TWI753157B - Molding mold and resin molding method - Google Patents
Molding mold and resin molding method Download PDFInfo
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- TWI753157B TWI753157B TW107114708A TW107114708A TWI753157B TW I753157 B TWI753157 B TW I753157B TW 107114708 A TW107114708 A TW 107114708A TW 107114708 A TW107114708 A TW 107114708A TW I753157 B TWI753157 B TW I753157B
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- 229920005989 resin Polymers 0.000 title claims abstract description 208
- 239000011347 resin Substances 0.000 title claims abstract description 208
- 238000000465 moulding Methods 0.000 title claims abstract description 144
- 238000000034 method Methods 0.000 title claims description 45
- 238000000926 separation method Methods 0.000 claims abstract description 5
- 230000007246 mechanism Effects 0.000 claims description 99
- 238000010438 heat treatment Methods 0.000 claims description 32
- 238000000748 compression moulding Methods 0.000 claims description 17
- 238000001721 transfer moulding Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 9
- 238000012423 maintenance Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 5
- 238000007664 blowing Methods 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 230000003578 releasing effect Effects 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 238000007688 edging Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920009441 perflouroethylene propylene Polymers 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- 238000001179 sorption measurement Methods 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
- B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
提供一種模製模具，係即便工件端面精度、工件上產生階差、或者不論樹脂的黏度為如何，皆可防止樹脂漏洩而使保養省工並維持高成形品質。 Provided is a molding die, which can prevent resin leakage, save labor and maintain high molding quality even if the workpiece end face accuracy, the level difference on the workpiece, or regardless of the viscosity of the resin.
在下模1具備以與該下模夾持面分離並設置成可接觸離開地移動的可動模件9，在閉模時，工件W之和樹脂路徑交叉的端部被夾入可動模件9與下模1之間，在可動模件9與相對的上模2的夾持面之間形成連通於模穴凹部2e的樹脂路徑的一部分2c、9b。 The lower mold 1 is provided with a movable mold 9 that is separated from the clamping surface of the lower mold and is provided so as to be movable in contact and separation. When the mold is closed, the end portion where the workpiece W and the resin path intersect is sandwiched between the movable mold 9 and the movable mold 9. Between the lower molds 1, a part 2c, 9b of the resin path|route which communicates with the cavity recessed part 2e is formed between the movable mold 9 and the clamping surface of the upper mold|type 2 which opposes.
Description
本發明係有關使載置於模具載置面的工件滑動並定位且夾持的模製模具及使用模製模具之樹脂模製方法。 The present invention relates to a molding die that slides, positions, and clamps a workpiece placed on a die placement surface, and a resin molding method using the molding die.
樹脂密封裝置係將工件搬入已開模的模製模具並在定位後夾持並進行樹脂密封。作為工件，可使用樹脂基板(有機基板)、陶瓷基板、鋁基板、半導體晶圓、大型基板或導線架等(以下，僅簡稱為「工件」)，連同密封樹脂一起被搬入裝置所保持並朝模製模具搬入。工件係被模製模具所夾持，熔融的模製樹脂橫切(橫越)基板往模穴壓送以進行樹脂模製。 The resin sealing device transports the workpiece into the opened mold, clamps it after positioning, and performs resin sealing. As the workpieces, resin substrates (organic substrates), ceramic substrates, aluminum substrates, semiconductor wafers, large substrates, lead frames, etc. (hereinafter, simply referred to as "workpieces") can be used, and are held by the loading device together with the sealing resin and moved toward the workpiece. The molding die is moved in. The workpiece is held by the molding die, and the molten molding resin is press-fed across (across) the substrate to the cavity for resin molding.
在如有機基板般端面精度低的情況或模製樹脂黏度低的工件之情況，在進行從設置於工件側面的側澆口進行轉送成形的情況，由於樹脂的流道會橫越模具流道澆口與載置於工件載置部(凹部)的工件端面及工件上而通過，故會發生樹脂從該工件端面的微小間隙部分漏洩。 In the case of low end surface accuracy such as organic substrates or in the case of molding a workpiece with a low resin viscosity, when transfer molding is performed from a side gate provided on the side of the workpiece, the resin runner will cross the mold runner. Since the port passes through the workpiece end face and the workpiece placed on the workpiece placement portion (recess), resin leaks from the minute gap portion of the workpiece end face.
為解消此不理想情況，申請人提案一種模製模具，係將工件載置於嵌件塊並閉模，且於推動工件端面將相反側端面推抵於加熱室嵌件的端面使之靠邊的狀 態下，利用加熱室嵌件的架橋部將工件夾入架橋部與嵌件塊之間，並隔介設於架橋部的樹脂路徑將模製樹脂供給於模穴凹部(參照專利文獻1：日本國特開2015-51557號公報)。 In order to solve this unsatisfactory situation, the applicant proposes a molding die, which is to place the workpiece on the insert block and close the mold, and push the end face of the workpiece to push the end face of the opposite side against the end face of the heating chamber insert to make it close. In this state, the workpiece is sandwiched between the bridging portion and the insert block by the bridging portion of the heating chamber insert, and the molding resin is supplied to the cavity concave portion through the resin path interposed in the bridging portion (refer to Patent Document 1: Japanese National Patent Publication No. 2015-51557).
