WO2003101889A1 - Procede de production d'un microcomposant - Google Patents

Procede de production d'un microcomposant Download PDF

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Publication number
WO2003101889A1
WO2003101889A1 PCT/JP2003/006475 JP0306475W WO03101889A1 WO 2003101889 A1 WO2003101889 A1 WO 2003101889A1 JP 0306475 W JP0306475 W JP 0306475W WO 03101889 A1 WO03101889 A1 WO 03101889A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
micro component
resin base
manufacturing
micro
Prior art date
Application number
PCT/JP2003/006475
Other languages
English (en)
Japanese (ja)
Inventor
Kazuhisa Arai
Kazunori Ishikawa
Original Assignee
Disco Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corporation filed Critical Disco Corporation
Priority to US10/506,015 priority Critical patent/US20050103635A1/en
Priority to AU2003242436A priority patent/AU2003242436A1/en
Priority to DE10392431T priority patent/DE10392431T5/de
Priority to KR10-2004-7015921A priority patent/KR20040111494A/ko
Publication of WO2003101889A1 publication Critical patent/WO2003101889A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0075—Manufacture of substrate-free structures
    • B81C99/0085—Manufacture of substrate-free structures using moulds and master templates, e.g. for hot-embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/035—Microgears

Definitions

  • the present invention relates to a method for manufacturing a micro component constituting a micro machine.
  • micro components that make up a micromachine are generally manufactured by a Lithographie Galvanoformung Abformung (LIGA) process using semiconductor manufacturing technology.
  • LIGA Lithographie Galvanoformung Abformung
  • the LIGA process is a technology that combines X-ray lithography, electroplating, and molding. Using a method based on a normal semiconductor manufacturing process, the height of the manufactured object is limited to several to several tens of jum. On the other hand, when the LIGA process is used, it is possible to manufacture a three-dimensional object having a height of several hundreds / m and an aspect ratio of several tens or more.
  • a resist 21 is applied on one surface of a flat substrate 20. Then, X-rays are irradiated from above the mask 22 and projected onto the resist 21 through the lens 23 to be exposed, whereby the mask pattern formed on the mask 22 is transferred.
  • the exposed resist 21 is developed, the exposed portion is removed by exposure to light.
  • the portion removed in this way is filled with nickel, for example, by plating, and the remaining resist 21 and substrate 20 are removed by etching, whereby a component having a shape transferred by nickel is formed.
  • a mold is formed by the same method, a minute part can be manufactured using the mold.
  • the micro parts to be manufactured In addition to the need to manufacture individual masks corresponding to different shapes and the need for various lithography equipment such as steppers and etching equipment, equipment costs are high and economical efficiency is lacking. is there.
  • the masking pattern transferred by X-ray lithography has a problem that it is difficult to process it into a complex shape because its side faces are composed of vertical faces.
  • the present invention provides a resin base forming step of forming a resin base that can be dissolved using a solvent, and forming a concave portion having a shape corresponding to the shape of a micro component to be manufactured by applying a physical external force to the resin base. Consisting of a recess forming step to form a recess, a metal filling step of filling the recess with metal, a metal removing step of polishing and removing excess metal, and a base melting step of melting the resin base with a solvent.
  • the physical external force includes any one of laser beam, ultrasonic wave, cutting blade, and polishing grindstone. Filling recesses by plating, micro parts are molds used to manufacture parts or parts that make up the micromachine, metal is nickel, resin is ABS resin, and solvent is acetate. Additional requirements.
  • a concave portion having a shape of the micro component to be manufactured is formed on the base by a physical external force, and the base is removed after filling the metal into the concave portion.
  • FIG. 1 is a perspective view showing a base formed by a base forming step.
  • FIG. 2 is a perspective view showing a state in which a concave portion is formed on the base in the concave portion forming step.
  • FIG. 3 is a perspective view showing a state in which the recess is filled with metal in the metal filling step.
  • FIG. 4 is a perspective view showing a state where excess metal has been removed in a metal removing step.
  • FIG. 5 is a perspective view showing a micro component formed by the base melting step.
  • FIG. 6 is a cross-sectional view showing a state where a concave portion whose side surface is a tapered surface is formed.
  • FIG. 7 is a perspective view showing a lithography technique in a conventional method. BEST MODE FOR CARRYING OUT THE INVENTION
  • a resin base 1 having a thickness greater than a gear to be manufactured using resin is formed (resin base forming step).
  • the resin used for molding the resin base 1 needs to be capable of being dissolved later by a chemical reaction using a solvent.
  • a solvent for example, an ABS resin can be used.
  • a concave portion 3 which is a cavity having the same shape as the gear to be manufactured is formed (a concave portion forming step).
  • a concave portion forming step As the physical external force, an ultrasonic wave, a cutting blade, or the like can be used in addition to the laser beam. Also, depending on the shape of the micro component to be manufactured, a grinding wheel can be used.
  • the laser beam 2 is used as in the example in Fig. 2
  • the laser beam is irradiated while moving the irradiation unit 4 or the resin base 1 according to the shape of the gear to be manufactured, so that the gear-shaped recess 3 can be formed.
  • the concave portion 3 is filled with a metal 5 serving as a material of a micro component as shown in FIG. 3 (metal filling step).
  • the filling of the metal can be performed by, for example, spraying the metal by sputtering and then performing electrolytic plating. Nickel, copper, or the like is used as the metal.
  • metal removal step polishing can be performed using a polishing wheel, or can be performed using CMP technology.
  • the gear 7 as a micro component shown in FIG. 5 is formed (base melting step).
  • the resin base 1 is made of ABS resin
  • acetone is used as a solvent.
  • a concave portion 10 having a tapered surface 9 is formed by irradiating a laser beam 8 obliquely as shown in the figure. be able to. Then, the recess 10 is filled with metal. Then, a micro component having a side surface corresponding to the tapered surface 9 is formed. In this way, it is possible to manufacture a micro component having a shape that cannot be manufactured by the conventional method using one lithography technique.
  • micro component itself constituting the micro machine but also a mold such as a mold for molding the micro component can be manufactured.
  • a recess having the shape of a micro component to be manufactured by a physical external force is formed on a base, and the recess is filled with metal.
  • a laser beam is used as a physical external force, a micro component having a side surface that is not a vertical surface can be easily manufactured. Can be manufactured.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

