JP5460552B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5460552B2 JP5460552B2 JP2010233285A JP2010233285A JP5460552B2 JP 5460552 B2 JP5460552 B2 JP 5460552B2 JP 2010233285 A JP2010233285 A JP 2010233285A JP 2010233285 A JP2010233285 A JP 2010233285A JP 5460552 B2 JP5460552 B2 JP 5460552B2
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- Prior art keywords
- insulating layer
- layer
- oxide
- oxide semiconductor
- halogen element
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims description 614
- 229910052736 halogen Inorganic materials 0.000 claims description 301
- 150000002367 halogens Chemical class 0.000 claims description 300
- 125000004429 atom Chemical group 0.000 claims description 59
- 239000011737 fluorine Substances 0.000 claims description 53
- 229910052731 fluorine Inorganic materials 0.000 claims description 53
- 239000000460 chlorine Substances 0.000 claims description 48
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 41
- 229910052801 chlorine Inorganic materials 0.000 claims description 41
- 229910052733 gallium Inorganic materials 0.000 claims description 7
- 239000011701 zinc Substances 0.000 claims description 7
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 6
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 6
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052794 bromium Inorganic materials 0.000 claims description 6
- 125000001153 fluoro group Chemical group F* 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 6
- 229910052740 iodine Inorganic materials 0.000 claims description 6
- 239000011630 iodine Substances 0.000 claims description 6
- 238000001004 secondary ion mass spectrometry Methods 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 1578
- 239000010408 film Substances 0.000 description 399
- 239000000758 substrate Substances 0.000 description 185
- 239000001257 hydrogen Substances 0.000 description 176
- 229910052739 hydrogen Inorganic materials 0.000 description 176
- 239000007789 gas Substances 0.000 description 175
- 239000010409 thin film Substances 0.000 description 172
- 238000000034 method Methods 0.000 description 160
- 239000012535 impurity Substances 0.000 description 137
- 230000015572 biosynthetic process Effects 0.000 description 135
- 238000004544 sputter deposition Methods 0.000 description 112
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 111
- 239000000463 material Substances 0.000 description 77
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 75
- 230000001681 protective effect Effects 0.000 description 74
- 238000012545 processing Methods 0.000 description 66
- 239000004973 liquid crystal related substance Substances 0.000 description 65
- 229910052814 silicon oxide Inorganic materials 0.000 description 65
- 229910052581 Si3N4 Inorganic materials 0.000 description 64
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 64
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 60
- 150000002431 hydrogen Chemical class 0.000 description 59
- 230000008569 process Effects 0.000 description 56
- 238000010438 heat treatment Methods 0.000 description 54
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 51
- 229910052710 silicon Inorganic materials 0.000 description 50
- 239000010703 silicon Substances 0.000 description 50
- 230000006870 function Effects 0.000 description 49
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 47
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 47
- 229910052760 oxygen Inorganic materials 0.000 description 44
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 41
- 239000001301 oxygen Substances 0.000 description 41
- 150000004678 hydrides Chemical class 0.000 description 40
- 150000001875 compounds Chemical class 0.000 description 38
- 229910007541 Zn O Inorganic materials 0.000 description 35
- 238000005530 etching Methods 0.000 description 35
- 238000004519 manufacturing process Methods 0.000 description 35
- 238000009832 plasma treatment Methods 0.000 description 35
- 239000012298 atmosphere Substances 0.000 description 33
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 26
- 229910052782 aluminium Inorganic materials 0.000 description 26
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 24
- 150000004767 nitrides Chemical class 0.000 description 24
- 238000000206 photolithography Methods 0.000 description 24
- 229920005989 resin Polymers 0.000 description 24
- 239000011347 resin Substances 0.000 description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- 229910001868 water Inorganic materials 0.000 description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 23
- 238000005192 partition Methods 0.000 description 23
- 239000010936 titanium Substances 0.000 description 23
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 22
- 238000012546 transfer Methods 0.000 description 21
- 238000002347 injection Methods 0.000 description 20
- 239000007924 injection Substances 0.000 description 20
- 238000004140 cleaning Methods 0.000 description 17
- 239000011521 glass Substances 0.000 description 16
- 229910044991 metal oxide Inorganic materials 0.000 description 16
- 150000004706 metal oxides Chemical class 0.000 description 16
