JP5128095B2 - Resin sealing molding equipment for electronic parts - Google Patents

Resin sealing molding equipment for electronic parts Download PDF

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JP5128095B2
JP5128095B2 JP2006228941A JP2006228941A JP5128095B2 JP 5128095 B2 JP5128095 B2 JP 5128095B2 JP 2006228941 A JP2006228941 A JP 2006228941A JP 2006228941 A JP2006228941 A JP 2006228941A JP 5128095 B2 JP5128095 B2 JP 5128095B2
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mold
resin
cavity
heat sink
substrate
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JP2008053509A (en
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裕貴 岡本
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Towa Corp
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Towa Corp
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Priority to TW096120517A priority patent/TW200811968A/en
Priority to KR1020070066899A priority patent/KR100848746B1/en
Priority to CNB2007101485207A priority patent/CN100536100C/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Description

本発明は、一方の型と他方の型とから少なくとも成る電子部品の樹脂封止用の成形型を用いて、一方の型に少なくとも設けられたキャビティ内において形成した硬化樹脂によって、少なくとも基板に装着されたチップとキャビティ内に配置された放熱板とを樹脂封止して成形品を成形する、電子部品の樹脂封止成形装置の改良に関するものである。   The present invention uses a molding die for resin sealing of an electronic component comprising at least one mold and the other mold, and is mounted on at least a substrate by a cured resin formed in a cavity provided at least in one mold. The present invention relates to an improvement in a resin seal molding apparatus for an electronic component, in which a molded product is molded by resin sealing a chip and a heat radiating plate disposed in a cavity.

従来から、上型と下型とから成る電子部品の樹脂封止成形用金型を用いて上型と下型とに設けた樹脂成形用キャビティ内に、金型が型締めした状態で流動性樹脂を硬化させて形成した硬化樹脂によって電子部品及び放熱板を封止成形して封止済基板（成形品）を製造することが行われている（例えば、特許文献１及び特許文献２参照。）。   Conventionally, fluidity is maintained in a state where the mold is clamped in a resin molding cavity provided in the upper mold and the lower mold using a mold for resin sealing molding of an electronic component consisting of an upper mold and a lower mold. It has been practiced to manufacture a sealed substrate (molded product) by sealing and molding an electronic component and a heat sink with a cured resin formed by curing a resin (see, for example, Patent Document 1 and Patent Document 2). ).

即ち、特許文献１及び特許文献２では、放熱板を下型側のキャビティ内に位置決めし、且つ半導体チップ等の電子部品が装着されたリードフレームを載置セットし、さらに、この状態で、キャビティ内に流動性樹脂を樹脂通路を介して注入充填する半導体装置の製造方法が開示されている。
特許文献１及び特許文献２では、金型の型締め時に流動性樹脂にて封止成形する際に、キャビティ内の放熱板における移動防止について提案されている。
特許文献１の一例としては、放熱板自体に凸部を設け、凸部とエジェクタとを互いに引っ掛ける様にしてエジェクタに放熱板を固定するもの、特許文献２の一例としては、キャビティ内に配置した放熱板を金型のほぼ樹脂注入口のほぼ軸線上に配置した支持ピンによって支えること、さらには放熱板の下面に位置ずれ防止凹部を介して支持ピンにより放熱板を支持するものが開示されている。 That is, in Patent Document 1 and Patent Document 2, a heat sink is positioned in a cavity on the lower mold side, and a lead frame on which an electronic component such as a semiconductor chip is mounted is placed and set. A manufacturing method of a semiconductor device in which a fluid resin is injected and filled through a resin passage is disclosed.
In patent document 1 and patent document 2, when carrying out sealing molding with a fluid resin at the time of clamping of a metal mold | die, the movement prevention in the heat sink in a cavity is proposed.
As an example of Patent Document 1, a protrusion is provided on the heat dissipation plate itself, and the heat dissipation plate is fixed to the ejector so that the protrusion and the ejector are hooked to each other. As an example of Patent Document 2, the protrusion is disposed in the cavity. A heat sink is supported by a support pin disposed substantially on the axis of the resin injection port of the mold, and further, the heat sink is supported by a support pin through a misalignment prevention recess on the lower surface of the heat sink. Yes.

ところで、特許文献１及び特許文献２における半導体装置は、上下両パッケージ製品を開示しているが、近年のパッケージ製品の薄型化傾向を反映してか、薄型化した上下両パッケージ製品に代えて、上下いずれか一方の片側パッケージ製品が製造されている。さらには、この薄型化した片側パッケージ製品を上下方向に複数枚積層する積層型パッケージ製品も製造されている。
一方、この薄型化した片側パッケージ製品のパッケージ部分に放熱性を向上させるために放熱板を装着することもあり、パッケージ部分の薄型化に加えて放熱板の薄型化も行われている。 By the way, although the semiconductor device in patent document 1 and patent document 2 is disclosing both upper and lower package products, it reflects the recent trend of thinning of package products, or instead of the thinned upper and lower package products, Either one of the upper and lower one side package products is manufactured. Furthermore, a stacked package product is also manufactured in which a plurality of thinned one-side package products are stacked in the vertical direction.
On the other hand, a heat sink may be attached to the package portion of the thinned one-side package product in order to improve heat dissipation, and the heat sink is made thinner in addition to the package portion being thinned.

