JP6100482B2 - 磁気トンネリング接合装置、メモリ、メモリシステム及び電子装置 - Google Patents
磁気トンネリング接合装置、メモリ、メモリシステム及び電子装置 Download PDFInfo
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- 230000005291 magnetic effect Effects 0.000 title claims description 243
- 230000005641 tunneling Effects 0.000 title claims description 37
- 230000005415 magnetization Effects 0.000 claims description 230
- 230000001939 inductive effect Effects 0.000 claims description 60
- 230000006698 induction Effects 0.000 claims description 34
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 29
- 229910052760 oxygen Inorganic materials 0.000 claims description 29
- 239000001301 oxygen Substances 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 26
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 24
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 239000010931 gold Substances 0.000 claims description 12
- 229910000510 noble metal Inorganic materials 0.000 claims description 10
- 239000010948 rhodium Substances 0.000 claims description 10
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 9
- 230000004888 barrier function Effects 0.000 claims description 9
- 229910052763 palladium Inorganic materials 0.000 claims description 9
- 229910052707 ruthenium Inorganic materials 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 229910044991 metal oxide Inorganic materials 0.000 claims description 8
- 150000004706 metal oxides Chemical class 0.000 claims description 8
- 229910052697 platinum Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 7
- 229910052703 rhodium Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 229910052715 tantalum Inorganic materials 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000003302 ferromagnetic material Substances 0.000 claims description 6
- 229910052741 iridium Inorganic materials 0.000 claims description 6
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 6
- 239000000395 magnesium oxide Substances 0.000 claims description 6
- 229910052762 osmium Inorganic materials 0.000 claims description 6
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims description 6
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 6
- 229910003321 CoFe Inorganic materials 0.000 claims description 5
- 229910019236 CoFeB Inorganic materials 0.000 claims description 5
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 5
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 5
- 229910001936 tantalum oxide Inorganic materials 0.000 claims description 5
- 229910052684 Cerium Inorganic materials 0.000 claims description 4
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052770 Uranium Inorganic materials 0.000 claims description 4
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- 229910000449 hafnium oxide Inorganic materials 0.000 claims description 4
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 4
- 229910052746 lanthanum Inorganic materials 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 239000011777 magnesium Substances 0.000 claims description 4
- VJQGOPNDIAJXEO-UHFFFAOYSA-N magnesium;oxoboron Chemical compound [Mg].O=[B] VJQGOPNDIAJXEO-UHFFFAOYSA-N 0.000 claims description 4
- PNHVEGMHOXTHMW-UHFFFAOYSA-N magnesium;zinc;oxygen(2-) Chemical compound [O-2].[O-2].[Mg+2].[Zn+2] PNHVEGMHOXTHMW-UHFFFAOYSA-N 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052706 scandium Inorganic materials 0.000 claims description 4
- 229910052712 strontium Inorganic materials 0.000 claims description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 229910019233 CoFeNi Inorganic materials 0.000 claims description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
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- 229910000684 Cobalt-chrome Inorganic materials 0.000 description 2
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- BMPDGKPFUQVSBL-UHFFFAOYSA-N [Fe].[Co].[Gd] Chemical compound [Fe].[Co].[Gd] BMPDGKPFUQVSBL-UHFFFAOYSA-N 0.000 description 2
- FOPBMNGISYSNED-UHFFFAOYSA-N [Fe].[Co].[Tb] Chemical compound [Fe].[Co].[Tb] FOPBMNGISYSNED-UHFFFAOYSA-N 0.000 description 2
- 230000005303 antiferromagnetism Effects 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- FQMNUIZEFUVPNU-UHFFFAOYSA-N cobalt iron Chemical compound [Fe].[Co].[Co] FQMNUIZEFUVPNU-UHFFFAOYSA-N 0.000 description 2
