JP6467701B2 - Electromagnetic wave shielding film, flexible printed wiring board with electromagnetic wave shielding film, and manufacturing method thereof - Google Patents

Electromagnetic wave shielding film, flexible printed wiring board with electromagnetic wave shielding film, and manufacturing method thereof Download PDF

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JP6467701B2
JP6467701B2 JP2014219422A JP2014219422A JP6467701B2 JP 6467701 B2 JP6467701 B2 JP 6467701B2 JP 2014219422 A JP2014219422 A JP 2014219422A JP 2014219422 A JP2014219422 A JP 2014219422A JP 6467701 B2 JP6467701 B2 JP 6467701B2
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film
electromagnetic wave
layer
adhesive layer
wave shielding
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JP2016086120A (en
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川口　利行
利行 川口
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Shin Etsu Polymer Co Ltd
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Shin Etsu Polymer Co Ltd
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Priority to CN201910950714.1A priority patent/CN110662347B/en
Priority to CN201810993409.6A priority patent/CN108848609B/en
Priority to CN201510557975.9A priority patent/CN105555010B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure

Description

本発明は、電磁波シールドフィルム、該電磁波シールドフィルムが設けられたフレキシブルプリント配線板、およびそれらの製造方法に関する。   The present invention relates to an electromagnetic wave shielding film, a flexible printed wiring board provided with the electromagnetic wave shielding film, and a method for producing them.

フレキシブルプリント配線板から発生する電磁波ノイズや外部からの電磁波ノイズを遮蔽するために、電磁波シールドフィルムをフレキシブルプリント配線板の表面に設けることがある（例えば、特許文献１参照）。   In order to shield electromagnetic wave noise generated from the flexible printed wiring board and external electromagnetic noise, an electromagnetic wave shielding film may be provided on the surface of the flexible printed wiring board (for example, see Patent Document 1).

図９は、従来の電磁波シールドフィルム付きフレキシブルプリント配線板の製造工程の一例を示す断面図である。
電磁波シールドフィルム付きフレキシブルプリント配線板１０１は、フレキシブルプリント配線板１３０と、絶縁フィルム１４０と、離型フィルム１１８を剥離した電磁波シールドフィルム１１０とを備える。
フレキシブルプリント配線板１３０は、ベースフィルム１３２の片面にプリント回路１３４が設けられたものである。
絶縁フィルム１４０は、フレキシブルプリント配線板１３０のプリント回路１３４が設けられた側の表面に設けられる。
電磁波シールドフィルム１１０は、絶縁性保護層１１２と、絶縁性保護層１１２の第１の表面を覆う金属薄膜層１１４と、金属薄膜層１１４の表面を覆う異方導電性接着剤層１１６と、絶縁性保護層１１２の第２の表面を覆う離型フィルム１１８（キャリアフィルム）とを備える。
電磁波シールドフィルム１１０の異方導電性接着剤層１１６は、絶縁フィルム１４０の表面に接着され、かつ硬化されている。また、異方導電性接着剤層１１６は、絶縁フィルム１４０に形成された貫通孔１４２を通ってプリント回路１３４に電気的に接続されている。 FIG. 9 is a cross-sectional view showing an example of a manufacturing process of a conventional flexible printed wiring board with an electromagnetic wave shielding film.
The flexible printed wiring board 101 with the electromagnetic wave shielding film includes a flexible printed wiring board 130, an insulating film 140, and an electromagnetic wave shielding film 110 from which the release film 118 is peeled off.
The flexible printed wiring board 130 has a printed circuit 134 provided on one side of a base film 132.
The insulating film 140 is provided on the surface of the flexible printed wiring board 130 on the side where the printed circuit 134 is provided.
The electromagnetic wave shielding film 110 includes an insulating protective layer 112, a metal thin film layer 114 covering the first surface of the insulating protective layer 112, an anisotropic conductive adhesive layer 116 covering the surface of the metal thin film layer 114, and insulation. A release film 118 (carrier film) covering the second surface of the protective layer 112.
The anisotropic conductive adhesive layer 116 of the electromagnetic wave shielding film 110 is adhered to the surface of the insulating film 140 and cured. Further, the anisotropic conductive adhesive layer 116 is electrically connected to the printed circuit 134 through a through hole 142 formed in the insulating film 140.

電磁波シールドフィルム付きフレキシブルプリント配線板１０１は、例えば、図９に示すように、下記の工程を経て製造される。
（ｉ）フレキシブルプリント配線板１３０のプリント回路１３４が設けられた側の表面に、プリント回路１３４のグランドに対応する位置に貫通孔１４２が形成された絶縁フィルム１４０を設ける工程。
（ｉｉ）電磁波シールドフィルム１１０を、絶縁フィルム１４０の表面に、電磁波シールドフィルム１１０の異方導電性接着剤層１１６が接触するように重ね、これらを熱プレスすることによって、絶縁フィルム１４０の表面に異方導電性接着剤層１１６を接着し、かつ異方導電性接着剤層１１６を、貫通孔１４２を通ってプリント回路１３４のグランドに電気的に接続する工程。
（ｉｉｉ）熱プレス後、キャリアフィルムとしての役割を終えた離型フィルム１１８を、絶縁性保護層１１２から剥離し、取り除くことによって、電磁波シールドフィルム付きフレキシブルプリント配線板１０１を得る工程。 For example, as shown in FIG. 9, the flexible printed wiring board 101 with the electromagnetic wave shielding film is manufactured through the following steps.
(I) A step of providing an insulating film 140 in which a through hole 142 is formed at a position corresponding to the ground of the printed circuit 134 on the surface of the flexible printed wiring board 130 on which the printed circuit 134 is provided.
(Ii) The electromagnetic wave shielding film 110 is stacked on the surface of the insulating film 140 so that the anisotropic conductive adhesive layer 116 of the electromagnetic wave shielding film 110 is in contact with them, and these are hot-pressed on the surface of the insulating film 140. Bonding the anisotropic conductive adhesive layer 116 and electrically connecting the anisotropic conductive adhesive layer 116 to the ground of the printed circuit 134 through the through hole 142;
(Iii) The process of obtaining the flexible printed wiring board 101 with an electromagnetic wave shield film by peeling and removing the release film 118 which finished the role as a carrier film from the insulating protective layer 112 after hot pressing.

しかし、電磁波シールドフィルム付きフレキシブルプリント配線板１０１にあっては、貫通孔１４２の部分等の凹凸がある部分にて、電磁波シールドフィルム１１０が凹凸の形状に沿って曲げ変形するため、金属薄膜層１１４にクラックが生じやすい。異方導電性接着剤層１１６は厚さ方向に導電性を有するが、面方向には導電性を有さないため、金属薄膜層１１４にクラックが生じると、金属薄膜層１１４および異方導電性接着剤層１１６からなる電磁波シールド層の抵抗が高くなり、電磁波シールド層による電磁波ノイズの遮蔽効果が低下する。   However, in the flexible printed wiring board 101 with the electromagnetic wave shielding film, the electromagnetic thin film 114 is bent and deformed along the shape of the unevenness in the portion with the unevenness such as the through hole 142 portion. Are prone to cracks. The anisotropic conductive adhesive layer 116 has conductivity in the thickness direction but does not have conductivity in the surface direction. Therefore, when a crack occurs in the metal thin film layer 114, the metal thin film layer 114 and the anisotropic conductivity are formed. The resistance of the electromagnetic wave shielding layer composed of the adhesive layer 116 is increased, and the shielding effect of electromagnetic wave noise by the electromagnetic wave shielding layer is lowered.

特開２０１４−１１２５７６号公報JP, 2014-112576, A

本発明は、金属薄膜層にクラックが生じても、電磁波ノイズの遮蔽効果を維持できる電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板、ならびにそれらの製造方法を提供する。   The present invention provides an electromagnetic wave shielding film and a flexible printed wiring board with an electromagnetic wave shielding film that can maintain an electromagnetic wave noise shielding effect even when a metal thin film layer is cracked, and a method for producing the same.

本発明は、下記の態様を有する。
（１）絶縁性保護層と、表面抵抗が０．０１〜０．３Ωである金属薄膜層と、導電性フィラーを含み、表面抵抗が１〜１００Ωである等方導電性接着剤層とを順に備えた、電磁波シールドフィルム。
（２）前記導電性フィラーの割合が、前記等方導電性接着剤層の１００体積％のうち、３０〜８０体積％である、（１）の電磁波シールドフィルム。
（３）前記等方導電性接着剤層が、前記導電性フィラーとして、導電性粒子および導電性繊維を含む、（１）または（２）の電磁波シールドフィルム。
（４）前記絶縁性保護層の表面に設けられた第１の離型フィルムをさらに備えた、（１）〜（３）のいずれかの電磁波シールドフィルム。
（５）前記等方導電性接着剤層の表面に設けられた第２の離型フィルムをさらに備えた、（４）の電磁波シールドフィルム。
（６）前記（５）の電磁波シールドフィルムを製造する方法であって、下記の工程（ａ）〜（ｄ）を有する、電磁波シールドフィルムの製造方法。
（ａ）第１の離型フィルムの片面に絶縁性保護層を形成する工程。
（ｂ）前記絶縁性保護層の表面に金属薄膜層を形成することによって、第１の離型フィルムと、絶縁性保護層と、金属薄膜層とを順に備えた第１の積層体を得る工程。
（ｃ）第２の離型フィルムの片面に等方導電性接着剤層を形成することによって、第２の離型フィルムと、等方導電性接着剤層とを順に備えた第２の積層体を得る工程。
（ｄ）前記第１の積層体と前記第２の積層体とを、前記金属薄膜層と前記等方導電性接着剤層とが接触するように貼り合わせる工程。
（７）ベースフィルムの少なくとも片面にプリント回路が設けられたフレキシブルプリント配線板と、前記フレキシブルプリント配線板の前記プリント回路が設けられた側の表面に設けられた絶縁フィルムと、前記絶縁フィルムの表面に前記等方導電性接着剤層が接着された（１）〜（３）のいずれかの電磁波シールドフィルムとを備え、前記等方導電性接着剤層が、前記絶縁フィルムに形成された貫通孔を通って前記プリント回路に電気的に接続された、電磁波シールドフィルム付きフレキシブルプリント配線板。
（８）下記の工程（ｅ）〜（ｇ）を有する、電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法。
（ｅ）ベースフィルムの少なくとも片面にプリント回路を有するフレキシブルプリント配線板の前記プリント回路が設けられた側の表面に、前記プリント回路に対応する位置に貫通孔が形成された絶縁フィルムを設け、絶縁フィルム付きフレキシブルプリント配線板を得る工程。
（ｆ）前記工程（ｅ）の後、前記絶縁フィルム付きフレキシブルプリント配線板と、（１）〜（４）のいずれかの電磁波シールドフィルムとを、前記絶縁フィルムの表面に前記等方導電性接着剤層が接触するように重ね、これらを熱プレスすることによって、前記絶縁フィルムの表面に前記等方導電性接着剤層を接着し、かつ前記等方導電性接着剤層を、前記貫通孔を通って前記プリント回路に電気的に接続する工程。
（ｇ）前記電磁波シールドフィルムが第１の離型フィルムを備えている場合は、前記工程（ｆ）の後、前記第１の離型フィルムを剥離する工程。 The present invention has the following aspects.
(1) An insulating protective layer, a metal thin film layer having a surface resistance of 0.01 to 0.3Ω, and an isotropic conductive adhesive layer that includes a conductive filler and has a surface resistance of 1 to 100Ω in order. Equipped with an electromagnetic shielding film.
(2) The electromagnetic wave shielding film according to (1), wherein a ratio of the conductive filler is 30 to 80% by volume in 100% by volume of the isotropic conductive adhesive layer.
(3) The electromagnetic wave shielding film according to (1) or (2), wherein the isotropic conductive adhesive layer includes conductive particles and conductive fibers as the conductive filler.
(4) The electromagnetic wave shielding film according to any one of (1) to (3), further comprising a first release film provided on the surface of the insulating protective layer.
(5) The electromagnetic wave shielding film according to (4), further comprising a second release film provided on the surface of the isotropic conductive adhesive layer.
(6) A method for producing an electromagnetic wave shielding film according to (5), comprising the following steps (a) to (d).
(A) A step of forming an insulating protective layer on one surface of the first release film.
(B) The process of obtaining the 1st laminated body provided with the 1st release film, the insulating protective layer, and the metal thin film layer in order by forming a metal thin film layer on the surface of the said insulating protective layer. .
(C) A second laminate comprising a second release film and an isotropic conductive adhesive layer in this order by forming an isotropic conductive adhesive layer on one surface of the second release film. Obtaining.
(D) A step of bonding the first laminated body and the second laminated body so that the metal thin film layer and the isotropic conductive adhesive layer are in contact with each other.
(7) A flexible printed wiring board provided with a printed circuit on at least one side of a base film, an insulating film provided on the surface of the flexible printed wiring board provided with the printed circuit, and a surface of the insulating film The isotropic conductive adhesive layer is attached to the electromagnetic wave shielding film of any one of (1) to (3), and the isotropic conductive adhesive layer is formed in the through-hole formed in the insulating film. A flexible printed wiring board with an electromagnetic wave shielding film electrically connected to the printed circuit through the wiring board.
(8) The manufacturing method of the flexible printed wiring board with an electromagnetic wave shielding film which has the following process (e)-(g).
(E) An insulating film having a through-hole formed at a position corresponding to the printed circuit is provided on the surface of the flexible printed wiring board having the printed circuit on at least one side of the base film on the side where the printed circuit is provided; The process of obtaining the flexible printed wiring board with a film.
(F) After the step (e), the isotropic conductive adhesion of the flexible printed wiring board with an insulating film and the electromagnetic wave shielding film of any one of (1) to (4) to the surface of the insulating film The isotropic conductive adhesive layer is adhered to the surface of the insulating film by stacking the adhesive layers so that they are in contact with each other and hot pressing them, and the isotropic conductive adhesive layer is attached to the through-holes. Electrically connecting to the printed circuit through.
(G) A step of peeling off the first release film after the step (f) when the electromagnetic wave shielding film includes a first release film.

本発明の電磁波シールドフィルムは、金属薄膜層にクラックが生じても、電磁波ノイズの遮蔽効果を維持できる。
本発明の電磁波シールドフィルムの製造方法によれば、金属薄膜層にクラックが生じても、電磁波ノイズの遮蔽効果を維持できる電磁波シールドフィルムを製造できる。
本発明の電磁波シールドフィルム付きフレキシブルプリント配線板は、金属薄膜層にクラックが生じても、電磁波ノイズの遮蔽効果を維持できる。
本発明の電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法によれば、金属薄膜層にクラックが生じても、電磁波ノイズの遮蔽効果を維持できる電磁波シールドフィルム付きフレキシブルプリント配線板を製造できる。 The electromagnetic wave shielding film of the present invention can maintain the electromagnetic noise shielding effect even if a crack occurs in the metal thin film layer.
According to the method for producing an electromagnetic wave shielding film of the present invention, it is possible to produce an electromagnetic wave shielding film that can maintain an electromagnetic noise shielding effect even if a crack occurs in the metal thin film layer.
The flexible printed wiring board with an electromagnetic wave shielding film of the present invention can maintain an electromagnetic noise shielding effect even if a crack occurs in the metal thin film layer.
According to the method for producing a flexible printed wiring board with an electromagnetic wave shielding film of the present invention, it is possible to produce a flexible printed wiring board with an electromagnetic wave shielding film capable of maintaining an electromagnetic noise shielding effect even if a crack occurs in the metal thin film layer.

本発明の電磁波シールドフィルムの一例を示す断面図である。It is sectional drawing which shows an example of the electromagnetic wave shielding film of this invention. 本発明の電磁波シールドフィルムの製造方法における工程（ａ）〜（ｂ）の一例を示す断面図である。It is sectional drawing which shows an example of process (a)-(b) in the manufacturing method of the electromagnetic wave shield film of this invention. 本発明の電磁波シールドフィルムの製造方法における工程（ｃ）の一例を示す断面図である。It is sectional drawing which shows an example of the process (c) in the manufacturing method of the electromagnetic wave shield film of this invention. 本発明の電磁波シールドフィルムの製造方法における工程（ｄ）の一例を示す断面図である。It is sectional drawing which shows an example of the process (d) in the manufacturing method of the electromagnetic wave shield film of this invention. 金属薄膜層にクラックが生じる前の電磁波シールド層の全体抵抗を概算するために用いた電磁波シールド層のモデルケースを示す斜視図である。It is a perspective view which shows the model case of the electromagnetic wave shield layer used in order to approximate the whole resistance of the electromagnetic wave shield layer before a crack arises in a metal thin film layer. 金属薄膜層にクラックが生じた後の電磁波シールド層の全体抵抗を概算するために用いた電磁波シールド層のモデルケースを示す斜視図である。It is a perspective view which shows the model case of the electromagnetic wave shield layer used in order to approximate the whole resistance of the electromagnetic wave shield layer after a crack produced in the metal thin film layer. 本発明の電磁波シールドフィルム付きフレキシブルプリント配線板の一例を示す断面図である。It is sectional drawing which shows an example of the flexible printed wiring board with an electromagnetic wave shielding film of this invention. 本発明の電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法における工程（ｅ）〜（ｇ）の一例を示す断面図である。It is sectional drawing which shows an example of process (e)-(g) in the manufacturing method of the flexible printed wiring board with an electromagnetic wave shielding film of this invention. 従来の電磁波シールドフィルム付きフレキシブルプリント配線板の製造工程の一例を示す断面図である。It is sectional drawing which shows an example of the manufacturing process of the conventional flexible printed wiring board with an electromagnetic wave shielding film.

以下の用語の定義は、本明細書および特許請求の範囲にわたって適用される。
導電性粒子の平均粒子径は、導電性粒子の電子顕微鏡像から３０個の導電性粒子を無作為に選び、それぞれの導電性粒子について、最小径および最大径を測定し、最小径と最大径との中央値を一粒子の粒子径とし、測定した３０個の導電性粒子の粒子径を算術平均して得た値である。
導電性繊維の平均繊維長は、導電性繊維の電子顕微鏡像から３０本の導電性繊維を無作為に選び、それぞれの導電性繊維について、繊維長を測定し、測定した３０本の導電性繊維の繊維長を算術平均して得た値である。
導電性繊維の平均繊維径は、導電性繊維の電子顕微鏡像から３０本の導電性繊維を無作為に選び、それぞれの導電性繊維について、最小径および最大径を測定し、最小径と最大径との中央値を一繊維の繊維径とし、測定した３０本の導電性繊維の繊維径を算術平均して得た値である。
導電性粒子および導電性繊維の比表面積は、脱気した粒子等を液体窒素に浸漬させ、吸着した窒素量を測定し、この値から算出した値である。
フィルム（離型フィルム、絶縁フィルム等）、塗膜（絶縁性保護層、導電性接着剤層等）、金属薄膜層等の厚さは、透過型電子顕微鏡を用いて測定対象の断面を観察し、５箇所の厚さを測定し、平均した値である。
貯蔵弾性率は、測定対象に与えた応力と検出した歪から算出され、温度または時間の関数として出力する動的粘弾性測定装置を用いて、粘弾性特性の一つとして測定される。
表面抵抗は、石英ガラス上に金を蒸着して形成した、２本の薄膜金属電極（長さ１０ｍｍ、幅５ｍｍ、電極間距離１０ｍｍ）を用い、この電極上に被測定物を置き、被測定物上から、被測定物の１０ｍｍ×２０ｍｍの領域を０．０４９Ｎの荷重で押し付け、１ｍＡ以下の測定電流で測定される電極間の抵抗である。 The following definitions of terms apply throughout this specification and the claims.
For the average particle diameter of the conductive particles, 30 conductive particles are randomly selected from the electron microscopic image of the conductive particles, and the minimum diameter and the maximum diameter are measured for each conductive particle. Is a value obtained by arithmetically averaging the measured particle diameters of 30 conductive particles.
For the average fiber length of the conductive fibers, 30 conductive fibers were randomly selected from the electron microscope image of the conductive fibers, the fiber length was measured for each conductive fiber, and the measured 30 conductive fibers were measured. This is a value obtained by arithmetically averaging the fiber lengths.
For the average fiber diameter of the conductive fibers, 30 conductive fibers were randomly selected from the electron microscopic image of the conductive fibers, the minimum diameter and the maximum diameter were measured for each conductive fiber, and the minimum diameter and maximum diameter were measured. Is the value obtained by arithmetically averaging the measured fiber diameters of 30 conductive fibers.
The specific surface area of the conductive particles and the conductive fibers is a value calculated by immersing degassed particles or the like in liquid nitrogen and measuring the amount of adsorbed nitrogen.
The thickness of film (release film, insulating film, etc.), coating film (insulating protective layer, conductive adhesive layer, etc.), metal thin film layer, etc. is observed using a transmission electron microscope. It is the value obtained by measuring the thickness at five locations and averaging.
The storage elastic modulus is calculated as one of the viscoelastic characteristics using a dynamic viscoelasticity measuring device that is calculated from the stress applied to the measurement object and the detected strain and outputs it as a function of temperature or time.
The surface resistance is measured by using two thin film metal electrodes (length 10 mm, width 5 mm, distance 10 mm between electrodes) formed by depositing gold on quartz glass, placing an object to be measured on the electrodes, and measuring the surface resistance. This is a resistance between electrodes measured by pressing a 10 mm × 20 mm region of the object to be measured with a load of 0.049 N from above the object with a measurement current of 1 mA or less.

＜電磁波シールドフィルム＞
図１は、本発明の電磁波シールドフィルムの一例を示す断面図である。
電磁波シールドフィルム１０は、絶縁性保護層１２と、絶縁性保護層１２の第１の表面を覆う金属薄膜層１４と、金属薄膜層１４の表面を覆う等方導電性接着剤層１６と、絶縁性保護層１２の第２の表面を覆う第１の離型フィルム１８と、等方導電性接着剤層１６の表面を覆う第２の離型フィルム２０とを備える。 <Electromagnetic wave shielding film>
FIG. 1 is a cross-sectional view showing an example of the electromagnetic wave shielding film of the present invention.
The electromagnetic wave shielding film 10 includes an insulating protective layer 12, a metal thin film layer 14 covering the first surface of the insulating protective layer 12, an isotropic conductive adhesive layer 16 covering the surface of the metal thin film layer 14, and an insulating film. The first release film 18 that covers the second surface of the protective protective layer 12 and the second release film 20 that covers the surface of the isotropic conductive adhesive layer 16 are provided.

（絶縁性保護層）
絶縁性保護層１２は、金属薄膜層１４を形成する際のベース（下地）となり、電磁波シールドフィルム１０を、フレキシブルプリント配線板の表面に設けられた絶縁フィルムの表面に貼着した後には、金属薄膜層１４を保護する。
絶縁性保護層１２の表面抵抗は、電気的絶縁性の点から、１×１０６Ω以上が好ましい。絶縁性保護層１２の表面抵抗は、実用上の点から、１×１０１９Ω以下が好ましい。 (Insulating protective layer)
The insulating protective layer 12 becomes a base (base) for forming the metal thin film layer 14, and after the electromagnetic wave shielding film 10 is attached to the surface of the insulating film provided on the surface of the flexible printed wiring board, the insulating protective layer 12 is a metal. The thin film layer 14 is protected.
The surface resistance of the insulating protective layer 12 is preferably 1 × 10 6 Ω or more from the viewpoint of electrical insulation. The surface resistance of the insulating protective layer 12 is preferably 1 × 10 19 Ω or less from a practical point of view.

絶縁性保護層１２としては、熱硬化性樹脂と硬化剤とを含む塗料を塗布し、硬化させて形成された塗膜、熱可塑性樹脂を含む塗料を塗布して形成された塗膜、熱可塑性樹脂を溶融成形したフィルムからなる層等が挙げられる。ハンダ付け等の際の耐熱性の点から、熱硬化性樹脂と硬化剤とを含む塗料を塗布し、硬化させて形成された塗膜が好ましい。   As the insulating protective layer 12, a coating film formed by applying and curing a paint containing a thermosetting resin and a curing agent, a coating film formed by applying a paint containing a thermoplastic resin, thermoplasticity Examples thereof include a layer made of a film obtained by melt-molding a resin. From the viewpoint of heat resistance during soldering or the like, a coating film formed by applying and curing a paint containing a thermosetting resin and a curing agent is preferable.

熱硬化性樹脂としては、アミド樹脂、エポキシ樹脂、フェノール樹脂、アミノ樹脂、アルキッド樹脂、ウレタン樹脂、合成ゴム、ＵＶ硬化アクリレート樹脂等が挙げられ、耐熱性に優れる点から、アミド樹脂、エポキシ樹脂が好ましい。   Examples of thermosetting resins include amide resins, epoxy resins, phenol resins, amino resins, alkyd resins, urethane resins, synthetic rubbers, UV curable acrylate resins, etc. From the viewpoint of excellent heat resistance, amide resins and epoxy resins are preferable.

絶縁性保護層１２の１６０℃における貯蔵弾性率は、５×１０６〜１×１０８Ｐａが好ましく、８×１０６〜２×１０７Ｐａがより好ましい。通常、熱硬化性樹脂の硬化物は硬いため、これからなる塗膜は、柔軟性に乏しく、特に、厚さを薄くした場合は、非常に脆く自立膜として存在できるほどの強度がない。絶縁性保護層１２は、第１の離型フィルム１８を剥離する際の温度下（導電性接着剤を硬化させる温度で、通常１５０〜２００℃の温度）において、十分な強度を有することが好ましい。絶縁性保護層１２の１６０℃における貯蔵弾性率が５×１０６Ｐa以上であれば、絶縁性保護層１２が軟化することがない。絶縁性保護層１２の１６０℃における貯蔵弾性率が１×１０８Ｐａ以下であれば、柔軟性や強度が十分となる。その結果、第１の離型フィルム１８を剥離する際に絶縁性保護層１２はもとより電磁波シールドフィルム１０が破断しにくい。 The storage elastic modulus at 160 ° C. of the insulating protective layer 12 is preferably 5 × 10 6 to 1 × 10 8 Pa, more preferably 8 × 10 6 to 2 × 10 7 Pa. Usually, since a cured product of a thermosetting resin is hard, a coating film made thereof is poor in flexibility, and in particular, when the thickness is reduced, it is very brittle and does not have enough strength to exist as a self-supporting film. The insulating protective layer 12 preferably has sufficient strength at the temperature at which the first release film 18 is peeled (the temperature at which the conductive adhesive is cured, usually 150 to 200 ° C.). . When the storage elastic modulus at 160 ° C. of the insulating protective layer 12 is 5 × 10 6 Pa or more, the insulating protective layer 12 is not softened. If the storage elastic modulus at 160 ° C. of the insulating protective layer 12 is 1 × 10 8 Pa or less, flexibility and strength are sufficient. As a result, when the first release film 18 is peeled off, the electromagnetic shielding film 10 as well as the insulating protective layer 12 is hardly broken.

絶縁性保護層１２は、電磁波シールドフィルム付きフレキシブルプリント配線板に意匠性を付与するために、着色されていてもよい。
絶縁性保護層１２は、貯蔵弾性率等の特性、材料等が異なる２種以上の層から構成されていてもよい。 The insulating protective layer 12 may be colored in order to impart designability to the flexible printed wiring board with an electromagnetic wave shielding film.
The insulating protective layer 12 may be composed of two or more layers having different properties such as storage elastic modulus, materials, and the like.

絶縁性保護層１２の厚さは、１〜１０μｍが好ましく、１〜５μｍがより好ましい。絶縁性保護層１２の厚さが１μｍ以上であれば、耐熱性が良好となる。絶縁性保護層１２の厚さが１０μｍ以下であれば、電磁波シールドフィルム１０を薄くできる。   1-10 micrometers is preferable and, as for the thickness of the insulating protective layer 12, 1-5 micrometers is more preferable. When the thickness of the insulating protective layer 12 is 1 μm or more, the heat resistance is good. If the thickness of the insulating protective layer 12 is 10 μm or less, the electromagnetic wave shielding film 10 can be thinned.

（金属薄膜層）
金属薄膜層１４は、金属の薄膜からなる層である。金属薄膜層１４は、面方向に広がるように形成されていることから、面方向に導電性を有し、電磁波シールド層等として機能する。 (Metal thin film layer)
The metal thin film layer 14 is a layer made of a metal thin film. Since the metal thin film layer 14 is formed so as to spread in the plane direction, it has conductivity in the plane direction and functions as an electromagnetic wave shielding layer or the like.

金属薄膜層１４としては、物理蒸着（真空蒸着、スパッタリング、イオンビーム蒸着、電子ビーム蒸着等）、ＣＶＤ、めっき等によって形成された金属薄膜、金属箔等が挙げられ、厚さを薄くでき、かつ厚さが薄くても面方向の導電性に優れ、ドライプロセスにて簡便に形成できる点から、物理蒸着による金属薄膜（蒸着膜）が好ましい。   Examples of the metal thin film layer 14 include physical vapor deposition (vacuum vapor deposition, sputtering, ion beam vapor deposition, electron beam vapor deposition, etc.), metal thin films, metal foils, and the like formed by CVD, plating, etc. A metal thin film (deposited film) by physical vapor deposition is preferable because it has excellent surface conductivity even when the thickness is small and can be easily formed by a dry process.

金属薄膜層１４を構成する金属薄膜の材料としては、アルミニウム、銀、銅、金、導電性セラミックス等が挙げられる。電気伝導度の点からは、銅が好ましく、化学的安定性の点からは、導電性セラミックスが好ましい。   Examples of the material for the metal thin film constituting the metal thin film layer 14 include aluminum, silver, copper, gold, and conductive ceramics. From the viewpoint of electrical conductivity, copper is preferable, and from the viewpoint of chemical stability, conductive ceramics are preferable.

