JP6540665B2 - 両面冷却器 - Google Patents
両面冷却器 Download PDFInfo
- Publication number
- JP6540665B2 JP6540665B2 JP2016226256A JP2016226256A JP6540665B2 JP 6540665 B2 JP6540665 B2 JP 6540665B2 JP 2016226256 A JP2016226256 A JP 2016226256A JP 2016226256 A JP2016226256 A JP 2016226256A JP 6540665 B2 JP6540665 B2 JP 6540665B2
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- Prior art keywords
- plate
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- cooling plate
- refrigerant
- cooling
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- 238000001816 cooling Methods 0.000 claims description 220
- 239000003507 refrigerant Substances 0.000 claims description 178
- 238000011144 upstream manufacturing Methods 0.000 claims description 104
- 238000010438 heat treatment Methods 0.000 claims description 25
- 238000004891 communication Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 description 30
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 238000005192 partition Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000002826 coolant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- -1 for example Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
3a−3f:分割流路
10:積層ユニット
31:第1空間
32:第2空間
33:仕切板
34、71、73、134、234:第1中板
35、72、74、135:第2中板
34a、134a、234a:第1上流閉塞板
34b、134b、234b:第1下流閉塞板
35a、135a:第2上流閉塞板
35b、135b:第2下流閉塞部
36、36a、36b、136:第1ノズル
38、38a、38b、138:第2ノズル
37:フィン
41:第1冷却板
42:第2冷却板
43:供給口
44:排出口
50:半導体モジュール
51:樹脂パッケージ
52:放熱板
53a、53b、59a−59d:トランジスタチップ(発熱体)
54:銅ブロック
55:絶縁板
61:冷媒供給管
62:冷媒排出管
63:供給連結管
64:排出連結管
80:連通空間
102a、202a:上流部分
102b、202b:下流部分
Claims (4)
- 対向する第1冷却板と第2冷却板の間を冷媒が流れるとともに夫々の冷却板の外面に発熱体が取り付けられる両面冷却器であり、
前記第1冷却板の法線方向からみたときに前記両面冷却器の一端に前記冷媒の供給口が設けられているとともに他端に前記冷媒の排出口が設けられており、
前記第1冷却板と前記第2冷却板の間の冷媒流路は、前記供給口から前記排出口へ向かう前記冷媒の流れ方向と前記法線方向の両方に直交する流路幅方向で複数の分割流路に分割されており、
少なくとも1つの前記分割流路は、その内部空間を前記第1冷却板側の空間と前記第2冷却板側の空間に区画するとともに前記第1冷却板側の空間から前記第2冷却板へ向けて冷媒を噴出する第1ノズルが設けられている第1中板と、前記第1ノズルの前記供給口側で前記第2冷却板側の空間を塞ぐ第1上流閉塞板と前記第1ノズルの前記排出口側で前記第1冷却板側の空間を塞ぐ第1下流閉塞板と、を備えており、
別の少なくとも1つの前記分割流路は、その内部空間を前記第1冷却板側の空間と前記第2冷却板側の空間に区画するとともに前記第2冷却板側の空間から前記第1冷却板へ向けて冷媒を噴出する第2ノズルが設けられている第2中板と、前記第2ノズルの前記供給口側で前記第1冷却板側の空間を塞ぐ第2上流閉塞板と前記第2ノズルの前記排出口側で前記第2冷却板側の空間を塞ぐ第2下流閉塞板と、を備えており、
前記第1中板と前記第2中板が、前記流路幅方向に並んでいる、両面冷却器。 - 前記冷媒流路が前記流れ方向に沿って上流部分と下流部分に分割されており、
前記少なくとも一つの前記分割流路の前記上流部分に前記第1中板と前記第1上流閉塞板と前記第1下流閉塞板が備えられているとともに、前記下流部分に、その内部空間を前記第1冷却板側の空間と前記第2冷却板側の空間に区画するとともに前記第2冷却板側の空間から前記第1冷却板へ向けて冷媒を噴出する第3ノズルが設けられている第3中板と、前記第3ノズルの前記供給口側で前記第1冷却板側の空間を塞ぐ第3上流閉塞板と、前記第3ノズルの前記排出口側で前記第2冷却板側の空間を塞ぐ第3下流閉塞板と、が備えられており、
前記別の少なくとも一つの前記分割流路の前記上流部分に前記第2中板と前記第2上流閉塞板と前記第2下流閉塞板が備えられているとともに、前記下流部分に、その内部空間を前記第1冷却板側の空間と前記第2冷却板側の空間に区画するとともに前記第1冷却板側の空間から前記第2冷却板へ向けて冷媒を噴出する第4ノズルが設けられている第4中板と、前記第4ノズルの前記供給口側で前記第2冷却板側の空間を塞ぐ第4上流閉塞板と、前記第4ノズルの前記排出口側で前記第1冷却板側の空間を塞ぐ第4下流閉塞板と、が備えられている、請求項1に記載の両面冷却器。 - 前記上流部分と前記下流部分の境界に、前記流路幅方向で隣接する前記分割流路同士を連通する連通空間が設けられている、請求項2に記載の両面冷却器。
- 前記第1中板と前記第2中板が、前記流路幅方向で交互に並んでいる、請求項1から3のいずれか1項に記載の両面冷却器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016226256A JP6540665B2 (ja) | 2016-11-21 | 2016-11-21 | 両面冷却器 |
US15/785,862 US10422592B2 (en) | 2016-11-21 | 2017-10-17 | Double-sided cooler |