特開２００１−１１０８３０号公報JP 2001-110830 A 特開平１１−２７４１９６号公報JP-A-11-274196

しかしながら、特許文献１及び特許文献２によれば、薄型化した上下両側、或いは片側パッケージ製品のパッケージ部分（キャビティ内）に放熱板を移動することなく固定（支持）するのには、以下のような問題点が考えられる。
即ち、薄型化した放熱板を移動せず固定（支持）するのには、エジェクタ（支持ピン）が最低でも必ず三本必要となる。そして、三本以上のエジェクタ（支持ピン）に対応し、薄型化した放熱板に形成される凸部の形成、或いは支持ピンの形成においては、非常に精度を高める必要が生じてくる。このことは、コスト高の要因となる。
また、放熱性を向上させるためには、放熱板をパッケージ部分から露出させることが、放熱板の薄型化もあいまって強く要求されている。そのため、薄型化した金型、放熱板或いはエジェクタ（支持ピン）への精度良く且つ複雑な加工をより一層要求されるので、莫大なコストを費やす要因となっている。
さらには、特許文献１及び特許文献２における放熱板を樹脂成形用キャビティ内に位置決めする際に、最低三本以上のエジェクタ（支持ピン）をキャビティ内で水平状態を確実に維持させる必要が生じるので、キャビティ内でのエジェクタ（支持ピン）の制御をシビアに対応しなければならない。つまり、金型内の構造が複雑化する。 However, according to Patent Literature 1 and Patent Literature 2, fixing (supporting) a heat sink without moving it to the package portion (inside the cavity) of the thinned upper and lower sides or one side package product is as follows. There are many problems.
That is, at least three ejectors (support pins) are always required to fix (support) the thinned heat sink without moving. In addition, it is necessary to increase the accuracy in forming convex portions formed on a thin heat sink corresponding to three or more ejectors (support pins) or forming support pins. This is a cause of high costs.
Further, in order to improve the heat dissipation, it is strongly required to expose the heat sink from the package portion, together with the thin heat sink. For this reason, since a more precise and complicated processing is required for a thin mold, a heat sink, or an ejector (support pin), it is a factor of enormous cost.
Furthermore, when positioning the heat sink in Patent Document 1 and Patent Document 2 in the resin molding cavity, it is necessary to reliably maintain the horizontal state of at least three ejectors (support pins) in the cavity. The control of the ejector (support pin) in the cavity must correspond to severe. That is, the structure in the mold becomes complicated.

従って、本発明は、薄型化したパッケージ製品並びに放熱板であっても、電子部品の樹脂封止成形用金型に設けた樹脂成形用キャビティ内に突出部を形成することにより、放熱板をキャビティ内に容易（単純）に且つ精度良く位置決めすることができる電子部品の樹脂封止成形装置を提供することを目的とする。   Therefore, the present invention provides a heat sink that has a reduced thickness by forming a protrusion in a resin molding cavity provided in a mold for resin sealing molding of electronic components, even for thin package products and heat sinks. It is an object of the present invention to provide an electronic component resin sealing molding apparatus that can be easily (simple) and accurately positioned inside.

そこで、上述した技術的課題を解決するための本発明に係る電子部品の樹脂封止成形装置は、一方の型と該一方の型に相対向する他方の型とから少なくとも成る電子部品の樹脂封止用の成形型と、少なくとも一方の型に設けられたキャビティとを備え、成形型が型締めされた状態においてキャビティ内に存在する流動性樹脂を硬化させることによって硬化樹脂を形成し、少なくとも基板に装着されたチップとキャビティ内に配置された放熱板とを硬化樹脂によって樹脂封止して成形品を成形する電子部品の樹脂封止成形装置であって、キャビティの内底面に設けられた複数の突出部を備え、キャビティ内に放熱板が配置された状態において、放熱板が有する水平部とキャビティの内底面とが接触し、放熱板が有する水平部に設けられた複数の開口部において複数の突出部がそれぞれ貫通することによって、キャビティの内底面において放熱板が位置決めされ、かつ、移動しないように仮固定され、複数の突出部のうちの１つの突出部は、キャビティに注入される流動性樹脂が流動する樹脂通路を構成するゲートピースの一部として設けられ、ゲートピースが成形型から着脱自在に設けられることを特徴とする。 Therefore, an electronic component resin sealing molding apparatus according to the present invention for solving the technical problem described above includes a resin sealing of an electronic component comprising at least one mold and the other mold opposite to the one mold. A fixed mold and a cavity provided in at least one mold, and a cured resin is formed by curing a flowable resin existing in the cavity in a state where the mold is clamped, and at least a substrate A resin-sealed molding apparatus for electronic parts that molds a molded product by resin-sealing a chip mounted on a chip and a heat dissipation plate disposed in the cavity with a cured resin, and a plurality of moldings provided on the inner bottom surface of the cavity In the state where the heat sink is disposed in the cavity, the horizontal portion of the heat sink and the inner bottom surface of the cavity are in contact with each other, and a plurality of portions provided on the horizontal portion of the heat sink By plurality of protrusions penetrate respectively in the mouth are heat sink positioned in the inner bottom surface of the cavity, and is temporarily fixed so as not to move, one protrusion of the plurality of protrusions, the cavity The flowable resin to be injected is provided as a part of the gate piece constituting the resin passage through which the flowable resin flows, and the gate piece is provided detachably from the mold .

また、本発明に係る電子部品の樹脂封止成形装置は、上述した樹脂封止成形装置において、複数の突出部のうち１つの突出部以外の突出部は、成形品突き出し用の離型ピンとして機能することを特徴とする。 Moreover, the resin sealing molding apparatus of the electronic component according to the present invention is the above-described resin sealing molding apparatus, wherein the protrusions other than one of the plurality of protrusions are used as mold release pins for projecting the molded product. It is characterized by functioning .

本発明によれば、電子部品の樹脂封止用の成形用金型（成形型）に設けた樹脂成形用キャビティ内に放熱板を容易（単純）に且つ精度良く位置決めすることにより、放熱板とチップが装着された基板とを有するパッケージ製品（成形品）の生産性をより一層向上することができると云う優れた効果を奏する。   According to the present invention, by positioning a heat sink easily (simple) and accurately in a resin molding cavity provided in a molding die (molding die) for resin sealing of electronic components, There is an excellent effect that the productivity of the package product (molded product) having the substrate on which the chip is mounted can be further improved.

以下、本実施形態において、図１及び図５を用いて詳細に説明する。
図１及び図２は、電子部品の樹脂封止成形装置に搭載された成形型の要部である。
図３から図５は、本装置に搭載された他の成形型の要部である。 Hereinafter, in this embodiment, it demonstrates in detail using FIG.1 and FIG.5.
1 and 2 show the main part of a molding die mounted on a resin sealing molding apparatus for electronic components.
3 to 5 show the main part of another mold mounted on this apparatus.

まず、図１及び図２に示す電子部品の樹脂封止用の成形用金型（成形型）の構造をベースにし、（成形型）を用いる樹脂封止成形方法について説明する。図３から図５においても、図１及び図２に示す符号を転用して説明する。
即ち、成形型は、他方の型に相当する固定上型１と、該固定上型１に対向して配置され一方の型に相当する可動中間型２と、可動中間型２の下方に配置され別の型に相当する下型（図示なし）とを有する。成形型は次の構成要素を含む。それは、可動中間型２のパーティングライン面（ P.L面）に設けられ且つ放熱板５が配置されてセットされる樹脂成形用のキャビティ３と、ＩＣ等のチップ１１が装着された基板６が供給されセットされるセット用凹所７と、下型に配置された樹脂材料供給用のポット（図示なし）と、ポット内に嵌装された樹脂加圧用のプランジャ（図示なし）と、である。更に、ポットとキャビティ３とを連通させる樹脂移送用の樹脂通路８と、固定上型１と可動中間型２とに少なくとも夫々配設されたカートリッジヒータ、及び／又はフレキシブルヒータ等の加熱手段（図示なし）と、である。更に、キャビティ３内で成形された樹脂成形体（硬化樹脂）を含む成形品（図示なし）をキャビティ３内から突き出して離型させる成形品突き出し用の離型ピン（エジェクターピン１０）と、キャビティ３と成形型の外部とを連通させるエアベント（図示なし）と、である。 First, a resin sealing molding method using (molding die) based on the structure of a molding die (molding die) for resin sealing of an electronic component shown in FIGS. 1 and 2 will be described. 3 to 5 will be described using the reference numerals shown in FIGS.
That is, the molding die is disposed below the fixed upper die 1 corresponding to the other die, the movable intermediate die 2 that is disposed opposite to the fixed upper die 1 and corresponds to one die, and the movable intermediate die 2. It has a lower mold (not shown) corresponding to another mold. The mold includes the following components. It is provided with a resin molding cavity 3 provided on a parting line surface (PL surface) of the movable intermediate mold 2 and set with a heat sink 5 disposed thereon, and a substrate 6 on which a chip 11 such as an IC is mounted. The set recess 7 is set, the resin material supply pot (not shown) arranged in the lower mold, and the resin pressurizing plunger (not shown) fitted in the pot. Further, a resin passage 8 for transferring the resin that allows the pot and the cavity 3 to communicate with each other, and heating means such as a cartridge heater and / or a flexible heater disposed at least in the fixed upper mold 1 and the movable intermediate mold 2 (illustrated). None). Further, a molded product ejection pin (ejector pin 10) for ejecting a molded product (not shown) including a resin molded body (cured resin) molded in the cavity 3 from the cavity 3 and releasing the mold, and a cavity 3 and an air vent (not shown) that communicates the outside of the mold.

成形型としては、図１及び図２においては三型構造にしているが、二型さらには四型以上の成形型の構造を採用することができる。また、本装置に搭載される成形型を単数個配設する構造ではなく、成形型を含むモジュールを所要数だけ並列に配設するモジュール構造を採用することができる。   As the mold, a three-type structure is used in FIGS. 1 and 2, but it is possible to adopt a structure of two or more molds. In addition, a module structure in which a required number of modules including the molds are arranged in parallel can be adopted instead of a structure in which a single mold is mounted on the apparatus.

図１及び図２に示されているように、基板６の上にはＩＣ等のチップ１１が装着され、チップ１１と基板６とはワイヤ１２によって電気的に接続されている。チップ１１とワイヤ１２とは、樹脂封止される対象である被封止物４である。図１及び図２には、基板６に対してチップ１１を単数個配置した例を示す。これに限らず、チップ１１を基板６に対して複数個だけ装着するマップ型或いはマトリックス型の基板６を採用することができる。このマップ型或いはマトリックス型の基板６であれば、複数個のチップ１１に対応してキャビティ３を所要数だけ、或いは複数のチップ１１を一群とする一括キャビティを単数群又は所要複数群だけ、成形型（この場合、可動中間型２）に形成することができる。
また、基板６として、ワイヤボンディング基板に限定されず、フリップチップ基板、或いはウェーハレベルパッケージ基板に、本発明を適用することができる。
さらには、上記した様々な基板においてチップ１１を上下方向に所要数積層する積層型パッケージ基板にも、本発明を適用することができる。 As shown in FIGS. 1 and 2, a chip 11 such as an IC is mounted on the substrate 6, and the chip 11 and the substrate 6 are electrically connected by a wire 12. The chip 11 and the wire 12 are objects to be sealed 4 that are objects to be sealed with resin. 1 and 2 show an example in which a single chip 11 is arranged on the substrate 6. However, the present invention is not limited to this, and a map type or matrix type substrate 6 in which only a plurality of chips 11 are mounted on the substrate 6 can be employed. In the case of this map type or matrix type substrate 6, a required number of cavities 3 corresponding to a plurality of chips 11, or a single group or a plurality of required groups of collective cavities including a plurality of chips 11 as a group are formed. A mold (in this case, the movable intermediate mold 2) can be formed.
The substrate 6 is not limited to a wire bonding substrate, and the present invention can be applied to a flip chip substrate or a wafer level package substrate.
Furthermore, the present invention can also be applied to a stacked package substrate in which a required number of chips 11 are stacked in the vertical direction on the various substrates described above.

図１及び図２に示されているように、放熱板５は、薄型化したパッケージ製品の動向を反映し、被封止物４に限りなく接近した非接触状態で、基板６における被封止物４の側においてキャビティ３の内底面に載置される。この載置された放熱板５は、樹脂封止成形後には、樹脂成形体９の天面において水平部１５ａが露出した状態になる。図１には、樹脂封止成形後の硬化樹脂からなる樹脂成形体９が二点鎖線によって仮想的に示されている。この樹脂成形体９から露出した状態の放熱板５により、より一層放熱性を向上させ、さらに薄型化したパッケージ製品に適応する成形品が得られる。そして、放熱板５は、樹脂封止成形前においてワイヤボンディング基板に固着していない。つまり、樹脂封止されることによって、固定上型１と可動中間型２との内部にセットされた被封止物４及び放熱板５を樹脂材料によって一体化させる。そして、図１に示す放熱板５は、少なくとも水平部１５ａと水平部１５ａを支持する支持部１６とによって構成される。水平部１５ａ・支持部１６には、樹脂封止成形時において加熱溶融化された樹脂材料（流動性樹脂１７）が円滑に流動するように開口部分が所要箇所形成される。水平部１５ａには、位置決め用の開口部１５ｂが設けられる。なお、放熱板５のうち主に水平部１５ａの外形（平面形状）は、円形或いは多角形状となる。   As shown in FIGS. 1 and 2, the heat sink 5 reflects the trend of thinned package products, and is sealed in the substrate 6 in a non-contact state as close as possible to the sealed object 4. It is placed on the inner bottom surface of the cavity 3 on the object 4 side. The placed heat sink 5 is in a state where the horizontal portion 15a is exposed on the top surface of the resin molded body 9 after the resin sealing molding. In FIG. 1, a resin molded body 9 made of a cured resin after resin sealing molding is virtually shown by a two-dot chain line. With the heat radiating plate 5 exposed from the resin molded body 9, a heat-radiating property can be further improved, and a molded product that can be applied to a thinner package product can be obtained. And the heat sink 5 is not adhering to the wire bonding board | substrate before resin sealing molding. That is, by being resin-sealed, the object to be sealed 4 and the heat radiating plate 5 set inside the fixed upper mold 1 and the movable intermediate mold 2 are integrated with the resin material. And the heat sink 5 shown in FIG. 1 is comprised by the support part 16 which supports at least the horizontal part 15a and the horizontal part 15a. The horizontal portion 15a and the support portion 16 are formed with required openings so that the resin material (fluid resin 17) melted by heating at the time of resin sealing molding flows smoothly. The horizontal portion 15a is provided with a positioning opening 15b. Note that the outer shape (planar shape) of the horizontal portion 15a of the heat sink 5 is mainly circular or polygonal.

樹脂通路８は、例えば、ポットに対向配置した樹脂分配用のカル（図示なし）とランナ・ゲート（スプル）とから構成されている。図１において、キャビティ３の略中央部に開口したゲート口１３から流動性樹脂１７がキャビティ３内に注入されて充填される（図２参照）。
ゲート口１３は、可動中間型２に設けられたゲートピース１４に形成される。そして、ゲートピース１４は、可動中間型２に対して着脱自在であるように構成されている。
ゲートピース１４におけるゲート口１３の先端部分である突出部１８ａは、キャビティ３の水平面（内底面）よりも突出した状態で、且つ放熱板５がキャビティ３内に載置されセットされた時に、放熱板５の水平部１５ａに設けられた開口部１５ｂを貫通する。エジェクターピン１０の先端部分である突出部１８ｂは、キャビティ３の水平面（内底面）よりも突出した状態で、且つ放熱板５がキャビティ３内に載置されセットされた時に、放熱板５の水平部１５ａに設けられた開口部１５ｂを貫通する。つまり、図１に示すように、突出部１８は、ゲートピース１４のゲート口１３を含む突出部１８ａ及びエジェクターピン１０の突出部１８ｂの総称である。
このように、突出部１８ａ・１８ｂの二箇所が、放熱板５の水平部１５ａの開口部１５ｂにおいて放熱板５を貫通する。このことにより、放熱板５が効率良く位置決めされる。このとき、キャビティ３の水平面（内底面）と放熱板５の水平部１５ａとが接触した状態で、放熱板５がキャビティ３の水平面（内底面）に載置されてセットされる。また、突出部１８の先端部位が、放熱板５の水平部１５ａにおける開口部１５ｂを貫通した状態で、キャビティ３内に突出している。突出部１８が開口部１５ｂを貫通した状態でキャビティ３内に突出することにより、放熱板５が上下方向又は水平方向に移動することを効率良く防止することができる。
従って、キャビティ３内における突出部１８としては、略中央部分の突出部１８ａと、突出部１８ａ周囲の所定箇所にもう一方の突出部１８ｂとの二箇所を配置して構成するだけでよい。これにより、放熱板５をキャビティ３内に容易（単純）に且つ精度良く位置決めすることができる。加えて、放熱板５が上下方向又は水平方向に移動することを効率良く防止することができる。 The resin passage 8 is constituted by, for example, a resin distribution cull (not shown) and a runner gate (sprue) arranged opposite to the pot. In FIG. 1, a fluid resin 17 is injected into the cavity 3 from a gate port 13 opened at a substantially central portion of the cavity 3 (see FIG. 2).
The gate port 13 is formed in the gate piece 14 provided in the movable intermediate mold 2. The gate piece 14 is configured to be detachable from the movable intermediate mold 2.
The protrusion 18a, which is the tip of the gate port 13 in the gate piece 14, protrudes from the horizontal surface (inner bottom surface) of the cavity 3, and heat is dissipated when the heat sink 5 is placed and set in the cavity 3. It penetrates the opening 15b provided in the horizontal portion 15a of the plate 5. The protrusion 18b, which is the tip of the ejector pin 10, protrudes from the horizontal surface (inner bottom surface) of the cavity 3 and when the heat sink 5 is placed and set in the cavity 3, the horizontal position of the heat sink 5 is set. It penetrates the opening 15b provided in the part 15a. That is, as shown in FIG. 1, the protruding portion 18 is a generic name for the protruding portion 18 a including the gate port 13 of the gate piece 14 and the protruding portion 18 b of the ejector pin 10.
In this way, the two portions of the projecting portions 18 a and 18 b penetrate the heat radiating plate 5 at the opening 15 b of the horizontal portion 15 a of the heat radiating plate 5. Thereby, the heat sink 5 is positioned efficiently. At this time, the radiator plate 5 is placed and set on the horizontal plane (inner bottom surface) of the cavity 3 in a state where the horizontal plane (inner bottom surface) of the cavity 3 and the horizontal portion 15 a of the radiator plate 5 are in contact with each other. Further, the tip portion of the protruding portion 18 protrudes into the cavity 3 in a state of penetrating the opening portion 15 b in the horizontal portion 15 a of the heat radiating plate 5. By projecting into the cavity 3 with the projecting portion 18 penetrating through the opening 15b, the heat radiating plate 5 can be efficiently prevented from moving in the vertical direction or the horizontal direction.
Therefore, the projecting portion 18 in the cavity 3 only needs to be configured by arranging the projecting portion 18a at the substantially central portion and the other projecting portion 18b at a predetermined location around the projecting portion 18a. Thereby, the heat sink 5 can be easily (simple) and accurately positioned in the cavity 3. In addition, it is possible to efficiently prevent the heat radiating plate 5 from moving in the vertical direction or the horizontal direction.

