SG136833A1 - An improved net table - Google Patents
An improved net tableInfo
- Publication number
- SG136833A1 SG136833A1 SG200602873-2A SG2006028732A SG136833A1 SG 136833 A1 SG136833 A1 SG 136833A1 SG 2006028732 A SG2006028732 A SG 2006028732A SG 136833 A1 SG136833 A1 SG 136833A1
- Authority
- SG
- Singapore
- Prior art keywords
- regions
- net table
- apertures
- array
- base plate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A net table comprising a net base plate having an array of regions, each for receiving an integrated circuit unit (ICU); each of said regions in communication with a vacuum source; a location device having a plurality of apertures, said apertures having peripheral barrier elements, wherein the location device and net base plate are arranged such that each region corresponds to an aperture, and consequently the peripheral barrier elements and regions forming an array of recesses into which the integrated circuit units fit.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200602873-2A SG136833A1 (en) | 2006-05-02 | 2006-05-02 | An improved net table |
PCT/SG2007/000122 WO2007126393A2 (en) | 2006-05-02 | 2007-04-30 | An improved net table |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200602873-2A SG136833A1 (en) | 2006-05-02 | 2006-05-02 | An improved net table |
Publications (1)
Publication Number | Publication Date |
---|---|
SG136833A1 true SG136833A1 (en) | 2007-11-29 |
Family
ID=38655935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200602873-2A SG136833A1 (en) | 2006-05-02 | 2006-05-02 | An improved net table |
Country Status (2)
Country | Link |
---|---|
SG (1) | SG136833A1 (en) |
WO (1) | WO2007126393A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2005626C2 (en) * | 2010-11-04 | 2012-05-07 | Fico Bv | CARRIER FOR SEPARATED ELECTRONIC COMPONENTS AND METHOD FOR VISUAL INSPECTION OF SEPARATED ELECTRONIC COMPONENTS. |
SG10201404371VA (en) * | 2014-07-24 | 2016-02-26 | Rokko Systems Pte Ltd | Improved dry block assembly |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG84524A1 (en) * | 1998-03-13 | 2001-11-20 | Towa Corp | Nest for dicing, and method and apparatus for cutting tapeless substrate using the same |
JP2004537853A (en) * | 2001-08-01 | 2004-12-16 | リロジックス・インコーポレイテッド・ドゥーイング・ビシネス・アズ・アールディー・オートメーション | Process and apparatus for attaching a semiconductor element to a substrate, and components required for the process |
US7829383B2 (en) * | 2004-08-23 | 2010-11-09 | Rokko Systems Pte Ltd. | Supply mechanism for the chuck of an integrated circuit dicing device |
-
2006
- 2006-05-02 SG SG200602873-2A patent/SG136833A1/en unknown
-
2007
- 2007-04-30 WO PCT/SG2007/000122 patent/WO2007126393A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2007126393A3 (en) | 2008-02-14 |
WO2007126393A2 (en) | 2007-11-08 |
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