JP5268215B2 - 銅結線のシード層の処理方法および処理装置 - Google Patents
銅結線のシード層の処理方法および処理装置 Download PDFInfo
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76853—Barrier, adhesion or liner layers characterized by particular after-treatment steps
- H01L21/76861—Post-treatment or after-treatment not introducing additional chemical elements into the layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
- H01L21/76873—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroplating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
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- Condensed Matter Physics & Semiconductors (AREA)
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- Organic Chemistry (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Electrodes Of Semiconductors (AREA)
Description
Claims (21)
- 誘電体層に半導体結線形状を形成するための方法であって、
前記誘電体層(340)上、およびバリア層(343)を有する前記誘電体層のエッチング形状(342)内に、銅シード層を生成する工程(344)と、
脱イオン水と、有機化合物と、フッ素化合物と、を含み、酸性のpH環境を有する溶液を塗布することによって、酸化された層を前記銅シード層上から除去するよう前記銅シード層を処理する工程であって、酸化銅以外のものを除去しないよう構成される工程(346)と、
前記処理工程の直後に、前記処理された銅シード層上に銅のバルク層を充填する工程であって、前記銅のバルク層は、前記誘電体層の前記エッチング形状を充填するように構成されている工程(350)と、を備える方法。
- 請求項1記載の誘電体層に半導体結線形状を形成するための方法であって、
前記銅シード層の前記生成工程は、化学蒸着チャンバと物理生成チャンバの中の一つの中で実行され、
前記生成工程は、前記バリア層の底面上に比較的厚い銅の層を形成し、前記エッチング形状の壁には比較的薄い銅の層を形成し、
前記銅シード層の前記生成工程が完了すると、前記銅シード層は、前記比較的厚い層と前記比較的薄い層の両方に酸化が起きる大気環境に露出される、方法。
- 請求項1記載の誘電体層に半導体結線形状を形成するための方法であって、
前記酸性のpH環境を持つ前記溶液は、前記充填工程を実行する直前に、前記銅シード層の表面に塗布されるよう構成されている、方法。
- 請求項3記載の誘電体層に半導体結線形状を形成するための方法であって、
前記有機化合物は有機酸である、方法。
- 請求項4記載の誘電体層に半導体結線形状を形成するための方法であって、
前記有機酸は、クエン酸、リンゴ酸、マロン酸、および琥珀酸の中の一つである、方法。
- 請求項3記載の誘電体層に半導体結線形状を形成するための方法であって、
前記フッ素化合物は、フッ化水素酸およびフッ化アンモニウム(NH4F)の中の一つである、方法。
- 請求項1記載の誘電体層に半導体結線形状を形成するための方法であって、
前記酸性のpH環境を持つ前記溶液は、
脱イオン水内において混合されたフッ化水素酸(HF)と、クエン酸と、アンモニアと、を含み、
前記充填工程の直前に、前記銅シード層の表面に塗布されるよう構成されている、方法。
- 請求項1記載の誘電体層に半導体結線形状を形成するための方法であって、
前記処理工程は、電気メッキ工程と同じ場所で実行される、方法。
- 請求項1記載の誘電体層に半導体結線形状を形成するための方法であって、
前記処理工程は、前記充填工程と同じ場所で実行される、方法。
- 請求項1記載の誘電体層に半導体結線形状を形成するための方法であって、
前記処理工程は、
前記銅シード層からの前記酸化された層の前記除去を引き起こすために、脱イオン水に希釈された酸を含むよう構成された、酸性のpH環境を有する前記溶液を塗布する工程(346)と、
前記酸化された層の前記除去の後に、前記銅シード層上にアゾール溶液を塗布する工程であって、前記アゾール溶液は、酸化物形成を抑制する不動態層を前記銅シード層上に形成する溶液である工程(348)と、を含む方法。
- 請求項10記載の誘電体層に半導体結線形状を形成するための方法であって、
前記アゾール溶液はベンゾトリアゾール(BTA)である、方法。
- 銅結線を加工するための装置であって、
バリア層上に銅シード層を生成するための生成ステーションであって、前記バリア層は、基板の誘電体層と、前記誘電体層のエッチング形状と、を被覆する生成ステーション(202)と、