被封止物４を有する基板６及び放熱板５を、固定上型１と可動中間型２とに載置してセットする。この場合には、基板６における被封止物４の側を下方に向けた状態とする。この被封止物４が収容されるキャビティ３が可動中間型２に設けられる。可動中間型２に形成されたキャビティ３の水平面（内底面）に突き出した二箇所の突出部１８（１８ａ・１８ｂ）が、設けられる。
まず、固定上型１と可動中間型２との型開き時に、放熱板５における水平部１５ａにおける開口部１５ｂに二箇所の突出部１８（１８ａ・１８ｂ）を貫通させて、この状態で放熱板５を位置決めする。位置決めされた放熱板５がキャビティ３内に供給されてセットされた状態で、被封止物４が装着された基板６を固定上型１に載置してセットする。
つまり、突出部１８に対して放熱板５を位置決めする場合には、図１及び図２では、ゲートピース１４における突出部１８ａとエジェクターピン１０の突出部１８ｂとの二箇所を、放熱板５の水平部１５ａの開口部１５ｂに貫通させて挿入する。図３では、エジェクターピン１０の先端部分である突出部１８ｂとさらに同様のエジェクターピン１０の別の先端部分である突出部１８ｃとの二箇所を、放熱板５の水平部１５ａの開口部１５ｂにおいて貫通させる。この図３では、ゲートピース１４の先端部分はキャビティ３内に突き出さず、キャビティ３の水平面（内底面）とゲート口１３とが略水平状態で形成される。当然のことながら、放熱板５の外形形状（平面形状）が、例えば、真円形状であれば、ゲートピース１４の先端部分からなる突出部１８ａ（一箇所）をキャビティ３内の略中央（中心）部分に設けて、突出部１８ａが放熱板５を貫通した状態で、放熱板５を位置決めすることができる。
また、図１から図３では、ゲートピース１４をキャビティ３内の略中央部分に形成している。図４及び図５に示すフリップチップ基板を樹脂封止する場合には、該チップ１１と基板７との間にも流動性樹脂１７を注入して充填すること（アンダーフィル）も考えられる。この場合には、図４では、ゲート口１３を、キャビティ３の水平面（内底面）における端部に配置することができる。図５では、ゲート口１３を、キャビティ３の側面部分において基板６に接触する状態で開口させることができる。図３から図５では、放熱板５を位置決めする場合に、エジェクターピン１０の二箇所の先端部分１８ｂ・１８ｃを放熱板５に貫通させた状態で行う。そして、図１から図４までは、樹脂通路８が設けられたゲートピース１４を可動中間型２に対して着脱自在の構造にしている。図５では、可動中間型２を有さない二型構造における可動下型１９に樹脂通路８を設けて、可動下型１９に対して着脱自在であるゲートピースが存在しない構造にしている。
以上のとおり、薄型化した成形品及び放熱板５を対象とする場合であっても、放熱板５の開口部１５ｂを貫通してキャビティ３内に突出する突出部１８を形成することにより、キャビティ３内において放熱板５を容易（単純）に且つ精度良く位置決めすることができる。 The substrate 6 and the heat radiating plate 5 having the objects to be sealed 4 are placed and set on the fixed upper mold 1 and the movable intermediate mold 2. In this case, the state of the substrate 4 on the substrate 6 is directed downward. A cavity 3 in which the object to be sealed 4 is accommodated is provided in the movable intermediate mold 2. Two protruding portions 18 (18a and 18b) protruding from the horizontal surface (inner bottom surface) of the cavity 3 formed in the movable intermediate mold 2 are provided.
First, when the fixed upper mold 1 and the movable intermediate mold 2 are opened, the two projecting portions 18 (18a and 18b) are passed through the opening 15b in the horizontal portion 15a of the heat sink 5, and in this state the heat sink 5 is positioned. In a state where the positioned heat sink 5 is supplied and set in the cavity 3, the substrate 6 on which the object to be sealed 4 is mounted is placed on the fixed upper mold 1 and set.
That is, when positioning the heat sink 5 with respect to the protrusion 18, in FIG. 1 and FIG. 2, two portions of the protrusion 18 a of the gate piece 14 and the protrusion 18 b of the ejector pin 10 are connected to the heat sink 5. It is inserted through the opening 15b of the horizontal portion 15a. In FIG. 3, two portions of the protruding portion 18 b that is the tip portion of the ejector pin 10 and the protruding portion 18 c that is another tip portion of the same ejector pin 10 are arranged at the opening portion 15 b of the horizontal portion 15 a of the radiator plate 5. To penetrate. In FIG. 3, the tip portion of the gate piece 14 does not protrude into the cavity 3, and the horizontal plane (inner bottom surface) of the cavity 3 and the gate port 13 are formed in a substantially horizontal state. As a matter of course, if the outer shape (planar shape) of the heat sink 5 is, for example, a perfect circle shape, the protruding portion 18a (one place) consisting of the tip portion of the gate piece 14 is arranged at the approximate center (center) in the cavity 3. ), And the heat sink 5 can be positioned in a state where the protrusion 18a penetrates the heat sink 5.
Further, in FIGS. 1 to 3, the gate piece 14 is formed at a substantially central portion in the cavity 3. When the flip chip substrate shown in FIGS. 4 and 5 is resin-sealed, it is conceivable that the fluid resin 17 is also injected and filled between the chip 11 and the substrate 7 (underfill). In this case, in FIG. 4, the gate port 13 can be disposed at the end of the cavity 3 on the horizontal plane (inner bottom surface). In FIG. 5, the gate port 13 can be opened while being in contact with the substrate 6 at the side surface portion of the cavity 3. 3 to 5, when the heat sink 5 is positioned, the two tip portions 18 b and 18 c of the ejector pin 10 are passed through the heat sink 5. 1 to 4, the gate piece 14 provided with the resin passage 8 is configured to be detachable from the movable intermediate mold 2. In FIG. 5, a resin passage 8 is provided in the movable lower mold 19 in the two-type structure that does not have the movable intermediate mold 2, so that there is no gate piece that is detachable from the movable lower mold 19.
As described above, even when the molded product and the heat radiating plate 5 are thinned, by forming the protruding portion 18 that penetrates the opening 15b of the heat radiating plate 5 and protrudes into the cavity 3, the cavity 3, the heat radiating plate 5 can be easily (simple) and accurately positioned.

