JP5946401B2 - 保護膜の被覆方法 - Google Patents
保護膜の被覆方法 Download PDFInfo
- Publication number
- JP5946401B2 JP5946401B2 JP2012268403A JP2012268403A JP5946401B2 JP 5946401 B2 JP5946401 B2 JP 5946401B2 JP 2012268403 A JP2012268403 A JP 2012268403A JP 2012268403 A JP2012268403 A JP 2012268403A JP 5946401 B2 JP5946401 B2 JP 5946401B2
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- wafer
- film liquid
- spinner table
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000001681 protective effect Effects 0.000 title claims description 137
- 239000007888 film coating Substances 0.000 title claims description 24
- 238000009501 film coating Methods 0.000 title claims description 24
- 238000000034 method Methods 0.000 title claims description 22
- 239000007788 liquid Substances 0.000 claims description 86
- 238000000576 coating method Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 87
- 238000004140 cleaning Methods 0.000 description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 14
- 230000007246 mechanism Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- 239000004372 Polyvinyl alcohol Substances 0.000 description 5
- 230000005291 magnetic effect Effects 0.000 description 5
- 229920002451 polyvinyl alcohol Polymers 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 4
- 239000003302 ferromagnetic material Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Landscapes
- Dicing (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
18 チャックテーブル
24 レーザービーム照射ユニット
30 保護膜被覆装置
48 スピンナテーブル
66 保護膜液供給手段
68 吐出ノズル
100 加熱手段
102 電磁切替弁
104 保護膜液供給源
105 保護膜液
106 保護膜液層
106a 保護膜
Claims (2)
- 板状物に保護膜を被覆する保護膜の被覆方法であって、
板状物を回転可能なスピンナテーブルで保持する保持ステップと、
該スピンナテーブルに保持された板状物上に液状樹脂からなる保護膜液を供給する保護膜液供給ステップと、
該保護膜液供給ステップを実施した後、該スピンナテーブルを回転させて板状物上の保護膜液を所定厚みに均一に形成するとともに乾燥させて所定厚みの保護膜を形成する保護膜形成ステップと、を備え、
該保護膜液供給ステップでは、該保護膜液は所定温度に加熱されて粘度が常温時よりも低下した状態で供給されることを特徴とする保護膜の被覆方法。 - 前記保護膜液供給ステップを実施した後、前記保護膜形成ステップを実施する前に、板状物上に供給された前記保護膜液を冷却して常温時の粘度に戻す冷却ステップを更に備えた請求項1記載の保護膜の被覆方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012268403A JP5946401B2 (ja) | 2012-12-07 | 2012-12-07 | 保護膜の被覆方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012268403A JP5946401B2 (ja) | 2012-12-07 | 2012-12-07 | 保護膜の被覆方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014113527A JP2014113527A (ja) | 2014-06-26 |
JP5946401B2 true JP5946401B2 (ja) | 2016-07-06 |
Family
ID=51170122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012268403A Active JP5946401B2 (ja) | 2012-12-07 | 2012-12-07 | 保護膜の被覆方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5946401B2 (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0555131A (ja) * | 1991-08-26 | 1993-03-05 | Sumitomo Electric Ind Ltd | レジストの塗布方法および塗布装置 |
JPH0677211A (ja) * | 1992-05-28 | 1994-03-18 | Nec Corp | スピンオングラス塗布方法及びその装置 |
AU2003281895A1 (en) * | 2002-12-05 | 2004-06-23 | Unaxis Balzers Ag | Method and apparatus for control of layer thicknesses |
WO2009145526A2 (en) * | 2008-05-29 | 2009-12-03 | Dongwoo Fine-Chem. Co., Ltd. | Protective film composition for wafer dicing |
JP5715859B2 (ja) * | 2011-03-18 | 2015-05-13 | 株式会社ディスコ | 保護膜被覆方法及び保護膜被覆装置 |
-
2012
- 2012-12-07 JP JP2012268403A patent/JP5946401B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2014113527A (ja) | 2014-06-26 |
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