JP6195709B2 - プローブカード、検査装置、及び検査方法 - Google Patents

プローブカード、検査装置、及び検査方法 Download PDF

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Publication number: JP6195709B2
Authority: JP; Japan
Prior art keywords: probe; wafer; contact; group; probe group
Prior art date: 2012-12-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2012274412A

Other languages

English (en)

Japanese (ja)

Other versions

JP2014119340A (ja

Inventor

成田　聡

聡成田

寿男成田

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Micronics Japan Co Ltd

Original Assignee

Micronics Japan Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-12-17

Filing date

2012-12-17

Publication date

2017-09-13

2012-12-17 Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd

2012-12-17 Priority to JP2012274412A priority Critical patent/JP6195709B2/ja

2013-12-11 Priority to KR1020130153967A priority patent/KR101559984B1/ko

2013-12-13 Priority to TW102146186A priority patent/TWI484192B/zh

2014-06-30 Publication of JP2014119340A publication Critical patent/JP2014119340A/ja

2017-09-13 Application granted granted Critical

2017-09-13 Publication of JP6195709B2 publication Critical patent/JP6195709B2/ja

Status Active legal-status Critical Current

2032-12-17 Anticipated expiration legal-status Critical

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Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)
Testing Of Individual Semiconductor Devices (AREA)
Measuring Leads Or Probes (AREA)

JP2012274412A 2012-12-17 2012-12-17 プローブカード、検査装置、及び検査方法 Active JP6195709B2 (ja)

Priority Applications (3)

Application Number	Priority Date	Filing Date	Title
JP2012274412A JP6195709B2 (ja)	2012-12-17	2012-12-17	プローブカード、検査装置、及び検査方法
KR1020130153967A KR101559984B1 (ko)	2012-12-17	2013-12-11	프로브 카드, 검사 장치 및 검사 방법
TW102146186A TWI484192B (zh)	2012-12-17	2013-12-13	Probe card, inspection device and inspection method

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2012274412A JP6195709B2 (ja)	2012-12-17	2012-12-17	プローブカード、検査装置、及び検査方法

Publications (2)

Publication Number	Publication Date
JP2014119340A JP2014119340A (ja)	2014-06-30
JP6195709B2 true JP6195709B2 (ja)	2017-09-13

Family

ID=51130130

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2012274412A Active JP6195709B2 (ja)	2012-12-17	2012-12-17	プローブカード、検査装置、及び検査方法

Country Status (3)

Country	Link
JP (1)	JP6195709B2 (ko)
KR (1)	KR101559984B1 (ko)
TW (1)	TWI484192B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI626446B (zh) *	2017-01-13	2018-06-11	崇碁科技股份有限公司	晶片燒錄測試設備及方法
KR102375702B1 (ko) *	2018-01-29	2022-03-18	에스케이하이닉스 주식회사	테스트 장치 및 이를 이용한 웨이퍼 테스트 방법
TWI679433B (zh) *	2018-07-20	2019-12-11	均豪精密工業股份有限公司	檢測系統、探針裝置及面板檢測方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH067067U (ja) *	1992-07-03	1994-01-28	株式会社東芝	プローブカード
AU2003284411A1 (en) *	2002-11-19	2004-06-15	Nhk Spring Co., Ltd.	Electric probe system
US7285968B2 (en) *	2005-04-19	2007-10-23	Formfactor, Inc.	Apparatus and method for managing thermally induced motion of a probe card assembly
JP4695447B2 (ja)	2005-06-23	2011-06-08	株式会社日本マイクロニクス	プローブ組立体およびこれを用いた電気的接続装置
US7843202B2 (en) *	2005-12-21	2010-11-30	Formfactor, Inc.	Apparatus for testing devices
TWI317813B (en) *	2007-01-09	2009-12-01	King Yuan Electronics Co Ltd	Probe card assembly with zif connectors, method of assembling, wafer testing system and wafer testing method introduced by the same
KR100897982B1 (ko)	2007-09-27	2009-05-18	주식회사 동부하이텍	프로브카드 니들과 패드간의 미스 얼라인 방지 패턴 및 그방법
TW200938848A (en) *	2008-03-03	2009-09-16	Mjc Probe Inc	Probe card
WO2009131100A1 (ja) *	2008-04-21	2009-10-29	日本発條株式会社	プローブカード
JP2010175507A (ja) *	2009-02-02	2010-08-12	Micronics Japan Co Ltd	電気的接続装置

2012
- 2012-12-17 JP JP2012274412A patent/JP6195709B2/ja active Active
2013
- 2013-12-11 KR KR1020130153967A patent/KR101559984B1/ko active IP Right Grant
- 2013-12-13 TW TW102146186A patent/TWI484192B/zh active

Also Published As

Publication number	Publication date
TWI484192B (zh)	2015-05-11
KR101559984B1 (ko)	2015-10-13
KR20140078549A (ko)	2014-06-25
TW201432269A (zh)	2014-08-16
JP2014119340A (ja)	2014-06-30

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