JP6280518B2 - Fpc用導電性接着シート及びそれを用いたfpc - Google Patents
Fpc用導電性接着シート及びそれを用いたfpc Download PDFInfo
- Publication number
- JP6280518B2 JP6280518B2 JP2015084928A JP2015084928A JP6280518B2 JP 6280518 B2 JP6280518 B2 JP 6280518B2 JP 2015084928 A JP2015084928 A JP 2015084928A JP 2015084928 A JP2015084928 A JP 2015084928A JP 6280518 B2 JP6280518 B2 JP 6280518B2
- Authority
- JP
- Japan
- Prior art keywords
- fpc
- conductive adhesive
- adhesive sheet
- conductive
- vol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000853 adhesive Substances 0.000 title claims description 107
- 230000001070 adhesive effect Effects 0.000 title claims description 107
- 229910052751 metal Inorganic materials 0.000 claims description 66
- 239000002184 metal Substances 0.000 claims description 66
- 239000012790 adhesive layer Substances 0.000 claims description 64
- 229920005989 resin Polymers 0.000 claims description 52
- 239000011347 resin Substances 0.000 claims description 52
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 43
- 239000003063 flame retardant Substances 0.000 claims description 43
- 230000003014 reinforcing effect Effects 0.000 claims description 43
- 239000011231 conductive filler Substances 0.000 claims description 39
- 239000003795 chemical substances by application Substances 0.000 claims description 33
- 239000003431 cross linking reagent Substances 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 239000010419 fine particle Substances 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 12
- 239000002981 blocking agent Substances 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 8
- 239000011574 phosphorus Substances 0.000 claims description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 230000002209 hydrophobic effect Effects 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- 229920005749 polyurethane resin Polymers 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000010946 fine silver Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 45
- 239000000463 material Substances 0.000 description 20
- 230000000903 blocking effect Effects 0.000 description 18
- -1 polyethylene terephthalate Polymers 0.000 description 14
- 239000011888 foil Substances 0.000 description 11
- 206010040844 Skin exfoliation Diseases 0.000 description 10
- 229920002050 silicone resin Polymers 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 230000002787 reinforcement Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 229910052811 halogen oxide Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910001392 phosphorus oxide Inorganic materials 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Signal Processing (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Materials Engineering (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015084928A JP6280518B2 (ja) | 2015-04-17 | 2015-04-17 | Fpc用導電性接着シート及びそれを用いたfpc |
KR1020160036660A KR101764754B1 (ko) | 2015-04-17 | 2016-03-28 | Fpc용 도전성 접착 시트 및 그것을 이용한 fpc |
CN201610188046.XA CN106042519B (zh) | 2015-04-17 | 2016-03-29 | Fpc用导电性粘接片及使用该粘接片的fpc |
TW109115674A TWI754931B (zh) | 2015-04-17 | 2016-04-07 | Fpc用導電性黏著片材及使用此片材之fpc |
TW105110861A TWI754611B (zh) | 2015-04-17 | 2016-04-07 | Fpc用導電性黏著片材及使用此片材之fpc |
KR1020170095998A KR101848635B1 (ko) | 2015-04-17 | 2017-07-28 | Fpc용 도전성 접착 시트 및 그것을 이용한 fpc |
KR1020180040766A KR101953555B1 (ko) | 2015-04-17 | 2018-04-09 | Fpc용 도전성 접착 시트 및 그것을 이용한 fpc |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015084928A JP6280518B2 (ja) | 2015-04-17 | 2015-04-17 | Fpc用導電性接着シート及びそれを用いたfpc |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018006787A Division JP6448160B2 (ja) | 2018-01-18 | 2018-01-18 | 接着性組成物及びfpc用導電性接着シート |
JP2018006786A Division JP6541283B2 (ja) | 2018-01-18 | 2018-01-18 | Fpc用導電性接着シート及びそれを用いたfpc |
JP2018006785A Division JP6542920B2 (ja) | 2018-01-18 | 2018-01-18 | Fpc用導電性接着シート及びそれを用いたfpc |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016207738A JP2016207738A (ja) | 2016-12-08 |
JP6280518B2 true JP6280518B2 (ja) | 2018-02-14 |
Family
