JP6508399B2 - 電子部品搭載用放熱基板 - Google Patents
電子部品搭載用放熱基板 Download PDFInfo
- Publication number
- JP6508399B2 JP6508399B2 JP2018119511A JP2018119511A JP6508399B2 JP 6508399 B2 JP6508399 B2 JP 6508399B2 JP 2018119511 A JP2018119511 A JP 2018119511A JP 2018119511 A JP2018119511 A JP 2018119511A JP 6508399 B2 JP6508399 B2 JP 6508399B2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- lead frame
- electronic component
- substrate
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49589—Capacitor integral with or on the leadframe
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Description
段により同時に成形することが可能である。
ある。
本発明では、このように、後加工により上記リードフレーム110を折り曲げることを可能とする事により、次のような利点を有する。
すなわち、本発明では、上記図18又は図19(A)において示すように、本発明の電子部品搭載用放熱基板の表面側の板面上に複数の発熱性電子部品群を分散して配置する構成を選択することが可能である。そして、上記本発明の電子部品搭載用放熱基板では、上記表面側のみならず裏面側にも上記発熱性電子部品群を含む電子部品を実装することが可能である。
すなわち、上記基板870の上面から透視して見た場合に、上記基板870の上面側の上記仮想的な正三角形状Tの重心から上記仮想的な正三角形状Tを構成する各辺の中点方向の延長線上に上記裏面側に仮想的に形成した正三角形状T`の各頂点が位置するように配置したものとなっている。
そのため、上記近傍とは、上記シャント抵抗の2つの端子を上記リードフレーム110Hとの接続部に接続部に配置した場合に、上記シャント抵抗の2つの端子の下方に上記リードフレーム110Lの一端が配設されるように構成可能な領域であって、上記シャント抵抗と上記リードフレーム110Lとの直接接続が可能な領域のことを意味している。
2 コラム軸(ステアリングシャフト、ハンドル軸)
3 減速機構
4a 4b ユニバーサルジョイント
5 ピニオンラック機構
6a 6b タイロッド
7a 7b ハブユニット
8L 8R 操向車輪
10 トルクセンサ
11 イグニションキー
12 車速センサ
13 バッテリ
14 舵角センサ
20 電動モータ
30 制御装置(コントロールユニット、ECU)
100(s) 200(s) 300 同一の厚みを有するリードフレーム電子部品搭載
用放熱基板
100(d) 200(d) 350 異なる厚みを有するリードフレーム電子部品搭載
用放熱基板
100(s、d) 200(s、d) 電子部品搭載用放熱基板(リードフレームの厚み
が相互に同じものと異なるものとの双方を含む)
110 リードフレーム
110C 環状リードフレーム
110H リードフレーム(大電流ライン用)
110M リードフレーム(中電流ライン用)
110L リードフレーム(小電流ライン用(信号線用))
t リードフレームの厚さ
113 凹部
113(u) 凹部(表面側)
113(d) 凹部(裏面側)
115 係止部
130 絶縁材
150 縁取り部
400 電子部品搭載用放熱基板(凹部形成例)
800 810 電子部品搭載用放熱基板(リードフレーム折り曲げ可能)
830 850 870 電子部品搭載用放熱基板(分散配置したもの)
900 電子部品搭載用放熱基板(介挿シートを含むもの)
910 インバータ回路
911 電解コンデンサ
913 SR シャント抵抗
930 モータリレー部
935 モータリレー部のU相FET
937 モータリレー部のV相FET
939 モータリレー部のW相FET
950 電動モータ
1000 制御装置
1100 制御装置に設けられるTIM層
1300 制御装置の筐体を構成するアルミダイカスト
1800 1900 介挿シート
1900E 介挿シートの周縁部分
5000 従来型の基板
8000 熱伝導体
EC 電子部品
bb バスバー
CP 接続部
LP 切り欠き部
T T` 仮想的な正三角形状
UP UP` U相領域部品群
VP VP` V相領域部品群
WP WP` W相領域部品群
Ui 電源側U相ライン
Uo グランド側U相ライン
Wi 電源側W相ライン
Wo グランド側W相ライン
Ul Ul` U相のリード線引出し方向
Vl Vl` V相のリード線引出し方向
Wl Wl` W相のリード線引出し方向
Claims (18)