金属薄膜層１４の厚さは、０．０１〜１μｍが好ましく、０．０５〜１μｍがより好ましい。金属薄膜層１４の厚さが０．０１μｍ以上であれば、面方向の導電性がさらに良好になる。金属薄膜層１４の厚さが０．０５μｍ以上であれば、電磁波ノイズの遮蔽効果がさらに良好になる。金属薄膜層１４の厚さが１μｍ以下であれば、電磁波シールドフィルム１０を薄くできる。また、電磁波シールドフィルム１０の生産性、可とう性がよくなる。   The thickness of the metal thin film layer 14 is preferably 0.01 to 1 μm, and more preferably 0.05 to 1 μm. When the thickness of the metal thin film layer 14 is 0.01 μm or more, the surface conductivity is further improved. When the thickness of the metal thin film layer 14 is 0.05 μm or more, the electromagnetic noise shielding effect is further improved. If the thickness of the metal thin film layer 14 is 1 μm or less, the electromagnetic wave shielding film 10 can be thinned. In addition, the productivity and flexibility of the electromagnetic wave shielding film 10 are improved.

金属薄膜層１４の表面抵抗は、０．０１〜０．３Ωであり、０．０２〜０．２Ωが好ましく、０．０５〜０．１Ωがより好ましい。金属薄膜層１４の表面抵抗が０．０１Ω以上であれば、金属薄膜層１４を十分に薄くできる。金属薄膜層１４の表面抵抗が０．３Ω以下であれば、電磁波シールド層として十分に機能できる。   The surface resistance of the metal thin film layer 14 is 0.01 to 0.3Ω, preferably 0.02 to 0.2Ω, and more preferably 0.05 to 0.1Ω. When the surface resistance of the metal thin film layer 14 is 0.01Ω or more, the metal thin film layer 14 can be made sufficiently thin. If the surface resistance of the metal thin film layer 14 is 0.3Ω or less, it can sufficiently function as an electromagnetic wave shielding layer.

（等方導電性接着剤層）
等方導電性接着剤層１６は、厚さ方向および面方向に導電性を有し、かつ接着性を有する。
等方導電性接着剤層１６は、厚さ方向に導電性を有し、面方向に導電性を有しない異方導電性接着剤層に比べ、電磁波シールド層として十分に機能できる。 (Isotropic conductive adhesive layer)
The isotropic conductive adhesive layer 16 has conductivity in the thickness direction and the surface direction, and has adhesiveness.
The isotropic conductive adhesive layer 16 can sufficiently function as an electromagnetic wave shielding layer as compared with an anisotropic conductive adhesive layer having conductivity in the thickness direction and not having conductivity in the surface direction.

等方導電性接着剤層１６は、導電性フィラーを含む。等方導電性接着剤層１６は、厚さ方向および面方向の導電性の点から、導電性フィラーとして導電性粒子２２を含むことが好ましく、面方向の導電性がさらに良好になり、表面抵抗が低くなる点、また、等方導電性接着剤層１６の強度が高くなり、クラックが生じにくい点から、導電性フィラーとして導電性粒子２２および導電性繊維２４を含むことがより好ましい。   The isotropic conductive adhesive layer 16 includes a conductive filler. The isotropic conductive adhesive layer 16 preferably includes the conductive particles 22 as a conductive filler from the viewpoint of the conductivity in the thickness direction and the plane direction, and the conductivity in the plane direction is further improved and the surface resistance is improved. It is more preferable that the conductive particles 22 and the conductive fibers 24 are included as the conductive filler because the strength of the isotropic conductive adhesive layer 16 is increased and cracks are not easily generated.

また、等方導電性接着剤層１６においては、面方向の導電性がさらに良好になり、表面抵抗が低くなる点、また、等方導電性接着剤層１６の強度が高くなり、クラックが生じにくい点から、導電性繊維２４の繊維方向の向きが、等方導電性接着剤層１６の厚さ方向よりも、等方導電性接着剤層１６の面方向に偏っている、すなわち導電性繊維２４が等方導電性接着剤層１６の面方向に配向していることが好ましい。   Further, in the isotropic conductive adhesive layer 16, the surface conductivity is further improved, the surface resistance is lowered, and the strength of the isotropic conductive adhesive layer 16 is increased, resulting in cracks. From the difficult point, the direction of the conductive fiber 24 in the fiber direction is biased toward the surface direction of the isotropic conductive adhesive layer 16 rather than the thickness direction of the isotropic conductive adhesive layer 16, that is, the conductive fiber. 24 is preferably oriented in the surface direction of the isotropic conductive adhesive layer 16.

等方導電性接着剤層１６としては、硬化後に耐熱性を発揮できる点から、熱硬化性の等方導電性接着剤層が好ましい。
熱硬化性の等方導電性接着剤層１６は、例えば、熱硬化性接着剤と導電性粒子２２と導電性繊維２４とを含む。等方導電性接着剤層１６は、未硬化の状態であってもよく、Ｂステージ化された状態であってもよい。 The isotropic conductive adhesive layer 16 is preferably a thermosetting isotropic conductive adhesive layer from the viewpoint that heat resistance can be exhibited after curing.
The thermosetting isotropic conductive adhesive layer 16 includes, for example, a thermosetting adhesive, conductive particles 22, and conductive fibers 24. The isotropic conductive adhesive layer 16 may be in an uncured state or may be in a B-staged state.

熱硬化性接着剤としては、エポキシ樹脂、フェノール樹脂、アミノ樹脂、アルキッド樹脂、ウレタン樹脂、合成ゴム、ＵＶ硬化アクリレート樹脂等が挙げられる。耐熱性に優れる点から、エポキシ樹脂が好ましい。エポキシ樹脂は、可とう性付与のためのゴム成分（カルボキシル変性ニトリルゴム等）、粘着付与剤等を含んでいてもよい。
熱硬化性接着剤は、等方導電性接着剤層１６の強度を高め、打ち抜き特性を向上させるために、セルロース樹脂、ミクロフィブリル（ガラス繊維等）を含んでいてもよい。 Examples of the thermosetting adhesive include epoxy resin, phenol resin, amino resin, alkyd resin, urethane resin, synthetic rubber, and UV curable acrylate resin. An epoxy resin is preferable from the viewpoint of excellent heat resistance. The epoxy resin may contain a rubber component (carboxyl-modified nitrile rubber or the like) for imparting flexibility, a tackifier or the like.
The thermosetting adhesive may contain a cellulose resin and microfibril (such as glass fiber) in order to increase the strength of the isotropic conductive adhesive layer 16 and improve the punching characteristics.

導電性粒子２２としては、黒鉛粉、焼成カーボン粒子、金属（銀、白金、金、銅、ニッケル、パラジウム、アルミニウム、ハンダ等）の粒子、めっきされた焼成カーボン粒子等が挙げられる。等方導電性接着剤層１６の流動性の点からは、堅く球状である焼成カーボン粒子が好ましい。   Examples of the conductive particles 22 include graphite powder, calcined carbon particles, metal (silver, platinum, gold, copper, nickel, palladium, aluminum, solder, etc.) particles, plated calcined carbon particles, and the like. From the viewpoint of the fluidity of the isotropic conductive adhesive layer 16, baked carbon particles that are hard and spherical are preferred.

導電性粒子２２の平均粒子径は、０．１〜１０μｍが好ましく、０．２〜１μｍがより好ましい。導電性粒子２２の平均粒子径が０．１μｍ以上であれば、導電性粒子２２の接触点数が増えることになり、３次元方向の導通性を安定的に高めることができる。導電性粒子２２の平均粒子径が１０μｍ以下であれば、等方導電性接着剤層１６の流動性（絶縁フィルムの貫通孔の形状への追随性）を確保でき、絶縁フィルムの貫通孔内を導電性接着剤で十分に埋めることができる。   0.1-10 micrometers is preferable and, as for the average particle diameter of the electroconductive particle 22, 0.2-1 micrometer is more preferable. If the average particle diameter of the conductive particles 22 is 0.1 μm or more, the number of contact points of the conductive particles 22 increases, and the conductivity in the three-dimensional direction can be stably increased. If the average particle diameter of the conductive particles 22 is 10 μm or less, the fluidity of the isotropic conductive adhesive layer 16 (followability to the shape of the through hole of the insulating film) can be secured, and the inside of the through hole of the insulating film can be secured. It can be sufficiently filled with a conductive adhesive.

導電性粒子２２の比表面積は、０．２〜５０ｍ２／ｇが好ましく、０．５〜２０ｍ２／ｇがより好ましい。導電性粒子２２の比表面積が０．２ｍ２／ｇ以上であれば、導電性粒子２２を入手しやすい。導電性粒子２２の比表面積が５０ｍ２／ｇ以下であれば、導電性粒子２２の吸油量が大きくなりすぎず、その結果、導電性接着剤の粘度が高くなりすぎず、塗布性がさらに良好となる。また、等方導電性接着剤層１６の流動性（絶縁フィルムの貫通孔の形状への追随性）をさらに確保できる。 0.2-50 m < 2 > / g is preferable and, as for the specific surface area of the electroconductive particle 22, 0.5-20 m < 2 > / g is more preferable. If the specific surface area of the electroconductive particle 22 is 0.2 m < 2 > / g or more, the electroconductive particle 22 will be easy to obtain. If the specific surface area of the conductive particles 22 is 50 m 2 / g or less, the oil absorption amount of the conductive particles 22 does not become too large, and as a result, the viscosity of the conductive adhesive does not become too high and the coatability is further improved. It becomes. Further, the fluidity of the isotropic conductive adhesive layer 16 (followability to the shape of the through hole of the insulating film) can be further ensured.

導電性フィラーが導電性粒子２２のみの場合、導電性粒子２２の割合は、等方導電性接着剤層１６の１００体積％のうち、３０〜８０体積％が好ましく、５０〜７０体積％がより好ましい。導電性粒子２２の割合が３０体積％以上であれば、等方導電性接着剤層１６の導電性が安定化する。導電性粒子２２の割合が８０体積％以下であれば、等方導電性接着剤層１６の接着性、流動性（絶縁フィルムの貫通孔の形状への追随性）が良好になる。また、電磁波シールドフィルム１０の可とう性がよくなる。   When the conductive filler is only the conductive particles 22, the proportion of the conductive particles 22 is preferably 30 to 80% by volume, more preferably 50 to 70% by volume, out of 100% by volume of the isotropic conductive adhesive layer 16. preferable. When the ratio of the conductive particles 22 is 30% by volume or more, the conductivity of the isotropic conductive adhesive layer 16 is stabilized. When the ratio of the conductive particles 22 is 80% by volume or less, the adhesiveness and fluidity of the isotropic conductive adhesive layer 16 (followability to the shape of the through hole of the insulating film) are improved. Moreover, the flexibility of the electromagnetic wave shielding film 10 is improved.

導電性繊維２４としては、カーボンナノファイバ、金属（銅、白金、金、銀、ニッケル等）のナノワイヤ等が挙げられ、等方導電性接着剤層１６の厚みがミクロンレベルと薄いことから繊維径の細いカーボンナノファイバが好ましい。カーボンナノファイバとしては、分散性に優れている点、等方導電性接着剤層１６の流動性（絶縁フィルムの貫通孔の形状への追随性）を確保する点から、気相法炭素繊維が好ましい。   Examples of the conductive fibers 24 include carbon nanofibers and nanowires of metals (copper, platinum, gold, silver, nickel, etc.). Since the thickness of the isotropic conductive adhesive layer 16 is as small as a micron level, the fiber diameter A thin carbon nanofiber is preferred. As carbon nanofibers, vapor grown carbon fibers are used because they are excellent in dispersibility and ensure the fluidity of the isotropic conductive adhesive layer 16 (followability to the shape of the through holes of the insulating film). preferable.

導電性繊維２４の平均繊維長は、０．５〜５μｍが好ましく、１〜３μｍがより好ましい。導電性繊維２４の平均繊維長が０．５μｍ以上であれば、等方導電性接着剤層１６の導電性および強度がさらに良好になる。導電性繊維２４の平均繊維長が５μｍ以下であれば、等方導電性接着剤層１６の接着性、流動性（絶縁フィルムの貫通孔の形状への追随性）が良好になる。   0.5-5 micrometers is preferable and, as for the average fiber length of the conductive fiber 24, 1-3 micrometers is more preferable. When the average fiber length of the conductive fibers 24 is 0.5 μm or more, the conductivity and strength of the isotropic conductive adhesive layer 16 are further improved. When the average fiber length of the conductive fibers 24 is 5 μm or less, the adhesiveness and fluidity (trackability to the shape of the through holes of the insulating film) of the isotropic conductive adhesive layer 16 are improved.

導電性繊維２４の平均繊維径は、０．０１〜０．５μｍが好ましく、０．０５〜０．３μｍがより好ましい。導電性繊維の平均繊維径が０．０１μｍ以上であれば、等方導電性接着剤層１６の導電性および強度がさらに良好になる。導電性繊維２４の平均繊維径が０．５μｍ以下であれば、等方導電性接着剤層１６の接着性、流動性（絶縁フィルムの貫通孔の形状への追随性）が良好になる。   The average fiber diameter of the conductive fibers 24 is preferably 0.01 to 0.5 μm, and more preferably 0.05 to 0.3 μm. When the average fiber diameter of the conductive fibers is 0.01 μm or more, the conductivity and strength of the isotropic conductive adhesive layer 16 are further improved. When the average fiber diameter of the conductive fibers 24 is 0.5 μm or less, the adhesiveness and fluidity (trackability to the shape of the through holes of the insulating film) of the isotropic conductive adhesive layer 16 are improved.

導電性繊維２４のアスペクト比は、５〜３００が好ましく、１０〜１００がより好ましい。導電性繊維のアスペクト比が５以上であれば、等方導電性接着剤層１６の導電性および強度がさらに良好になる。導電性繊維のアスペクト比が３００以下であれば、等方導電性接着剤層１６の接着性、流動性（絶縁フィルムの貫通孔の形状への追随性）が良好になる。   The aspect ratio of the conductive fiber 24 is preferably 5 to 300, and more preferably 10 to 100. When the aspect ratio of the conductive fiber is 5 or more, the conductivity and strength of the isotropic conductive adhesive layer 16 are further improved. When the aspect ratio of the conductive fiber is 300 or less, the adhesiveness and fluidity (followability to the shape of the through hole of the insulating film) of the isotropic conductive adhesive layer 16 are good.

導電性繊維２４の比表面積は、２〜５０ｍ２／ｇが好ましく、２〜４０ｍ２／ｇがより好ましい。導電性繊維２４の比表面積が２ｍ２／ｇ以上であれば、導電性繊維２４を入手しやすい。導電性繊維２４の比表面積が５０ｍ２／ｇ以下であれば、導電性繊維２４の吸油量が大きくなりすぎず、その結果、導電性接着剤の粘度が高くなりすぎず、塗布性がさらに良好となる。また、等方導電性接着剤層１６の流動性（絶縁フィルムの貫通孔の形状への追随性）をさらに確保できる。 2-50 m < 2 > / g is preferable and, as for the specific surface area of the conductive fiber 24, 2-40 m < 2 > / g is more preferable. If the specific surface area of the conductive fiber 24 is 2 m 2 / g or more, the conductive fiber 24 is easily available. If the specific surface area of the conductive fiber 24 is 50 m 2 / g or less, the oil absorption amount of the conductive fiber 24 does not become too large, and as a result, the viscosity of the conductive adhesive does not become too high and the coatability is further improved. It becomes. Further, the fluidity of the isotropic conductive adhesive layer 16 (followability to the shape of the through hole of the insulating film) can be further ensured.