L'invention concerne un procédé de production d'un microcomposant, consistant à former une base de résine (1), soluble au moyen d'un solvant, à former une portion concave (3) dans cette base de résine (1) par application d'une force physique externe, à introduire du métal dans cette portion concave (3), à retirer l'excédent de métal par meulage, puis à dissoudre la base de résine (1) au moyen d'un solvant. Ce procédé ne nécessite aucun dispositif de lithographie, tel qu'un stepper ou un dispositif de gravure, ce qui permet d'augmenter sa rentabilité et de produire un composant présentant une forme complexe, que la technique de lithographie ne permettrait pas d'obtenir.
PCT/JP2003/006475 2002-06-03 2003-05-23 Procede de production d'un microcomposant WO2003101889A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US10/506,015 US20050103635A1 (en) 2002-06-03 2003-05-23 Method of producing micro component
AU2003242436A AU2003242436A1 (en) 2002-06-03 2003-05-23 Mthod of producing micro component
DE10392431T DE10392431T5 (de) 2002-06-03 2003-05-23 Herstellungsverfahren für Mikrokomponenten
KR10-2004-7015921A KR20040111494A (ko) 2002-06-03 2003-05-23 마이크로 부품의 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002-161389 2002-06-03
JP2002161389A JP2004009144A (ja) 2002-06-03 2002-06-03 マイクロ部品の製造方法

Publications (1)

Publication Number Publication Date
WO2003101889A1 true WO2003101889A1 (fr) 2003-12-11

Family

ID=29706576

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/006475 WO2003101889A1 (fr) 2002-06-03 2003-05-23 Procede de production d'un microcomposant

Country Status (6)

Country Link
US (1) US20050103635A1 (fr)
JP (1) JP2004009144A (fr)
KR (1) KR20040111494A (fr)
AU (1) AU2003242436A1 (fr)
DE (1) DE10392431T5 (fr)
WO (1) WO2003101889A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10161493C5 (de) * 2001-12-14 2008-09-18 Micromotion Gmbh Getriebe nach dem Spannungswellen-Prinzip mit Hohlwellen
DE06405114T1 (de) * 2006-03-15 2008-04-24 Doniar S.A. LIGA Verfahren zur Herstellung einer einzel- oder mehrlagigen metallischen Struktur und damit hergestellte Struktur
JP4526556B2 (ja) * 2007-09-18 2010-08-18 株式会社木村鋳造所 マイクロ部品の製造方法
US8216697B2 (en) 2009-02-13 2012-07-10 Global Oled Technology Llc OLED with fluoranthene-macrocyclic materials

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10168591A (ja) * 1996-12-11 1998-06-23 Yaskawa Electric Corp 微小機械部品の製造方法
JPH10202757A (ja) * 1997-01-24 1998-08-04 Fuji Xerox Co Ltd 微小構造体、およびその製造方法および装置
JP2002307398A (ja) * 2001-04-18 2002-10-23 Mitsui Chemicals Inc マイクロ構造物の製造方法
JP2003200396A (ja) * 2001-10-29 2003-07-15 Sumitomo Electric Ind Ltd 金属微細構造体の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6159681A (en) * 1997-05-28 2000-12-12 Syntrix Biochip, Inc. Light-mediated method and apparatus for the regional analysis of biologic material
US20020119079A1 (en) * 1999-12-10 2002-08-29 Norbert Breuer Chemical microreactor and microreactor made by process
JP3865989B2 (ja) * 2000-01-13 2007-01-10 新光電気工業株式会社 多層配線基板、配線基板、多層配線基板の製造方法、配線基板の製造方法、及び半導体装置
CN100539106C (zh) * 2000-09-25 2009-09-09 揖斐电株式会社 半导体元件及其制造方法、多层印刷布线板及其制造方法
US6422528B1 (en) * 2001-01-17 2002-07-23 Sandia National Laboratories Sacrificial plastic mold with electroplatable base

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10168591A (ja) * 1996-12-11 1998-06-23 Yaskawa Electric Corp 微小機械部品の製造方法
JPH10202757A (ja) * 1997-01-24 1998-08-04 Fuji Xerox Co Ltd 微小構造体、およびその製造方法および装置
JP2002307398A (ja) * 2001-04-18 2002-10-23 Mitsui Chemicals Inc マイクロ構造物の製造方法
JP2003200396A (ja) * 2001-10-29 2003-07-15 Sumitomo Electric Ind Ltd 金属微細構造体の製造方法

Also Published As

Publication number Publication date
DE10392431T5 (de) 2005-06-30
JP2004009144A (ja) 2004-01-15
AU2003242436A1 (en) 2003-12-19
US20050103635A1 (en) 2005-05-19
KR20040111494A (ko) 2004-12-31

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