JP5140428B2 - 集積回路ダイシング装置のチャック用供給機構 - Google Patents
集積回路ダイシング装置のチャック用供給機構 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
この処理(プロセス:process)の間、ユニットはボールグリッドアレイで覆われる上面の領域の外側である周辺部の、上面の縁部で集積回路と接触する装置によって扱われる。そこで回路と接触することで、ボールアレイが破損するリスクは低減する。しかしながら、この処理動作は困難であり、集積回路が小型化し、ボールグリッドアレイの周辺部が縮小するにつれ一層難しくなる。
図1(a)は、本発明の1つの実施形態である集積回路ソーイングおよびソーティングシステムの全体構造を示す。図1(a)は該システムを上から見た図である。該システムはダイシング部とソーティング部の2つの部分から成る。2つの水平方向はXとYで表示される。
Claims (17)
- ダイシング機と協働する基板配送およびチャックシステムであって:
各々が2つのチャックセクションを有し、各自のトラック上に移動可能に配置されている、複数のチャックテーブルと;
第1の位置と第2の位置との間でチャックセクションを移動させる駆動機構と;
(i)第1のチャックセクションが第1の位置にあるとき、第1の基板を第1のチャックセクションに置き、(ii)第2のチャックセクションが第2の位置にあるとき、先にダイスカットされた基板の単体化されたユニットを第2のチャックセクションから持ち上げる、リフトアッセンブリと;を備え、
各チャックテーブルは、チャックテーブルの移動及びそれに従った基板の移動のために、他のチャックテーブルとは独立して各自のトラック上に配置されており、
チャックテーブルと駆動機構が、(i)第1の位置で第1のチャックセクションに置かれた第1の基板をダイスカットし、(ii)第1のチャックセクションを第2の位置に移動させる、ようにダイシング機と協働するよう動作可能である、
ことを特徴とするシステム。 - 各々のチャックテーブルが回転のために搭載され、チャックテーブルの回転が、チャックセクションを第1の位置と第2の位置との間で交代に移動させる、ことを特徴とする請求項1に記載のシステム。
- リフトアッセンブリが、基板を保持する表面を有するフレームリフト部材と、単体化されたユニットを保持する表面を有するネットリフト部材と、を含むことを特徴とする請求項1または2に記載のシステム。
- 第1のチャックセクションと第2のチャックセクションとが同じ方向に面し、フレームリフト部材とネットリフト部材は、前記方向を横切って一緒に移動するが、該方向と平行には個別に移動するように配置されることを特徴とする請求項3に記載のシステム。
- チャックテーブルとリフトアッセンブリのそれぞれが1つまたはそれ以上のガイド部材を有し、フレームリフト部材とネットリフト部材がチャックテーブルに対してリフトアッセンブリを位置決めするため、前記方向にチャックテーブルを近づけるとき、チャックテーブルのガイド部材がリフトアッセンブリのガイド部材と協働することを特徴とする請求項4に記載のシステム。
- ガイド部材のうち1つが突出部を含み、他のガイド部材が突出部を受け入れる凹部を含むことを特徴とする請求項5に記載のシステム。
- フレームリフト部材の表面が、フレームリフト部材の表面に対して基板を付勢する吸引力を生成する真空供給源と結合可能な少なくとも1つの開口を含むことを特徴とする請求項3から6のいずれかに記載のシステム。
- ネットリフト部材の表面が、ネットリフト部材の表面に対して単体化されたユニットを付勢する吸引力を生成する真空供給源と結合可能な少なくとも1つの開口を含むことを特徴とする請求項3から7のいずれかに記載のシステム。
- リフトアッセンブリとチャックテーブルが、複数のパネルを含む基板と協働するように配置され、各パネルが単体化される複数のユニットから成ることを特徴とする請求項1から8のいずれかに記載のシステム。
- リフトアッセンブリとチャックテーブルが、それぞれの表面のうちの1つに電気接点のアレイを有する集積回路を含む基板と協働するように配置され、ダイシング中に電気接点のアレイがチャックテーブルから外れる方に向いていることを特徴とする請求項1から9のいずれかに記載のシステム。
- 基板が1つまたはそれ以上の分離したパネルを備え、各パネルがシステムによって単体化される複数のユニットを備えることを特徴とする請求項1に記載のシステム。
- ユニットが2x2パッケージ用に設計されることを特徴とする請求項1に記載のシステム。
- 単一の基板内の所定数のパネルを、第1のチャックセクションへの配置に備えてより大きな基板から分離するためのパネル分離装置をさらに備えることを特徴とする請求項1に記載のシステム。
- 分離装置が、第1のチャックセクション上に配置するための単一のパネルを分離することを特徴とする請求項13に記載のシステム。
- 分離装置が、第1のチャックセクション上に配置するための2つまたはそれ以上のパネルを分離することを特徴とする請求項13に記載のシステム。
- 集積回路をダイスカットして単体化されたユニットを形成するシステムであって:
ダイシング機と;
各々が2つのチャックセクションを有し、各自のトラック上に移動可能に配置されている、複数のチャックテーブルと;
第1の位置と第2の位置の間でチャックセクションを移動させる駆動機構と;
(i)第1のチャックセクションが第1の位置にあるとき、第1の基板を第1のチャックセクションに置き、(ii)第2のチャックセクションが第2の位置にあるとき、先にダイスカットされた基板の単体化されたユニットを第2のチャックセクションから持ち上げるリフトアッセンブリと;を備え、
各チャックテーブルは、チャックテーブルの移動及びそれに従った基板の移動のために、他のチャックテーブルとは独立して各自のトラック上に配置されており、
チャックテーブル,駆動機構およびダイシング機が、第1の位置で前記チャックセクションに置かれた基板をダイスカットし、チャックセクションを第2の位置に移動させる、ように動作可能である、
ことを特徴とするシステム。 - 基板内に形成された集積回路ユニットを単体化する方法であって:
第1のチャックテーブル上に第1の基板を置き、前記第1のチャックテーブルを第1のトラックに沿って第1の位置に移動させ、;
第1の基板をダイスカットするようにダイシング機を動作させ、ダイスカットされた第1の基板を第2の位置に移動させるために第1のチャックテーブルを移動させるように駆動機構を動作させ;
(i)第2の位置で、チャックテーブルからダイスカットされた第1の基板を持ち上げ、
(ii)第1の位置でチャックテーブルに第2の基板を置き、
第2のチャックテーブル上に基板を置き、前記第2のチャックテーブルを、第1のチャックテーブルとは独立して、第2のトラックに沿って移動させる、
ことを特徴とする方法。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200405166-0 | 2004-08-23 | ||
SG200405166A SG120197A1 (en) | 2004-08-23 | 2004-08-23 | Supply mechanism for the chuck of an integrated circuit dicing device |
SG200501802A SG125997A1 (en) | 2005-03-22 | 2005-03-22 | Improved chuck table for an integrated circuit dicing device |
SG200501802-3 | 2005-03-22 | ||
SG200505056-2 | 2005-07-15 | ||
SG200505056A SG129327A1 (en) | 2005-07-15 | 2005-07-15 | Improved method and apparatus for an integrated circuit dicing device |
PCT/SG2005/000288 WO2006022597A2 (en) | 2004-08-23 | 2005-08-23 | Supply mechanism for the chuck of an integrated circuit dicing device |
Publications (3)
Publication Number | Publication Date |
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JP2008511164A JP2008511164A (ja) | 2008-04-10 |
JP2008511164A5 JP2008511164A5 (ja) | 2008-09-25 |
JP5140428B2 true JP5140428B2 (ja) | 2013-02-06 |
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JP2007529785A Active JP5140428B2 (ja) | 2004-08-23 | 2005-08-23 | 集積回路ダイシング装置のチャック用供給機構 |
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US (2) | US7829383B2 (ja) |
EP (1) | EP1789998B1 (ja) |
JP (1) | JP5140428B2 (ja) |
KR (1) | KR101299322B1 (ja) |
CN (1) | CN101969038B (ja) |
MY (1) | MY146842A (ja) |
TW (1) | TWI387053B (ja) |
WO (1) | WO2006022597A2 (ja) |
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SG136833A1 (en) * | 2006-05-02 | 2007-11-29 | Rokko Systems Pte Ltd | An improved net table |
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SG143079A1 (en) * | 2006-11-14 | 2008-06-27 | Rokko Systems Pte Ltd | Net block assembly |
US8167523B2 (en) * | 2007-07-12 | 2012-05-01 | Asm Assembly Automation Ltd | Singulation handler comprising vision system |
JP2009200089A (ja) * | 2008-02-19 | 2009-09-03 | Towa Corp | 基板の切断方法及び装置 |
SG156539A1 (en) * | 2008-04-14 | 2009-11-26 | Rokko Ventures Pte Ltd | A system and process for dicing integrated circuits |
NL2001790C2 (nl) * | 2008-07-11 | 2010-01-12 | Fico Bv | Inrichting en werkwijze voor het zagen van elektronische componenten. |
SG172499A1 (en) | 2009-12-23 | 2011-07-28 | Rokko Systems Pte Ltd | Assembly and method for ic unit engagement |
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JPH07240453A (ja) * | 1994-02-28 | 1995-09-12 | Seiko Seiki Co Ltd | 半導体ウエハ加工装置 |
JPH07240452A (ja) * | 1994-02-28 | 1995-09-12 | Seiko Seiki Co Ltd | 半導体ウエハ加工装置 |
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SK14092001A3 (sk) | 1999-04-09 | 2002-05-09 | Basf Aktiengesellschaft | Prekurzory inhibítorov trombínu |
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JP2001196328A (ja) * | 2000-01-12 | 2001-07-19 | Disco Abrasive Syst Ltd | Csp基板の分割方法 |
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JP4696321B2 (ja) * | 2001-03-21 | 2011-06-08 | 株式会社東京精密 | ダイシング装置 |
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JP3765265B2 (ja) | 2001-11-28 | 2006-04-12 | 株式会社東京精密 | ダイシング装置 |
KR100445457B1 (ko) * | 2002-02-25 | 2004-08-21 | 삼성전자주식회사 | 웨이퍼 후면 검사 장치 및 검사 방법 |
KR100483653B1 (ko) | 2002-11-19 | 2005-04-19 | 세크론 주식회사 | 소잉소터시스템 |
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WO2004053967A1 (ja) * | 2002-12-10 | 2004-06-24 | Fujitsu Limited | 半導体装置、配線基板の形成方法及び基板処理装置 |
KR100479417B1 (ko) * | 2003-03-31 | 2005-03-25 | 한미반도체 주식회사 | 반도체 패키지 제조공정용 쏘잉 장치 및 그 제어방법 |
JP4315788B2 (ja) | 2003-11-26 | 2009-08-19 | アピックヤマダ株式会社 | 半導体装置の製造方法及び製造装置 |
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CN100470758C (zh) | 2004-05-07 | 2009-03-18 | 韩美半导体株式会社 | 用于制造半导体封装的切割和处理*** |
KR100749917B1 (ko) | 2004-12-07 | 2007-08-16 | 한미반도체 주식회사 | 반도체 패키지 제조공정용 절단 및 핸들러시스템 |
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WO2006022597A3 (en) | 2006-08-31 |
US20110021003A1 (en) | 2011-01-27 |
CN101969038A (zh) | 2011-02-09 |
WO2006022597A2 (en) | 2006-03-02 |
KR20070048737A (ko) | 2007-05-09 |
KR101299322B1 (ko) | 2013-08-26 |
EP1789998A4 (en) | 2011-09-14 |
EP1789998B1 (en) | 2014-04-09 |
EP1789998A2 (en) | 2007-05-30 |
CN101969038B (zh) | 2012-02-15 |
JP2008511164A (ja) | 2008-04-10 |
MY146842A (en) | 2012-09-28 |
TWI387053B (zh) | 2013-02-21 |
US7829383B2 (en) | 2010-11-09 |
US7939374B2 (en) | 2011-05-10 |
US20080213975A1 (en) | 2008-09-04 |
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