導電性フィラーが導電性粒子２２および導電性繊維２４である場合、導電性繊維２４の割合は、等方導電性接着剤層１６の１００体積％のうち、３〜３０体積％が好ましく、５〜２０体積％がより好ましい。ただし、導電性粒子２２および導電性繊維２４の合計は、３０〜８０体積％（好ましくは５０〜７０体積％）である。導電性繊維２４の割合が３体積％以上であれば、等方導電性接着剤層１６の導電性および強度がさらに良好になる。導電性繊維２４の割合が３０体積％以下であれば、導電性接着剤の粘度が高くなりすぎず、塗布性が良好となる。また、等方導電性接着剤層１６の流動性（絶縁フィルムの貫通孔の形状への追随性）を確保でき、絶縁フィルムの貫通孔内を等方導電性接着剤層１６で十分に埋めることができる。   When the conductive filler is the conductive particles 22 and the conductive fibers 24, the proportion of the conductive fibers 24 is preferably 3 to 30% by volume in 100% by volume of the isotropic conductive adhesive layer 16, and 5 to 5%. 20% by volume is more preferable. However, the total of the conductive particles 22 and the conductive fibers 24 is 30 to 80% by volume (preferably 50 to 70% by volume). When the proportion of the conductive fibers 24 is 3% by volume or more, the conductivity and strength of the isotropic conductive adhesive layer 16 are further improved. If the ratio of the conductive fibers 24 is 30% by volume or less, the viscosity of the conductive adhesive will not be too high, and the coating property will be good. Further, the fluidity of the isotropic conductive adhesive layer 16 (followability to the shape of the through hole of the insulating film) can be secured, and the through hole of the insulating film is sufficiently filled with the isotropic conductive adhesive layer 16. Can do.

等方導電性接着剤層１６の厚さは、５〜２０μｍが好ましく、７〜１７μｍがより好ましい。等方導電性接着剤層１６の厚さが５μｍ以上であれば、等方導電性接着剤層１６の導電性がさらに良好になり、電磁波シールド層として十分に機能できる。また、等方導電性接着剤層１６の流動性（絶縁フィルムの貫通孔の形状への追随性）を確保でき、絶縁フィルムの貫通孔内を導電性接着剤で十分に埋めることができ、耐折性も確保でき繰り返し折り曲げても等方導電性接着剤層１６が断裂することはない。等方導電性接着剤層１６の厚さが２０μｍ以下であれば、電磁波シールドフィルム１０を薄くできる。また、電磁波シールドフィルム１０の可とう性がよくなる。 The thickness of the isotropic conductive adhesive layer 16 is preferably 5 to 20 μm, and more preferably 7 to 17 μm. If the thickness of the isotropic conductive adhesive layer 16 is 5 μm or more, the conductivity of the isotropic conductive adhesive layer 16 is further improved, and can sufficiently function as an electromagnetic wave shielding layer. In addition, the fluidity of the isotropic conductive adhesive layer 16 (followability to the shape of the through hole of the insulating film) can be ensured, and the through hole of the insulating film can be sufficiently filled with the conductive adhesive. The bendability can be secured and the isotropic conductive adhesive layer 16 will not be torn even if it is repeatedly bent. If the thickness of the isotropic conductive adhesive layer 16 is 20 μm or less, the electromagnetic shielding film 10 can be thinned. Moreover, the flexibility of the electromagnetic wave shielding film 10 is improved.

等方導電性接着剤層１６の表面抵抗は、１〜１００Ωであり、１〜５０Ωが好ましく、１〜１０Ωがより好ましい。等方導電性接着剤層１６の表面抵抗が１Ω以上であれば、等方導電性接着剤層１６の流動性も高く、強度が高く強靭となる。等方導電性接着剤層１６の表面抵抗が１００Ω以下であれば、金属薄膜層１４にクラックが生じても、金属薄膜層１４および等方導電性接着剤層１６からなる電磁波シールド層の抵抗の上昇が抑えられ、その結果、電磁波シールドフィルム１０が、電磁波ノイズの遮蔽効果を維持できる。 The surface resistance of the isotropic conductive adhesive layer 16 is 1 to 100Ω, preferably 1 to 50Ω, and more preferably 1 to 10Ω. If the surface resistance of the isotropic conductive adhesive layer 16 is more than 1 [Omega, fluidity of the isotropic conductive adhesive layer 16 is high, strength is higher toughness. If the surface resistance of the isotropic conductive adhesive layer 16 is 100Ω or less, even if a crack occurs in the metal thin film layer 14, the resistance of the electromagnetic wave shielding layer composed of the metal thin film layer 14 and the isotropic conductive adhesive layer 16 is reduced. As a result, the electromagnetic wave shielding film 10 can maintain the electromagnetic noise shielding effect.

（第１の離型フィルム）
第１の離型フィルム１８は、絶縁性保護層１２や金属薄膜層１４を形成する際のキャリアフィルムとなるものであり、電磁波シールドフィルム１０のハンドリング性を良好にする。第１の離型フィルム１８は、電磁波シールドフィルム１０をフレキシブルプリント配線板等に貼り付けた後には、絶縁性保護層１２から剥離される。 (First release film)
The first release film 18 is a carrier film for forming the insulating protective layer 12 and the metal thin film layer 14, and improves the handling properties of the electromagnetic wave shielding film 10. The first release film 18 is peeled from the insulating protective layer 12 after the electromagnetic wave shielding film 10 is attached to a flexible printed wiring board or the like.

第１の離型フィルム１８の樹脂材料としては、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリエチレンイソフタレート、ポリブチレンテレフタレート、ポリオレフィン、ポリアセテート、ポリカーボネート、ポリフェニレンサルファイド、ポリアミド、エチレン−酢酸ビニル共重合体、ポリ塩化ビニル、ポリ塩化ビニリデン、合成ゴム、液晶ポリマー等が挙げられ、電磁波シールドフィルム１０を製造する際の耐熱性（寸法安定性）およびコストの点から、ポリエチレンテレフタレートが好ましい。   As the resin material of the first release film 18, polyethylene terephthalate, polyethylene naphthalate, polyethylene isophthalate, polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, ethylene-vinyl acetate copolymer, polychlorinated Examples thereof include vinyl, polyvinylidene chloride, synthetic rubber, liquid crystal polymer, and the like, and polyethylene terephthalate is preferable from the viewpoint of heat resistance (dimensional stability) and cost when the electromagnetic wave shielding film 10 is produced.

第１の離型フィルム１８の１６０℃における貯蔵弾性率は、０．８×１０８〜４×１０８Ｐａが好ましく、０．８×１０８〜３×１０８Ｐａがより好ましい。第１の離型フィルム１８の１６０℃における貯蔵弾性率が０．８×１０８Ｐａ以上であれば、電磁波シールドフィルム１０のハンドリング性が良好となる。第１の離型フィルム１８の１６０℃における貯蔵弾性率が４×１０８Ｐａ以下であれば、第１の離型フィルム１８の柔軟性が良好となる。 The storage elastic modulus at 160 ° C. of the first release film 18 is preferably 0.8 × 10 8 to 4 × 10 8 Pa, and more preferably 0.8 × 10 8 to 3 × 10 8 Pa. When the storage elastic modulus at 160 ° C. of the first release film 18 is 0.8 × 10 8 Pa or more, the handling property of the electromagnetic wave shielding film 10 is good. If the storage elastic modulus at 160 ° C. of the first release film 18 is 4 × 10 8 Pa or less, the flexibility of the first release film 18 will be good.

第１の離型フィルム１８の厚さは、５〜５００μｍが好ましく、１０〜１５０μｍがより好ましく、２５〜１００μｍがさらに好ましい。第１の離型フィルム１８の厚さが５μｍ以上であれば、電磁波シールドフィルム１０のハンドリング性が良好となる。また、第１の離型フィルム１８がクッション材として十分に働き、フレキシブルプリント配線板の表面に設けられた絶縁フィルムの表面に電磁波シールドフィルム１０の等方導電性接着剤層１６を熱プレスにて貼着する際に、等方導電性接着剤層１６が絶縁フィルムの表面の凹凸形状に追随しやすくなる。第１の離型フィルム１８の厚さが５００μｍ以下であれば、絶縁フィルムの表面に電磁波シールドフィルム１０の等方導電性接着剤層１６を熱プレスする際に等方導電性接着剤層１６に熱が伝わりやすい。   The thickness of the first release film 18 is preferably 5 to 500 μm, more preferably 10 to 150 μm, and further preferably 25 to 100 μm. If the thickness of the 1st release film 18 is 5 micrometers or more, the handleability of the electromagnetic wave shielding film 10 will become favorable. Further, the first release film 18 functions sufficiently as a cushioning material, and the isotropic conductive adhesive layer 16 of the electromagnetic wave shielding film 10 is applied to the surface of the insulating film provided on the surface of the flexible printed wiring board by hot pressing. When sticking, the isotropic conductive adhesive layer 16 easily follows the uneven shape on the surface of the insulating film. If the thickness of the first release film 18 is 500 μm or less, when the isotropic conductive adhesive layer 16 of the electromagnetic wave shielding film 10 is hot-pressed on the surface of the insulating film, the isotropic conductive adhesive layer 16 is formed. Heat is easily transmitted.

（離型剤層）
離型フィルム本体１８ａの絶縁性保護層１２側の表面に、離型剤による離型処理が施されて、離型剤層１８ｂが形成される。第１の離型フィルム１８が離型剤層１８ｂを有することによって、後述する工程（ｇ）において第１の離型フィルム１８を絶縁性保護層１２から剥離する際に、第１の離型フィルム１８が剥離しやすく、絶縁性保護層１２や硬化後の等方導電性接着剤層１６が破断しにくくなる。
離型剤としては、公知の離型剤を用いればよい。 (Release agent layer)
A release treatment with a release agent is performed on the surface of the release film main body 18a on the insulating protective layer 12 side to form a release agent layer 18b. When the first release film 18 includes the release agent layer 18b, the first release film 18 is peeled off from the insulating protective layer 12 in the step (g) described later. 18 easily peels off, and the insulating protective layer 12 and the isotropic conductive adhesive layer 16 after curing are less likely to break.
As the release agent, a known release agent may be used.

離型剤層１８ｂの厚さは、０．０５〜２．０μｍが好ましく、０．１〜１．５μｍがより好ましい。離型剤層１８ｂの厚さが前記範囲内であれば、後述する工程（ｇ）において第１の離型フィルム１８がさらに剥離しやすくなる。   The thickness of the release agent layer 18b is preferably 0.05 to 2.0 μm, and more preferably 0.1 to 1.5 μm. If the thickness of the release agent layer 18b is within the above range, the first release film 18 is more easily peeled in the step (g) described later.

（第２の離型フィルム）
第２の離型フィルム２０は、等方導電性接着剤層１６を保護するものであり、電磁波シールドフィルム１０のハンドリング性を良好にする。第２の離型フィルム２０は、電磁波シールドフィルム１０をフレキシブルプリント配線板等に貼り付ける前に、等方導電性接着剤層１６から剥離される。 (Second release film)
The second release film 20 protects the isotropic conductive adhesive layer 16 and improves the handling properties of the electromagnetic wave shielding film 10. The second release film 20 is peeled from the isotropic conductive adhesive layer 16 before the electromagnetic wave shielding film 10 is attached to a flexible printed wiring board or the like.

第２の離型フィルム２０の樹脂材料としては、第１の離型フィルム１８の樹脂材料と同様なものが挙げられる。
第２の離型フィルム２０の厚さは、５〜５００μｍが好ましく、１０〜１５０μｍがより好ましく、２５〜１００μｍがさらに好ましい。 Examples of the resin material of the second release film 20 include the same resin material as that of the first release film 18.
The thickness of the second release film 20 is preferably 5 to 500 μm, more preferably 10 to 150 μm, and further preferably 25 to 100 μm.

（離型剤層）
離型フィルム本体２０ａの等方導電性接着剤層１６側の表面に、離型剤による離型処理が施されて、離型剤層２０ｂが形成される。第２の離型フィルム２０が離型剤層２０ｂを有することによって、後述する工程（ｇ）において第２の離型フィルム２０を等方導電性接着剤層１６から剥離する際に、第２の離型フィルム２０が剥離しやすく、等方導電性接着剤層１６が破断しにくくなる。
離型剤としては、公知の離型剤を用いればよい。 (Release agent layer)
A release treatment with a release agent is performed on the surface of the release film main body 20a on the side of the isotropic conductive adhesive layer 16 to form a release agent layer 20b. When the second release film 20 has the release agent layer 20b, the second release film 20 is peeled off from the isotropic conductive adhesive layer 16 in the step (g) described later. The release film 20 is easy to peel off, and the isotropic conductive adhesive layer 16 is difficult to break.
As the release agent, a known release agent may be used.

離型剤層２０ｂの厚さは、０．０５〜２．０μｍが好ましく、０．１〜１．５μｍがより好ましい。離型剤層２０ｂの厚さが前記範囲内であれば、後述する工程（ｇ）において第２の離型フィルム２０がさらに剥離しやすくなる。   The thickness of the release agent layer 20b is preferably 0.05 to 2.0 μm, and more preferably 0.1 to 1.5 μm. If the thickness of the release agent layer 20b is within the above range, the second release film 20 is more easily peeled in the step (g) described later.

（電磁波シールドフィルムの厚さ）
電磁波シールドフィルム１０の厚さ（離型フィルムを除く）は、１０〜４５μｍが好ましく、１０〜３０μｍがより好ましい。電磁波シールドフィルム１０の厚さ（離型フィルムを除く）が１０μｍ以上であれば、第１の離型フィルム１８を剥離する際に破断しにくい。電磁波シールドフィルム１０の厚さ（離型フィルムを除く）が４５μｍ以下であれば、電磁波シールドフィルム付きフレキシブルプリント配線板を薄くできる。 (Thickness of electromagnetic shielding film)
10-45 micrometers is preferable and, as for the thickness (except a release film) of the electromagnetic wave shielding film 10, 10-30 micrometers is more preferable. If the thickness of the electromagnetic wave shielding film 10 (excluding the release film) is 10 μm or more, it is difficult to break when the first release film 18 is peeled off. When the thickness of the electromagnetic shielding film 10 (excluding the release film) is 45 μm or less, the flexible printed wiring board with the electromagnetic shielding film can be thinned.

