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及び成型品 |
JP2008106185A (ja) * | 2006-10-27 | 2008-05-08 | Shin Etsu Chem Co Ltd | 熱伝導性シリコーン組成物の接着方法、熱伝導性シリコーン組成物接着用プライマー及び熱伝導性シリコーン組成物の接着複合体の製造方法 |
JP5507059B2 (ja) | 2008-05-27 | 2014-05-28 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーン組成物および電子装置 |
TWI495666B (zh) * | 2009-07-17 | 2015-08-11 | Shinetsu Chemical Co | 有機氫聚矽氧烷,製造方法,及加成固化聚矽氧組成物 |
JP5534837B2 (ja) * | 2010-01-28 | 2014-07-02 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
CN102892837B (zh) * | 2010-03-05 | 2016-02-24 | 迈图高新材料有限责任公司 | 用作太阳能电池模块的密封剂的可固化聚有机硅氧烷组合物 |
CN101831181A (zh) * | 2010-05-21 | 2010-09-15 | 浙江三元电子科技有限公司 | 加成型导热绝缘硅橡胶复合材料及其制备方法 |
JP5553006B2 (ja) * | 2010-11-12 | 2014-07-16 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
JP5472241B2 (ja) * | 2011-09-16 | 2014-04-16 | 信越化学工業株式会社 | 光硬化型シリコーン樹脂組成物を用いる硬化薄膜の製造方法 |
JP5783128B2 (ja) * | 2012-04-24 | 2015-09-24 | 信越化学工業株式会社 | 加熱硬化型熱伝導性シリコーングリース組成物 |
JP2014005323A (ja) * | 2012-06-21 | 2014-01-16 | Nitto Denko Corp | シリコーン樹脂組成物 |
WO2014188872A1 (ja) * | 2013-05-22 | 2014-11-27 | 信越化学工業株式会社 | 一液型オルガノポリシロキサンゲル組成物及びその硬化方法 |
JP5947267B2 (ja) * | 2013-09-20 | 2016-07-06 | 信越化学工業株式会社 | シリコーン組成物及び熱伝導性シリコーン組成物の製造方法 |
JP6217590B2 (ja) * | 2013-11-05 | 2017-10-25 | 信越化学工業株式会社 | 紫外線硬化性接着性オルガノポリシロキサン組成物 |
TW201601358A (zh) * | 2014-06-19 | 2016-01-01 | 道康寧公司 | 用於晶圓級z軸熱中介層的可光圖案化聚矽氧 |
US20170283677A1 (en) * | 2014-09-25 | 2017-10-05 | Shin-Etsu Chemical Co., Ltd. | Uv-thickening thermally conductive silicone grease composition |
JP6390361B2 (ja) * | 2014-11-11 | 2018-09-19 | 信越化学工業株式会社 | 紫外線増粘型熱伝導性シリコーングリース組成物 |
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2015
- 2015-10-13 JP JP2015201832A patent/JP6524879B2/ja active Active
-
2016
- 2016-10-10 ES ES16192979T patent/ES2854448T3/es active Active
- 2016-10-10 EP EP16192979.9A patent/EP3156456B1/en active Active
- 2016-10-11 KR KR1020160131414A patent/KR102084526B1/ko active IP Right Grant
- 2016-10-12 US US15/291,165 patent/US10030184B2/en active Active
- 2016-10-12 TW TW105132899A patent/TWI682030B/zh active
- 2016-10-13 CN CN201610892074.XA patent/CN106566253A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20170043459A (ko) | 2017-04-21 |
US20170101570A1 (en) | 2017-04-13 |
TWI682030B (zh) | 2020-01-11 |
JP2017075202A (ja) | 2017-04-20 |
ES2854448T3 (es) | 2021-09-21 |
KR102084526B1 (ko) | 2020-03-04 |
EP3156456A1 (en) | 2017-04-19 |
CN106566253A (zh) | 2017-04-19 |
EP3156456B1 (en) | 2021-01-20 |
TW201726901A (zh) | 2017-08-01 |
US10030184B2 (en) | 2018-07-24 |
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