前記基板を受け取り、脱イオン水と、有機化合物と、フッ素化合物と、を含む溶液であって、酸性のpH環境を有する溶液を使用して、前記銅シード層上から酸化銅層を除去するための処理モジュール(204)と、
同じ場所で前記処理モジュール(204)に接続された電気メッキモジュールであって、前記処理された銅シード層上に充填銅部を形成し、前記誘電体層の前記エッチング形状を充填するよう構成されている電気メッキモジュール(206)と、を備える装置。
- 請求項12記載の銅結線を加工するための装置であって、
前記同じ場所での接続は、前記処理モジュール(204)および前記電気メッキモジュール(206)について、共通の環境(203)を作り出している、装置。
- 請求項12記載の銅結線を加工するための装置であって、
前記処理モジュール(204)は、酸化銅を除去する槽(204c)であり、
前記電気メッキモジュール(206)は、電気メッキ槽である、装置。
- 請求項12記載の銅結線を加工するための装置であって、
前記酸化銅を除去する槽(204c)は、脱イオン水で希釈された酸を含む、装置。
- 請求項12記載の銅結線を加工するための装置であって、
前記酸化銅を除去する槽(204c)は、HFと、クエン酸と、水酸化アンモニウム(NH4OH)と、脱イオン水と、を含む、装置。
- 請求項12記載の銅結線を加工するための装置であって、さらに、
前記処理モジュール(204)と前記電気メッキモジュール(206)との間に設けられ、前記電気メッキモジュール(206)における銅の電気メッキを実行する前に処理のために用いられた化学薬品を、除去するよう構成されている脱イオン水モジュール(204b)を備える装置。
- 請求項12記載の銅結線を加工するための装置であって、さらに、
前記処理モジュール(204)と前記電気メッキモジュール(206)との間に、酸化物形成抑制モジュール(204d)を備える、装置。
- 請求項12記載の銅結線を加工するための装置であって、
前記酸化物形成を抑制するモジュール(204d)は、不動態化剤を備える、装置。
- 請求項19記載の銅結線を加工するための装置であって、
前記不動態化剤は、アゾール族の1つである、装置。
- 請求項7記載の誘電体層に半導体結線形状を形成するための方法であって、
銅の前記バルク層の前記充填工程は、電気メッキモジュールで実行される、方法。
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US09/410,110 | 1999-09-30 | ||
US09/410,110 US6423200B1 (en) | 1999-09-30 | 1999-09-30 | Copper interconnect seed layer treatment methods and apparatuses for treating the same |
PCT/US2000/026612 WO2001024257A1 (en) | 1999-09-30 | 2000-09-27 | Methods and apparatus for treating seed layer in copper interconnctions |
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JP2003510846A JP2003510846A (ja) | 2003-03-18 |
JP5268215B2 true JP5268215B2 (ja) | 2013-08-21 |
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JP2012118948A Withdrawn JP2012191226A (ja) | 1999-09-30 | 2012-05-24 | 銅結線のシード層の処理方法および処理装置 |
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US (2) | US6423200B1 (ja) |
EP (1) | EP1216486A1 (ja) |
JP (2) | JP5268215B2 (ja) |
KR (1) | KR100824484B1 (ja) |
TW (1) | TW469585B (ja) |
WO (1) | WO2001024257A1 (ja) |
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US7135098B2 (en) | 2006-11-14 |
US20020063062A1 (en) | 2002-05-30 |
JP2012191226A (ja) | 2012-10-04 |
KR100824484B1 (ko) | 2008-04-22 |
KR20020037368A (ko) | 2002-05-18 |
US20020175071A1 (en) | 2002-11-28 |
TW469585B (en) | 2001-12-21 |
JP2003510846A (ja) | 2003-03-18 |
EP1216486A1 (en) | 2002-06-26 |
US6423200B1 (en) | 2002-07-23 |
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