CN104032295B - 一种铜杆塑化处理方法 - Google Patents
一种铜杆塑化处理方法 Download PDFInfo
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- CN104032295B CN104032295B CN201410200065.0A CN201410200065A CN104032295B CN 104032295 B CN104032295 B CN 104032295B CN 201410200065 A CN201410200065 A CN 201410200065A CN 104032295 B CN104032295 B CN 104032295B
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- Prior art keywords
- copper bar
- copper
- microetch
- processing method
- mixed solution
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- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
Description
组分 | 用量 | 种类及作用 |
硫酸 | 50g/L | 活化 |
聚乙烯基苯磺酸 | 25g/L | 清洗 |
柠檬酸 | 74g/L | 清洗 |
组分 | 用量 | 种类及作用 |
过硫酸钠 | 120g/L | 微蚀剂 |
硫酸 | 176g/L | 提供H离子 |
组分 | 用量 | 种类及作用 |
乙酸 | 60g/L | pH调整剂 |
苯并三氮唑 | 20g/L | 塑化剂 |
2,4-二氯苄基苯并咪唑 | 20g/L | 塑化剂 |
HEDTA | 5ml/L | 络合剂 |
组分 | 用量 | 种类及作用 |
硫酸 | 30g/L | 活化 |
聚乙烯基苯磺酸 | 45g/L | 清洗 |
柠檬酸 | 20g/L | 清洗 |
组分 | 用量 | 种类及作用 |
过硫酸钠 | 160g/L | 微蚀剂 |
硫酸 | 100g/L | 提供H离子 |
组分 | 用量 | 种类及作用 |
乙酸 | 20g/L | pH调整剂 |
苯并三氮唑 | 40g/L | 塑化剂 |
2,4-二氯苄基苯并咪唑 | 40g/L | 塑化剂 |
HEDTA | 12ml/L | 络合剂 |
Claims (6)
Priority Applications (1)
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CN201410200065.0A CN104032295B (zh) | 2014-05-13 | 2014-05-13 | 一种铜杆塑化处理方法 |
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CN201410200065.0A CN104032295B (zh) | 2014-05-13 | 2014-05-13 | 一种铜杆塑化处理方法 |
Publications (2)
Publication Number | Publication Date |
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CN104032295A CN104032295A (zh) | 2014-09-10 |
CN104032295B true CN104032295B (zh) | 2016-05-18 |
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Application Number | Title | Priority Date | Filing Date |
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CN201410200065.0A Active CN104032295B (zh) | 2014-05-13 | 2014-05-13 | 一种铜杆塑化处理方法 |
Country Status (1)
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CN (1) | CN104032295B (zh) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9425090D0 (en) * | 1994-12-12 | 1995-02-08 | Alpha Metals Ltd | Copper coating |
US6423200B1 (en) * | 1999-09-30 | 2002-07-23 | Lam Research Corporation | Copper interconnect seed layer treatment methods and apparatuses for treating the same |
CN100497751C (zh) * | 2005-12-28 | 2009-06-10 | 无锡华润安盛科技有限公司 | 电子元器件外引线的微蚀剂 |
CN102523680B (zh) * | 2011-12-27 | 2014-03-19 | 深圳市华傲创表面技术有限公司 | 印制线路板表面的osp及用于其制造的预浸原液与预浸方法 |
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2014
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Publication number | Publication date |
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Effective date of registration: 20180821 Address after: 514329 Jintian Road, Tang Keng Town, Fengshun County, Meizhou, Guangdong Patentee after: Fengshun County Da Sen Technology Co., Ltd. Address before: 230088 Room 403, building 4, software park, Tian Tong Road, Hefei, Anhui, China, 14 Patentee before: Hefei Aofu Surface Treatment Technology Co., Ltd. |
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Effective date of registration: 20191211 Address after: Room 309, building 02, northwest area, Suzhou nano City, No. 99, Jinjihu Avenue, Suzhou Industrial Park, Suzhou, 215224, Jiangsu Province Patentee after: Suzhou Megina Nanomaterials Technology Co., Ltd. Address before: 514329 Jintian Road, Tang Keng Town, Fengshun County, Meizhou, Guangdong Patentee before: Fengshun County Da Sen Technology Co., Ltd. |