JP6393127B2 - 保持パッド - Google Patents
保持パッド Download PDFInfo
- Publication number
- JP6393127B2 JP6393127B2 JP2014184084A JP2014184084A JP6393127B2 JP 6393127 B2 JP6393127 B2 JP 6393127B2 JP 2014184084 A JP2014184084 A JP 2014184084A JP 2014184084 A JP2014184084 A JP 2014184084A JP 6393127 B2 JP6393127 B2 JP 6393127B2
- Authority
- JP
- Japan
- Prior art keywords
- template
- holding
- layer
- holding pad
- silicone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001179 sorption measurement Methods 0.000 claims description 36
- 229920001296 polysiloxane Polymers 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 26
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 10
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 10
- 238000006073 displacement reaction Methods 0.000 claims description 6
- -1 polyethylene terephthalate Polymers 0.000 claims description 6
- 238000004132 cross linking Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 239000002984 plastic foam Substances 0.000 claims description 2
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 73
- 238000005498 polishing Methods 0.000 description 46
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 239000007788 liquid Substances 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 238000009415 formwork Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229920005830 Polyurethane Foam Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000003463 adsorbent Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000011496 polyurethane foam Substances 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
・研磨圧力:0.163kgf/cm2 。
研磨パッドの回転速度:45rpm
被研磨部材の回転速度:47rpm。
・ヘッドの揺動速度:250mm/min。
・研磨時間:3min
Claims (5)
- 被研磨部材を保持するための保持層を有する保持パッドにおいて、
前記保持層は、表面に微小孔を有する発泡プラスチックフォームで構成されており、
前記保持層は、その表面上の一部に被研磨部材の横ズレ防止のためのテンプレートを固定するためのテンプレート固定部を有し、
前記保持層は、前記テンプレート固定部の表面のみに、テンプレートを着脱可能な状態で吸着固定するための吸着層を有し、
前記吸着層は、両末端にのみビニル基を有する直鎖状ポリオルガノシロキサンからなるシリコーン、両末端及び側鎖にビニル基を有する直鎖状ポリオルガノシロキサンからなるシリコーン、末端にのみビニル基を有する分岐状ポリオルガノシロキサンからなるシリコーン、及び末端及び側鎖にビニル基を有する分岐状ポリオルガノシロキサンからなるシリコーンから選ばれる少なくとも1種のシリコーンを架橋させてなる組成物からなるものであることを特徴とする保持パッド。 - 吸着層が保持層の上に接着されてなる請求項1記載の保持パッド。
- 吸着層の厚さは、20〜50μmである請求項1又は請求項2記載の保持パッド。
- 吸着層は、支持層を介して保持層に接着されており、
前記支持層は、引張弾性率が2600〜4200MPaの有機樹脂材料からなる請求項1〜請求項3のいずれかに記載の保持パッド。 - 支持層を構成する有機樹脂材料は、ポリエチレンテレフタレート(PET)、ポリエチレンナフタレート(PEN)のいずれかである請求項4記載の保持パッド。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014184084A JP6393127B2 (ja) | 2014-09-10 | 2014-09-10 | 保持パッド |
US15/504,122 US10449653B2 (en) | 2014-09-10 | 2014-11-26 | Holding pad |
CN201480081839.0A CN107073681A (zh) | 2014-09-10 | 2014-11-26 | 保持垫片 |
PCT/JP2014/081204 WO2016038752A1 (ja) | 2014-09-10 | 2014-11-26 | 保持パッド |
KR1020177006616A KR20170041856A (ko) | 2014-09-10 | 2014-11-26 | 유지 패드 |
TW103142555A TWI543843B (zh) | 2014-09-10 | 2014-12-08 | 保持墊片 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014184084A JP6393127B2 (ja) | 2014-09-10 | 2014-09-10 | 保持パッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016055385A JP2016055385A (ja) | 2016-04-21 |
JP6393127B2 true JP6393127B2 (ja) | 2018-09-19 |
Family
ID=55458535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014184084A Active JP6393127B2 (ja) | 2014-09-10 | 2014-09-10 | 保持パッド |
Country Status (6)
Country | Link |
---|---|
US (1) | US10449653B2 (ja) |
JP (1) | JP6393127B2 (ja) |
KR (1) | KR20170041856A (ja) |
CN (1) | CN107073681A (ja) |
TW (1) | TWI543843B (ja) |
