JP6922612B2 - クーリングプレート、及び情報処理装置 - Google Patents
クーリングプレート、及び情報処理装置 Download PDFInfo
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- JP6922612B2 JP6922612B2 JP2017186497A JP2017186497A JP6922612B2 JP 6922612 B2 JP6922612 B2 JP 6922612B2 JP 2017186497 A JP2017186497 A JP 2017186497A JP 2017186497 A JP2017186497 A JP 2017186497A JP 6922612 B2 JP6922612 B2 JP 6922612B2
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- flow path
- refrigerant flow
- refrigerant
- plate
- heating element
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/0202—Header boxes having their inner space divided by partitions
- F28F9/0204—Header boxes having their inner space divided by partitions for elongated header box, e.g. with transversal and longitudinal partitions
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/0219—Arrangements for sealing end plates into casing or header box; Header box sub-elements
- F28F9/0221—Header boxes or end plates formed by stacked elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
- F28F9/0278—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits in the form of stacked distribution plates or perforated plates arranged over end plates
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D2001/0253—Particular components
- F28D2001/026—Cores
- F28D2001/0266—Particular core assemblies, e.g. having different orientations or having different geometric features
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F2009/0285—Other particular headers or end plates
- F28F2009/0297—Side headers, e.g. for radiators having conduits laterally connected to common header
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2210/00—Heat exchange conduits
- F28F2210/08—Assemblies of conduits having different features
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
止するため、発熱体が用いられている電子機器には、各種の冷却機構が用いられる。冷却機構としては、例えば、空冷方式や水冷方式が挙げられる(例えば、特許文献1−3を参照)。
路を形成する。よって、複数の第2ヘッダ13に連通する第1ヘッダ10は、各第2ヘッダ13を流れる冷媒が分岐または合流するヘッダとして機能する。
」、「15e」を付している。図6に示す第1変形例では、冷媒流路15の高さが各段で相違している。そして、各冷媒流路15の高さは、冷媒流路15e側から冷媒流路15a側へ向かうにつれて漸次高くなっている。各冷媒流路15の高さが、冷媒流路15e側から冷媒流路15a側へ向かうにつれて漸次高くなることにより、CPU7に近い段ほど有効断面積の大きい冷媒流路が形成される。
さが冷媒流路15aから冷媒流路15eまで何れも同じである代わりに、CPU7に近い段ほど有効断面積が大きくなるようにオリフィスその他の流量調整手段が各段に設けられていてもよい。
<付記1>
発熱体に取り付けられるプレートと、
前記プレートの板面に沿って交互に配列される冷媒の送り流路および戻り流路と、
前記プレートの内部において前記送り流路および戻り流路よりも前記発熱体側に複数段で形成されており、隣り合う前記送り流路と前記戻り流路とを各段で並列に連通する複数の冷媒流路と、を備える、
クーリングプレート。
<付記2>
前記複数の冷媒流路は、前記発熱体に近い段ほど断面積が大きい、
付記1に記載のクーリングプレート。
<付記3>
前記冷媒流路は、前記発熱体に近い段ほど高さが高い、
付記1または2に記載のクーリングプレート。
<付記4>
前記冷媒流路は、前記発熱体に近い段ほど出入口の大きさが大きい、
付記1から3の何れか一項に記載のクーリングプレート。
<付記5>
前記冷媒流路は、前記発熱体の部位によって段数が異なる、
付記1から4の何れか一項に記載のクーリングプレート。
<付記6>
発熱体と、
前記発熱体に取り付けられるプレート、前記プレートの板面に沿って交互に配列される冷媒の送り流路および戻り流路、及び、前記プレートの内部において前記送り流路および戻り流路よりも前記発熱体側に複数段で形成されており、隣り合う前記送り流路と前記戻り流路とを各段で並列に連通する複数の冷媒流路を有するクーリングプレートと、を備える、
情報処理装置。
<付記7>
前記複数の冷媒流路は、前記発熱体に近い段ほど断面積が大きい、
付記6に記載の情報処理装置。
<付記8>
前記冷媒流路は、前記発熱体に近い段ほど高さが高い、
付記6または7に記載の情報処理装置。
<付記9>
前記冷媒流路は、前記発熱体に近い段ほど出入口の大きさが大きい、
付記6から8の何れか一項に記載の情報処理装置。
<付記10>
前記冷媒流路は、前記発熱体の部位によって段数が異なる、
付記6から9の何れか一項に記載の情報処理装置。
Claims (5)
- 発熱体に取り付けられるプレートと、
前記プレートの板面に沿って交互に配列される冷媒の送り流路および戻り流路と、