（電磁波シールドフィルムの製造方法）
本発明の電磁波シールドフィルムは、例えば、下記の工程（ａ）〜（ｄ）を有する方法によって製造できる。
（ａ）第１の離型フィルムの片面に絶縁性保護層を形成する工程。
（ｂ）絶縁性保護層の表面に金属薄膜層を形成することによって、第１の離型フィルムと、絶縁性保護層と、金属薄膜層とを順に備えた第１の積層体を得る工程。
（ｃ）第２の離型フィルムの片面に等方導電性接着剤層を形成することによって、第２の離型フィルムと、等方導電性接着剤層とを順に備えた第２の積層体を得る工程。
（ｄ）第１の積層体と第２の積層体とを、金属薄膜層と等方導電性接着剤層とが接触するように貼り合わせる工程。 (Method for producing electromagnetic shielding film)
The electromagnetic wave shielding film of the present invention can be produced, for example, by a method having the following steps (a) to (d).
(A) A step of forming an insulating protective layer on one surface of the first release film.
(B) The process of obtaining the 1st laminated body provided with the 1st release film, the insulating protective layer, and the metal thin film layer in order by forming a metal thin film layer on the surface of an insulating protective layer.
(C) A second laminate comprising a second release film and an isotropic conductive adhesive layer in this order by forming an isotropic conductive adhesive layer on one surface of the second release film. Obtaining.
(D) A step of bonding the first laminate and the second laminate so that the metal thin film layer and the isotropic conductive adhesive layer are in contact with each other.

以下、図１に示す電磁波シールドフィルム１０を製造する方法について、図２〜図４を参照しながら説明する。   Hereinafter, a method for producing the electromagnetic wave shielding film 10 shown in FIG. 1 will be described with reference to FIGS.

（工程（ａ））
図２に示すように、第１の離型フィルム１８の離型剤層１８ｂの表面に絶縁性保護層１２を形成する。 (Process (a))
As shown in FIG. 2, the insulating protective layer 12 is formed on the surface of the release agent layer 18 b of the first release film 18.

絶縁性保護層１２の形成方法としては、熱硬化性樹脂と硬化剤とを含む塗料を塗布し、硬化させる方法、熱可塑性樹脂を含む塗料を塗布する方法、熱可塑性樹脂を溶融成形したフィルムを貼着する方法等が挙げられる。ハンダ付け等の際の耐熱性の点から、熱硬化性樹脂と硬化剤とを含む塗料を塗布し、硬化させる方法が好ましい。
熱硬化性樹脂と硬化剤とを含む塗料は、必要に応じて溶剤、他の成分を含んでいてもよい。 The insulating protective layer 12 can be formed by applying and curing a paint containing a thermosetting resin and a curing agent, applying a paint containing a thermoplastic resin, and a film obtained by melt-molding a thermoplastic resin. The method of sticking etc. are mentioned. From the viewpoint of heat resistance during soldering or the like, a method of applying and curing a paint containing a thermosetting resin and a curing agent is preferable.
The paint containing a thermosetting resin and a curing agent may contain a solvent and other components as necessary.

絶縁性保護層１２を、塗料の塗布によって形成した場合、絶縁性保護層１２を比較的薄くできる。なお、熱硬化性樹脂の硬化物は硬いため、絶縁性保護層１２を薄くした場合は、強度が不十分となる。上述したように、絶縁性保護層１２の１６０℃における貯蔵弾性率を、５×１０6〜１×１０８Ｐａの範囲とすることによって、柔軟性や強度と、耐熱性とのバランスが良好となる。 When the insulating protective layer 12 is formed by applying a paint, the insulating protective layer 12 can be made relatively thin. In addition, since the hardened | cured material of a thermosetting resin is hard, intensity | strength becomes inadequate when the insulating protective layer 12 is made thin. As described above, when the storage elastic modulus at 160 ° C. of the insulating protective layer 12 is in the range of 5 × 10 6 to 1 × 10 8 Pa, the balance between flexibility and strength and heat resistance is good. Become.

絶縁性保護層１２の貯蔵弾性率の制御は、架橋密度および架橋構造からもたらされる強靭性の観点から熱硬化性樹脂、硬化剤等の種類や組成を選択し、熱硬化性樹脂の硬化物の貯蔵弾性率を調整することによって行われる。
このほか、貯蔵弾性率は、熱硬化性樹脂を硬化させる際の温度、時間等の硬化条件を調整する、または熱硬化性を有さない成分として熱可塑性エラストマー等の熱可塑性樹脂を添加することによって調整できる。 The storage elastic modulus of the insulating protective layer 12 is controlled by selecting the type and composition of a thermosetting resin, a curing agent, etc. from the viewpoint of toughness resulting from the crosslink density and the crosslink structure. This is done by adjusting the storage modulus.
In addition, the storage elastic modulus is adjusted by adjusting the curing conditions such as temperature and time when the thermosetting resin is cured, or a thermoplastic resin such as a thermoplastic elastomer is added as a component having no thermosetting property. Can be adjusted by.

（工程（ｂ））
図２に示すように、絶縁性保護層１２の表面に金属薄膜層１４を形成、第１の積層体１０ａを得る。 (Process (b))
As shown in FIG. 2, the metal thin film layer 14 is formed on the surface of the insulating protective layer 12, and the 1st laminated body 10a is obtained.

金属薄膜層１４の形成方法としては、物理蒸着、ＣＶＤ、めっき等によって金属薄膜を形成する方法、金属箔を貼り付ける方法等が挙げられる。面方向の導電性に優れる金属薄膜層１４を形成できる点から、物理蒸着、ＣＶＤ、めっき等によって金属薄膜を形成する方法が好ましく、金属薄膜層１４の厚さを薄くでき、かつ厚さが薄くても面方向の導電性に優れる金属薄膜層１４を形成でき、ドライプロセスにて簡便に金属薄膜層１４を形成できる点から、物理蒸着による方法がより好ましい。   Examples of the method for forming the metal thin film layer 14 include a method of forming a metal thin film by physical vapor deposition, CVD, plating, and the like, a method of attaching a metal foil, and the like. From the viewpoint that the metal thin film layer 14 having excellent surface conductivity can be formed, a method of forming the metal thin film by physical vapor deposition, CVD, plating, or the like is preferable. The thickness of the metal thin film layer 14 can be reduced and the thickness can be reduced. However, the method by physical vapor deposition is more preferable because the metal thin film layer 14 having excellent conductivity in the plane direction can be formed and the metal thin film layer 14 can be easily formed by a dry process.

（工程（ｃ））
図３に示すように、第２の離型フィルム２０の離型剤層２０ｂの表面に等方導電性接着剤層１６を形成し、第２の積層体１０ｂを得る。 (Process (c))
As shown in FIG. 3, the isotropic conductive adhesive layer 16 is formed on the surface of the release agent layer 20b of the second release film 20, and the second laminate 10b is obtained.

等方導電性接着剤層１６の形成方法としては、導電性接着剤組成物を塗布する方法が挙げられる。
導電性接着剤組成物としては、上述した熱硬化性接着剤と導電性粒子２２と導電性繊維２４とを含むものを用いる。 Examples of the method for forming the isotropic conductive adhesive layer 16 include a method of applying a conductive adhesive composition.
As the conductive adhesive composition, one containing the above-described thermosetting adhesive, conductive particles 22 and conductive fibers 24 is used.

（工程（ｄ））
図４に示すように、第１の積層体１０ａと第２の積層体１０ｂとを、金属薄膜層１４と等方導電性接着剤層１６とが接触するように貼り合わせる。 (Process (d))
As shown in FIG. 4, the first laminated body 10a and the second laminated body 10b are bonded so that the metal thin film layer 14 and the isotropic conductive adhesive layer 16 are in contact with each other.

第１の積層体１０ａと第２の積層体１０ｂとの貼り合わせは、導電性繊維２４が等方導電性接着剤層１６の面方向に配向しやすくなる点から、プレス機（図示略）等による熱プレスによって行うことが好ましい。   The first laminated body 10a and the second laminated body 10b are bonded to each other by a press machine (not shown) or the like because the conductive fibers 24 are easily oriented in the surface direction of the isotropic conductive adhesive layer 16. It is preferable to carry out by hot pressing.

（作用効果）
以上説明した電磁波シールドフィルム１０にあっては、金属薄膜層１４の表面抵抗が０．３Ω以下であり、かつ等方導電性接着剤層１６の表面抵抗が１０Ω以下であるため、以下に説明するように、金属薄膜層１４にクラックが生じても、電磁波ノイズの遮蔽効果を維持できる。 (Function and effect)
In the electromagnetic wave shielding film 10 described above, the surface resistance of the metal thin film layer 14 is 0.3Ω or less and the surface resistance of the isotropic conductive adhesive layer 16 is 10Ω or less. Thus, even if a crack occurs in the metal thin film layer 14, the shielding effect of electromagnetic noise can be maintained.

図５は、金属薄膜層１４にクラックが生じる前の、金属薄膜層１４および等方導電性接着剤層１６からなる電磁波シールド層のモデルケースを示す斜視図である。
モデルケースにおける電磁波シールド層は、幅１０ｍｍ、長さ２０ｍｍの金属薄膜層１４と、幅１０ｍｍ、長さ２０ｍｍの等方導電性接着剤層１６との積層体である。
金属薄膜層１４の表面抵抗Ｒｍｓは、長さ１０ｍｍ、電極間距離１０ｍｍの２本の電極間の抵抗であるから、金属薄膜層１４の長さ方向（２０ｍｍ）の全体抵抗、すなわち回路の抵抗は、表面抵抗Ｒｍｓの２倍の２Ｒｍｓとなる。
等方導電性接着剤層１６の表面抵抗Ｒｃｓは、長さ１０ｍｍ、電極間距離１０ｍｍの２本の電極間の抵抗であるから、等方導電性接着剤層１６の長さ方向（２０ｍｍ）の全体抵抗は、同様に２Ｒｃｓとなる。
電磁波シールド層を、金属薄膜層１４と等方導電性接着剤層１６との並列回路と見なせば、クラックが生じる前の電磁波シールド層の長さ方向の全体抵抗Ｒ１は、並列回路の抵抗、すなわち下記式（１）で表される。
Ｒ１＝２×Ｒｍｓ・Ｒｃｓ／（Ｒｍｓ＋Ｒｃｓ） ・・・（１） FIG. 5 is a perspective view showing a model case of an electromagnetic wave shielding layer composed of the metal thin film layer 14 and the isotropic conductive adhesive layer 16 before the metal thin film layer 14 is cracked.
The electromagnetic wave shielding layer in the model case is a laminate of a metal thin film layer 14 having a width of 10 mm and a length of 20 mm and an isotropic conductive adhesive layer 16 having a width of 10 mm and a length of 20 mm.
Since the surface resistance Rms of the metal thin film layer 14 is a resistance between two electrodes having a length of 10 mm and a distance between the electrodes of 10 mm, the total resistance in the length direction (20 mm) of the metal thin film layer 14, that is, the resistance of the circuit is , 2Rms which is twice the surface resistance Rms.
Since the surface resistance Rcs of the isotropic conductive adhesive layer 16 is a resistance between two electrodes having a length of 10 mm and a distance between electrodes of 10 mm, the length of the isotropic conductive adhesive layer 16 in the length direction (20 mm) is as follows. The total resistance is similarly 2Rcs.
If the electromagnetic shielding layer is regarded as a parallel circuit of the metal thin film layer 14 and the isotropic conductive adhesive layer 16, the total resistance R1 in the length direction of the electromagnetic shielding layer before the crack is generated is the resistance of the parallel circuit, That is, it is represented by the following formula (1).
R1 = 2 × Rms · Rcs / (Rms + Rcs) (1)

図６は、金属薄膜層１４にクラックが生じた後の、金属薄膜層１４および等方導電性接着剤層１６からなる電磁波シールド層のモデルケースを示す斜視図である。
金属薄膜層１４の長さ方向の中央に、幅方向にわたって間隙０．２ｍｍのクラックが生じたとする。
電磁波シールド層を、幅１０ｍｍ、長さ９．９ｍｍの金属薄膜層１４と等方導電性接着剤層１６とからなる並列回路と、幅１０ｍｍ、長さ０．２ｍｍの等方導電性接着剤層１６からなる回路と、幅１０ｍｍ、長さ９．９ｍｍの金属薄膜層１４と等方導電性接着剤層１６とからなる並列回路とが、直列に接続していると見なせば、クラックが生じた後の電磁波シールド層の長さ方向の全体抵抗Ｒ２は、下記式（２）で表される。
Ｒ２＝２×０．９９×Ｒｍｓ・Ｒｃｓ／（Ｒｍｓ＋Ｒｃｓ）＋０．０２×Ｒｃｓ ・・・（２） FIG. 6 is a perspective view showing a model case of the electromagnetic wave shielding layer composed of the metal thin film layer 14 and the isotropic conductive adhesive layer 16 after the metal thin film layer 14 is cracked.
It is assumed that a crack having a gap of 0.2 mm occurs in the center in the length direction of the metal thin film layer 14 in the width direction.
The electromagnetic shielding layer includes a parallel circuit including a metal thin film layer 14 having a width of 10 mm and a length of 9.9 mm and an isotropic conductive adhesive layer 16, and an isotropic conductive adhesive layer having a width of 10 mm and a length of 0.2 mm. If a circuit composed of 16 and a parallel circuit composed of a metal thin film layer 14 having a width of 10 mm and a length of 9.9 mm and an isotropic conductive adhesive layer 16 are considered to be connected in series, a crack occurs. The total resistance R2 in the length direction of the electromagnetic wave shielding layer after is expressed by the following formula (2).
R2 = 2 × 0.99 × Rms · Rcs / (Rms + Rcs) + 0.02 × Rcs (2)

金属薄膜層１４の表面抵抗Ｒｍｓが最大値の０．３Ωであり、等方導電性接着剤層１６の表面抵抗Ｒｃｓが最大値の１００Ωであった場合、クラックが生じる前の電磁波シールド層の長さ方向の全体抵抗Ｒ１は、０．５９８Ωとなり、クラックが生じた後の電磁波シールド層の長さ方向の全体抵抗Ｒ２は、２．５３８Ωとなる。このように、金属薄膜層１４にクラックが生じることによる電磁波シールド層の抵抗の上昇は、１０倍以下に抑えられ、電磁波ノイズの遮蔽効果を維持できる。   When the surface resistance Rms of the metal thin film layer 14 is 0.3Ω which is the maximum value and the surface resistance Rcs of the isotropic conductive adhesive layer 16 is 100Ω which is the maximum value, the length of the electromagnetic wave shielding layer before the crack is generated The total resistance R1 in the length direction is 0.598Ω, and the total resistance R2 in the length direction of the electromagnetic wave shielding layer after the crack is generated is 2.538Ω. Thus, the increase in resistance of the electromagnetic wave shielding layer due to the occurrence of cracks in the metal thin film layer 14 is suppressed to 10 times or less, and the shielding effect of electromagnetic wave noise can be maintained.

一方、金属薄膜層１４の表面抵抗Ｒｍｓが最大値の０．３Ωであり、等方導電性接着剤層１６の表面抵抗Ｒｃｓが最大値を超える１０００Ωであった場合、クラックが生じる前の電磁波シールド層の長さ方向の全体抵抗Ｒ１は、０．６００Ωとなり、クラックが生じた後の電磁波シールド層の長さ方向の全体抵抗Ｒ２は、２０.５４０Ωとなる。このように、等方導電性接着剤層１６の表面抵抗Ｒｃｓが最大値を超える場合、金属薄膜層１４にクラックが生じることによって電磁波シールド層の抵抗が大きく上昇し、その結果、電磁波ノイズの遮蔽効果が低下する。   On the other hand, when the surface resistance Rms of the metal thin film layer 14 is 0.3Ω, which is the maximum value, and the surface resistance Rcs of the isotropic conductive adhesive layer 16 is 1000Ω which exceeds the maximum value, the electromagnetic wave shield before cracks are generated. The overall resistance R1 in the length direction of the layer is 0.600Ω, and the overall resistance R2 in the length direction of the electromagnetic wave shielding layer after the crack is generated is 20.540Ω. As described above, when the surface resistance Rcs of the isotropic conductive adhesive layer 16 exceeds the maximum value, the metal thin film layer 14 is cracked, so that the resistance of the electromagnetic wave shielding layer is greatly increased. As a result, the electromagnetic noise is shielded. The effect is reduced.

（他の実施形態）
本発明の電磁波シールドフィルムは、絶縁性保護層と、特定の表面抵抗の金属薄膜層と、特定の表面抵抗の等方導電性接着剤層とを順に備えたものであればよく、図１の実施形態に限定はされない。
例えば、等方導電性接着剤層１６の表面のタック性が少ない場合は、第２の離型フィルム２０を省略しても構わない。
絶縁性保護層１２が十分な柔軟性や強度を有する場合は、第１の離型フィルム１８を省略しても構わない。
離型フィルムは、離型フィルム本体のみで十分な離型性を有する場合は、離型剤層を有しなくてもよい。 (Other embodiments)
The electromagnetic wave shielding film of the present invention only needs to be provided with an insulating protective layer, a metal thin film layer having a specific surface resistance, and an isotropic conductive adhesive layer having a specific surface resistance in this order. The embodiment is not limited.
For example, when the tackiness of the surface of the isotropic conductive adhesive layer 16 is small, the second release film 20 may be omitted.
When the insulating protective layer 12 has sufficient flexibility and strength, the first release film 18 may be omitted.
In the case where the release film has sufficient release properties only with the release film main body, the release film may not have a release agent layer.

＜電磁波シールドフィルム付きフレキシブルプリント配線板＞
図７は、本発明の電磁波シールドフィルム付きフレキシブルプリント配線板の一例を示す断面図である。
電磁波シールドフィルム付きフレキシブルプリント配線板１は、フレキシブルプリント配線板３０と、絶縁フィルム４０と、離型フィルムを剥離した電磁波シールドフィルム１０とを備える。
フレキシブルプリント配線板３０は、ベースフィルム３２の少なくとも片面にプリント回路３４が設けられたものである。
絶縁フィルム４０は、フレキシブルプリント配線板３０のプリント回路３４が設けられた側の表面に設けられる。
電磁波シールドフィルム１０の等方導電性接着剤層１６は、絶縁フィルム４０の表面に接着され、かつ硬化されている。また、等方導電性接着剤層１６は、絶縁フィルム４０に形成された貫通孔（図示略）を通ってプリント回路３４に電気的に接続されている。 <Flexible printed wiring board with electromagnetic shielding film>
FIG. 7 is a cross-sectional view showing an example of the flexible printed wiring board with an electromagnetic wave shielding film of the present invention.
The flexible printed wiring board 1 with an electromagnetic wave shielding film includes a flexible printed wiring board 30, an insulating film 40, and an electromagnetic wave shielding film 10 from which a release film is peeled off.
The flexible printed wiring board 30 has a printed circuit 34 provided on at least one side of a base film 32.
The insulating film 40 is provided on the surface of the flexible printed wiring board 30 on the side where the printed circuit 34 is provided.
The isotropic conductive adhesive layer 16 of the electromagnetic wave shielding film 10 is adhered to the surface of the insulating film 40 and cured. Further, the isotropic conductive adhesive layer 16 is electrically connected to the printed circuit 34 through a through hole (not shown) formed in the insulating film 40.

貫通孔のある部分を除くプリント回路３４（信号回路、グランド回路、グランド層等）の近傍には、電磁波シールドフィルム１０の金属薄膜層１４が、絶縁フィルム４０および等方導電性接着剤層１６を介して離間して対向配置される。
貫通孔のある部分を除くプリント回路３４と金属薄膜層１４との離間距離は、絶縁フィルム４０の厚さおよび等方導電性接着剤層１６の厚さの総和である。離間距離は、３０〜２００μｍが好ましく、６０〜２００μｍがより好ましい。離間距離が３０μｍより小さいと、信号回路のインピーダンスが低くなるため、１００Ω等の特性インピーダンスを有するためには、信号回路の線幅を小さくしなければならず、線幅のバラツキが特性インピーダンスのバラツキとなって、インピーダンスのミスマッチによる反射共鳴ノイズが電気信号に乗りやすくなる。離間距離が２００μｍより大きいと、電磁波シールドフィルム付きフレキシブルプリント配線板１が厚くなり、可とう性が不足する。 In the vicinity of the printed circuit 34 (signal circuit, ground circuit, ground layer, etc.) excluding the portion having the through hole, the metal thin film layer 14 of the electromagnetic wave shielding film 10 is provided with the insulating film 40 and the isotropic conductive adhesive layer 16. Are arranged opposite to each other.
The separation distance between the printed circuit 34 and the metal thin film layer 14 excluding the portion having the through hole is the sum of the thickness of the insulating film 40 and the thickness of the isotropic conductive adhesive layer 16. The separation distance is preferably 30 to 200 μm, and more preferably 60 to 200 μm. When the separation distance is smaller than 30 μm, the impedance of the signal circuit is lowered. Therefore, in order to have a characteristic impedance such as 100Ω, the line width of the signal circuit has to be reduced, and the variation in the line width causes the variation in the characteristic impedance. Thus, the reflection resonance noise due to the impedance mismatch is easily applied to the electric signal. If the separation distance is larger than 200 μm, the flexible printed wiring board 1 with an electromagnetic wave shielding film becomes thick, and the flexibility is insufficient.

（フレキシブルプリント配線板）
フレキシブルプリント配線板３０は、銅張積層板の銅箔を公知のエッチング法により所望のパターンに加工してプリント回路３４（電源回路、グランド回路、グランド層等）としたものである。
銅張積層板としては、ベースフィルム３２の片面または両面に接着剤層（図示略）を介して銅箔を貼り付けたもの；銅箔の表面にベースフィルム３２を形成する樹脂溶液等をキャストしたもの等が挙げられる。
接着剤層の材料としては、エポキシ樹脂、ポリエステル、ポリイミド、ポリアミドイミド、ポリアミド、フェノール樹脂、ポリウレタン、アクリル樹脂、メラミン樹脂等が挙げられる。
接着剤層の厚さは、０．５〜３０μｍが好ましい。 (Flexible printed wiring board)
The flexible printed wiring board 30 is a printed circuit 34 (power supply circuit, ground circuit, ground layer, etc.) obtained by processing a copper foil of a copper clad laminate into a desired pattern by a known etching method.
As the copper clad laminate, one or both surfaces of the base film 32 are bonded with copper foil via an adhesive layer (not shown); a resin solution or the like that forms the base film 32 is cast on the surface of the copper foil. And the like.
Examples of the material for the adhesive layer include epoxy resin, polyester, polyimide, polyamideimide, polyamide, phenol resin, polyurethane, acrylic resin, and melamine resin.
As for the thickness of an adhesive bond layer, 0.5-30 micrometers is preferable.

（ベースフィルム）
ベースフィルム３２としては、耐熱性を有するフィルムが好ましく、ポリイミドフィルム、液晶ポリマーフィルムがより好ましく、ポリイミドフィルムがさらに好ましい。
ベースフィルム３２の表面抵抗は、電気的絶縁性の点から、１×１０６Ω以上が好ましい。ベースフィルム３２の表面抵抗は、実用上の点から、１×１０１９Ω以下が好ましい。
ベースフィルム３２の厚さは、５〜２００μｍが好ましく、屈曲性の点から、６〜２５μｍがより好ましく、１０〜２５μｍがより好ましい。 (Base film)
The base film 32 is preferably a heat resistant film, more preferably a polyimide film or a liquid crystal polymer film, and even more preferably a polyimide film.
The surface resistance of the base film 32 is preferably 1 × 10 6 Ω or more from the viewpoint of electrical insulation. The surface resistance of the base film 32 is preferably 1 × 10 19 Ω or less from a practical point of view.
The thickness of the base film 32 is preferably 5 to 200 μm, more preferably 6 to 25 μm, and more preferably 10 to 25 μm from the viewpoint of flexibility.

（プリント回路）
プリント回路３４（信号回路、グランド回路、グランド層等）を構成する銅箔としては、圧延銅箔、電解銅箔等が挙げられ、屈曲性の点から、圧延銅箔が好ましい。
銅箔の厚さは、１〜５０μｍが好ましく、１８〜３５μｍがより好ましい。
プリント回路３４の長さ方向の端部（端子）は、ハンダ接続、コネクター接続、部品搭載等のため、絶縁フィルム４０や電磁波シールドフィルム１０に覆われていない。 (Printed circuit)
Examples of the copper foil constituting the printed circuit 34 (signal circuit, ground circuit, ground layer, etc.) include rolled copper foil, electrolytic copper foil, and the like, and rolled copper foil is preferred from the viewpoint of flexibility.
1-50 micrometers is preferable and, as for the thickness of copper foil, 18-35 micrometers is more preferable.
An end portion (terminal) in the length direction of the printed circuit 34 is not covered with the insulating film 40 or the electromagnetic wave shielding film 10 for solder connection, connector connection, component mounting, or the like.

（絶縁フィルム）
絶縁フィルム４０は、基材フィルム（図示略）の片面に、接着剤の塗布、接着剤シートの貼り付け等によって接着剤層（図示略）を形成したものである。
基材フィルムの表面抵抗は、電気的絶縁性の点から、１×１０６Ω以上が好ましい。基材フィルムの表面抵抗は、実用上の点から、１×１０１９Ω以下が好ましい。
基材フィルムとしては、耐熱性を有するフィルムが好ましく、ポリイミドフィルム、液晶ポリマーフィルムがより好ましく、ポリイミドフィルムがさらに好ましい。
基材フィルムの厚さは、１〜１００μｍが好ましく、可とう性の点から、３〜２５μｍがより好ましい。
接着剤層の材料としては、エポキシ樹脂、ポリエステル、ポリイミド、ポリアミドイミド、ポリアミド、フェノール樹脂、ポリウレタン、アクリル樹脂、メラミン樹脂、ポリスチレン、ポリオレフィン等が挙げられる。エポキシ樹脂は、可とう性付与のためのゴム成分（カルボキシル変性ニトリルゴム等）を含んでいてもよい。
接着剤層の厚さは、１〜１００μｍが好ましく、１．５〜６０μｍがより好ましい。 (Insulating film)
The insulating film 40 is obtained by forming an adhesive layer (not shown) on one surface of a base film (not shown) by applying an adhesive, attaching an adhesive sheet, or the like.
The surface resistance of the base film is preferably 1 × 10 6 Ω or more from the viewpoint of electrical insulation. The surface resistance of the base film is preferably 1 × 10 19 Ω or less from a practical point of view.
As a base film, the film which has heat resistance is preferable, a polyimide film and a liquid crystal polymer film are more preferable, and a polyimide film is further more preferable.
1-100 micrometers is preferable and, as for the thickness of a base film, 3-25 micrometers is more preferable from a flexible point.
Examples of the material for the adhesive layer include epoxy resin, polyester, polyimide, polyamideimide, polyamide, phenol resin, polyurethane, acrylic resin, melamine resin, polystyrene, and polyolefin. The epoxy resin may contain a rubber component (carboxyl-modified nitrile rubber or the like) for imparting flexibility.
1-100 micrometers is preferable and, as for the thickness of an adhesive bond layer, 1.5-60 micrometers is more preferable.

貫通孔の開口部の形状は、特に限定されない。貫通孔の開口部の形状としては、例えば、円形、楕円形、四角形等が挙げられる。   The shape of the opening of the through hole is not particularly limited. Examples of the shape of the opening of the through hole include a circle, an ellipse, and a quadrangle.

（電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法）
本発明の電磁波シールドフィルム付きフレキシブルプリント配線板は、例えば、下記の工程（ｅ）〜（ｇ）を有する方法によって製造できる。
（ｅ）ベースフィルムの少なくとも片面にプリント回路を有するフレキシブルプリント配線板のプリント回路が設けられた側の表面に、プリント回路に対応する位置に貫通孔が形成された絶縁フィルムを設け、絶縁フィルム付きフレキシブルプリント配線板を得る工程。
（ｆ）工程（ｅ）の後、絶縁フィルム付きフレキシブルプリント配線板と、本発明の電磁波シールドフィルムとを、絶縁フィルムの表面に等方導電性接着剤層が接触するように重ね、これらを熱プレスすることによって、絶縁フィルムの表面に等方導電性接着剤層を接着し、かつ等方導電性接着剤層を、貫通孔を通ってプリント回路に電気的に接続する工程。
（ｇ）工程（ｆ）の後、第１の離型フィルムを剥離し、電磁波シールドフィルム付きフレキシブルプリント配線板を得る工程。 (Method for producing flexible printed wiring board with electromagnetic shielding film)
The flexible printed wiring board with an electromagnetic wave shielding film of the present invention can be produced, for example, by a method having the following steps (e) to (g).
(E) An insulating film having a through-hole formed at a position corresponding to the printed circuit is provided on the surface of the flexible printed wiring board having the printed circuit on at least one side of the base film on the side where the printed circuit is provided. The process of obtaining a flexible printed wiring board.
(F) After the step (e), the flexible printed wiring board with an insulating film and the electromagnetic wave shielding film of the present invention are overlaid so that the isotropic conductive adhesive layer contacts the surface of the insulating film, and these are heated. The step of bonding the isotropic conductive adhesive layer to the surface of the insulating film by pressing and electrically connecting the isotropic conductive adhesive layer to the printed circuit through the through hole.
(G) The process of peeling a 1st release film after a process (f) and obtaining a flexible printed wiring board with an electromagnetic wave shielding film.

以下、電磁波シールドフィルム付きフレキシブルプリント配線板を製造する方法について、図８を参照しながら説明する。   Hereinafter, a method for producing a flexible printed wiring board with an electromagnetic wave shielding film will be described with reference to FIG.