- 230000007547 defect Effects 0.000 description 15
- -1 tungsten nitride Chemical class 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 14
- 229910052757 nitrogen Inorganic materials 0.000 description 14
- 239000002356 single layer Substances 0.000 description 14
- 229910052719 titanium Inorganic materials 0.000 description 13
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 12
- 229910052786 argon Inorganic materials 0.000 description 12
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 12
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 12
- 230000032258 transport Effects 0.000 description 12
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 11
- 239000011787 zinc oxide Substances 0.000 description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 10
- 239000000956 alloy Substances 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 10
- 230000005525 hole transport Effects 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 229910052750 molybdenum Inorganic materials 0.000 description 10
- 239000010453 quartz Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 9
- 239000000565 sealant Substances 0.000 description 9
- 229910052721 tungsten Inorganic materials 0.000 description 9
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 8
- 229910052799 carbon Inorganic materials 0.000 description 8
- 150000001721 carbon Chemical group 0.000 description 8
- 238000000151 deposition Methods 0.000 description 8
- 230000008021 deposition Effects 0.000 description 8
- 150000002483 hydrogen compounds Chemical class 0.000 description 8
- 229910003437 indium oxide Inorganic materials 0.000 description 8
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 8
- 239000011777 magnesium Substances 0.000 description 8
- 239000011733 molybdenum Substances 0.000 description 8
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 8
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 8
- 229910001930 tungsten oxide Inorganic materials 0.000 description 8
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 8
- 239000004642 Polyimide Substances 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 7
- 238000004364 calculation method Methods 0.000 description 7
- 239000011651 chromium Substances 0.000 description 7
- 230000005684 electric field Effects 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- 239000004952 Polyamide Substances 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000005611 electricity Effects 0.000 description 6
- GVGCUCJTUSOZKP-UHFFFAOYSA-N nitrogen trifluoride Chemical compound FN(F)F GVGCUCJTUSOZKP-UHFFFAOYSA-N 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229920002647 polyamide Polymers 0.000 description 6
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 6
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 6
- 230000003068 static effect Effects 0.000 description 6
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 6
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 6
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 6
- 239000010937 tungsten Substances 0.000 description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 5
- 229910020923 Sn-O Inorganic materials 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 229910052804 chromium Inorganic materials 0.000 description 5
- 238000004891 communication Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 229910052734 helium Inorganic materials 0.000 description 5
- 239000001307 helium Substances 0.000 description 5
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 229910052715 tantalum Inorganic materials 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 108010083687 Ion Pumps Proteins 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 239000000969 carrier Substances 0.000 description 4
- 229920001940 conductive polymer Polymers 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 230000002441 reversible effect Effects 0.000 description 4
- 238000009751 slip forming Methods 0.000 description 4
- 238000000859 sublimation Methods 0.000 description 4
- 230000008022 sublimation Effects 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 229910052691 Erbium Inorganic materials 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 3
- 229910052779 Neodymium Inorganic materials 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- 229910052769 Ytterbium Inorganic materials 0.000 description 3
- 229910052783 alkali metal Inorganic materials 0.000 description 3
- 150000001340 alkali metals Chemical class 0.000 description 3
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 3
- 150000001342 alkaline earth metals Chemical class 0.000 description 3
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 229910052792 caesium Inorganic materials 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 3
- 229910052754 neon Inorganic materials 0.000 description 3
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000001552 radio frequency sputter deposition Methods 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 150000002910 rare earth metals Chemical class 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 229910052706 scandium Inorganic materials 0.000 description 3
