JP6440740B2 - 物体を保持、位置決めおよび/または移動させるための装置 - Google Patents
物体を保持、位置決めおよび/または移動させるための装置 Download PDFInfo
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- JP6440740B2 JP6440740B2 JP2016564136A JP2016564136A JP6440740B2 JP 6440740 B2 JP6440740 B2 JP 6440740B2 JP 2016564136 A JP2016564136 A JP 2016564136A JP 2016564136 A JP2016564136 A JP 2016564136A JP 6440740 B2 JP6440740 B2 JP 6440740B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70816—Bearings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Magnetic Bearings And Hydrostatic Bearings (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Linear Motors (AREA)
Description
2 搬送方向
10 磁気支承装置
11 制御回路
12 電磁石
14 鉄心
15 電子ユニット
16 コイル
18 相手方部材
20 距離センサ
22 コントローラ
23 振動減衰部
24 増幅器
25 設定値発信器
26 間隔
28 運動センサ
29 中央制御装置
30 基礎
32 案内レール
34 案内レール
35 案内レール
36 駆動レール
38 駆動装置
40 コイル構造体
42 永久磁石構造体
44 符号化部
46 位置センサ
50 支持体
52 エネルギー供給装置
54 永久磁石装置
56 永久磁石
58 導体貫通部
60 ケーシング
100 磁気支承装置
Claims (14)
- 物体(52)を保持、位置決めおよび/または移動させるための装置であって、
基礎(30)と、この基礎(30)と相対的に移動可能なキャリア(50)を具備し、
少なくとも3個の磁気軸受(10、100)を具備し、この磁気軸受によって前記キャリア(50)が前記基礎(30)上で非接触支承され、
前記磁気軸受(10、100)の少なくとも2個が能動的に制御可能な磁気軸受(10、100)として形成され、能動的に制御可能な各磁気軸受は相手方部材(18)と磁気的に相互作用する電気的に制御可能な電磁アクチュエータ(12)を備え、
この電磁アクチュエータは、前記基礎(30)と前記キャリア(50)の間を設定された間隔に維持するために電子ユニット(15)によって能動的に制御可能であり、
前記磁気軸受(10、100)の少なくとも2個の電磁アクチュエータ(12)と前記電子ユニット(15)が前記キャリア(50)上に配置され、
さらに、少なくとも1つの搬送方向(2)に沿って前記基礎(30)と相対的に前記キャリア(50)を移動させるための駆動装置(38)を具備し、この駆動装置(38)が前記基礎(30)上に配置された永久磁石構造体(42)と、前記キャリア(50)上に配置され前記永久磁石構造体(42)と相互作用するコイル構造体(40)とを備えている、装置。 - 能動的に制御可能な各磁気軸受(10、100)には、前記基礎(30)と前記キャリア(50)の間の間隔(26)を測定するための距離センサ(20)が前記キャリア(50)上に設けられている、請求項1に記載の装置。
- 能動的に制御可能な各磁気軸受(10、100)には、前記距離センサ(20)によって検出可能な間隔(26)に依存して前記電磁アクチュエータ(12)を制御するように形成された電子ユニット(15)が前記キャリア(50)上に設けられている、請求項2に記載の装置。
- 前記電子ユニット(15)としては、少なくとも2個の前記磁気軸受(10、100)に接続されたものであるか、あるいは、すべての能動的な磁気軸受(10、100)に接続された中央制御装置(29)で実現したものである、請求項1〜3のいずれか一項に記載の装置。
- 少なくとも1個の相手方部材(18)を備えた、搬送方向(2)に沿って延在する少なくとも1本の案内レール(32、34)が前記基礎(30)上に配置され、前記相手方部材が前記電磁アクチュエータ(12)と磁気的に相互作用する、請求項1〜4のいずれか一項に記載の装置。
- 少なくとも1つの搬送方向(2)に沿って延在する三次元的な符号化部(44)が前記基礎(30)上に配置され、この符号化部が前記キャリア(50)上に配置された位置センサ(46)によって読み取り可能である、請求項1〜5のいずれか一項に記載の装置。
- 前記磁気軸受(10)の少なくとも1個が永久磁石ユニット(54)と、この永久磁石ユニット(54)と相互作用する電気的に制御可能な電磁アクチュエータ(12)を備えている、請求項1〜6のいずれか一項に記載の装置。
- 少なくとも1個の磁気軸受(10)の永久磁石ユニットが前記キャリア(50)に作用する支持力(S)を発生するように形成され、この支持力が前記キャリアの重力(G)よりも大きく、前記電磁アクチュエータ(12)が前記支持力(S)に反作用する調節力を発生するように形成されている、請求項7に記載の装置。
- 前記電子ユニット(15)に接続された少なくとも1個の運動センサ(28)が前記キャリア(50)上に配置されている、請求項1〜8のいずれか一項に記載の装置。
- 能動的な磁気軸受(10、100)の電気的に制御可能な、信号を処理するかまたは信号を発生するすべての構成要素(15、16、20、22、24、25、28)が前記キャリア(50)上に配置されている、請求項1〜9のいずれか一項に記載の装置。
- 前記キャリア(50)が位置変更可能なエネルギー供給装置(52)に接続されている、請求項1〜10のいずれか一項に記載の装置。
- 前記エネルギー供給装置(52)が引きずりケーブルとして、長さ変更可能な可撓性のらせんケーブルとしてあるいは誘導形エネルギー供給部として形成されている、請求項11に記載の装置。
- 前記エネルギー供給装置(52)がデータ伝送装置および/または冷却媒体供給部を備えている、請求項11または12に記載の装置。
- 前記キャリア(50)が真空封止的に形成されている、請求項1〜13のいずれか一項に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014005897.2 | 2014-04-25 | ||
DE102014005897.2A DE102014005897B3 (de) | 2014-04-25 | 2014-04-25 | Vorrichtung zum Halten, Positionieren und/oder Bewegen eines Objekts |
PCT/EP2015/058716 WO2015162177A1 (de) | 2014-04-25 | 2015-04-22 | Vorrichtung zum halten, positionieren und/oder bewegen eines objekts |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017514446A JP2017514446A (ja) | 2017-06-01 |