（工程（ｅ））
図８に示すように、フレキシブルプリント配線板３０に、プリント回路３４に対応する位置に貫通孔４２が形成された絶縁フィルム４０を重ね、フレキシブルプリント配線板３０の表面に絶縁フィルム４０の接着剤層（図示略）を接着し、接着剤層を硬化させることによって、絶縁フィルム付きフレキシブルプリント配線板２を得る。フレキシブルプリント配線板３０の表面に絶縁フィルム４０の接着剤層を仮接着し、工程（ｆ）にて接着剤層を本硬化させてもよい。
接着剤層の接着および硬化は、例えば、プレス機（図示略）等による熱プレスによって行う。 (Process (e))
As shown in FIG. 8, an insulating film 40 in which a through hole 42 is formed at a position corresponding to the printed circuit 34 is overlaid on the flexible printed wiring board 30, and an adhesive layer of the insulating film 40 is placed on the surface of the flexible printed wiring board 30. A flexible printed wiring board 2 with an insulating film is obtained by bonding (not shown) and curing the adhesive layer. The adhesive layer of the insulating film 40 may be temporarily bonded to the surface of the flexible printed wiring board 30, and the adhesive layer may be fully cured in the step (f).
Adhesion and curing of the adhesive layer are performed by, for example, hot pressing with a press machine (not shown) or the like.

（工程（ｆ））
図８に示すように、絶縁フィルム付きフレキシブルプリント配線板２に、第２の離型フィルム２０を剥離した電磁波シールドフィルム１０を重ね、熱プレスすることによって、絶縁フィルム４０の表面に等方導電性接着剤層１６が接着され、かつ等方導電性接着剤層１６が、貫通孔４２を通ってプリント回路３４に電気的に接続された電磁波シールドフィルム付きフレキシブルプリント配線板の前駆体３を得る。 (Process (f))
As shown in FIG. 8, the electromagnetic shielding film 10 from which the second release film 20 has been peeled is superimposed on the flexible printed wiring board 2 with an insulating film, and is hot-pressed, so that the surface of the insulating film 40 is isotropically conductive. The precursor 3 of the flexible printed wiring board with an electromagnetic wave shielding film in which the adhesive layer 16 is bonded and the isotropic conductive adhesive layer 16 is electrically connected to the printed circuit 34 through the through hole 42 is obtained.

等方導電性接着剤層１６の接着および硬化は、例えば、プレス機（図示略）等による熱プレスによって行う。
熱プレスの時間は、２０秒〜６０分間であり、３０秒〜３０分間がさらに好ましい。熱プレスの時間が２０秒以上であれば、絶縁フィルム４０の表面に等方導電性接着剤層１６が接着される。熱プレスの時間が６０分以下であれば、電磁波シールドフィルム付きフレキシブルプリント配線板１の製造時間を短縮できる。 The isotropic conductive adhesive layer 16 is bonded and cured by, for example, hot pressing with a press (not shown) or the like.
The hot pressing time is 20 seconds to 60 minutes, and more preferably 30 seconds to 30 minutes. If the hot pressing time is 20 seconds or more, the isotropic conductive adhesive layer 16 is adhered to the surface of the insulating film 40. If the time of hot press is 60 minutes or less, the manufacturing time of the flexible printed wiring board 1 with an electromagnetic wave shielding film can be shortened.

熱プレスの温度（プレス機のプレス板の温度）は、１４０〜１９０℃が好ましく、１５０〜１７５℃がより好ましい。熱プレスの温度が１４０℃以上であれば、絶縁フィルム４０の表面に等方導電性接着剤層１６が接着される。また、熱プレスの時間を短縮できる。熱プレスの温度が１９０℃以下であれば、電磁波シールドフィルム１０、フレキシブルプリント配線板３０等の劣化等を抑えることができる。   140-190 degreeC is preferable and, as for the temperature of a hot press (temperature of the press plate of a press), 150-175 degreeC is more preferable. If the temperature of the hot press is 140 ° C. or higher, the isotropic conductive adhesive layer 16 is bonded to the surface of the insulating film 40. In addition, the time for hot pressing can be shortened. When the temperature of the hot press is 190 ° C. or lower, deterioration of the electromagnetic wave shielding film 10, the flexible printed wiring board 30, and the like can be suppressed.

熱プレスの圧力は、１０ＭＰａ〜２０ＭＰａが好ましく、１０ＭＰａ〜１６ＭＰａがより好ましい。熱プレスの圧力が１０ＭＰａ以上であれば、絶縁フィルム４０の表面に等方導電性接着剤層１６が接着される。また、熱プレスの時間を短縮できる。熱プレスの圧力が２０ＭＰａ以下であれば、電磁波シールドフィルム１０、フレキシブルプリント配線板３０等の破損等を抑えることができる。   The pressure of the hot press is preferably 10 MPa to 20 MPa, and more preferably 10 MPa to 16 MPa. If the pressure of hot pressing is 10 MPa or more, the isotropic conductive adhesive layer 16 is bonded to the surface of the insulating film 40. In addition, the time for hot pressing can be shortened. If the pressure of hot press is 20 MPa or less, damage to the electromagnetic shielding film 10, the flexible printed wiring board 30, etc. can be suppressed.

（工程（ｇ））
図８に示すように、絶縁性保護層１２から第１の離型フィルム１８を剥離し、電磁波シールドフィルム付きフレキシブルプリント配線板１を得る。 (Process (g))
As shown in FIG. 8, the 1st release film 18 is peeled from the insulating protective layer 12, and the flexible printed wiring board 1 with an electromagnetic wave shielding film is obtained.

工程（ｆ）における熱プレスの時間が２０秒〜１０分間の短時間である場合、第１の離型フィルム１８を剥離する前または剥離した後に等方導電性接着剤層１６の本硬化を行うことが好ましい。
等方導電性接着剤層１６の本硬化は、例えば、オーブン等の加熱装置を用いて行う。
加熱時間は、１５〜１２０分間であり、３０〜６０分間が好ましい。加熱時間が１５分以上であれば、等方導電性接着剤層１６を十分に硬化できる。加熱時間が１２０分以下であれば、電磁波シールドフィルム付きフレキシブルプリント配線板１の製造時間を短縮できる。
加熱温度（オーブン中の雰囲気温度）は、１２０〜１８０℃が好ましく、１２０〜１５０℃が好ましい。加熱温度が１２０℃以上であれば、加熱時間を短縮できる。加熱温度が１６０℃以下であれば、電磁波シールドフィルム１０、フレキシブルプリント配線板３０等の劣化等を抑えることができる。
加熱は、特殊な装置を使用しなくてもよい点から、無加圧で行うことが好ましい。 When the hot pressing time in the step (f) is a short time of 20 seconds to 10 minutes, the isotropic conductive adhesive layer 16 is fully cured before or after the first release film 18 is peeled off. It is preferable.
The main curing of the isotropic conductive adhesive layer 16 is performed using a heating device such as an oven, for example.
The heating time is 15 to 120 minutes, preferably 30 to 60 minutes. If the heating time is 15 minutes or more, the isotropic conductive adhesive layer 16 can be sufficiently cured. If heating time is 120 minutes or less, the manufacturing time of the flexible printed wiring board 1 with an electromagnetic wave shielding film can be shortened.
The heating temperature (atmosphere temperature in the oven) is preferably 120 to 180 ° C, more preferably 120 to 150 ° C. When the heating temperature is 120 ° C. or higher, the heating time can be shortened. If heating temperature is 160 degrees C or less, deterioration etc. of the electromagnetic wave shielding film 10, the flexible printed wiring board 30, etc. can be suppressed.
Heating is preferably performed without pressure from the point that a special apparatus need not be used.

（作用効果）
以上説明した電磁波シールドフィルム付きフレキシブルプリント配線板１にあっては、金属薄膜層１４の表面抵抗が０．３Ω以下であり、かつ等方導電性接着剤層１６の表面抵抗が１０Ω以下であるため、金属薄膜層１４にクラックが生じても、電磁波ノイズの遮蔽効果を維持できる。 (Function and effect)
In the flexible printed wiring board 1 with the electromagnetic wave shielding film described above, the surface resistance of the metal thin film layer 14 is 0.3Ω or less and the surface resistance of the isotropic conductive adhesive layer 16 is 10Ω or less. Even if the metal thin film layer 14 is cracked, the electromagnetic noise shielding effect can be maintained.

（他の実施形態）
本発明の電磁波シールドフィルム付きフレキシブルプリント配線板は、フレキシブルプリント配線板と、絶縁フィルムと、本発明の電磁波シールドフィルムとを備えたものであればよく、図示例の実施形態に限定はされない。
例えば、フレキシブルプリント配線板は、裏面側にグランド層を有するものであってもよい。また、フレキシブルプリント配線板は、両面にプリント回路を有し、両面に絶縁フィルムおよび電磁波シールドフィルムが貼り付けられたものであってもよい。 (Other embodiments)
The flexible printed wiring board with an electromagnetic wave shielding film of the present invention only needs to include a flexible printed wiring board, an insulating film, and the electromagnetic wave shielding film of the present invention, and is not limited to the illustrated embodiment.
For example, the flexible printed wiring board may have a ground layer on the back side. The flexible printed wiring board may have a printed circuit on both sides, and an insulating film and an electromagnetic wave shielding film may be attached to both sides.

以下、実施例を示す。なお、本発明は実施例に限定されるものではない。   Examples are shown below. In addition, this invention is not limited to an Example.

（貯蔵弾性率）
貯蔵弾性率は、動的粘弾性測定装置（Ｒｈｅｏｍｅｔｒｉｃ Ｓｃｉｅｎｔｉｆｉｃ，Ｉｎｃ．製、ＲＳＡII）を用いて測定した。 (Storage modulus)
The storage elastic modulus was measured using a dynamic viscoelasticity measuring apparatus (Rheometric Scientific, Inc., RSAII).

（実施例１）
第１の離型フィルム１８および第２の離型フィルム２０として、非シリコーン系離型剤にて片面が離型処理されたポリエチレンテレフタレートフィルム（リンテック社製、Ｔ１５７、厚さ：５０μｍ、１６０℃における貯蔵弾性率：６×１０８Ｐａ）を用意した。 Example 1
As the first release film 18 and the second release film 20, a polyethylene terephthalate film whose one surface was release-treated with a non-silicone release agent (manufactured by Lintec, T157, thickness: 50 μm, at 160 ° C. Storage modulus: 6 × 10 8 Pa) was prepared.

工程（ａ）：
第１の離型フィルム１８の離型剤層１８ｂの表面に、溶剤溶解性アミド樹脂（ティーアンドケイ東華社製、ＴＰＡＥ−６１７Ｃ）および硬化剤（トルエンジイソシアネート）をＮ，Ｎ−ジメチルホルムアミドに溶解した塗料を塗布し、１５０℃で０．４時間加熱し、アミド樹脂を硬化させて、絶縁性保護層１２（厚さ：５μｍ、１６０℃における貯蔵弾性率：８×１０６Ｐａ、表面抵抗：８×１０１２Ω）を形成した。 Step (a):
On the surface of the release agent layer 18b of the first release film 18, a solvent-soluble amide resin (TPAE-617C, manufactured by T & K Toka Co., Ltd.) and a curing agent (toluene diisocyanate) are dissolved in N, N-dimethylformamide. The coating material was applied, heated at 150 ° C. for 0.4 hours to cure the amide resin, and the insulating protective layer 12 (thickness: 5 μm, storage elastic modulus at 160 ° C .: 8 × 10 6 Pa, surface resistance: 8 × 10 12 Ω).

工程（ｂ）：
絶縁性保護層１２の表面に、電子ビーム蒸着法にて銅を物理的に蒸着させ、厚さ０．０７μｍ、表面抵抗０．３Ωの蒸着膜（金属薄膜層１４）を形成し、第１の積層体１０ａを得た。 Step (b):
Copper is physically vapor-deposited on the surface of the insulating protective layer 12 by an electron beam vapor deposition method to form a vapor-deposited film (metal thin film layer 14) having a thickness of 0.07 μm and a surface resistance of 0.3Ω. The laminated body 10a was obtained.

工程（ｃ）：
第２の離型フィルム２０の離型剤層２０ｂの表面に、硬化性エポキシ樹脂としてエポキシ樹脂（ＤＩＣ社製、ＥＸＡ−４８１６）と硬化剤（味の素ファインテクノ社製、ＰＮ−２３）との混合物、導電性粒子２２として銀粒子（ＤＯＷＡエレクトロニクス社製、ＡＧ ６−１１、平均粒子径：３．６μｍ、比表面積：０．２１ｍ２／ｇ、真密度：１０．５ｇ／ｃｍ３）およびカーボンナノファイバ（昭和電工社製、ＶＧＣＦ、平均繊維長：６μｍ、平均繊維径：０．１５μｍ、アスペクト比：６０、比表面積：１３ｍ２／ｇ、真密度：２．１ｇ／ｃｍ３）を溶剤（メチルエチルケトン）に溶解または分散させた導電性接着剤組成物を、ダイコーターを用いて塗布し、溶剤を揮発させて、等方導電性接着剤層１６（厚さ：１０μｍ、銀粒子：５８体積％、カーボンナノファイバ：１５体積％、表面抵抗：８０Ω）を形成し、第２の積層体１０ｂを得た。 Step (c):
A mixture of an epoxy resin (manufactured by DIC, EXA-4816) and a curing agent (manufactured by Ajinomoto Fine Techno Co., PN-23) as a curable epoxy resin on the surface of the release agent layer 20b of the second release film 20 In addition, silver particles (manufactured by DOWA Electronics, AG 6-11, average particle size: 3.6 μm, specific surface area: 0.21 m 2 / g, true density: 10.5 g / cm 3 ) and carbon nano particles as conductive particles 22 Fiber (manufactured by Showa Denko KK, VGCF, average fiber length: 6 μm, average fiber diameter: 0.15 μm, aspect ratio: 60, specific surface area: 13 m 2 / g, true density: 2.1 g / cm 3 ) solvent (methyl ethyl ketone) The conductive adhesive composition dissolved or dispersed in) is applied using a die coater, the solvent is evaporated, and the isotropic conductive adhesive layer 16 (thickness: 10 μm, silver particles: 8% by volume, carbon nanofibers: 15 vol%, surface resistivity: 80 [Omega) on the ridges thereby to obtain a second laminate 10b.

工程（ｄ）：
第１の積層体１０ａと第２の積層体１０ｂとを、金属薄膜層１４と等方導電性接着剤層１６とが接触するように重ね、ホットプレス装置（ＶＩＧＯＲ社製、ＶＦＰＣ−０５Ｒ）を用い、温度：９０℃、圧力：２ＭＰａで３秒間熱プレスし、電磁波シールドフィルム１０を得た。 Step (d):
The first laminated body 10a and the second laminated body 10b are stacked so that the metal thin film layer 14 and the isotropic conductive adhesive layer 16 are in contact with each other, and a hot press apparatus (VFPC-05R, manufactured by Vigor Corporation) is attached. The electromagnetic wave shielding film 10 was obtained by hot pressing at a temperature of 90 ° C. and a pressure of 2 MPa for 3 seconds.