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- 229910002441 CoNi Inorganic materials 0.000 description 1
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- 229910015187 FePd Inorganic materials 0.000 description 1
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- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
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- SKKMWRVAJNPLFY-UHFFFAOYSA-N azanylidynevanadium Chemical compound [V]#N SKKMWRVAJNPLFY-UHFFFAOYSA-N 0.000 description 1
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- VABUPYFNWNQKEQ-UHFFFAOYSA-N cobalt dysprosium iron Chemical compound [Fe][Co][Dy] VABUPYFNWNQKEQ-UHFFFAOYSA-N 0.000 description 1
- XBCSKPOWJATIFC-UHFFFAOYSA-N cobalt iron nickel Chemical compound [Fe][Ni][Fe][Co] XBCSKPOWJATIFC-UHFFFAOYSA-N 0.000 description 1
- QNWDQRWHBHBLSM-UHFFFAOYSA-N cobalt iron platinum Chemical compound [Fe].[Co].[Pt] QNWDQRWHBHBLSM-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
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- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
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- 229910052702 rhenium Inorganic materials 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/14—Handling requests for interconnection or transfer
- G06F13/16—Handling requests for interconnection or transfer for access to memory bus
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1659—Cell access
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
- H10N50/85—Magnetic active materials
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- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
Description
20 第2配線
30 選択素子
41 下部構造体
42 上部構造体
50 トンネルバリア
100 単位セル
MTJ 磁気トンネル接合
EPMS 外因性垂直磁化構造
IPMS 内在的垂直磁化構造
MGL 磁性膜
PMI 垂直磁化誘導膜
PMP 垂直磁化保存膜
ECL 交換結合層
Claims (25)
- 磁性膜を含む第1構造体と、
少なくとも2つの外因性垂直磁化構造体を含み、前記外因性垂直磁化構造体の各々が磁性膜及び前記磁性膜上の垂直磁化誘導膜を含む第2構造体と、
前記第1及び第2構造体間のトンネルバリアと、を含むとともに、
2つの前記磁性膜の間には金属膜が介在され、
前記金属膜は、ルテニウムRu、ロジウムRh、パラジウムPd、銀Ag、オスミウムOs、イリジウムIr、白金Pt、又は金Au等の貴金属の1つで形成される磁気トンネリング接合装置。 - 前記第2構造体が追加的な外因性垂直磁化構造体をさらに含み、その各々が磁性膜及び前記磁性膜上の垂直磁化誘導膜を含む、請求項1に記載の磁気トンネリング接合装置。
- 前記垂直磁化誘導膜の中の1つの上に配置される垂直磁化保存膜をさらに含む、請求項1に記載の磁気トンネリング接合装置。
- 前記磁性膜の各々が前記垂直磁化誘導膜の各々より小さい酸素親和度を有する、請求項3に記載の磁気トンネリング接合装置。
- 前記垂直磁化保存膜の各々が前記垂直磁化誘導膜の各々より小さい酸素親和度を有する、請求項3に記載の磁気トンネリング接合装置。
- 前記磁性膜が強磁性物質から成る、請求項3に記載の磁気トンネリング接合装置。
- 前記強磁性物質が、CoFeB、CoFe、NiFe、CoFePt、CoFePd、CoFeCr、CoFeTb、CoFeGd又はCoFeNiの中の少なくとも1つである、請求項6に記載の磁気トンネリング接合装置。
- 前記磁性膜が約1乃至約30Åの厚さを有する、請求項3に記載の磁気トンネリング接合装置。
- 前記磁性膜が約3乃至約17Åの厚さを有する、請求項8に記載の磁気トンネリング接合装置。
- 前記垂直磁化誘導膜が前記磁性膜に直接接触する、請求項3に記載の磁気トンネリング接合装置。
- 前記垂直磁化誘導膜が酸素含有物質である、請求項3に記載の磁気トンネリング接合装置。
- 前記垂直磁化誘導膜が金属酸化物である、請求項11に記載の磁気トンネリング接合装置。
- 前記金属酸化物が、マグネシウム酸化物、タンタル酸化物、チタン酸化物、アルミニウム酸化物、マグネシウム亜鉛酸化物、ハフニウム酸化物、又はマグネシウムホウ素酸化物の中の少なくとも1つである、請求項12に記載の磁気トンネリング接合装置。
- 前記垂直磁化誘導膜が、Ta、Ti、U、Ba、Zr、Al、Sr、Hf、La、Ce、Sm、Mg、Th、Ca、Sc、又はYの中の少なくとも1つを含む、請求項3に記載の磁気トンネリング接合装置。
- 前記垂直磁化誘導膜が、前記磁性膜又は前記垂直磁化保存膜より大きい電気抵抗を有する、請求項3に記載の磁気トンネリング接合装置。
- 前記垂直磁化誘導膜が、前記磁性膜又は前記垂直磁化保存膜より薄い厚さを有する、請求項3に記載の磁気トンネリング接合装置。
- 前記垂直磁化保存膜が前記垂直磁化誘導膜より小さい電気抵抗を有する、請求項3に記載の磁気トンネリング接合装置。
- 前記垂直磁化保存膜が少なくとも1つの貴金属又は銅で形成される請求項3に記載の磁気トンネリング接合装置。
- 少なくとも1つの前記貴金属が、ルテニウムRu、ロジウムRh、パラジウムPd、銀Ag、オスミウムOs、イリジウムIr、白金Pt、又は金Auを含む、請求項18に記載の磁気トンネリング接合装置。
- 前記垂直磁化保存膜が、タンタル又はチタンより小さい電気抵抗を有する物質の中の少なくとも1つで形成される、請求項3に記載の磁気トンネリング接合装置。
- 基板をさらに含み、
前記第1構造体が前記基板に隣接する下部構造体であり、前記第2構造体が前記基板から離隔された上部構造体である、請求項3に記載の磁気トンネリング接合装置。 - 前記第2構造体の前記磁性膜が自由磁性膜である、請求項21に記載の磁気トンネリング接合装置。
- 前記第1構造体が固定磁性膜を含む、請求項21に記載の磁気トンネリング接合装置。
- 前記垂直磁化保存膜上の上部電極をさらに含む、請求項21に記載の磁気トンネリング接合装置。
- 基板をさらに含み、
前記第1構造体が前記基板から離隔された上部構造体であり、前記第2構造体が前記基板に隣接する下部構造体である、請求項3に記載の磁気トンネリング接合装置。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2011-0079627 | 2011-08-10 | ||
KR1020110079627A KR101831931B1 (ko) | 2011-08-10 | 2011-08-10 | 외인성 수직 자화 구조를 구비하는 자기 메모리 장치 |
US13/398,640 | 2012-02-16 | ||
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KR20130017283A (ko) | 2013-02-20 |
KR101831931B1 (ko) | 2018-02-26 |
DE102012105595A1 (de) | 2013-02-14 |
US8772846B2 (en) | 2014-07-08 |
US8987798B2 (en) | 2015-03-24 |
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