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000012798 spherical particle Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- UWCWUCKPEYNDNV-LBPRGKRZSA-N 2,6-dimethyl-n-[[(2s)-pyrrolidin-2-yl]methyl]aniline Chemical compound CC1=CC=CC(C)=C1NC[C@H]1NCCC1 UWCWUCKPEYNDNV-LBPRGKRZSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- GDFCWFBWQUEQIJ-UHFFFAOYSA-N [B].[P] Chemical compound [B].[P] GDFCWFBWQUEQIJ-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 238000003915 air pollution Methods 0.000 description 2
- 239000005407 aluminoborosilicate glass Substances 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 239000012300 argon atmosphere Substances 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 238000005284 basis set Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 239000005380 borophosphosilicate glass Substances 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000007766 curtain coating Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 230000005281 excited state Effects 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 239000005262 ferroelectric liquid crystals (FLCs) Substances 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000003094 microcapsule Substances 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 238000005121 nitriding Methods 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 238000010345 tape casting Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 210000003462 vein Anatomy 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910018137 Al-Zn Inorganic materials 0.000 description 1
- 229910018573 Al—Zn Inorganic materials 0.000 description 1
- 229910011255 B2O3 Inorganic materials 0.000 description 1
- 239000004986 Cholesteric liquid crystals (ChLC) Substances 0.000 description 1
- 238000004057 DFT-B3LYP calculation Methods 0.000 description 1
- 239000004985 Discotic Liquid Crystal Substance Substances 0.000 description 1
- 108091006149 Electron carriers Proteins 0.000 description 1
- 241000238558 Eucarida Species 0.000 description 1
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 1
- 206010052128 Glare Diseases 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004983 Polymer Dispersed Liquid Crystal Substances 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 206010047571 Visual impairment Diseases 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910008322 ZrN Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000003098 cholesteric effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000004453 electron probe microanalysis Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
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Description
本実施の形態の半導体装置及び半導体装置の作製方法の一形態を、図1を用いて説明する。本実施の形態で示す半導体装置は薄膜トランジスタである。
本実施の形態は、本明細書で開示する半導体装置に適用できる薄膜トランジスタの他の例を示す。上記実施の形態と同一部分又は同様な機能を有する部分、及び工程は、上記実施の形態を適用することができ、繰り返しの説明は省略する。また同じ箇所の詳細な説明は省略する。
本実施の形態は、本明細書で開示する半導体装置に適用できる薄膜トランジスタの他の例を示す。上記実施の形態と同一部分又は同様な機能を有する部分、及び工程は、上記実施の形態を適用することができ、繰り返しの説明は省略する。また同じ箇所の詳細な説明は省略する。
本実施の形態は、本明細書で開示する半導体装置に適用できる薄膜トランジスタの他の例を示す。上記実施の形態と同一部分又は同様な機能を有する部分、及び工程は、上記実施の形態を適用することができ、繰り返しの説明は省略する。また同じ箇所の詳細な説明は省略する。
本実施の形態は、本明細書で開示する半導体装置に適用できる薄膜トランジスタの他の例を示す。
本実施の形態は、本明細書で開示する半導体装置に適用できる薄膜トランジスタの他の例を示す。
本実施の形態は、本明細書で開示する半導体装置に適用できる薄膜トランジスタの例を示す。
本実施の形態は、本明細書で開示する半導体装置に適用できる薄膜トランジスタの例を示す。
本実施の形態では、実施の形態1乃至8に示した半導体装置において、薄膜トランジスタと、エレクトロルミネッセンスを利用する発光素子とを用い、アクティブマトリクス型の発光表示装置を作製する一例を示す。
本実施の形態では、発光表示パネル(発光パネルともいう)の外観及び断面について、図10を用いて説明する。図10(A)は、第1の基板上に形成された薄膜トランジスタ及び発光素子を、第2の基板との間にシール材によって封止した、パネルの平面図であり、図10(B)は、図10(A)のH−Iにおける断面図に相当する。
半導体装置の一形態に相当する液晶表示パネルの外観及び断面について、図16を用いて説明する。図16(A)(C)は、薄膜トランジスタ4010、4011、及び液晶素子4013を、第1の基板4001と第2の基板4006との間にシール材4005によって封止した、パネルの平面図であり、図16(B)は、図16(A)または図16(C)のM−Nにおける断面図に相当する。
本実施の形態では、本発明の一実施の形態である半導体装置として電子ペーパーの例を示す。
本明細書に開示する半導体装置は、さまざまな電子機器(遊技機も含む)に適用することができる。電子機器としては、例えば、テレビジョン装置(テレビ、またはテレビジョン受信機ともいう)、コンピュータ用などのモニタ、デジタルカメラ、デジタルビデオカメラ、デジタルフォトフレーム、携帯電話機(携帯電話、携帯電話装置ともいう)、携帯型ゲーム機、携帯情報端末、音響再生装置、パチンコ機などの大型ゲーム機などが挙げられる。
本明細書に開示する半導体装置は、電子ペーパーとして適用することができる。電子ペーパーは、情報を表示するものであればあらゆる分野の電子機器に用いることが可能である。例えば、電子ペーパーを用いて、電子書籍(電子ブック)、ポスター、電車などの乗り物の車内広告、クレジットカード等の各種カードにおける表示等に適用することができる。電子機器の一例を図20に示す。
(実施の形態15)
本実施の形態は、本明細書で開示する半導体装置に適用できる薄膜トランジスタの例を示す。
Claims (10)
- 酸化物半導体層と、
前記酸化物半導体層と接する領域を有する絶縁層と、を有し、
前記絶縁層は、ハロゲン元素を有し、
前記絶縁層は、前記ハロゲン元素の濃度が、5×10 18 atoms/cm 3 乃至1×10 20 atoms/cm 3 である領域を有することを特徴とする半導体装置。 - 酸化物半導体層と、
前記酸化物半導体層上方の絶縁層と、を有し、
前記絶縁層は、ハロゲン元素を有し、
前記絶縁層は、前記ハロゲン元素の濃度が、5×10 18 atoms/cm 3 乃至1×10 20 atoms/cm 3 である領域を有することを特徴とする半導体装置。 - 絶縁層と、
前記絶縁層上方の酸化物半導体層と、を有し、
前記絶縁層は、ハロゲン元素を有し、
前記絶縁層は、前記ハロゲン元素の濃度が、5×10 18 atoms/cm 3 乃至1×10 20 atoms/cm 3 である領域を有することを特徴とする半導体装置。 - 第1の絶縁層と、
前記第1の絶縁層上方の酸化物半導体層と、
前記酸化物半導体層上方の第2の絶縁層と、を有し、
前記第1の絶縁層は、第1のハロゲン元素を有し、
前記第2の絶縁層は、第2のハロゲン元素を有し、
前記第1の絶縁層は、前記第1のハロゲン元素の濃度が、5×10 18 atoms/cm 3 乃至1×10 20 atoms/cm 3 である領域を有し、
前記第2の絶縁層は、前記第2のハロゲン元素の濃度が、5×10 18 atoms/cm 3 乃至1×10 20 atoms/cm 3 である領域を有することを特徴とする半導体装置。 - 酸化物半導体層と、
前記酸化物半導体層と接する領域を有する絶縁層と、を有し、
前記絶縁層は、ハロゲン元素を有し、
前記絶縁層は、前記ハロゲン元素の濃度が、5×10 18 atoms/cm 3 乃至1×10 20 atoms/cm 3 である領域を有し、
前記ハロゲン元素は、フッ素、塩素、臭素、又はヨウ素であることを特徴とする半導体装置。 - 酸化物半導体層と、
前記酸化物半導体層上方の絶縁層と、を有し、
前記絶縁層は、ハロゲン元素を有し、
前記絶縁層は、前記ハロゲン元素の濃度が、5×10 18 atoms/cm 3 乃至1×10 20 atoms/cm 3 である領域を有し、