工程（ｅ）：
厚さ２５μｍのポリイミドフィルム（表面抵抗：１×１０１７Ω）（基材フィルム）の表面に、ニトリルゴム変性エポキシ樹脂からなる絶縁性接着剤組成物を、乾燥膜厚が２５μｍになるように塗布し、接着剤層を形成し、絶縁フィルム４０（厚さ：５０μｍ）を得た。 Step (e):
An insulating adhesive composition made of a nitrile rubber-modified epoxy resin is applied to the surface of a polyimide film (surface resistance: 1 × 10 17 Ω) (base film) with a thickness of 25 μm so that the dry film thickness is 25 μm. Then, an adhesive layer was formed to obtain an insulating film 40 (thickness: 50 μm).

厚さ１２μｍのポリイミドフィルム（表面抵抗：１×１０１７Ω）（ベースフィルム３２）の表面に、プリント回路３４が形成されたフレキシブルプリント配線板３０を用意した。
フレキシブルプリント配線板３０に絶縁フィルム４０を熱プレスにより貼り付けて、絶縁フィルム付きフレキシブルプリント配線板２を得た。 A flexible printed wiring board 30 having a printed circuit 34 formed on the surface of a 12 μm thick polyimide film (surface resistance: 1 × 10 17 Ω) (base film 32) was prepared.
The insulating film 40 was affixed on the flexible printed wiring board 30 by hot press, and the flexible printed wiring board 2 with the insulating film was obtained.

工程（ｆ）：
フレキシブルプリント配線板３０に、第２の離型フィルム２０を剥離した電磁波シールドフィルム１０を重ね、ホットプレス装置（ＶＩＧＯＲ社製、ＶＦＰＣ−０５Ｒ）を用い、温度：１７０℃、圧力：１５ＭＰａで３０秒間熱プレスし、絶縁フィルム４０の表面に等方導電性接着剤層１６を接着して、電磁波シールドフィルム付きフレキシブルプリント配線板の前駆体３を得た。
電磁波シールドフィルム付きフレキシブルプリント配線板の前駆体３を、高温恒温器（楠本化成社製、ＨＴ２１０）を用い、温度：１７０℃で３０分間加熱することによって、等方導電性接着剤層１６を本硬化させた。 Step (f):
The electromagnetic wave shielding film 10 from which the second release film 20 has been peeled is overlapped on the flexible printed wiring board 30, and a hot press apparatus (VIGOR, VFPC-05R) is used for 30 seconds at a temperature of 170 ° C. and a pressure of 15 MPa. It heat-pressed and the isotropic conductive adhesive layer 16 was adhere | attached on the surface of the insulating film 40, and the precursor 3 of the flexible printed wiring board with an electromagnetic wave shield film was obtained.
The precursor 3 of the flexible printed wiring board with an electromagnetic wave shielding film is heated at a temperature of 170 ° C. for 30 minutes using a high-temperature thermostatic chamber (manufactured by Enomoto Kasei Co., Ltd., HT210). Cured.

工程（ｇ）：
絶縁性保護層１２から第１の離型フィルム１８を剥離し、電磁波シールドフィルム付きフレキシブルプリント配線板１を得た。 Step (g):
The 1st release film 18 was peeled from the insulating protective layer 12, and the flexible printed wiring board 1 with an electromagnetic wave shield film was obtained.

（比較例１）
工程（ａ）〜（ｂ）：
実施例１と同様にして、第１の積層体を得た。 (Comparative Example 1)
Steps (a) to (b):
In the same manner as in Example 1, a first laminate was obtained.

工程（ｃ）：
第２の離型フィルムの離型剤層の表面に、硬化性エポキシ樹脂としてエポキシ樹脂（ＤＩＣ社製、ＥＸＡ−４８１６）と硬化剤（味の素ファインテクノ社製、ＰＮ−２３）との混合物、導電性粒子２２として焼成カーボン粒子（エア・ウォーター・ベルパール社製、ＣＲ２−８００ＳＲ、平均粒子径：５．０μｍ、比表面積：０．８ｍ２／ｇ、真密度：１．３４ｇ／ｃｍ３）を溶剤（メチルエチルケトン）に溶解または分散させた導電性接着剤組成物を、ダイコーターを用いて塗布し、溶剤を揮発させて、等方導電性接着剤層（厚さ：１０μｍ、焼成カーボン粒子：７５体積％、カーボンナノファイバ：１０体積％、表面抵抗：６２０Ω）を形成し、第２の積層体を得た。 Step (c):
On the surface of the release agent layer of the second release film, a mixture of an epoxy resin (manufactured by DIC, EXA-4816) and a curing agent (manufactured by Ajinomoto Fine Techno Co., PN-23) as a curable epoxy resin, conductive Baked carbon particles (CR2-800SR, manufactured by Air Water Bell Pearl Co., Ltd., average particle size: 5.0 μm, specific surface area: 0.8 m 2 / g, true density: 1.34 g / cm 3 ) as solvent particles 22 A conductive adhesive composition dissolved or dispersed in (methyl ethyl ketone) is applied using a die coater, the solvent is evaporated, and an isotropic conductive adhesive layer (thickness: 10 μm, calcined carbon particles: 75 volumes) %, Carbon nanofiber: 10% by volume, surface resistance: 620Ω) to obtain a second laminate.

工程（ｄ）：
第２の積層体として、比較例１の工程（ｃ）で得られた第２の積層体を用いた以外は、実施例１と同様にして、電磁波シールドフィルムを得た。 Step (d):
An electromagnetic wave shielding film was obtained in the same manner as in Example 1 except that the second laminate obtained in the step (c) of Comparative Example 1 was used as the second laminate.

工程（ｅ）〜（ｇ）：
電磁波シールドフィルムとして、比較例１の工程（ｄ）で得られた電磁波シールドフィルムを用いた以外は、実施例１と同様にして、電磁波シールドフィルム付きフレキシブルプリント配線板を得た。 Steps (e) to (g):
A flexible printed wiring board with an electromagnetic wave shielding film was obtained in the same manner as in Example 1 except that the electromagnetic wave shielding film obtained in the step (d) of Comparative Example 1 was used as the electromagnetic wave shielding film.

本発明の電磁波シールドフィルムは、スマートフォン、携帯電話、光モジュール、デジタルカメラ、ゲーム機、ノートパソコン、医療器具等の電子機器用のフレキシブルプリント配線板における、電磁波シールド用部材として有用である。   The electromagnetic wave shielding film of the present invention is useful as an electromagnetic wave shielding member in flexible printed wiring boards for electronic devices such as smartphones, mobile phones, optical modules, digital cameras, game machines, notebook computers, and medical devices.

１ 電磁波シールドフィルム付きフレキシブルプリント配線板
２ 絶縁フィルム付きフレキシブルプリント配線板
３ 電磁波シールドフィルム付きフレキシブルプリント配線板の前駆体
１０ 電磁波シールドフィルム
１０ａ 第１の積層体
１０ｂ 第２の積層体
１２ 絶縁性保護層
１４ 金属薄膜層
１６ 等方導電性接着剤層
１８ 第１の離型フィルム
１８ａ 離型フィルム本体
１８ｂ 離型剤層
２０ 第２の離型フィルム
２０ａ 離型フィルム本体
２０ｂ 離型剤層
２２ 導電性粒子
２４ 導電性繊維
３０ フレキシブルプリント配線板
３２ ベースフィルム
３４ プリント回路
４０ 絶縁フィルム
４２ 貫通孔
１０１ 電磁波シールドフィルム付きフレキシブルプリント配線板
１１０ 電磁波シールドフィルム
１１２ 絶縁性保護層
１１４ 金属薄膜層
１１６ 異方導電性接着剤層
１１８ 離型フィルム
１３０ フレキシブルプリント配線板
１３２ ベースフィルム
１３４ プリント回路
１４０ 絶縁フィルム
１４２ 貫通孔 DESCRIPTION OF SYMBOLS 1 Flexible printed wiring board with electromagnetic shielding film 2 Flexible printed wiring board with insulating film 3 Precursor of flexible printed wiring board with electromagnetic shielding film 10 Electromagnetic shielding film 10a First laminated body 10b Second laminated body 12 Insulating protective layer DESCRIPTION OF SYMBOLS 14 Metal thin film layer 16 Isotropic conductive adhesive layer 18 1st release film 18a Release film body 18b Release agent layer 20 2nd release film 20a Release film body 20b Release agent layer 22 Conductive particle DESCRIPTION OF SYMBOLS 24 Conductive fiber 30 Flexible printed wiring board 32 Base film 34 Printed circuit 40 Insulating film 42 Through-hole 101 Flexible printed wiring board with an electromagnetic shielding film 110 Electromagnetic shielding film 112 Insulating protective layer 114 Metal thin film layer 11 6 Anisotropic Conductive Adhesive Layer 118 Release Film 130 Flexible Printed Wiring Board 132 Base Film 134 Printed Circuit 140 Insulating Film 142 Through-hole

Claims (7)

第１の離型フィルムと、
樹脂を含む塗料を塗布して形成された厚さ１０μｍ以下の絶縁性保護層と、
表面抵抗が０．０１〜０．３Ωである金属薄膜層と、
導電性フィラーを含み、表面抵抗が１〜１００Ωである等方導電性接着剤層と
を順に接して備えた、電磁波シールドフィルム。 A first release film;
An insulating protective layer having a thickness of 10 μm or less formed by applying a paint containing resin ;
A metal thin film layer having a surface resistance of 0.01 to 0.3Ω,
An electromagnetic wave shielding film comprising a conductive filler and an isotropic conductive adhesive layer having a surface resistance of 1 to 100Ω in contact with each other. 前記導電性フィラーの割合が、前記等方導電性接着剤層の１００体積％のうち、３０〜８０体積％である、請求項１に記載の電磁波シールドフィルム。   The electromagnetic wave shielding film according to claim 1, wherein a ratio of the conductive filler is 30 to 80% by volume in 100% by volume of the isotropic conductive adhesive layer. 前記等方導電性接着剤層が、前記導電性フィラーとして、導電性粒子および導電性繊維を含む、請求項１または２に記載の電磁波シールドフィルム。   The electromagnetic wave shielding film according to claim 1 or 2, wherein the isotropic conductive adhesive layer includes conductive particles and conductive fibers as the conductive filler. 前記等方導電性接着剤層の表面に設けられた第２の離型フィルムをさらに備えた、請求項１〜３のいずれか一項に記載の電磁波シールドフィルム。 The electromagnetic wave shielding film according to any one of claims 1 to 3 , further comprising a second release film provided on a surface of the isotropic conductive adhesive layer. 請求項４に記載の電磁波シールドフィルムを製造する方法であって、
下記の工程（ａ）〜（ｄ）を有する、電磁波シールドフィルムの製造方法。
（ａ）第１の離型フィルムの片面に樹脂を含む塗料を塗布して厚さ１０μｍ以下の絶縁性保護層を形成する工程。
（ｂ）前記絶縁性保護層の表面に表面抵抗が０．０１〜０．３Ωである金属薄膜層を形成することによって、第１の離型フィルムと、絶縁性保護層と、金属薄膜層とを順に接して備えた第１の積層体を得る工程。
（ｃ）第２の離型フィルムの片面に等方導電性接着剤層を形成することによって、第２の離型フィルムと、導電性フィラーを含み、表面抵抗が１〜１００Ωである等方導電性接着剤層とを順に接して備えた第２の積層体を得る工程。
（ｄ）前記第１の積層体と前記第２の積層体とを、前記第１の積層体の前記金属薄膜層と前記第２の積層体の前記等方導電性接着剤層とが接触するように貼り合わせる工程。 A method for producing the electromagnetic wave shielding film according to claim 4 ,
The manufacturing method of the electromagnetic wave shielding film which has the following process (a)-(d).
(A) The process of apply | coating the coating material containing resin to the single side | surface of a 1st release film, and forming the insulating protective layer 10 micrometers or less in thickness .
(B) By forming a metal thin film layer having a surface resistance of 0.01 to 0.3Ω on the surface of the insulating protective layer, a first release film, an insulating protective layer, a metal thin film layer, The process of obtaining the 1st laminated body which contacted and was equipped in order.
(C) By forming an isotropic conductive adhesive layer on one side of the second release film, the second release film and the conductive filler are included, and the isotropic conductivity having a surface resistance of 1 to 100Ω. obtaining a second laminate having in turn contact the sexual adhesive layer.
; (D) first laminate and the second laminate, wherein a first of said isotropic conductive adhesive layer of the metal thin film layer and the second stack of laminates are in contact The process of pasting together. ベースフィルムの少なくとも片面にプリント回路が設けられたフレキシブルプリント配線板と、
前記フレキシブルプリント配線板の前記プリント回路が設けられた側の表面に設けられた絶縁フィルムと、
前記絶縁フィルムの表面に前記等方導電性接着剤層が接着された請求項１〜３のいずれか一項に記載の電磁波シールドフィルムと
を備え、
前記等方導電性接着剤層が、前記絶縁フィルムに形成された貫通孔を通って前記プリント回路に電気的に接続された、電磁波シールドフィルム付きフレキシブルプリント配線板。 A flexible printed wiring board provided with a printed circuit on at least one side of the base film;
An insulating film provided on the surface of the flexible printed wiring board on which the printed circuit is provided;
The electromagnetic shielding film according to any one of claims 1 to 3, wherein the isotropic conductive adhesive layer is adhered to a surface of the insulating film.
A flexible printed wiring board with an electromagnetic wave shielding film, wherein the isotropic conductive adhesive layer is electrically connected to the printed circuit through a through hole formed in the insulating film. 下記の工程（ｅ）〜（ｇ）を有する、電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法。
（ｅ）ベースフィルムの少なくとも片面にプリント回路を有するフレキシブルプリント配線板の前記プリント回路が設けられた側の表面に、前記プリント回路に対応する位置に貫通孔が形成された絶縁フィルムを設け、絶縁フィルム付きフレキシブルプリント配線板を得る工程。
（ｆ）前記工程（ｅ）の後、前記絶縁フィルム付きフレキシブルプリント配線板と、請求項１〜３のいずれか一項に記載の電磁波シールドフィルムとを、前記絶縁フィルムの表面に前記等方導電性接着剤層が接触するように重ね、これらを熱プレスすることによって、前記絶縁フィルムの表面に前記等方導電性接着剤層を接着し、かつ前記等方導電性接着剤層を、前記貫通孔を通って前記プリント回路に電気的に接続する工程。
（ｇ）前記工程（ｆ）の後、前記第１の離型フィルムを剥離する工程。 The manufacturing method of the flexible printed wiring board with an electromagnetic wave shielding film which has the following process (e)-(g).
(E) An insulating film having a through-hole formed at a position corresponding to the printed circuit is provided on the surface of the flexible printed wiring board having the printed circuit on at least one side of the base film on the side where the printed circuit is provided; The process of obtaining the flexible printed wiring board with a film.
(F) After the step (e), the flexible printed wiring board with an insulating film and the electromagnetic wave shielding film according to any one of claims 1 to 3 are formed on the surface of the insulating film with the isotropic conduction. The isotropic conductive adhesive layer is adhered to the surface of the insulating film, and the isotropic conductive adhesive layer is adhered to the surface of the insulating film by stacking the adhesive adhesive layers so that they are in contact with each other. Electrically connecting to the printed circuit through a hole.
After (g) pre-Symbol step (f), the step of removing the first release film.
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