ID=57251926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015084928A Active JP6280518B2 (ja) | 2015-04-17 | 2015-04-17 | Fpc用導電性接着シート及びそれを用いたfpc |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6280518B2 (ko) |
KR (3) | KR101764754B1 (ko) |
CN (1) | CN106042519B (ko) |
TW (2) | TWI754611B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109890124B (zh) * | 2017-12-06 | 2024-03-19 | 昆山雅森电子材料科技有限公司 | 多层异向穿刺型导电布胶及使用其的fpc补强屏蔽结构 |
CN115867622A (zh) * | 2020-09-03 | 2023-03-28 | 东洋铝株式会社 | 导电性粘接剂、使用该导电性粘接剂的电子电路及其制造方法 |
CN111968536B (zh) * | 2020-09-09 | 2022-06-10 | 武汉华星光电半导体显示技术有限公司 | 屏蔽带及显示模组的制备方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61222299A (ja) | 1985-03-28 | 1986-10-02 | 日本光フアイバ株式会社 | 電磁波シ−ルド用テ−プもしくはシ−ト |
JPH07122883A (ja) | 1993-10-21 | 1995-05-12 | Nitto Denko Corp | 電磁波シ−ルド材 |
JPH1197879A (ja) * | 1997-09-19 | 1999-04-09 | Bridgestone Corp | 電磁波シールド性光透過窓材 |
US6344155B1 (en) * | 1999-04-06 | 2002-02-05 | Tomoegawa Paper Co., Ltd. | Electrically conductive adhesive composition, electrically conductive adhesive sheet and use thereof |
JP3535412B2 (ja) * | 1999-04-06 | 2004-06-07 | 株式会社巴川製紙所 | 導電性接着剤組成物、導電性接着剤シート及びそれを用いた電磁波シールド材料ならびに電磁波シールド性フレキシブルプリント基板。 |
JP4956867B2 (ja) * | 2001-04-27 | 2012-06-20 | 大日本印刷株式会社 | フラットケーブル用シールド材及びシールド付きフラットケーブル |
JP4759899B2 (ja) * | 2001-09-28 | 2011-08-31 | 大日本印刷株式会社 | 電磁波シールド材および電磁波シールド付きフラットケーブル |
JP2004212496A (ja) * | 2002-12-27 | 2004-07-29 | Nippon Aerosil Co Ltd | 混合粒子 |
JP4825830B2 (ja) * | 2008-03-11 | 2011-11-30 | 住友電気工業株式会社 | 金属補強板を備えたフレキシブルプリント配線板 |
JP6081819B2 (ja) * | 2013-02-28 | 2017-02-15 | 藤森工業株式会社 | Fpc用電磁波シールド材 |
JP6254386B2 (ja) * | 2013-08-29 | 2017-12-27 | 共同印刷株式会社 | 感圧接着剤組成物 |
KR20180041697A (ko) * | 2015-09-07 | 2018-04-24 | 가부시키가이샤 도모에가와 세이시쇼 | 도전성 접착제 조성물, 도전성 접착 시트 및 그것을 이용한 배선 디바이스 |
-
2015
- 2015-04-17 JP JP2015084928A patent/JP6280518B2/ja active Active
-
2016
- 2016-03-28 KR KR1020160036660A patent/KR101764754B1/ko active IP Right Grant
- 2016-03-29 CN CN201610188046.XA patent/CN106042519B/zh active Active
- 2016-04-07 TW TW105110861A patent/TWI754611B/zh active
- 2016-04-07 TW TW109115674A patent/TWI754931B/zh active
-
2017
- 2017-07-28 KR KR1020170095998A patent/KR101848635B1/ko active IP Right Grant
-
2018
- 2018-04-09 KR KR1020180040766A patent/KR101953555B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR101953555B1 (ko) | 2019-03-04 |
TW202033700A (zh) | 2020-09-16 |
KR20180040129A (ko) | 2018-04-19 |
KR101764754B1 (ko) | 2017-08-03 |
KR20160123990A (ko) | 2016-10-26 |
TWI754931B (zh) | 2022-02-11 |
TWI754611B (zh) | 2022-02-11 |
JP2016207738A (ja) | 2016-12-08 |
CN106042519B (zh) | 2020-05-05 |
TW201702336A (zh) | 2017-01-16 |
KR20170092502A (ko) | 2017-08-11 |
CN106042519A (zh) | 2016-10-26 |
KR101848635B1 (ko) | 2018-04-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106576424B (zh) | 柔性印刷配线板用增强部件和具备柔性印刷配线板用增强部件的柔性印刷配线板 | |
JP6287430B2 (ja) | 導電性接着シート、電磁波シールドシートおよびプリント配線板 | |
JP6255816B2 (ja) | 電磁波シールドシートおよびプリント配線板 | |
WO2019239710A1 (ja) | 電磁波シールドシート | |
KR101953555B1 (ko) | Fpc용 도전성 접착 시트 및 그것을 이용한 fpc | |
KR102088165B1 (ko) | Fpc용 도전성 접착 시트 및 fpc | |
JP6761884B2 (ja) | Fpc用導電性接着シート及びそれを用いたfpc | |
JP2015138813A (ja) | 電磁波シールドシート、および電磁波シールドシート付きプリント配線板 | |
JP6183568B1 (ja) | 部品搭載基板の製造方法 | |
JP6448160B2 (ja) | 接着性組成物及びfpc用導電性接着シート | |
JP6541283B2 (ja) | Fpc用導電性接着シート及びそれを用いたfpc | |
JP6542920B2 (ja) | Fpc用導電性接着シート及びそれを用いたfpc | |
JP6566008B2 (ja) | 電磁波シールドシートおよびプリント配線板 | |
CN107613628B (zh) | 电磁波屏蔽材料 | |
TW201940021A (zh) | 電磁波屏蔽膜及屏蔽印刷配線板 | |
JP2018129495A (ja) | 部品搭載基板の製造方法 | |
JP7099365B2 (ja) | 電磁波シールドシート、部品搭載基板、および電子機器 | |
CN114945268A (zh) | 电磁波屏蔽膜和带电磁波屏蔽膜印刷布线板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170405 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170411 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170606 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20171222 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180119 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6280518 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |