JP5678043B2 - 金属小型構造体を製造する方法 - Google Patents
金属小型構造体を製造する方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 48
- 229910052751 metal Inorganic materials 0.000 title claims description 45
- 239000002184 metal Substances 0.000 title claims description 45
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 229920005989 resin Polymers 0.000 claims description 74
- 239000011347 resin Substances 0.000 claims description 74
- 239000000758 substrate Substances 0.000 claims description 39
- 238000005323 electroforming Methods 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 11
- 238000003754 machining Methods 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 238000000151 deposition Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000001020 plasma etching Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 3
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- URQUNWYOBNUYJQ-UHFFFAOYSA-N diazonaphthoquinone Chemical compound C1=CC=C2C(=O)C(=[N]=[N])C=CC2=C1 URQUNWYOBNUYJQ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- GEWWCWZGHNIUBW-UHFFFAOYSA-N 1-(4-nitrophenyl)propan-2-one Chemical compound CC(=O)CC1=CC=C([N+]([O-])=O)C=C1 GEWWCWZGHNIUBW-UHFFFAOYSA-N 0.000 description 1
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000001015 X-ray lithography Methods 0.000 description 1
- YTAHJIFKAKIKAV-XNMGPUDCSA-N [(1R)-3-morpholin-4-yl-1-phenylpropyl] N-[(3S)-2-oxo-5-phenyl-1,3-dihydro-1,4-benzodiazepin-3-yl]carbamate Chemical compound O=C1[C@H](N=C(C2=C(N1)C=CC=C2)C1=CC=CC=C1)NC(O[C@H](CCN1CCOCC1)C1=CC=CC=C1)=O YTAHJIFKAKIKAV-XNMGPUDCSA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/003—3D structures, e.g. superposed patterned layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0075—Manufacture of substrate-free structures
- B81C99/0085—Manufacture of substrate-free structures using moulds and master templates, e.g. for hot-embossing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/03—Processes for manufacturing substrate-free structures
- B81C2201/032—LIGA process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Micromachines (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
−後で行う電気めっき工程のために犠牲金属層およびシード層を形成する工程と、
−感光性ポリイミド樹脂層を塗布する工程と、
−望みの小型構造の外形に合ったマスクを通してポリイミド樹脂層にUV照射する工程と、
−ポリイミド層の照射されなかった部分を溶解することで現像し、複数のポリイミドモールドを作製する工程と、
−モールドの開いている部分に、このモールドの高さまでニッケルをガルバニック堆積する工程と、
−作製された金属構造体を基板から分離する工程と、
−ポリイミドモールドを除去して電鋳金属部品を取り出す工程。
a)導電基板、または導電シード層で被覆された絶縁基板を用意する工程と、
b)基板表面の導電部分の上に感光性樹脂の層を塗布する工程と、
c)感光性樹脂層の表面を平坦化またはレベリングして、望みの厚さおよび/または表面状態にする工程と、
d)望みの小型構造体の外形に合ったマスクを通して樹脂層にUV照射する工程と、
e)感光性樹脂層の重合されていない領域を溶解して、前記基板の導電面が所々露出する工程と、
f)上記露出した導電面の上に少なくとも1層の金属層をガルバニック堆積して、ほぼ上記感光性樹脂の上面の高さまで達するユニットを形成する工程と、
g)上記感光性樹脂と上記ユニットが同じ高さになるように樹脂および電鋳金属を平坦化またはレベリングし、それにより電鋳部品または小型構造体を形成する工程と、
h)上記感光性樹脂層と上記ユニットを基板から分離する工程と、
i)工程h)で得られたユニットすなわち部品または小型構造体から感光性樹脂層を除去して、部品または小型構造体を取り出す工程と
を含むことを特徴とする方法に関する。
j)ブリッジが接続した状態の部品の前記基板に接合していた面をワークプレートに固定する工程と、
k)この状態でブリッジが接続している面を機械加工して、望みの厚さおよび/または表面状態にし、ブリッジを取り除いて上記部品を切り離す工程と、
l)上記k)ステップ後に完成品としての部品をワークプレートから取り出す工程。
1.厚さを調節するためにワークプレート上に多数の部品を効率よく移送できるようにし、
2.部品をワークプレートに固定するときにワークプレート上に一様に押し付けることができるようにする。これは、完成時の厚さ寸法のばらつきを減少させ、かつ
3.後で行う別の機械加工操作(電食、切削屑除去加工、ダイヤモンド研削、研磨、装飾など)のために、部品を正確にかつ整然と配置できるようにする。
m)搬送用ストリップを、上記部品の基準面とは反対の面に被せる工程と、
n)上記部品を、ストリップと反対側の基準面でワークプレートに固定する工程と、
o)見えている面を機械加工して、上記部品を望みの厚さおよび/または表面状態にする工程と、
p)上記の完成品をワークプレートから取り出す工程。
q)部品を、その基準面でワークプレートに固定する工程と、
r)見えている面を機械加工して、上記部品を望みの厚さおよび/または表面状態にする工程と、
s)上記の完成品をワークプレートから取り出す工程。
Claims (3)
- 複数の金属微小構造体を製造する方法であって、この方法は;
a)平坦な導電基板、または導電シード層で被覆された平坦な絶縁基板を準備する工程と、
b)前記基板の導電表面に感光性樹脂の層を塗布する工程と、
c)前記感光性樹脂の層の表面を平坦化して、希望の均一な厚さにする工程と、
d)希望の微小構造体の外形を決めるマスクを介して前記感光性樹脂の層にUV照射する工程と、
e)前記感光性樹脂の層の重合していない領域を溶解して、この領域に対応する前記基板の導電表面を露出する工程と、
f′)前記露出した導電表面上に少なくとも一層の金属層を前記感光性樹脂の上面を超えた高さまでガルバニック堆積して金属微小構造体となる電鋳ユニットを形成すると共に、この電鋳ユニットの前記基板の導電表面と接触している基準面と反対側の面同士を接続するブリッジを形成する工程と、
g′)前記樹脂層と前記電鋳ユニットとを一体として前記基板から分離すると共に電鋳ユニットから樹脂層を除去する工程と、
h′)前記電鋳ユニットの基準面をワークプレート上に接着固定する工程と、
i′)固定した前記電鋳ユニットの厚さを希望の厚さまで前記ブリッジを接続した表面から機械加工して微小構造体を形成する工程と、
j)次いで、この微小構造体をワークプレートから取り外す工程と、
から構成されることを特徴とする方法。 - 前記工程c)は切削工具を使用しておこなう、請求項1記載の方法。
- 前記切削工具は、ハードメタル、セラミック、金属炭化物、金属窒化物、またはダイヤモンドからなる刃先を備えることを特徴とする請求項2記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09162638A EP2263972A1 (fr) | 2009-06-12 | 2009-06-12 | Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé |
EP09162638.2 | 2009-06-12 | ||
PCT/EP2010/057255 WO2010142529A1 (fr) | 2009-06-12 | 2010-05-26 | Procede de fabrication d'une microstructure metallique et microstructure obtenue selon ce procede |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012529377A JP2012529377A (ja) | 2012-11-22 |
JP5678043B2 true JP5678043B2 (ja) | 2015-02-25 |
Family
ID=41328705
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Application Number | Title | Priority Date | Filing Date |
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JP2012514411A Active JP5678043B2 (ja) | 2009-06-12 | 2010-05-26 | 金属小型構造体を製造する方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9194052B2 (ja) |
EP (2) | EP2263972A1 (ja) |
JP (1) | JP5678043B2 (ja) |
CN (1) | CN102459713B (ja) |
HK (1) | HK1170780A1 (ja) |
RU (1) | RU2528522C2 (ja) |
WO (1) | WO2010142529A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2014003843A1 (en) * | 2012-06-29 | 2014-01-03 | Regents Of The University Of Minnesota | Method of forming individual metallic microstructures |
EP2767869A1 (fr) * | 2013-02-13 | 2014-08-20 | Nivarox-FAR S.A. | Procédé de fabrication d'une pièce de micromécanique monobloc comportant au moins deux niveaux distincts |
CN107002264B (zh) * | 2014-12-12 | 2019-06-07 | 西铁城时计株式会社 | 电铸部件的制造方法 |
CH712210B1 (fr) * | 2016-03-14 | 2020-02-14 | Nivarox Sa | Procédé de fabrication d'un composant d'affichage d'horlogerie. |
EP3454122B1 (fr) * | 2017-09-11 | 2020-02-19 | Patek Philippe SA Genève | Procede de fabrication par technologie liga d'une microstructure metallique comportant au moins deux niveaux |
EP3467151B1 (fr) * | 2017-10-06 | 2020-06-17 | Nivarox-FAR S.A. | Moule pour galvanoplastie et son procédé de fabrication |
EP3536826B1 (fr) * | 2018-03-09 | 2021-04-28 | The Swatch Group Research and Development Ltd | Procede de fabrication d'un decor metallique sur un cadran et cadran obtenu selon ce procede |
EP3670441A1 (fr) * | 2018-12-21 | 2020-06-24 | Rolex Sa | Procédé de fabrication d'un composant horloger |
EP3789825B1 (fr) * | 2019-09-05 | 2022-04-06 | Mimotec S.A. | Procédé pour fabriquer une pluralité de micropièces |
EP3839625A1 (fr) * | 2019-12-18 | 2021-06-23 | Nivarox-FAR S.A. | Procede de fabrication d'un composant horloger et composant obtenu selon ce procede |
EP3839624B1 (fr) * | 2019-12-18 | 2023-09-13 | Nivarox-FAR S.A. | Procede de fabrication d'un composant horloger |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4058401A (en) | 1974-05-02 | 1977-11-15 | General Electric Company | Photocurable compositions containing group via aromatic onium salts |