WO (1) | WO2016038752A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170252893A1 (en) * | 2016-03-03 | 2017-09-07 | P.R. Hoffman Machine Products Inc. | Polishing machine work piece holder |
US10556317B2 (en) * | 2016-03-03 | 2020-02-11 | P.R. Hoffman Machine Products Inc. | Polishing machine wafer holder |
JP6508123B2 (ja) * | 2016-05-13 | 2019-05-08 | 信越半導体株式会社 | テンプレートアセンブリの選別方法及びワークの研磨方法並びにテンプレートアセンブリ |
JP6449840B2 (ja) * | 2016-12-27 | 2019-01-09 | 株式会社Mhiエアロスペースプロダクション | 航空機外板の補修方法、電動工具及びアタッチメント |
JP6940363B2 (ja) * | 2017-10-10 | 2021-09-29 | 富士紡ホールディングス株式会社 | 保持パッド及びその製造方法 |
WO2020037683A1 (zh) | 2018-08-24 | 2020-02-27 | 深圳市汇顶科技股份有限公司 | 背光模组、屏下指纹识别方法、装置和电子设备 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000071170A (ja) * | 1998-08-28 | 2000-03-07 | Nitta Ind Corp | 研磨用ウエハ保持部材及びそのウエハ保持部材の研磨機定盤への脱着方法 |
JP4417460B2 (ja) * | 1999-01-20 | 2010-02-17 | 日東電工株式会社 | 半導体ウエハ保護用粘着シート及び半導体ウエハの研削方法 |
JP2001252863A (ja) * | 2000-03-07 | 2001-09-18 | Toshiba Ceramics Co Ltd | ウェーハの研磨方法 |
JP4726023B2 (ja) * | 2000-03-31 | 2011-07-20 | 東洋ゴム工業株式会社 | バッキングパッド |
JP2002059362A (ja) * | 2000-08-22 | 2002-02-26 | Nitto Shinko Kk | 被研磨物保持材 |
US6645049B2 (en) * | 2001-04-23 | 2003-11-11 | Phuong Van Nguyen | Polishing holder for silicon wafers and method of use thereof |
JP2004200451A (ja) * | 2002-12-19 | 2004-07-15 | Nitto Denko Corp | 半導体ウエハ加工用保護シート |
CN100551624C (zh) * | 2005-01-31 | 2009-10-21 | 三芳化学工业股份有限公司 | 用以固定抛光基材的吸附片材及其制造方法及抛光装置 |
JP2007069295A (ja) | 2005-09-06 | 2007-03-22 | Nitta Haas Inc | 被研磨物保持具 |
US8087975B2 (en) * | 2007-04-30 | 2012-01-03 | San Fang Chemical Industry Co., Ltd. | Composite sheet for mounting a workpiece and the method for making the same |
JP2009141122A (ja) * | 2007-12-06 | 2009-06-25 | Disco Abrasive Syst Ltd | ウェーハ加工装置 |
JP2010062269A (ja) * | 2008-09-02 | 2010-03-18 | Three M Innovative Properties Co | ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法 |
JP2010201534A (ja) * | 2009-03-02 | 2010-09-16 | Fujibo Holdings Inc | 保持具 |
JP2011000670A (ja) * | 2009-06-18 | 2011-01-06 | Okamoto Machine Tool Works Ltd | 基板ホルダー |
JP5619486B2 (ja) * | 2010-06-23 | 2014-11-05 | 東京エレクトロン株式会社 | フォーカスリング、その製造方法及びプラズマ処理装置 |
WO2012053548A1 (ja) * | 2010-10-19 | 2012-04-26 | 旭硝子株式会社 | 樹脂組成物、積層体およびその製造方法、構造体およびその製造方法、ならびに電子デバイスの製造方法 |
JP2013147621A (ja) * | 2012-01-23 | 2013-08-01 | Nitto Denko Corp | 貼り合わされた2枚の板の分離方法 |
JP6032643B2 (ja) * | 2012-12-03 | 2016-11-30 | 株式会社岡本工作機械製作所 | バッキング材およびそれを用いた基板のキャリアヘッド構造 |
JP2014144500A (ja) * | 2013-01-28 | 2014-08-14 | Sumitomo Metal Mining Co Ltd | サファイアウェハーの片面研磨方法、サファイアウェハーの製造方法 |
-
2014
- 2014-09-10 JP JP2014184084A patent/JP6393127B2/ja active Active
- 2014-11-26 KR KR1020177006616A patent/KR20170041856A/ko active Search and Examination
- 2014-11-26 WO PCT/JP2014/081204 patent/WO2016038752A1/ja active Application Filing
- 2014-11-26 CN CN201480081839.0A patent/CN107073681A/zh active Pending
- 2014-11-26 US US15/504,122 patent/US10449653B2/en active Active
- 2014-12-08 TW TW103142555A patent/TWI543843B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR20170041856A (ko) | 2017-04-17 |
CN107073681A (zh) | 2017-08-18 |
JP2016055385A (ja) | 2016-04-21 |
TW201609309A (zh) | 2016-03-16 |
US20170259397A1 (en) | 2017-09-14 |
US10449653B2 (en) | 2019-10-22 |
TWI543843B (zh) | 2016-08-01 |
WO2016038752A1 (ja) | 2016-03-17 |
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