JP5803963B2 - 冷却器 - Google Patents
冷却器 Download PDFInfo
- Publication number
- JP5803963B2 JP5803963B2 JP2013060727A JP2013060727A JP5803963B2 JP 5803963 B2 JP5803963 B2 JP 5803963B2 JP 2013060727 A JP2013060727 A JP 2013060727A JP 2013060727 A JP2013060727 A JP 2013060727A JP 5803963 B2 JP5803963 B2 JP 5803963B2
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- base plate
- supply path
- path
- cooler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Geometry (AREA)
Description
3:ベースプレート
3a:おもて面
3b:裏面
4:フィン
5:仕切板
6:冷媒ノズル
7:筐体
7a:天板
9:冷媒排出口
12:冷媒供給路
14:冷媒排出路
21:供給路仕切り部材
31:案内部
32:湾曲面
33:先端部
81:第1の冷媒供給口
82:第2の冷媒供給口
91:絶縁板
92a、92b、92c:半導体チップ(冷却対象)
121:第1の分割供給路
122:第2の分割供給路
Claims (2)
- おもて面に冷却対象が取り付けられるベースプレートを備えている筐体と、
前記ベースプレートの裏面に取り付けられており、平面同士を対向させて平行に配列されている複数のフィンと、
前記ベースプレートと平行に配置されている仕切板と、
前記ベースプレートの裏面側で複数の前記フィンの先端から離間して設けられており、前記ベースプレートに沿って伸びている冷媒供給路と、
複数の前記フィンの間の空間と通じており、前記冷媒供給路とベースプレートとの間に設けられている冷媒排出路と、
前記仕切板に設けられており、前記冷媒供給路から供給される冷媒を前記ベースプレートの裏面に向かって冷媒を噴出させる冷媒ノズルと、
前記冷媒供給路内において冷媒流れ方向に沿って伸びており、当該冷媒供給路を複数の分割供給路に仕切る供給路仕切り部材と、を備えており、
前記仕切板は、前記筐体の内部空間を前記ベースプレートの裏面に面する空間と、前記ベースプレートから離間する空間に分けており、
前記冷媒排出路は、前記ベースプレートと前記仕切板の間に形成されており、
前記冷媒供給路は、前記ベースプレートとは反対側における筐体の側壁と前記仕切板の間に形成されており、
前記供給路仕切り部材は、前記仕切板の裏面に密着すると共に、前記仕切板に対向する前記筐体の側壁内面に密着しており、
前記複数の分割供給路の少なくとも一つに前記冷媒供給路の一方側から冷媒を供給する第1の冷媒供給口が設けられているとともに、他の少なくとも一つに前記冷媒供給路の他方側から冷媒を供給する第2の冷媒供給口が設けられている衝突噴流型の冷却器。 - 前記ベースプレートの裏面には、前記冷媒排出路に向かって湾曲する湾曲面を有しており、当該湾曲面により前記冷媒排出路へ冷媒を案内する案内部が設けられている請求項1に記載の冷却器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013060727A JP5803963B2 (ja) | 2013-03-22 | 2013-03-22 | 冷却器 |
US14/222,154 US20140284029A1 (en) | 2013-03-22 | 2014-03-21 | Cooler |
CN201410109181.1A CN104064536A (zh) | 2013-03-22 | 2014-03-21 | 冷却器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013060727A JP5803963B2 (ja) | 2013-03-22 | 2013-03-22 | 冷却器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014187170A JP2014187170A (ja) | 2014-10-02 |
JP5803963B2 true JP5803963B2 (ja) | 2015-11-04 |
Family
ID=51552183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013060727A Expired - Fee Related JP5803963B2 (ja) | 2013-03-22 | 2013-03-22 | 冷却器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20140284029A1 (ja) |
JP (1) | JP5803963B2 (ja) |
CN (1) | CN104064536A (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10462939B2 (en) * | 2015-01-22 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
JP2016189414A (ja) * | 2015-03-30 | 2016-11-04 | 株式会社フジクラ | インピンジメント式冷却装置 |
US10634397B2 (en) * | 2015-09-17 | 2020-04-28 | Purdue Research Foundation | Devices, systems, and methods for the rapid transient cooling of pulsed heat sources |
JP6724613B2 (ja) * | 2016-07-08 | 2020-07-15 | トヨタ自動車株式会社 | 半導体装置 |
JP6540665B2 (ja) * | 2016-11-21 | 2019-07-10 | トヨタ自動車株式会社 | 両面冷却器 |
US11101194B2 (en) * | 2016-12-19 | 2021-08-24 | Agency For Science, Technology And Research | Heat sinks and methods for fabricating a heat sink |
JP6922612B2 (ja) * | 2017-09-27 | 2021-08-18 | 富士通株式会社 | クーリングプレート、及び情報処理装置 |
JP6860461B2 (ja) * | 2017-10-03 | 2021-04-14 | 浜松ホトニクス株式会社 | ヒートシンク |
TWI673842B (zh) * | 2018-10-24 | 2019-10-01 | 技嘉科技股份有限公司 | 散熱組件及主機板模組 |
US20210366806A1 (en) * | 2020-05-20 | 2021-11-25 | Google Llc | Spring Loaded Compliant Coolant Distribution Manifold for Direct Liquid Cooled Modules |
CN112462903B (zh) * | 2020-11-24 | 2023-06-27 | 苏州浪潮智能科技有限公司 | 散热装置及具有所述散热装置的服务器 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2536063B2 (ja) * | 1988-05-25 | 1996-09-18 | 株式会社日立製作所 | コ―ルドプレ―トの冷却構造 |
US7100381B2 (en) * | 2003-10-02 | 2006-09-05 | Raytheon Company | Slot jet cooler and method of cooling |
JP4832882B2 (ja) * | 2005-12-14 | 2011-12-07 | 株式会社ティラド | ヒートシンク |
JP2010171279A (ja) * | 2009-01-23 | 2010-08-05 | Toyota Motor Corp | 放熱装置 |
JP5476585B2 (ja) * | 2010-01-15 | 2014-04-23 | 株式会社豊田中央研究所 | 冷却器 |
JP2012109495A (ja) * | 2010-11-19 | 2012-06-07 | Toshiba Teli Corp | 水冷式冷却器 |
-
2013
- 2013-03-22 JP JP2013060727A patent/JP5803963B2/ja not_active Expired - Fee Related
-
2014
- 2014-03-21 US US14/222,154 patent/US20140284029A1/en not_active Abandoned
- 2014-03-21 CN CN201410109181.1A patent/CN104064536A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN104064536A (zh) | 2014-09-24 |
US20140284029A1 (en) | 2014-09-25 |
JP2014187170A (ja) | 2014-10-02 |
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