- 電子部品を実装するための配線パターン形状のリードフレームに形成した導体板と、前記導体板の前記配線パターン形状のリードフレーム間に設けられた絶縁材とにより構成され、前記導体板の電子部品配置面の板面と前記絶縁材の電子部品配置面側の板面とを同一面上に形成し、
前記導体板の前記電子部品配置面の裏面の板面と前記絶縁材の電子部品配置面側の裏面の板面とを同一面上に形成した電子部品搭載用放熱基板であって、
前記配線パターン形状のリードフレームは、少なくとも2種類以上の相互に異なる厚さを有し、
前記配線パターン形状のリードフレームの前記電子部品配置面の裏面の板面と前記絶縁材の電子部品配置面側の裏面の板面とは、前記リードフレームのうち最も厚みを有する前記リードフレームの前記電子部品配置面の裏面の板面に合わせて、同一面上に形成し、
前記相互に異なる厚さを有するリードフレームは、相互に交差や重なり合いを生ずることなく配線パターンを形成すると共に、前記電子部品が実装されることにより、前記相互に異なる厚みを有するリードフレームが電子回路を形成するように構成され、
前記電子部品配置面を上面から見た場合に厚みの厚いリードフレームと厚みの薄いリードフレームとは混在して配置され、
前記リードフレームの両側面は、前記電子部品配置面の板面の表面から裏面にかけて前記板面に垂直な平面に形成され、
前記配線パターン形状のリードフレームと前記絶縁材との間には係止部が設けられ、前記係止部は、前記リードフレームの側面に前記リードフレームの板面に沿って凹部を形成したものであり、前記凹部は、前記凹部の解放端側よりも奥側で広く形成され、
前記電子部品搭載用放熱基板上には、機能的なまとまりを有する3つの発熱性電子部品群が、前記発熱性電子部品群への入口から前記発熱性電子部品群の出口までの電流経路の長さが略同一となるように、前記電子部品搭載用放熱基板の略中央部を中心とした正三角形の各頂点部周辺に配置されていることを特徴とする電子部品搭載用放熱基板。 - 前記係止部は、更に、前記配線パターン形状のリードフレームと前記絶縁材との間で、前記リードフレームの側面側から前記絶縁材側にかけて、前記リードフレームの側面の表面側と裏面側に前記絶縁材との間に段差を形成したものである請求項1に記載の電子部品搭載用放熱基板。
- 前記機能的なまとまりを有する3つの発熱性電子部品群は、3相電動モータの各相の制御を行うパワーデバイスであり、前記パワーデバイスから前記電動モータの接続部までの電流経路の長さが、前記3相とも略同一である請求項1又は2に記載の電子部品搭載用放熱基板。
- 前記正三角形の各頂点部周辺に配置された前記機能的なまとまりを有する3つの発熱性電子部品群、又は、前記パワーデバイスからの出力方向は、前記機能的なまとまりを有する3つの発熱性電子部品群、又は、前記パワーデバイスからのリード線の引出し方向が、前記正三角形の重心から前記正三角形の各頂点の延長方向に向いている請求項1乃至3のいずれか1項に記載の電子部品搭載用放熱基板。
- 前記厚みの薄いリードフレームの配線幅は前記厚みの厚いリードフレームの配線幅よりも狭く形成される請求項1乃至4のいずれか1項に記載の電子部品搭載用放熱基板。
- 前記リードフレームの電子部品配置面の板面のうち、前記電子部品を配置しない部分には前記電子部品配置面の板面に表面側凹部を設けて前記絶縁材により被覆し、
前記表面側凹部を被覆する前記絶縁材の表面は、前記リードフレームの前記電子部品配置面の板面と前記絶縁材の前記電子部品配置面側の表面とで連続した一つの面を形成する請求項1乃至5のいずれか1項に記載の電子部品搭載用放熱基板。 - 前記リードフレームの電子部品配置面の裏面の板面であって、前記電子部品配置面のうち前記電子部品を配置しない部分の裏面に当たる部分に、前記裏面の板面に裏面側凹部を設けて前記絶縁材により被覆し、
前記裏面側凹部を被覆する前記絶縁材の表面は、前記リードフレームの電子部品配置面の裏面の板面と前記絶縁材の前記電子部品配置面側の裏面側の表面とで連続した一つの面を形成した請求項1乃至6のいずれか1項に記載の電子部品搭載用放熱基板。 - 前記導体板に形成した配線パターン形状のリードフレームの一部は、前記絶縁材の周縁より内側又は外側で、その一部を前記導体板の板面に対して上方又は下方に屈曲した形状を有する請求項1乃至7のいずれか1項に記載の電子部品搭載用放熱基板。
- 前記導体板に形成した配線パターン形状のリードフレームの全部又は一部は、前記絶縁材の周縁より外側で、折り曲げ可能に形成された請求項1乃至8のいずれか1項に記載の電子部品搭載用放熱基板。
- 前記導体板に形成した配線パターン形状のリードフレームの全部又は一部は、前記絶縁材の周縁より外側で、熱伝導体に当接される請求項1乃至9のいずれか1項に記載の電子部品搭載用放熱基板。
- 前記電子部品搭載用放熱基板2枚を介挿シートを介して1枚の電子部品搭載用放熱基板として構成し、前記1枚の電子部品搭載用放熱基板を構成する前記介挿シートを挟んだ一方の電子部品搭載用放熱基板の上面を前記1枚の電子部品搭載用放熱基板の表面側として用い、前記1枚の電子部品搭載用放熱基板を構成する前記介挿シートを挟んだ他の一方の電子部品搭載用放熱基板の下面を前記1枚の電子部品搭載用放熱基板の裏面側として用いる請求項1乃至10のいずれか1項に記載の電子部品搭載用放熱基板。