US4462873A (en) * | 1982-07-16 | 1984-07-31 | Eiji Watanabe | Method of fixedly arranging an array of electroformed letters or the like on an article |
US4869760A (en) * | 1987-01-28 | 1989-09-26 | Kayoh Technical Industry Co., Ltd. | Method for production of metallic sticker |
RU2050423C1 (ru) * | 1989-05-23 | 1995-12-20 | Геннадий Ильич Шпаков | Гальванопластический способ изготовления деталей, преимущественно матриц пресс-форм |
JPH05326395A (ja) * | 1992-05-21 | 1993-12-10 | Toshiba Corp | 半導体装置の製造方法 |
US5378583A (en) * | 1992-12-22 | 1995-01-03 | Wisconsin Alumni Research Foundation | Formation of microstructures using a preformed photoresist sheet |
JPH09279365A (ja) * | 1996-04-11 | 1997-10-28 | Mitsubishi Materials Corp | 微細構造部品を製造する方法 |
JPH09279366A (ja) * | 1996-04-16 | 1997-10-28 | Mitsubishi Materials Corp | 微細構造部品の製造方法 |
US5989994A (en) * | 1998-12-29 | 1999-11-23 | Advantest Corp. | Method for producing contact structures |
JP4249827B2 (ja) * | 1998-12-04 | 2009-04-08 | 株式会社ディスコ | 半導体ウェーハの製造方法 |
US6841339B2 (en) * | 2000-08-09 | 2005-01-11 | Sandia National Laboratories | Silicon micro-mold and method for fabrication |
SE523309E (sv) * | 2001-06-15 | 2010-03-02 | Replisaurus Technologies Ab | Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt |
JP2005153054A (ja) * | 2003-11-25 | 2005-06-16 | Sumitomo Electric Ind Ltd | 微細金属部材の製造方法 |
JP2007070703A (ja) * | 2005-09-08 | 2007-03-22 | Ricoh Co Ltd | 乳化用金属膜の形成方法 |
JP2007204809A (ja) * | 2006-02-01 | 2007-08-16 | Sumitomo Electric Ind Ltd | 3次元微細構造体の製造方法 |
DE06405114T1 (de) * | 2006-03-15 | 2008-04-24 | Doniar S.A. | LIGA Verfahren zur Herstellung einer einzel- oder mehrlagigen metallischen Struktur und damit hergestellte Struktur |
EP1835050A1 (fr) * | 2006-03-15 | 2007-09-19 | Doniar S.A. | Procédé de fabrication par LIGA-UV d'une structure métallique multicouche à couches adjacentes non entièrement superposées, et structure obtenue |
RU2308552C1 (ru) * | 2006-06-21 | 2007-10-20 | "Общество с ограниченной ответственностью "НаноИмпринт" | Способ изготовления нано-пресс-форм для контактной пресс-литографии (варианты) |
JP2008126375A (ja) * | 2006-11-22 | 2008-06-05 | Sumitomo Electric Ind Ltd | 3次元微細構造体の製造方法 |
JP2009127105A (ja) * | 2007-11-27 | 2009-06-11 | Seiko Instruments Inc | 電鋳部品の製造方法 |
-
2009
- 2009-06-12 EP EP09162638A patent/EP2263972A1/fr not_active Withdrawn
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2010
- 2010-05-26 US US13/266,229 patent/US9194052B2/en active Active
- 2010-05-26 WO PCT/EP2010/057255 patent/WO2010142529A1/fr active Application Filing
- 2010-05-26 CN CN201080025743.4A patent/CN102459713B/zh active Active
- 2010-05-26 RU RU2012100707/02A patent/RU2528522C2/ru not_active IP Right Cessation
- 2010-05-26 JP JP2012514411A patent/JP5678043B2/ja active Active
- 2010-05-26 EP EP10724020.2A patent/EP2440690B1/fr active Active
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Also Published As
Publication number | Publication date |
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JP2012529377A (ja) | 2012-11-22 |
RU2528522C2 (ru) | 2014-09-20 |
RU2012100707A (ru) | 2013-07-20 |
US20120042510A1 (en) | 2012-02-23 |
HK1170780A1 (en) | 2013-03-08 |
US9194052B2 (en) | 2015-11-24 |
EP2440690B1 (fr) | 2014-07-16 |
CN102459713B (zh) | 2014-11-19 |
WO2010142529A1 (fr) | 2010-12-16 |
EP2263972A1 (fr) | 2010-12-22 |
EP2440690A1 (fr) | 2012-04-18 |
CN102459713A (zh) | 2012-05-16 |
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