JP5602685B2 - マルチパッケージモジュールおよびその形成方法 - Google Patents
マルチパッケージモジュールおよびその形成方法 Download PDFInfo
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- JP5602685B2 JP5602685B2 JP2011137096A JP2011137096A JP5602685B2 JP 5602685 B2 JP5602685 B2 JP 5602685B2 JP 2011137096 A JP2011137096 A JP 2011137096A JP 2011137096 A JP2011137096 A JP 2011137096A JP 5602685 B2 JP5602685 B2 JP 5602685B2
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- Toxicology (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
図1は積み重ねられたマルチパッケージモジュール(「MPM」)のボトムパッケージとして用いることができ、産業界でよく確立された標準的なボールグリッドアレイ(「BGA」)パッケージの構造を例示する断面図である。BGAは、一般的に10のように示され、少なくとも1つの金属レイヤを有する基板12の上に取り付けられたダイス14を有している。様々な基板形式のいずれかが用いられ、例えば、1−2の金属レイヤをラミネートしたもの、4−8の金属レイヤを有する基板構造、1−2の金属レイヤを有するフレキシブルポリイミドテープまたはセラミックマルチレイヤ基板が含まれる。図1の例によって示された基板12は、2つの金属レイヤ121,123を有し、適当な回路構成を提供すべくパターンがそれぞれ形成され、バイアス122を経由して互いに接続されている。ダイスは、所定の箇所で基板表面に図1の13で示されるダイス接着エポキシとして一般的に参照される接着剤を用いて取り付けられる。そして、図1の構成において、例え、ダイス接着表面が使用時において特定の方位が必要でなくても、ダイスが取り付けられた基板上の表面は、「上側」表面として参照され、当該表面上のの金属レイヤは、「上側」金属レイヤとして参照される。
単に平面のヒートスプレッダをドロップインモールド処理したり、トップパッケージダイスの上側表面またはトップパッケージ上のスペーサの上側表面に接着剤を適用し、当該接着剤の上に平面のヒートスプレッダを取り付けたりすることにより挿入する。
Claims (2)
- 積み重ねられた第1および第2パッケージを具備するマルチパッケージモジュールであって、前記第1および第2パッケージのそれぞれは、第1および第2の基板のそれぞれに取り付けられたダイスを有し、前記第1および第2の基板は、ワイヤボンディングにより相互接続され、前記第1パッケージは、上向きダイス構成のフリップチップを有するフリップチップボールグリッドアレイパッケージを具備することを特徴とするマルチパッケージモジュール。
- 第1パッケージ基板を有する上向きダイスフリップチップ第1パッケージを供給し、
ダイスおよび第2パッケージ基板を有する第2パッケージを供給し、前記第1パッケージ上に前記第2パッケージを積み重ね、
前記第1パッケージ基板と第2パッケージ基板とをワイヤボンド接続することにより、前記第1および第2パッケージを電気的に相互接続することを特徴とするマルチパッケージモジュールの形成方法。
Applications Claiming Priority (14)
Application Number | Priority Date | Filing Date | Title |
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US41159002P | 2002-09-17 | 2002-09-17 | |
US60/411,590 | 2002-09-17 | ||
US10/632,550 US6972481B2 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages |
US10/632,552 | 2003-08-02 | ||
US10/632,568 US7205647B2 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages |
US10/632,549 US7064426B2 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module having wire bond interconnect between stacked packages |
US10/632,568 | 2003-08-02 | ||
US10/632,553 US7053476B2 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages |
US10/632,551 | 2003-08-02 | ||
US10/632,553 | 2003-08-02 | ||
US10/632,550 | 2003-08-02 | ||
US10/632,551 US6838761B2 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield |
US10/632,549 | 2003-08-02 | ||
US10/632,552 US20040061213A1 (en) | 2002-09-17 | 2003-08-02 | Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages |
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JP2004568930A Division JP4800625B2 (ja) | 2002-09-17 | 2003-09-15 | 積み重ねられたパッケージ間のワイヤボンド相互接続を有する半導体マルチパッケージモジュール及びその形成方法 |
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JP2011137096A Expired - Fee Related JP5602685B2 (ja) | 2002-09-17 | 2011-06-21 | マルチパッケージモジュールおよびその形成方法 |
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AU (1) | AU2003272405A1 (ja) |
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2003
- 2003-09-15 KR KR1020057004551A patent/KR101166575B1/ko active IP Right Grant
- 2003-09-15 JP JP2004568930A patent/JP4800625B2/ja not_active Expired - Fee Related
- 2003-09-15 EP EP03754585A patent/EP1547141A4/en not_active Ceased
- 2003-09-15 WO PCT/US2003/028919 patent/WO2004027823A2/en active Application Filing
- 2003-09-15 AU AU2003272405A patent/AU2003272405A1/en not_active Abandoned
- 2003-09-17 TW TW100113640A patent/TWI469301B/zh not_active IP Right Cessation
- 2003-09-17 TW TW092125625A patent/TWI329918B/zh not_active IP Right Cessation
- 2003-09-17 TW TW098139252A patent/TWI378548B/zh not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
---|---|
KR20050044925A (ko) | 2005-05-13 |
TW201131731A (en) | 2011-09-16 |
JP2005539403A (ja) | 2005-12-22 |
TWI469301B (zh) | 2015-01-11 |
JP4800625B2 (ja) | 2011-10-26 |
JP2011181971A (ja) | 2011-09-15 |
WO2004027823A3 (en) | 2004-05-21 |
TWI329918B (en) | 2010-09-01 |
KR101166575B1 (ko) | 2012-07-18 |
TWI378548B (en) | 2012-12-01 |
EP1547141A2 (en) | 2005-06-29 |
TW200419765A (en) | 2004-10-01 |
AU2003272405A1 (en) | 2004-04-08 |
TW201017853A (en) | 2010-05-01 |
JP2013211589A (ja) | 2013-10-10 |
JP5856103B2 (ja) | 2016-02-09 |
WO2004027823A2 (en) | 2004-04-01 |
EP1547141A4 (en) | 2010-02-24 |
AU2003272405A8 (en) | 2004-04-08 |
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