まず、予め、加熱手段によって固定上型１と可動中間型２とを樹脂成形温度にまで加熱する。次に、可動中間型２（或いは、可動下型１９）の所定部分が（図１及び図２においては二箇所の突出部１８ａ・１８ｂが、図３から図５においては二箇所の突出部１８ｂ・１８ｃが）、放熱板５の水平部１５ａにおける開口部１５ｂを貫通した状態で放熱板５を位置決めする。次に、放熱板５の開口部１５ｂを貫通した状態で位置決めされた放熱板５がキャビティ３内に載置された状態で、被封止物４が装着された基板６（或いは、リードフレーム）を固定上型１のセット用凹所７に載置してセットし、且つ、ポット内に樹脂材料を供給する。次に、可動中間型２（或いは、可動下型１９）を上動して、可動中間型２（或いは、可動下型１９）と固定上型１とを型締めする。このとき、キャビティ３内には放熱板５が載置されている。
次に、ポット内で加熱溶融化された樹脂材料をプランジャで加圧することによりキャビティ３内に流動性樹脂１７を注入して充填する。これにより、キャビティ３内において、放熱板５及び被封止物４とその周辺の基板６とが流動性樹脂１７に浸漬される（浸かった状態になる）。キャビティ３内において流動性樹脂１７を硬化させて、硬化樹脂を形成する。放熱板５及び被封止物４とその周辺の基板６とを硬化樹脂によって樹脂封止する。
流動性樹脂１７を硬化させて硬化樹脂を形成するために必要な所要時間の経過後、可動中間型２（或いは、可動下型１９）を下動して、成形型を型開きする。放熱板５を位置決めするために用いるエジェクターピン１０を含めたエジェクターピン１０を使用して、キャビティ３から樹脂成形体９を突き出して離型する。
また、次に、成形型から樹脂成形体９と基板６とを有する成形体を取り出すことができる。 First, the fixed upper mold 1 and the movable intermediate mold 2 are heated to a resin molding temperature in advance by heating means. Next, a predetermined portion of the movable intermediate mold 2 (or the movable lower mold 19) has two protrusions 18a and 18b in FIGS. 1 and 2, and two protrusions 18b in FIGS. 18c), the heat sink 5 is positioned in a state of passing through the opening 15b in the horizontal portion 15a of the heat sink 5. Next, the substrate 6 (or lead frame) on which the object to be sealed 4 is mounted in a state in which the heat sink 5 positioned in a state of passing through the opening 15b of the heat sink 5 is placed in the cavity 3. Is placed in the setting recess 7 of the fixed upper mold 1 and set, and a resin material is supplied into the pot. Next, the movable intermediate mold 2 (or the movable lower mold 19) is moved up, and the movable intermediate mold 2 (or the movable lower mold 19) and the fixed upper mold 1 are clamped. At this time, the heat radiating plate 5 is placed in the cavity 3.
Next, the resin material heated and melted in the pot is pressurized with a plunger to inject and fill the fluid resin 17 into the cavity 3. Thereby, in the cavity 3, the heat sink 5 and the to-be-sealed thing 4 and the board | substrate 6 of the circumference | surroundings are immersed in the fluid resin 17 (it will be in the state immersed). The fluid resin 17 is cured in the cavity 3 to form a cured resin. The heat sink 5 and the object to be sealed 4 and the peripheral substrate 6 are resin-sealed with a cured resin.
After the time required to form the cured resin by curing the fluid resin 17 is reached, the movable intermediate mold 2 (or the movable lower mold 19) is moved down to open the mold. Using the ejector pins 10 including the ejector pins 10 used for positioning the heat sink 5, the resin molded body 9 is protruded from the cavity 3 and released.
Next, the molded body having the resin molded body 9 and the substrate 6 can be taken out from the mold.

即ち、本実施形態によれば、電子部品の樹脂封止用の成形用金型（成形型）に設けられた樹脂成形用キャビティ３内に、放熱板５を容易（単純）に且つ精度良く位置決めすることができる。加えて、放熱板５が上下方向又は水平方向に移動することを効率良く防止することができる。これらのことにより、放熱板５及びチップ１１を有するパッケージ製品（成形品）の生産性をより一層向上させることができる。   That is, according to the present embodiment, the heat radiating plate 5 is easily (simple) and accurately positioned in the resin molding cavity 3 provided in the molding die (molding die) for resin sealing of electronic components. can do. In addition, it is possible to efficiently prevent the heat radiating plate 5 from moving in the vertical direction or the horizontal direction. By these things, productivity of the package product (molded product) which has the heat sink 5 and the chip | tip 11 can be improved further.