前記ハロゲン元素は、フッ素、塩素、臭素、又はヨウ素であることを特徴とする半導体装置。 - 絶縁層と、
前記絶縁層上方の酸化物半導体層と、を有し、
前記絶縁層は、ハロゲン元素を有し、
前記絶縁層は、前記ハロゲン元素の濃度が、5×10 18 atoms/cm 3 乃至1×10 20 atoms/cm 3 である領域を有し、
前記ハロゲン元素は、フッ素、塩素、臭素、又はヨウ素であることを特徴とする半導体装置。 - 第1の絶縁層と、
前記第1の絶縁層上方の酸化物半導体層と、
前記酸化物半導体層上方の第2の絶縁層と、を有し、
前記第1の絶縁層は、第1のハロゲン元素を有し、
前記第2の絶縁層は、第2のハロゲン元素を有し、
前記第1の絶縁層は、前記第1のハロゲン元素の濃度が、5×10 18 atoms/cm 3 乃至1×10 20 atoms/cm 3 である領域を有し、
前記第2の絶縁層は、前記第2のハロゲン元素の濃度が、5×10 18 atoms/cm 3 乃至1×10 20 atoms/cm 3 である領域を有し、
前記第1のハロゲン元素は、フッ素、塩素、臭素、又はヨウ素であり、
前記第2のハロゲン元素は、フッ素、塩素、臭素、又はヨウ素であることを特徴とする半導体装置。 - 請求項1乃至請求項8のいずれか一項において、
前記酸化物半導体層は、インジウム、ガリウム、又は亜鉛を有することを特徴とする半導体装置。 - 請求項1乃至請求項9のいずれか一項において、
前記ハロゲン元素の濃度の値は、二次イオン質量分析によるものであることを特徴とする半導体装置。
Priority Applications (1)
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JP2010233285A JP5460552B2 (ja) | 2009-10-21 | 2010-10-18 | 半導体装置 |
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Application Number | Priority Date | Filing Date | Title |
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JP2014003953A Active JP5566546B2 (ja) | 2009-10-21 | 2014-01-14 | 発光装置 |
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Country Status (5)
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JP (11) | JP5460552B2 (ja) |
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Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101291488B1 (ko) * | 2009-10-21 | 2013-07-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
CN102668096B (zh) | 2009-10-30 | 2015-04-29 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
WO2011108381A1 (en) | 2010-03-05 | 2011-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
WO2011108382A1 (en) * | 2010-03-05 | 2011-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
WO2011118741A1 (en) | 2010-03-26 | 2011-09-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
DE112011101069B4 (de) * | 2010-03-26 | 2018-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung und Verfahren zur Herstellung der Halbleitervorrichtung |
WO2011132625A1 (en) | 2010-04-23 | 2011-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
CN105321961B (zh) | 2010-04-23 | 2018-10-02 | 株式会社半导体能源研究所 | 半导体装置的制造方法 |
WO2011142467A1 (en) | 2010-05-14 | 2011-11-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
US9496405B2 (en) | 2010-05-20 | 2016-11-15 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device including step of adding cation to oxide semiconductor layer |
WO2011145484A1 (en) | 2010-05-21 | 2011-11-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8629438B2 (en) | 2010-05-21 | 2014-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US8441010B2 (en) * | 2010-07-01 | 2013-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8642380B2 (en) * | 2010-07-02 | 2014-02-04 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
JP5778960B2 (ja) * | 2011-03-29 | 2015-09-16 | 株式会社Joled | 表示パネル、表示装置および電子機器 |
JP5766491B2 (ja) * | 2011-04-11 | 2015-08-19 | 株式会社Joled | 発光パネル、表示装置および電子機器 |
JP6004308B2 (ja) * | 2011-08-12 | 2016-10-05 | Nltテクノロジー株式会社 | 薄膜デバイス |
CN102629574A (zh) * | 2011-08-22 | 2012-08-08 | 京东方科技集团股份有限公司 | 一种氧化物tft阵列基板及其制造方法和电子器件 |
KR101506303B1 (ko) * | 2011-09-29 | 2015-03-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 및 반도체 장치의 제작 방법 |
KR20130043063A (ko) | 2011-10-19 | 2013-04-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
KR101976212B1 (ko) * | 2011-10-24 | 2019-05-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
KR102067051B1 (ko) | 2011-10-24 | 2020-01-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
JP5933895B2 (ja) | 2011-11-10 | 2016-06-15 | 株式会社半導体エネルギー研究所 | 半導体装置および半導体装置の作製方法 |
TWI621183B (zh) | 2011-12-01 | 2018-04-11 | 半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的製造方法 |
KR102083380B1 (ko) * | 2012-01-25 | 2020-03-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
JP2013201428A (ja) * | 2012-02-23 | 2013-10-03 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
US8860023B2 (en) * | 2012-05-01 | 2014-10-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
CN104380444A (zh) | 2012-06-29 | 2015-02-25 | 株式会社半导体能源研究所 | 半导体装置 |
TWI495943B (zh) * | 2012-07-10 | 2015-08-11 | Innocom Tech Shenzhen Co Ltd | 液晶顯示面板、其驅動方法及包含其之液晶顯示器 |
KR102008956B1 (ko) * | 2012-07-18 | 2019-08-09 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
KR102141977B1 (ko) * | 2012-07-20 | 2020-08-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제조 방법 |
TWI782259B (zh) * | 2012-10-24 | 2022-11-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
CN103022149B (zh) * | 2012-12-14 | 2015-06-10 | 京东方科技集团股份有限公司 | 薄膜晶体管、阵列基板及制造方法和显示器件 |
WO2014150237A1 (en) * | 2013-03-15 | 2014-09-25 | Applied Materials, Inc. | Buffer layers for metal oxide semiconductors for tft |
JP6108898B2 (ja) | 2013-03-19 | 2017-04-05 | 株式会社東芝 | 表示装置、薄膜トランジスタ、表示装置の製造方法及び薄膜トランジスタの製造方法 |
TWI809474B (zh) | 2013-05-16 | 2023-07-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
JP6326270B2 (ja) * | 2013-06-28 | 2018-05-16 | 株式会社神戸製鋼所 | 薄膜トランジスタおよびその製造方法 |
US20150079727A1 (en) * | 2013-09-17 | 2015-03-19 | Intermolecular, Inc. | Amorphous IGZO Devices and Methods for Forming the Same |
CN103500711B (zh) * | 2013-10-15 | 2017-06-06 | 深圳市华星光电技术有限公司 | 薄膜晶体管的制造方法 |