- 前記電子部品搭載用放熱基板の表面側の略中央部を重心とした正三角形状の各頂点部周辺に前記機能的なまとまりを有する3つの発熱性電子部品群、又は、前記電動モータの制御を行うパワーデバイスを分散配置した場合に、
前記分散配置を前記電子部品搭載用放熱基板の裏面側についても同様に行い、
前記裏面側に分散配置を行う際には、前記正三角形状の頂点に相当する位置を上記表面側と裏面側とで、前記正三角形状の重心を基準にして相互に略60度回転させた異なる位置で行う請求項11に記載の電子部品搭載用放熱基板。 - 請求項1乃至10のいずれか1項に記載の電子部品搭載用放熱基板を用いる放熱構造であって、少なくとも2枚以上の前記電子部品搭載用放熱基板の電子部品配置面の裏面を熱伝導体を介して取り付けて前記電子部品搭載用放熱基板からの放熱を行う前記電子部品搭載用放熱基板を用いる放熱構造。
- 請求項1乃至12のいずれか1項に記載の電子部品搭載用放熱基板を用いる電動パワーステアリング装置のパワーモジュール。
- 請求項1乃至12のいずれか1項に記載の電子部品搭載用放熱基板、又は、請求項13に記載の放熱構造、又は請求項14に記載のパワーモジュールに用いるシャント抵抗の接続構造であって、
前記電子部品搭載用放熱基板は、前記厚みの厚いリードフレーム上に、前記シャント抵抗の2つの端子を接続する2つの接続部を有し、
前記2つの接続部のそれぞれの近傍に前記厚みの薄いリードフレームの一端を配設するか、若しくは、前記厚みの薄いリードフレームの一端を、前記2つの接続部の一部にそれぞれ設けられた切り欠き部に配置し、
前記シャント抵抗の2つの端子の接続は、前記2つの接続部の上に前記シャント抵抗の2つの端子をそれぞれ載置して接続した構造を有するシャント抵抗の接続構造。 - 請求項1乃至12のいずれか1項に記載の電子部品搭載用放熱基板を用いた電動パワーステアリング装置。
- 請求項13に記載の放熱構造を用いた電動パワーステアリング装置。
- 請求項15に記載のシャント抵抗の接続構造を有する電動パワーステアリング装置。
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JP2018178601A Expired - Fee Related JP6573013B2 (ja) | 2014-11-20 | 2018-09-25 | 電子部品搭載用放熱基板 |
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JP6179679B2 (ja) * | 2014-11-20 | 2017-08-16 | 日本精工株式会社 | 電子部品搭載用放熱基板 |
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CN111284331B (zh) * | 2018-12-07 | 2023-06-27 | 瑷司柏电子股份有限公司 | 内建有分流电阻和功率晶体管的马达控制装置 |
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US10388596B2 (en) | 2019-08-20 |
JP6409923B2 (ja) | 2018-10-24 |
JP6508400B2 (ja) | 2019-05-08 |
JP6573014B2 (ja) | 2019-09-11 |
EP3223307A1 (en) | 2017-09-27 |
JPWO2016080520A1 (ja) | 2017-09-07 |
JP2017224839A (ja) | 2017-12-21 |
JP6361806B2 (ja) | 2018-07-25 |
JP6573013B2 (ja) | 2019-09-11 |
JP2018201020A (ja) | 2018-12-20 |
WO2016080520A1 (ja) | 2016-05-26 |
JP6191784B2 (ja) | 2017-09-06 |
JP6573015B2 (ja) | 2019-09-11 |
JP2019009466A (ja) | 2019-01-17 |
EP3223307A4 (en) | 2018-08-29 |
CN107004647B (zh) | 2019-05-03 |
JP2018152613A (ja) | 2018-09-27 |
JP2019041110A (ja) | 2019-03-14 |
JP2018011062A (ja) | 2018-01-18 |
US20170309555A1 (en) | 2017-10-26 |
JP2019009465A (ja) | 2019-01-17 |
JP2018152614A (ja) | 2018-09-27 |
CN107004647A (zh) | 2017-08-01 |
JP6573001B2 (ja) | 2019-09-11 |
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