本発明に係る電子部品の樹脂封止成形装置に搭載された樹脂封止成形用金型を概略的に示す概略断面図であり、金型の型開き状態を示す。It is a schematic sectional drawing which shows schematically the resin sealing molding die mounted in the resin sealing molding apparatus of the electronic component which concerns on this invention, and shows the mold open state of a metal mold | die. 図１に示す金型であって、金型の型締め時における流動性樹脂注入充填状態を示す。It is a metal mold | die shown in FIG. 1, Comprising: The fluid resin injection | pouring filling state at the time of mold clamping of a metal mold | die is shown. 図１に示す金型とは別の金型であって、金型の型締め時における流動性樹脂注入充填状態を示す。FIG. 1 shows a mold different from the mold shown in FIG. 1 and shows a fluid resin injection and filling state when the mold is clamped. 図１に示す金型とは別の金型であって、金型の型締め時における流動性樹脂注入充填状態を示す。FIG. 1 shows a mold different from the mold shown in FIG. 1 and shows a fluid resin injection and filling state when the mold is clamped. 図１に示す金型とは別の金型であって、金型の型締め時における流動性樹脂注入充填状態を示す。FIG. 1 shows a mold different from the mold shown in FIG. 1 and shows a fluid resin injection and filling state when the mold is clamped.

１ 固定上型
２ 可動中間型
３ キャビティ
４ 被封止物
５ 放熱板
６ 基板
７ セット用凹所
８ 樹脂通路
９ 樹脂成形体（硬化樹脂）
１０ エジェクターピン（離型ピン）
１１ チップ
１２ ワイヤ
１３ ゲート口
１４ ゲートピース
１５ａ 水平部
１５ｂ 開口部
１６ 支持部
１７ 流動性樹脂
１８（１８ａ・１８ｂ・１８ｃ） 突出部
１９ 可動下型 DESCRIPTION OF SYMBOLS 1 Fixed upper type | mold 2 Movable intermediate type | mold 3 Cavity 4 To-be-sealed thing 5 Heat sink 6 Substrate 7 Set recess 8 Resin passage 9 Resin molding (cured resin)
10 Ejector pin (release pin)
DESCRIPTION OF SYMBOLS 11 Chip 12 Wire 13 Gate port 14 Gate piece 15a Horizontal part 15b Opening part 16 Support part 17 Flowable resin 18 (18a * 18b * 18c) Protrusion part 19 Movable lower type | mold

Claims (2)

一方の型と該一方の型に相対向する他方の型とから少なくとも成る電子部品の樹脂封止用の成形型と、少なくとも前記一方の型に設けられたキャビティとを備え、前記成形型が型締めされた状態において前記キャビティ内に存在する流動性樹脂を硬化させることによって硬化樹脂を形成し、少なくとも基板に装着されたチップと前記キャビティ内に配置された放熱板とを前記硬化樹脂によって樹脂封止して成形品を成形する電子部品の樹脂封止成形装置であって、
前記キャビティの内底面に設けられた複数の突出部を備え、
前記キャビティ内に前記放熱板が配置された状態において、前記放熱板が有する水平部と前記キャビティの内底面とが接触し、
前記放熱板が有する水平部に設けられた複数の開口部において前記複数の突出部がそれぞれ貫通することによって、前記キャビティの内底面において前記放熱板が位置決めされ、かつ、移動しないように仮固定され、
前記複数の突出部のうちの１つの突出部は、前記キャビティに注入される前記流動性樹脂が流動する樹脂通路を構成するゲートピースの一部として設けられ、
前記ゲートピースが前記成形型から着脱自在に設けられることを特徴とする電子部品の樹脂封止成形装置。 A mold for resin-sealing an electronic component comprising at least one mold and the other mold opposite to the one mold, and at least a cavity provided in the one mold, wherein the mold is a mold A cured resin is formed by curing the fluid resin present in the cavity in the clamped state, and at least the chip mounted on the substrate and the heat radiating plate disposed in the cavity are sealed with the cured resin. A resin sealing molding apparatus for electronic parts that stops and molds a molded product,
A plurality of protrusions provided on the inner bottom surface of the cavity;
In the state where the heat sink is disposed in the cavity, the horizontal portion of the heat sink and the inner bottom surface of the cavity are in contact,
The plurality of protrusions pass through the plurality of openings provided in the horizontal portion of the heat sink, whereby the heat sink is positioned on the inner bottom surface of the cavity and temporarily fixed so as not to move. ,
One protrusion of the plurality of protrusions is provided as a part of a gate piece constituting a resin passage through which the fluid resin injected into the cavity flows,
A resin-sealed molding apparatus for electronic parts, wherein the gate piece is detachably provided from the mold. 請求項１に記載の電子部品の樹脂封止成形装置において、
前記複数の突出部のうち前記１つの突出部以外の突出部は、成形品突き出し用の離型ピンとして機能することを特徴とする電子部品の樹脂封止成形装置。 In the resin sealing molding apparatus of the electronic component according to claim 1,
A protruding portion other than the one protruding portion among the plurality of protruding portions functions as a release pin for protruding a molded product .
JP2006228941A 2006-08-25 2006-08-25 Resin sealing molding equipment for electronic parts Active JP5128095B2 (en)

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JP2006228941A JP5128095B2 (en) 2006-08-25 2006-08-25 Resin sealing molding equipment for electronic parts
TW096120517A TW200811968A (en) 2006-08-25 2007-06-07 Resin sealing apparatus for electronics parts
KR1020070066899A KR100848746B1 (en) 2006-08-25 2007-07-04 Resin sealing apparatus for electronics parts
CNB2007101485207A CN100536100C (en) 2006-08-25 2007-08-22 Resin sealing shaping device for electronic parts

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