KR20150060448A (ko) * | 2013-11-26 | 2015-06-03 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 이의 제조 방법 |
JP6486660B2 (ja) * | 2013-11-27 | 2019-03-20 | 株式会社半導体エネルギー研究所 | 表示装置 |
JP6556998B2 (ja) * | 2013-11-28 | 2019-08-07 | 株式会社半導体エネルギー研究所 | 表示装置 |
JP2016027597A (ja) * | 2013-12-06 | 2016-02-18 | 株式会社半導体エネルギー研究所 | 半導体装置 |
CN104752516A (zh) * | 2013-12-27 | 2015-07-01 | 昆山工研院新型平板显示技术中心有限公司 | 氧化物半导体薄膜晶体管及其制造方法 |
CN103730373B (zh) | 2013-12-31 | 2016-09-07 | 京东方科技集团股份有限公司 | 一种半导体器件的制备方法及半导体器件 |
KR101536174B1 (ko) * | 2014-02-11 | 2015-07-14 | 연세대학교 산학협력단 | 산소 확산을 억제할 수 있는 반도체 소자 제조 방법 |
JP6412322B2 (ja) * | 2014-03-13 | 2018-10-24 | 東京エレクトロン株式会社 | 半導体デバイス、その製造方法、及びその製造装置 |
JP6375654B2 (ja) * | 2014-03-17 | 2018-08-22 | 株式会社デンソー | 有機トランジスタ |
WO2015194176A1 (ja) * | 2014-06-20 | 2015-12-23 | 株式会社Joled | 薄膜トランジスタ、薄膜トランジスタの製造方法及び有機el表示装置 |
JP6392061B2 (ja) * | 2014-10-01 | 2018-09-19 | 東京エレクトロン株式会社 | 電子デバイス、その製造方法、及びその製造装置 |
CN107004602A (zh) * | 2014-10-20 | 2017-08-01 | 株式会社半导体能源研究所 | 半导体装置、其制造方法、显示装置以及显示模块 |
WO2016063159A1 (en) * | 2014-10-20 | 2016-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof, module, and electronic device |
WO2016067159A1 (en) | 2014-10-28 | 2016-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Functional panel, method for manufacturing the same, module, data processing device |
WO2016067161A1 (ja) * | 2014-10-28 | 2016-05-06 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
US20160155849A1 (en) * | 2014-12-02 | 2016-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, method for manufacturing semiconductor device, module, and electronic device |
US10056497B2 (en) * | 2015-04-15 | 2018-08-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US10192995B2 (en) | 2015-04-28 | 2019-01-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
WO2017002986A1 (ko) * | 2015-06-30 | 2017-01-05 | 실리콘 디스플레이 (주) | 산화물 반도체 박막 트랜지스터 및 그 제조 방법 |
WO2017013691A1 (ja) * | 2015-07-17 | 2017-01-26 | 株式会社Joled | 薄膜トランジスタ及び薄膜トランジスタの製造方法 |
US20180219097A1 (en) * | 2015-07-27 | 2018-08-02 | Sharp Kabushiki Kaisha | Semiconductor device and method for manufacturing same |
CN105137660A (zh) * | 2015-09-25 | 2015-12-09 | 京东方科技集团股份有限公司 | 一种光配向膜杂质去除装置和方法 |
US20170104090A1 (en) * | 2015-10-12 | 2017-04-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
US10121759B2 (en) * | 2015-11-04 | 2018-11-06 | Kulicke And Soffa Industries, Inc. | On-bonder automatic overhang die optimization tool for wire bonding and related methods |
DE112017000905T5 (de) | 2016-02-18 | 2018-10-25 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung, Herstellungsverfahren dafür, Anzeigevorrichtung und elektronisches Gerät |
KR101874822B1 (ko) * | 2016-04-01 | 2018-07-06 | 주식회사 테스 | 실리콘산화막의 선택적 식각 방법 |
JP6179912B2 (ja) * | 2016-06-10 | 2017-08-16 | Tianma Japan株式会社 | 薄膜デバイス及びその製造方法 |
KR102661549B1 (ko) * | 2016-11-30 | 2024-04-26 | 엘지디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
KR102627305B1 (ko) * | 2016-12-30 | 2024-01-18 | 한양대학교 산학협력단 | 박막 트랜지스터 기판 및 표시 장치 |
KR102393552B1 (ko) | 2017-11-09 | 2022-05-02 | 엘지디스플레이 주식회사 | 수소 차단막을 갖는 박막 트랜지스터 및 이를 포함하는 표시장치 |
JP6753450B2 (ja) * | 2018-11-12 | 2020-09-09 | セイコーエプソン株式会社 | 電気光学装置用基板、電気光学装置、電子機器 |
TWI692816B (zh) * | 2019-05-22 | 2020-05-01 | 友達光電股份有限公司 | 顯示裝置及其製作方法 |
JP7182577B2 (ja) * | 2020-03-24 | 2022-12-02 | 株式会社Kokusai Electric | 基板処理方法、半導体装置の製造方法、基板処理装置、およびプログラム |
JP7418703B2 (ja) * | 2020-07-01 | 2024-01-22 | 日新電機株式会社 | 薄膜トランジスタ |
JP2022038209A (ja) | 2020-08-26 | 2022-03-10 | キオクシア株式会社 | 半導体装置 |
Family Cites Families (166)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60198861A (ja) | 1984-03-23 | 1985-10-08 | Fujitsu Ltd | 薄膜トランジスタ |
JPH0244256B2 (ja) | 1987-01-28 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn2o5deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH0244260B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn5o8deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH0244258B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn3o6deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPS63210023A (ja) | 1987-02-24 | 1988-08-31 | Natl Inst For Res In Inorg Mater | InGaZn↓4O↓7で示される六方晶系の層状構造を有する化合物およびその製造法 |
JPH0244262B2 (ja) | 1987-02-27 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn6o9deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH0244263B2 (ja) | 1987-04-22 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn7o10deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
TW237562B (ja) | 1990-11-09 | 1995-01-01 | Semiconductor Energy Res Co Ltd | |
JP3071851B2 (ja) | 1991-03-25 | 2000-07-31 | 株式会社半導体エネルギー研究所 | 電気光学装置 |
JPH0567782A (ja) * | 1991-09-09 | 1993-03-19 | Hitachi Ltd | 薄膜トランジスタとその製造方法 |
JPH05251705A (ja) | 1992-03-04 | 1993-09-28 | Fuji Xerox Co Ltd | 薄膜トランジスタ |
KR0143873B1 (ko) | 1993-02-19 | 1998-08-17 | 순페이 야마자끼 | 절연막 및 반도체장치 및 반도체 장치 제조방법 |
JP3564505B2 (ja) * | 1993-02-19 | 2004-09-15 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US7465679B1 (en) | 1993-02-19 | 2008-12-16 | Semiconductor Energy Laboratory Co., Ltd. | Insulating film and method of producing semiconductor device |
JP2796049B2 (ja) * | 1993-11-26 | 1998-09-10 | 菱電セミコンダクタシステムエンジニアリング株式会社 | 薄膜トランジスタおよびその製造方法 |
JP3117872B2 (ja) * | 1994-06-02 | 2000-12-18 | 株式会社半導体エネルギー研究所 | 薄膜半導体集積回路の作製方法 |
JP3468848B2 (ja) * | 1994-06-09 | 2003-11-17 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタおよびその作製方法、並びに液晶表示装置およびその作製方法 |
JP3479375B2 (ja) | 1995-03-27 | 2003-12-15 | 科学技術振興事業団 | 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法 |
EP0820644B1 (en) | 1995-08-03 | 2005-08-24 | Koninklijke Philips Electronics N.V. | Semiconductor device provided with transparent switching element |
JP3625598B2 (ja) | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
US6100562A (en) | 1996-03-17 | 2000-08-08 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
JPH10303128A (ja) | 1997-04-30 | 1998-11-13 | Fujitsu Ltd | 成膜方法 |
JP4170454B2 (ja) | 1998-07-24 | 2008-10-22 | Hoya株式会社 | 透明導電性酸化物薄膜を有する物品及びその製造方法 |
JP2000150861A (ja) | 1998-11-16 | 2000-05-30 | Tdk Corp | 酸化物薄膜 |
JP3276930B2 (ja) | 1998-11-17 | 2002-04-22 | 科学技術振興事業団 | トランジスタ及び半導体装置 |
TW460731B (en) | 1999-09-03 | 2001-10-21 | Ind Tech Res Inst | Electrode structure and production method of wide viewing angle LCD |
JP3241708B2 (ja) * | 2000-08-07 | 2001-12-25 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型表示装置 |
JP4089858B2 (ja) | 2000-09-01 | 2008-05-28 | 国立大学法人東北大学 | 半導体デバイス |
KR20020038482A (ko) | 2000-11-15 | 2002-05-23 | 모리시타 요이찌 | 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널 |
JP3997731B2 (ja) | 2001-03-19 | 2007-10-24 | 富士ゼロックス株式会社 | 基材上に結晶性半導体薄膜を形成する方法 |
JP2002289859A (ja) | 2001-03-23 | 2002-10-04 | Minolta Co Ltd | 薄膜トランジスタ |
JP2002368009A (ja) * | 2001-06-05 | 2002-12-20 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタおよび液晶表示装置 |
JP3925839B2 (ja) | 2001-09-10 | 2007-06-06 | シャープ株式会社 | 半導体記憶装置およびその試験方法 |
JP4090716B2 (ja) | 2001-09-10 | 2008-05-28 | 雅司 川崎 | 薄膜トランジスタおよびマトリクス表示装置 |
EP1443130B1 (en) | 2001-11-05 | 2011-09-28 | Japan Science and Technology Agency | Natural superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film |
JP4164562B2 (ja) | 2002-09-11 | 2008-10-15 | 独立行政法人科学技術振興機構 | ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ |
JP4083486B2 (ja) | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
US7049190B2 (en) | 2002-03-15 | 2006-05-23 | Sanyo Electric Co., Ltd. | Method for forming ZnO film, method for forming ZnO semiconductor layer, method for fabricating semiconductor device, and semiconductor device |
JP3933591B2 (ja) | 2002-03-26 | 2007-06-20 | 淳二 城戸 | 有機エレクトロルミネッセント素子 |
US7339187B2 (en) | 2002-05-21 | 2008-03-04 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Transistor structures |
JP2004022625A (ja) | 2002-06-13 | 2004-01-22 | Murata Mfg Co Ltd | 半導体デバイス及び該半導体デバイスの製造方法 |
US7105868B2 (en) | 2002-06-24 | 2006-09-12 | Cermet, Inc. | High-electron mobility transistor with zinc oxide |
US7067843B2 (en) | 2002-10-11 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Transparent oxide semiconductor thin film transistors |
JP4166105B2 (ja) | 2003-03-06 | 2008-10-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
JP2004273732A (ja) | 2003-03-07 | 2004-09-30 | Sharp Corp | アクティブマトリクス基板およびその製造方法 |
JP2004311702A (ja) * | 2003-04-07 | 2004-11-04 | Sumitomo Heavy Ind Ltd | 薄膜トランジスタの製造方法および薄膜トランジスタ |
JP4108633B2 (ja) | 2003-06-20 | 2008-06-25 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法ならびに電子デバイス |
US7262463B2 (en) | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
JP3923458B2 (ja) * | 2003-09-10 | 2007-05-30 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US8247965B2 (en) | 2003-11-14 | 2012-08-21 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting display device and method for manufacturing the same |
JP4877867B2 (ja) * | 2003-11-14 | 2012-02-15 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
JP2005167019A (ja) * | 2003-12-03 | 2005-06-23 | Sharp Corp | トランジスタおよびそのゲート絶縁膜の成膜に用いるcvd装置 |
US7297977B2 (en) | 2004-03-12 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Semiconductor device |
US7282782B2 (en) | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
CN102856390B (zh) | 2004-03-12 | 2015-11-25 | 独立行政法人科学技术振兴机构 | 包含薄膜晶体管的lcd或有机el显示器的转换组件 |
US7145174B2 (en) | 2004-03-12 | 2006-12-05 | Hewlett-Packard Development Company, Lp. | Semiconductor device |
US7211825B2 (en) | 2004-06-14 | 2007-05-01 | Yi-Chi Shih | Indium oxide-based thin film transistors and circuits |
US8158517B2 (en) | 2004-06-28 | 2012-04-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing wiring substrate, thin film transistor, display device and television device |
JP4854994B2 (ja) * | 2004-06-28 | 2012-01-18 | 株式会社半導体エネルギー研究所 | 配線基板の作製方法及び薄膜トランジスタの作製方法 |
JP2006100760A (ja) | 2004-09-02 | 2006-04-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
US7285501B2 (en) | 2004-09-17 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Method of forming a solution processed device |
US7298084B2 (en) | 2004-11-02 | 2007-11-20 | 3M Innovative Properties Company | Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes |
US7829444B2 (en) | 2004-11-10 | 2010-11-09 | Canon Kabushiki Kaisha | Field effect transistor manufacturing method |
US7872259B2 (en) | 2004-11-10 | 2011-01-18 | Canon Kabushiki Kaisha | Light-emitting device |
JP5118810B2 (ja) | 2004-11-10 | 2013-01-16 | キヤノン株式会社 | 電界効果型トランジスタ |
US7453065B2 (en) | 2004-11-10 | 2008-11-18 | Canon Kabushiki Kaisha | Sensor and image pickup device |
RU2402106C2 (ru) | 2004-11-10 | 2010-10-20 | Кэнон Кабусики Кайся | Аморфный оксид и полевой транзистор с его использованием |
KR100889796B1 (ko) | 2004-11-10 | 2009-03-20 | 캐논 가부시끼가이샤 | 비정질 산화물을 사용한 전계 효과 트랜지스터 |
JP5138163B2 (ja) | 2004-11-10 | 2013-02-06 | キヤノン株式会社 | 電界効果型トランジスタ |
US7863611B2 (en) | 2004-11-10 | 2011-01-04 | Canon Kabushiki Kaisha | Integrated circuits utilizing amorphous oxides |
US7791072B2 (en) | 2004-11-10 | 2010-09-07 | Canon Kabushiki Kaisha | Display |
JP5126729B2 (ja) | 2004-11-10 | 2013-01-23 | キヤノン株式会社 | 画像表示装置 |
US7579224B2 (en) | 2005-01-21 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a thin film semiconductor device |
TWI505473B (zh) | 2005-01-28 | 2015-10-21 | Semiconductor Energy Lab | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
TWI481024B (zh) | 2005-01-28 | 2015-04-11 | Semiconductor Energy Lab | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
US7858451B2 (en) | 2005-02-03 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, semiconductor device and manufacturing method thereof |
US7948171B2 (en) | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
US20060197092A1 (en) | 2005-03-03 | 2006-09-07 | Randy Hoffman | System and method for forming conductive material on a substrate |
US8681077B2 (en) | 2005-03-18 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and display device, driving method and electronic apparatus thereof |
US7544967B2 (en) | 2005-03-28 | 2009-06-09 | Massachusetts Institute Of Technology | Low voltage flexible organic/transparent transistor for selective gas sensing, photodetecting and CMOS device applications |
US7645478B2 (en) | 2005-03-31 | 2010-01-12 | 3M Innovative Properties Company | Methods of making displays |
US8300031B2 (en) | 2005-04-20 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element |
JP3970891B2 (ja) * | 2005-06-06 | 2007-09-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP2006344849A (ja) | 2005-06-10 | 2006-12-21 | Casio Comput Co Ltd | 薄膜トランジスタ |
US7402506B2 (en) | 2005-06-16 | 2008-07-22 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
US7691666B2 (en) | 2005-06-16 | 2010-04-06 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
TWI267195B (en) * | 2005-06-20 | 2006-11-21 | Au Optronics Corp | Switching device for a pixel electrode and methods for fabricating the same |
US7507618B2 (en) | 2005-06-27 | 2009-03-24 | 3M Innovative Properties Company | Method for making electronic devices using metal oxide nanoparticles |
KR100711890B1 (ko) | 2005-07-28 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 및 그의 제조방법 |
JP2007059128A (ja) | 2005-08-23 | 2007-03-08 | Canon Inc | 有機el表示装置およびその製造方法 |
JP2007073558A (ja) * | 2005-09-02 | 2007-03-22 | Kochi Prefecture Sangyo Shinko Center | 薄膜トランジスタの製法 |
JP2007073705A (ja) | 2005-09-06 | 2007-03-22 | Canon Inc | 酸化物半導体チャネル薄膜トランジスタおよびその製造方法 |
JP5116225B2 (ja) | 2005-09-06 | 2013-01-09 | キヤノン株式会社 | 酸化物半導体デバイスの製造方法 |
JP4560502B2 (ja) | 2005-09-06 | 2010-10-13 | キヤノン株式会社 | 電界効果型トランジスタ |
CN101258607B (zh) | 2005-09-06 | 2011-01-05 | 佳能株式会社 | 使用非晶氧化物膜作为沟道层的场效应晶体管、使用非晶氧化物膜作为沟道层的场效应晶体管的制造方法、以及非晶氧化物膜的制造方法 |
JP4850457B2 (ja) | 2005-09-06 | 2012-01-11 | キヤノン株式会社 | 薄膜トランジスタ及び薄膜ダイオード |
JP4280736B2 (ja) | 2005-09-06 | 2009-06-17 | キヤノン株式会社 | 半導体素子 |
JP5064747B2 (ja) * | 2005-09-29 | 2012-10-31 | 株式会社半導体エネルギー研究所 | 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法 |
EP1998373A3 (en) | 2005-09-29 | 2012-10-31 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device having oxide semiconductor layer and manufacturing method thereof |
JP5037808B2 (ja) | 2005-10-20 | 2012-10-03 | キヤノン株式会社 | アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置 |
KR20090130089A (ko) | 2005-11-15 | 2009-12-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 다이오드 및 액티브 매트릭스 표시장치 |
TWI292281B (en) | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
US7867636B2 (en) | 2006-01-11 | 2011-01-11 | Murata Manufacturing Co., Ltd. | Transparent conductive film and method for manufacturing the same |
JP4977478B2 (ja) | 2006-01-21 | 2012-07-18 | 三星電子株式会社 | ZnOフィルム及びこれを用いたTFTの製造方法 |
US7576394B2 (en) | 2006-02-02 | 2009-08-18 | Kochi Industrial Promotion Center | Thin film transistor including low resistance conductive thin films and manufacturing method thereof |
US7977169B2 (en) | 2006-02-15 | 2011-07-12 | Kochi Industrial Promotion Center | Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof |
JP5015470B2 (ja) | 2006-02-15 | 2012-08-29 | 財団法人高知県産業振興センター | 薄膜トランジスタ及びその製法 |
JP2007242895A (ja) * | 2006-03-08 | 2007-09-20 | Mitsubishi Electric Corp | 薄膜トランジスタ装置及びその製造方法 |
JP2007250982A (ja) | 2006-03-17 | 2007-09-27 | Canon Inc | 酸化物半導体を用いた薄膜トランジスタ及び表示装置 |
KR20070101595A (ko) | 2006-04-11 | 2007-10-17 | 삼성전자주식회사 | ZnO TFT |
JP5135709B2 (ja) * | 2006-04-28 | 2013-02-06 | 凸版印刷株式会社 | 薄膜トランジスタ及びその製造方法 |
US20070252928A1 (en) | 2006-04-28 | 2007-11-01 | Toppan Printing Co., Ltd. | Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof |
JP4277874B2 (ja) * | 2006-05-23 | 2009-06-10 | エプソンイメージングデバイス株式会社 | 電気光学装置の製造方法 |
JP2009528670A (ja) * | 2006-06-02 | 2009-08-06 | 財団法人高知県産業振興センター | 半導体機器及びその製法 |
JP5028033B2 (ja) | 2006-06-13 | 2012-09-19 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
JP4609797B2 (ja) | 2006-08-09 | 2011-01-12 | Nec液晶テクノロジー株式会社 | 薄膜デバイス及びその製造方法 |
JP4999400B2 (ja) | 2006-08-09 | 2012-08-15 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
JP4332545B2 (ja) | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
JP4274219B2 (ja) | 2006-09-27 | 2009-06-03 | セイコーエプソン株式会社 | 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置 |
JP5164357B2 (ja) | 2006-09-27 | 2013-03-21 | キヤノン株式会社 | 半導体装置及び半導体装置の製造方法 |
US7622371B2 (en) | 2006-10-10 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Fused nanocrystal thin film semiconductor and method |
US7772021B2 (en) | 2006-11-29 | 2010-08-10 | Samsung Electronics Co., Ltd. | Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays |
JP2008140684A (ja) | 2006-12-04 | 2008-06-19 | Toppan Printing Co Ltd | カラーelディスプレイおよびその製造方法 |
JP5105842B2 (ja) | 2006-12-05 | 2012-12-26 | キヤノン株式会社 | 酸化物半導体を用いた表示装置及びその製造方法 |
JP5305630B2 (ja) * | 2006-12-05 | 2013-10-02 | キヤノン株式会社 | ボトムゲート型薄膜トランジスタの製造方法及び表示装置の製造方法 |
KR101303578B1 (ko) | 2007-01-05 | 2013-09-09 | 삼성전자주식회사 | 박막 식각 방법 |
US8207063B2 (en) | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
TWI478347B (zh) * | 2007-02-09 | 2015-03-21 | Idemitsu Kosan Co | A thin film transistor, a thin film transistor substrate, and an image display device, and an image display device, and a semiconductor device |
KR100851215B1 (ko) | 2007-03-14 | 2008-08-07 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치 |
WO2008126879A1 (en) | 2007-04-09 | 2008-10-23 | Canon Kabushiki Kaisha | Light-emitting apparatus and production method thereof |
JP5197058B2 (ja) | 2007-04-09 | 2013-05-15 | キヤノン株式会社 | 発光装置とその作製方法 |
US7795613B2 (en) | 2007-04-17 | 2010-09-14 | Toppan Printing Co., Ltd. | Structure with transistor |
KR101325053B1 (ko) | 2007-04-18 | 2013-11-05 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
KR20080094300A (ko) | 2007-04-19 | 2008-10-23 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이 |
KR101334181B1 (ko) | 2007-04-20 | 2013-11-28 | 삼성전자주식회사 | 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법 |
CN101663762B (zh) | 2007-04-25 | 2011-09-21 | 佳能株式会社 | 氧氮化物半导体 |
KR20080095538A (ko) * | 2007-04-25 | 2008-10-29 | 엘지전자 주식회사 | 박막 트랜지스터 및 그 제조방법, 이를 포함하는평판표시장치 |
KR101334182B1 (ko) * | 2007-05-28 | 2013-11-28 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터의 제조방법 |
KR101345376B1 (ko) | 2007-05-29 | 2013-12-24 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터 및 그 제조방법 |
KR101402189B1 (ko) | 2007-06-22 | 2014-06-02 | 삼성전자주식회사 | Zn 산화물계 박막 트랜지스터 및 Zn 산화물의 식각용액 |
US8566502B2 (en) | 2008-05-29 | 2013-10-22 | Vmware, Inc. | Offloading storage operations to storage hardware using a switch |
KR101576813B1 (ko) | 2007-08-17 | 2015-12-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
JP5213422B2 (ja) * | 2007-12-04 | 2013-06-19 | キヤノン株式会社 | 絶縁層を有する酸化物半導体素子およびそれを用いた表示装置 |
US8202365B2 (en) | 2007-12-17 | 2012-06-19 | Fujifilm Corporation | Process for producing oriented inorganic crystalline film, and semiconductor device using the oriented inorganic crystalline film |
KR101516034B1 (ko) * | 2007-12-25 | 2015-05-04 | 이데미쓰 고산 가부시키가이샤 | 산화물 반도체 전계효과형 트랜지스터 및 그의 제조 방법 |
KR101412761B1 (ko) * | 2008-01-18 | 2014-07-02 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
WO2009093625A1 (ja) * | 2008-01-23 | 2009-07-30 | Idemitsu Kosan Co., Ltd. | 電界効果型トランジスタ及びその製造方法、それを用いた表示装置、並びに半導体装置 |
JP5467728B2 (ja) * | 2008-03-14 | 2014-04-09 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよびその製造方法 |
TWI476921B (zh) | 2008-07-31 | 2015-03-11 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
JP2010056541A (ja) * | 2008-07-31 | 2010-03-11 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
TWI622175B (zh) * | 2008-07-31 | 2018-04-21 | 半導體能源研究所股份有限公司 | 半導體裝置 |
TWI642113B (zh) * | 2008-08-08 | 2018-11-21 | 半導體能源研究所股份有限公司 | 半導體裝置的製造方法 |
JP5627071B2 (ja) * | 2008-09-01 | 2014-11-19 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP4623179B2 (ja) | 2008-09-18 | 2011-02-02 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
EP2172804B1 (en) * | 2008-10-03 | 2016-05-11 | Semiconductor Energy Laboratory Co, Ltd. | Display device |
JP5451280B2 (ja) | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
KR101631454B1 (ko) * | 2008-10-31 | 2016-06-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 논리회로 |
KR101782176B1 (ko) * | 2009-07-18 | 2017-09-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제조 방법 |
WO2011027715A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
CN104733540B (zh) * | 2009-10-09 | 2019-11-12 | 株式会社半导体能源研究所 | 半导体器件 |
KR101291488B1 (ko) * | 2009-10-21 | 2013-07-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
CN102598285B (zh) * | 2009-11-20 | 2016-08-03 | 株式会社半导体能源研究所 | 用于制造半导体器件的方法 |
JP5731244B2 (ja) * | 2010-03-26 | 2015-06-10 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US8207025B2 (en) * | 2010-04-09 | 2012-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
US8629438B2 (en) * | 2010-05-21 | 2014-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
TWI521612B (zh) * | 2011-03-11 | 2016-02-11 | 半導體能源研究所股份有限公司 | 半導體裝置的製造方法 |
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