AU2003284411A1 - Electric probe system - Google Patents

Electric probe system

Info

Publication number
AU2003284411A1
AU2003284411A1 AU2003284411A AU2003284411A AU2003284411A1 AU 2003284411 A1 AU2003284411 A1 AU 2003284411A1 AU 2003284411 A AU2003284411 A AU 2003284411A AU 2003284411 A AU2003284411 A AU 2003284411A AU 2003284411 A1 AU2003284411 A1 AU 2003284411A1
Authority
AU
Australia
Prior art keywords
probe system
electric probe
electric
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003284411A
Inventor
Shigeki Ishikawa
Makoto Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NHK Spring Co Ltd
Original Assignee
NHK Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NHK Spring Co Ltd filed Critical NHK Spring Co Ltd
Publication of AU2003284411A1 publication Critical patent/AU2003284411A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AU2003284411A 2002-11-19 2003-11-19 Electric probe system Abandoned AU2003284411A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-335656 2002-11-19
JP2002335656 2002-11-19
PCT/JP2003/014717 WO2004046739A1 (en) 2002-11-19 2003-11-19 Electric probe system

Publications (1)

Publication Number Publication Date
AU2003284411A1 true AU2003284411A1 (en) 2004-06-15

Family

ID=32321772

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003284411A Abandoned AU2003284411A1 (en) 2002-11-19 2003-11-19 Electric probe system

Country Status (6)

Country Link
JP (1) JP4486890B2 (en)
KR (1) KR101067010B1 (en)
CN (1) CN1714297B (en)
AU (1) AU2003284411A1 (en)
TW (1) TWI230796B (en)
WO (1) WO2004046739A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6058325B2 (en) * 2012-09-12 2017-01-11 日置電機株式会社 Substrate inspection apparatus and substrate inspection method
JP6195709B2 (en) * 2012-12-17 2017-09-13 株式会社日本マイクロニクス Probe card, inspection apparatus, and inspection method
JP6035168B2 (en) * 2013-02-28 2016-11-30 日置電機株式会社 Board inspection equipment
JP5898243B2 (en) * 2014-01-09 2016-04-06 本田技研工業株式会社 Current application apparatus and semiconductor element manufacturing method
KR101845652B1 (en) * 2017-01-17 2018-04-04 주식회사 텝스 Hybrid probe card for component mounted wafer test

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58119766U (en) * 1982-02-08 1983-08-15 三洋電機株式会社 Printed circuit board inspection equipment
JPS63293944A (en) * 1987-05-27 1988-11-30 Nec Corp Logic circuit alternating system
JPS63293934A (en) 1987-05-27 1988-11-30 Hitachi Ltd Inspection equipment for semiconductor element
JP2844803B2 (en) * 1990-02-23 1999-01-13 日本電気株式会社 Inspection method and inspection device for printed circuit board
JPH0943276A (en) * 1995-05-23 1997-02-14 Tokyo Electron Ltd Probe card device used for probe unit
JPH0915289A (en) * 1995-06-26 1997-01-17 Ibiden Co Ltd Inspection device for multilayer printed circuit board
JP3519923B2 (en) 1997-11-19 2004-04-19 日本発条株式会社 Package board inspection equipment
JP2000340924A (en) * 1999-05-27 2000-12-08 Nhk Spring Co Ltd Inspection probe unit for substrate mounting semiconductor chip

Also Published As

Publication number Publication date
KR20050063811A (en) 2005-06-28
CN1714297A (en) 2005-12-28
WO2004046739A1 (en) 2004-06-03
JP4486890B2 (en) 2010-06-23
KR101067010B1 (en) 2011-09-22
JPWO2004046739A1 (en) 2006-03-16
CN1714297B (en) 2011-01-19
TWI230796B (en) 2005-04-11
TW200415364A (en) 2004-08-16

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase