JP5436997B2 - 集積回路 - Google Patents
集積回路 Download PDFInfo
- Publication number
- JP5436997B2 JP5436997B2 JP2009213344A JP2009213344A JP5436997B2 JP 5436997 B2 JP5436997 B2 JP 5436997B2 JP 2009213344 A JP2009213344 A JP 2009213344A JP 2009213344 A JP2009213344 A JP 2009213344A JP 5436997 B2 JP5436997 B2 JP 5436997B2
- Authority
- JP
- Japan
- Prior art keywords
- transmission
- integrated circuit
- circuit
- current
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000005540 biological transmission Effects 0.000 claims description 142
- 230000008859 change Effects 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 230000000295 complement effect Effects 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 27
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 230000001939 inductive effect Effects 0.000 description 5
- 230000001360 synchronised effect Effects 0.000 description 5
- 230000006870 function Effects 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L25/00—Baseband systems
- H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
- H04L25/0264—Arrangements for coupling to transmission lines
- H04L25/0266—Arrangements for providing Galvanic isolation, e.g. by means of magnetic or capacitive coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
- H04B5/24—Inductive coupling
- H04B5/26—Inductive coupling using coils
- H04B5/266—One coil at each side, e.g. with primary and secondary coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06527—Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
- H01L2225/06531—Non-galvanic coupling, e.g. capacitive coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Semiconductor Integrated Circuits (AREA)
- Dc Digital Transmission (AREA)
- Logic Circuits (AREA)
- Near-Field Transmission Systems (AREA)
Description
なお、本発明は上記実施例に限定されるものではない。
T1〜T8、T11〜T16 トランジスタ
26、54、84、91、101 フリップフロップ
31、61 受信コイル
19、20、32、33、62、63 抵抗
34〜46、64〜73、85、92〜96 トランジスタ
51、81 インバータ遅延線
Claims (7)
- 基板上の配線により形成される第1及び第2送信コイルと、
該第1及び第2送信コイルに送信信号に応じた単極性の電流を流す送信回路と
を有する第1基板と、
基板上の配線により形成され、前記単極性の電流が流れる前記第1及び第2送信コイルが互いに逆極性に誘導結合する受信コイルと、
該受信コイルに接続され、前記送信信号に応じた受信信号を得る受信回路と
を有する第2基板と
を備えることを特徴とする集積回路。
- 前記第1及び第2送信コイルは、それぞれ第1及び第2NMOSのドレインに接続されていることを特徴とする請求項1記載の集積回路。
- 前記第1及び第2送信コイルの内、一方はNMOSのドレインに接続されており、他方はPMOSのドレインに接続されていることを特徴とする請求項1記載の集積回路。
- 前記第1及び第2送信コイルは、それぞれ第1及び第2CMOSの相補のトランジスタ間に接続されていて、該CMOSの貫通電流が流れることを特徴とする請求項1記載の集積回路。
- 前記送信回路は、前記単極性の電流を、前記第1及び第2送信コイルにおいて互いに相補的に時間変化するように流すことを特徴とする請求項1乃至4いずれかに記載の集積回路。
- 前記送信回路は、前記単極性の電流を、前記第1又は第2送信コイルの内、前記送信信号に応じたいずれか一方に流すことを特徴とする請求項1乃至4いずれかに記載の集積回路。
- 前記送信回路は、通信を休止するスタンバイ時に、前記第1及び第2送信コイルのいずれにも前記単極性の電流を流さないことを特徴とする請求項1乃至6いずれかに記載の集積回路。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009213344A JP5436997B2 (ja) | 2009-09-15 | 2009-09-15 | 集積回路 |
PCT/JP2010/064602 WO2011033921A1 (ja) | 2009-09-15 | 2010-08-27 | 集積回路 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009213344A JP5436997B2 (ja) | 2009-09-15 | 2009-09-15 | 集積回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011066515A JP2011066515A (ja) | 2011-03-31 |
JP5436997B2 true JP5436997B2 (ja) | 2014-03-05 |
Family
ID=43758530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009213344A Active JP5436997B2 (ja) | 2009-09-15 | 2009-09-15 | 集積回路 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5436997B2 (ja) |
WO (1) | WO2011033921A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101922531B1 (ko) | 2011-12-01 | 2018-11-27 | 삼성전자주식회사 | 데이터 송수신 장치 및 그것의 송수신 방법 |
DE112012005076B4 (de) | 2011-12-05 | 2018-02-08 | Mitsubishi Electric Corp. | Signalübertragungs-Schaltung |
JP2013197988A (ja) | 2012-03-21 | 2013-09-30 | Advantest Corp | 無線通信装置および無線通信システム |
JP6475818B2 (ja) | 2015-02-19 | 2019-02-27 | 株式会社PEZY Computing | 信号ブリッジ装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6381054B1 (en) * | 1997-01-22 | 2002-04-30 | Advantest Corporation | Optical pulse transmission system, optical pulse transmitting method, and optical pulse detecting method |
US6262600B1 (en) * | 2000-02-14 | 2001-07-17 | Analog Devices, Inc. | Isolator for transmitting logic signals across an isolation barrier |
-
2009
- 2009-09-15 JP JP2009213344A patent/JP5436997B2/ja active Active
-
2010
- 2010-08-27 WO PCT/JP2010/064602 patent/WO2011033921A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2011033921A1 (ja) | 2011-03-24 |
JP2011066515A (ja) | 2011-03-31 |
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