JP6440740B2 true JP6440740B2 (ja) | 2018-12-19 |
Family
ID=53016595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016564136A Active JP6440740B2 (ja) | 2014-04-25 | 2015-04-22 | 物体を保持、位置決めおよび/または移動させるための装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6440740B2 (ja) |
KR (1) | KR102035210B1 (ja) |
DE (1) | DE102014005897B3 (ja) |
WO (1) | WO2015162177A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015016081A1 (de) * | 2015-12-10 | 2017-06-14 | Applied Materials, Inc. (N.D.Ges.D. Staates Delaware) | Verschluss- oder Schleusenvorrichtung für eine Vakuumkammer |
KR101939383B1 (ko) | 2016-10-18 | 2019-04-10 | 현대오트론 주식회사 | 초음파 센서 장치 및 초음파 센서 장치의 센싱 방법 |
DE102017002542A1 (de) * | 2017-03-16 | 2018-09-20 | Applied Materials, Inc. (N.D.Ges.D. Staates Delaware) | Vorrichtung zum Halten, Positionieren und/oder Bewegen eines Objekts |
JP2020500257A (ja) * | 2017-10-27 | 2020-01-09 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 堆積システムにおいてキャリアを非接触搬送するための装置、キャリアを非接触搬送するためのシステム、堆積システムにおいて非接触搬送されるキャリア、及び堆積システムにおいてキャリアを非接触搬送するための方法 |
KR20200087549A (ko) * | 2019-01-11 | 2020-07-21 | 캐논 톡키 가부시키가이샤 | 성막장치, 전자 디바이스 제조장치, 성막방법, 및 전자 디바이스 제조방법 |
CN111059148A (zh) * | 2019-12-27 | 2020-04-24 | 珠海格力电器股份有限公司 | 轴向磁悬浮轴承、电机、压缩机和空调器 |
KR20240014379A (ko) | 2022-07-25 | 2024-02-01 | 공주대학교 산학협력단 | 객체 추종 카트 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6331940A (ja) * | 1986-07-28 | 1988-02-10 | Nippon Telegr & Teleph Corp <Ntt> | 磁気浮上移送装置 |
US5347190A (en) * | 1988-09-09 | 1994-09-13 | University Of Virginia Patent Foundation | Magnetic bearing systems |
JPH0741992B2 (ja) * | 1991-05-30 | 1995-05-10 | エヌティエヌ株式会社 | 磁気浮上搬送装置 |
JPH06210555A (ja) * | 1993-01-19 | 1994-08-02 | Fuji Electric Co Ltd | 移動ステージの変位量計測装置 |
JPH06225568A (ja) * | 1993-01-25 | 1994-08-12 | Brother Ind Ltd | リニア駆動システム |
US5699621A (en) * | 1996-02-21 | 1997-12-23 | Massachusetts Institute Of Technology | Positioner with long travel in two dimensions |
JPH09252504A (ja) * | 1996-03-15 | 1997-09-22 | Hitachi Kiden Kogyo Ltd | 磁気浮上式搬送装置 |
JPH10270535A (ja) * | 1997-03-25 | 1998-10-09 | Nikon Corp | 移動ステージ装置、及び該ステージ装置を用いた回路デバイス製造方法 |
JP4314091B2 (ja) | 2003-10-03 | 2009-08-12 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
JP4478470B2 (ja) * | 2004-01-26 | 2010-06-09 | キヤノン株式会社 | 位置決めステージ装置 |
JP2007123332A (ja) * | 2005-10-25 | 2007-05-17 | Nikon Corp | ステージ装置、露光装置、デバイスの製造方法 |
KR100745371B1 (ko) * | 2006-10-23 | 2007-08-02 | 삼성전자주식회사 | 자기부상형 웨이퍼 스테이지 |
JP5383180B2 (ja) * | 2008-12-25 | 2014-01-08 | キヤノン株式会社 | 位置決め装置 |
DE102009038756A1 (de) * | 2009-05-28 | 2010-12-09 | Semilev Gmbh | Vorrichtung zur partikelfreien Handhabung von Substraten |
-
2014
- 2014-04-25 DE DE102014005897.2A patent/DE102014005897B3/de not_active Expired - Fee Related
-
2015
- 2015-04-22 KR KR1020167029285A patent/KR102035210B1/ko active IP Right Grant
- 2015-04-22 WO PCT/EP2015/058716 patent/WO2015162177A1/de active Application Filing
- 2015-04-22 JP JP2016564136A patent/JP6440740B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2017514446A (ja) | 2017-06-01 |
DE102014005897B3 (de) | 2015-09-17 |
WO2015162177A1 (de) | 2015-10-29 |
KR20160135338A (ko) | 2016-11-25 |
KR102035210B1 (ko) | 2019-10-22 |
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