CN201711142468.4A CN108091618A (zh) | 2016-11-21 | 2017-11-17 | 双面冷却器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016226256A JP6540665B2 (ja) | 2016-11-21 | 2016-11-21 | 両面冷却器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018085386A JP2018085386A (ja) | 2018-05-31 |
JP6540665B2 true JP6540665B2 (ja) | 2019-07-10 |
Family
ID=62147557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016226256A Expired - Fee Related JP6540665B2 (ja) | 2016-11-21 | 2016-11-21 | 両面冷却器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10422592B2 (ja) |
JP (1) | JP6540665B2 (ja) |
CN (1) | CN108091618A (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11333451B2 (en) * | 2017-06-11 | 2022-05-17 | Zvi Livni | Plate and shell heat exchanging system having a divided manifold tube |
JP7039917B2 (ja) * | 2017-10-06 | 2022-03-23 | 富士電機株式会社 | 冷却器 |
JP6844499B2 (ja) * | 2017-10-24 | 2021-03-17 | 三菱電機株式会社 | 冷却装置及びこれを備えた半導体モジュール |
EP3575919A1 (en) * | 2018-05-29 | 2019-12-04 | Dcx Sp. Z O.O. | Dlc block for use in electronic and electric components |
JP7021013B2 (ja) * | 2018-06-25 | 2022-02-16 | トヨタ自動車株式会社 | 冷却器 |
DE102018211520A1 (de) * | 2018-07-11 | 2020-01-16 | Mahle International Gmbh | Leistungselektronikeinheit |
TWI673842B (zh) * | 2018-10-24 | 2019-10-01 | 技嘉科技股份有限公司 | 散熱組件及主機板模組 |
KR20200134492A (ko) * | 2019-05-22 | 2020-12-02 | 현대자동차주식회사 | 열전모듈이 구비된 열교환기 및 이를 포함하는 배터리 열관리 시스템 |
US11502349B2 (en) | 2020-08-31 | 2022-11-15 | Borgwarner, Inc. | Cooling manifold assembly |
WO2024050175A1 (en) * | 2022-08-29 | 2024-03-07 | Atieva, Inc. | Cooler for power electronics |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06873Y2 (ja) * | 1988-01-22 | 1994-01-05 | 日本電気株式会社 | 冷却装置 |
US5553394A (en) * | 1995-05-11 | 1996-09-10 | Reliance/Comm Tech Corporation | Radial jet reattachment nozzle heat sink module for cooling electronics |
DE102004057526B4 (de) * | 2003-12-03 | 2020-08-20 | Denso Corporation | Stapelkühler |
JP2005332863A (ja) * | 2004-05-18 | 2005-12-02 | Denso Corp | パワースタック |
JP4699253B2 (ja) * | 2006-03-23 | 2011-06-08 | トヨタ自動車株式会社 | 冷却器 |
US7884468B2 (en) * | 2007-07-30 | 2011-02-08 | GM Global Technology Operations LLC | Cooling systems for power semiconductor devices |
WO2011083578A1 (ja) * | 2010-01-08 | 2011-07-14 | トヨタ自動車株式会社 | 半導体モジュール |
JP5062302B2 (ja) * | 2010-06-29 | 2012-10-31 | 株式会社デンソー | 冷却器への電子部品内蔵配線基板の取付構造及びその取付方法 |
CN103222049A (zh) * | 2010-11-24 | 2013-07-24 | 丰田自动车株式会社 | 层叠型冷却器 |
JP5803963B2 (ja) * | 2013-03-22 | 2015-11-04 | トヨタ自動車株式会社 | 冷却器 |
JP6075299B2 (ja) * | 2014-01-14 | 2017-02-08 | トヨタ自動車株式会社 | 冷却器とその製造方法 |
JP2015149361A (ja) * | 2014-02-05 | 2015-08-20 | 株式会社日本自動車部品総合研究所 | 冷却器 |
JP6382784B2 (ja) * | 2015-11-26 | 2018-08-29 | 株式会社Soken | 半導体装置の製造方法 |
-
2016
- 2016-11-21 JP JP2016226256A patent/JP6540665B2/ja not_active Expired - Fee Related
-
2017
- 2017-10-17 US US15/785,862 patent/US10422592B2/en not_active Expired - Fee Related
- 2017-11-17 CN CN201711142468.4A patent/CN108091618A/zh not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
US20180142968A1 (en) | 2018-05-24 |
JP2018085386A (ja) | 2018-05-31 |
US10422592B2 (en) | 2019-09-24 |
CN108091618A (zh) | 2018-05-29 |
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