前記プレートの内部において前記送り流路および戻り流路よりも前記発熱体側に複数段で形成されており、隣り合う前記送り流路と前記戻り流路とを各段で並列に連通する複数の冷媒流路と、を備え、
前記冷媒流路は、前記発熱体の部位によって段数が異なる、
クーリングプレート。 - 前記複数の冷媒流路は、前記発熱体に近い段ほど断面積が大きい、
請求項1に記載のクーリングプレート。 - 前記冷媒流路は、前記発熱体に近い段ほど高さが高い、
請求項1または2に記載のクーリングプレート。 - 前記冷媒流路は、前記発熱体に近い段ほど出入口の大きさが大きい、
請求項1から3の何れか一項に記載のクーリングプレート。 - 発熱体と、
前記発熱体に取り付けられるプレート、前記プレートの板面に沿って交互に配列される冷媒の送り流路および戻り流路、及び、前記プレートの内部において前記送り流路および戻り流路よりも前記発熱体側に複数段で形成されており、隣り合う前記送り流路と前記戻り流路とを各段で並列に連通する複数の冷媒流路を有するクーリングプレートと、を備え、
前記冷媒流路は、前記発熱体の部位によって段数が異なる、
情報処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017186497A JP6922612B2 (ja) | 2017-09-27 | 2017-09-27 | クーリングプレート、及び情報処理装置 |
US16/110,159 US10443957B2 (en) | 2017-09-27 | 2018-08-23 | Cooling plate and information processing device |
Applications Claiming Priority (1)
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JP2017186497A JP6922612B2 (ja) | 2017-09-27 | 2017-09-27 | クーリングプレート、及び情報処理装置 |
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JP2019062110A JP2019062110A (ja) | 2019-04-18 |
JP6922612B2 true JP6922612B2 (ja) | 2021-08-18 |
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JP (1) | JP6922612B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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EP3678174B1 (en) * | 2017-08-29 | 2022-11-16 | Welcon Inc. | Heat sink |
TWI673842B (zh) * | 2018-10-24 | 2019-10-01 | 技嘉科技股份有限公司 | 散熱組件及主機板模組 |
JP2020150170A (ja) * | 2019-03-14 | 2020-09-17 | 富士通株式会社 | 冷却プレート、冷却装置及び電子機器 |
CN112577334A (zh) * | 2019-09-27 | 2021-03-30 | 浙江盾安热工科技有限公司 | 换热器 |
CN110645815A (zh) * | 2019-09-29 | 2020-01-03 | 联想(北京)有限公司 | 一种均热板及其制备方法 |
CN114340297A (zh) * | 2020-09-29 | 2022-04-12 | 台达电子工业股份有限公司 | 水冷装置及其集流器 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5170319A (en) * | 1990-06-04 | 1992-12-08 | International Business Machines Corporation | Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels |
JP2000260916A (ja) * | 1999-03-11 | 2000-09-22 | Hitachi Ltd | ヒートシンク |
JP2003060145A (ja) | 2001-08-16 | 2003-02-28 | Nippon Alum Co Ltd | 冷却プレート |
US7156159B2 (en) * | 2003-03-17 | 2007-01-02 | Cooligy, Inc. | Multi-level microchannel heat exchangers |
JP4608641B2 (ja) | 2005-04-27 | 2011-01-12 | 株式会社豊田自動織機 | パワーモジュール用ヒートシンク |
JP2007012955A (ja) * | 2005-07-01 | 2007-01-18 | Matsushita Electric Ind Co Ltd | 受熱器、電子機器および投射型表示装置 |
JP5803963B2 (ja) * | 2013-03-22 | 2015-11-04 | トヨタ自動車株式会社 | 冷却器 |
JP6394267B2 (ja) * | 2014-10-15 | 2018-09-26 | 富士通株式会社 | 冷却装置及び電子機器 |
JP6477276B2 (ja) * | 2015-06-12 | 2019-03-06 | 富士通株式会社 | クーリングプレート及びクーリングプレートを備える情報処理装置 |
US10085362B2 (en) * | 2016-09-30 | 2018-09-25 | International Business Machines Corporation | Cold plate device for a two-phase cooling system |
-
2017
- 2017-09-27 JP JP2017186497A patent/JP6922612B2/ja active Active
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2018
- 2018-08-23 US US16/110,159 patent/US10443957B2/en active Active
Also Published As
Publication number | Publication date |
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US20190093964A1 (en) | 2019-03-28 |
JP2019062110A (ja) | 2019-04-18 |
US10443957B2 (en) | 2019-10-15 |
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