JP5814487B1 - 保護膜形成用フィルム - Google Patents

保護膜形成用フィルム Download PDF

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Publication number
JP5814487B1
JP5814487B1 JP2015504090A JP2015504090A JP5814487B1 JP 5814487 B1 JP5814487 B1 JP 5814487B1 JP 2015504090 A JP2015504090 A JP 2015504090A JP 2015504090 A JP2015504090 A JP 2015504090A JP 5814487 B1 JP5814487 B1 JP 5814487B1
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JP
Japan
Prior art keywords
protective film
film
forming
sheet
epoxy
Prior art date
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Active
Application number
JP2015504090A
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English (en)
Japanese (ja)
Other versions
JPWO2016002079A1 (ja
Inventor
洋一 稲男
洋一 稲男
尚哉 佐伯
尚哉 佐伯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Application granted granted Critical
Publication of JP5814487B1 publication Critical patent/JP5814487B1/ja
Publication of JPWO2016002079A1 publication Critical patent/JPWO2016002079A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/04—Compounds containing oxirane rings containing only hydrogen and carbon atoms in addition to the ring oxygen atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Laminated Bodies (AREA)
JP2015504090A 2014-07-04 2014-07-04 保護膜形成用フィルム Active JP5814487B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2014/067959 WO2016002079A1 (ja) 2014-07-04 2014-07-04 保護膜形成用フィルム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015183819A Division JP6216354B2 (ja) 2015-09-17 2015-09-17 保護膜形成用フィルム

Publications (2)

Publication Number Publication Date
JP5814487B1 true JP5814487B1 (ja) 2015-11-17
JPWO2016002079A1 JPWO2016002079A1 (ja) 2017-04-27

Family

ID=54595906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015504090A Active JP5814487B1 (ja) 2014-07-04 2014-07-04 保護膜形成用フィルム

Country Status (4)

Country Link
JP (1) JP5814487B1 (ko)
KR (1) KR102224972B1 (ko)
CN (1) CN106463370B (ko)
WO (1) WO2016002079A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109789666B (zh) * 2017-03-30 2024-06-04 琳得科株式会社 保护膜形成用复合片
CN111417513B (zh) * 2018-03-09 2022-06-03 琳得科株式会社 保护膜形成用复合片及带保护膜的半导体芯片的制造方法
JP7290989B2 (ja) * 2019-04-26 2023-06-14 リンテック株式会社 保護膜形成用複合シート

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009147277A (ja) * 2007-12-18 2009-07-02 Furukawa Electric Co Ltd:The チップ保護用フィルム
JP2013108027A (ja) * 2011-11-24 2013-06-06 Sekisui Chem Co Ltd 絶縁材料
JP2014123743A (ja) * 2013-12-27 2014-07-03 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5180507B2 (ja) * 2007-03-30 2013-04-10 リンテック株式会社 チップ用保護膜形成用シートおよび保護膜付半導体チップ
JP5276003B2 (ja) * 2007-09-28 2013-08-28 東京応化工業株式会社 共重合体、樹脂組成物、表示パネル用スペーサー、平坦化膜、熱硬化性保護膜、マイクロレンズ、および共重合体の製造方法
JP5456440B2 (ja) 2009-01-30 2014-03-26 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
CN102318059A (zh) * 2009-02-12 2012-01-11 住友电木株式会社 带切割片的半导体保护膜形成用膜、使用该膜的半导体装置的制造方法及半导体装置
JP5681374B2 (ja) * 2010-04-19 2015-03-04 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
JP5666335B2 (ja) * 2011-02-15 2015-02-12 日東電工株式会社 保護層形成用フィルム
JP5792592B2 (ja) * 2011-11-02 2015-10-14 積水化学工業株式会社 半導体装置の製造方法、半導体装置、接着フィルム、及び、接着フィルムの貼り合わせ方法
JP6117547B2 (ja) * 2012-12-21 2017-04-19 新日鉄住金化学株式会社 熱硬化性組成物、硬化膜及びカラーフィルター

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009147277A (ja) * 2007-12-18 2009-07-02 Furukawa Electric Co Ltd:The チップ保護用フィルム
JP2013108027A (ja) * 2011-11-24 2013-06-06 Sekisui Chem Co Ltd 絶縁材料
JP2014123743A (ja) * 2013-12-27 2014-07-03 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム

Also Published As

Publication number Publication date
CN106463370B (zh) 2019-06-21
CN106463370A (zh) 2017-02-22
WO2016002079A1 (ja) 2016-01-07
JPWO2016002079A1 (ja) 2017-04-27
KR20170029417A (ko) 2017-03-15
KR102224972B1 (ko) 2021-03-08

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