專利文獻1 日本國特開2015-51557號公報
不限於在工件端面具有間隙的情況，亦有對在工件上的樹脂成形面產生階差的製品進行樹脂模製的情況。例如，於形成在工件上的樹脂成形面貼有黏著帶等之情況(例如在金屬基板上貼有熱剝離片且該熱剝離片上經晶粒接合(die bonding)有半導體晶片之情況等)，由於側澆口的流道澆口會跨越工件上的帶交界部而通過，故而有導致模製樹脂繞入與黏著帶的階差部分之虞。 Not limited to the case where there is a gap in the end face of the workpiece, there is also a case where resin molding is performed on a product having a level difference in the resin molding surface on the workpiece. For example, in the case where an adhesive tape or the like is attached to the resin molding surface formed on the workpiece (for example, a thermal release sheet is attached to a metal substrate and a semiconductor chip is attached to the thermal release sheet through die bonding, etc.), Since the runner gate of the side gate passes over the tape boundary portion on the workpiece, there is a possibility that the molding resin will be wrapped around the level difference portion with the adhesive tape.
又，不限於模製樹脂是跨越工件端面而流入於模穴凹部的情況，亦有不管是轉送成形或是壓縮成形，模製樹脂從模穴凹部溢流的情況或是在模穴凹部彼此經由流道澆口連接的地圖成形中，模製樹脂跨越工件端面流動的情況。 In addition, the case is not limited to the case where the mold resin flows into the cavity concave portion across the end face of the workpiece, and there are cases where the mold resin overflows from the cavity concave portion or passes between the cavity concave portions regardless of transfer molding or compression molding. In map forming with runner gate connection, the molding resin flows across the end face of the workpiece.
在專利文獻1的情況，因為有必要使工件相對於加熱室嵌件靠邊，所以在模具布局受限的基礎下，依工件的大小，為將加熱室兼流道的凸緣部作成可動而成為大 型模具構造，故成本變高，且一旦增加了可動部則在維修或保養上會耗費工夫。又，在專利文獻1並未設置在進行樹脂模製後為將工件取出而使已靠邊的工件返回原來位置的返回機構。 In the case of
特別在黏度低的模製樹脂(LED用透明樹脂等)之情況，不論在工件有無階差及間隙，當模製樹脂橫切通過工件端面時，大多會發生樹脂漏洩。因此，在樹脂附著於工件板端面(側面)的情況，會妨礙操作(handling)，在後工程有必要除去不需要的樹脂，會無法利用自動模製裝置進行自動生產，而在除去漏洩的樹脂之保養作業上需耗費時間與勞力。 Especially in the case of low-viscosity molding resins (transparent resins for LEDs, etc.), regardless of whether there are steps or gaps in the workpiece, when the molding resin crosses the end face of the workpiece, resin leakage often occurs. Therefore, if the resin adheres to the end face (side surface) of the workpiece plate, it will hinder the handling, and it is necessary to remove the unnecessary resin in the subsequent process, and the automatic production by the automatic molding apparatus cannot be performed, and the leaked resin cannot be removed. The maintenance work takes time and labor.
本發明之目的在於提供一種模製模具及使用模製模具的樹脂模製方法，係解決上述習知技術的課題，即便在工件端面精度產生偏差、工件上產生階差，或者不論模製樹脂之黏度為如何，皆可防止樹脂漏洩使保養省工，可維持高成形品質。 An object of the present invention is to provide a molding die and a resin molding method using the molding die, which solve the above-mentioned problems of the prior art, even if there is a deviation in the end face accuracy of the workpiece, a level difference occurs on the workpiece, or regardless of the quality of the molding resin Regardless of the viscosity, resin leakage can be prevented, maintenance and labor are saved, and high molding quality can be maintained.
本發明為達成上述目的而具備如下的構成。 In order to achieve the above-mentioned object, the present invention has the following configuration.
即，一種模製模具，係藉由支持工件的第一模具與形成有模穴凹部的第二模具將前述工件連同模製樹脂一起夾持，其特徵為，在前述第一模具具備以與該第一模具夾持面分離並設置成可接觸/離開地移動的可動模件，前述工件之與樹脂路徑交叉的端部於閉模時被夾入前述可動模件與前述第一模具之間，在前述可動模件與相對的前述第二模具夾持面之間形成連通於前述模穴凹部的樹脂路徑的一部分。 That is, a mold for clamping the workpiece together with molding resin by a first mold supporting the workpiece and a second mold formed with a cavity concave portion, characterized in that the first mold is provided with a The first mold clamping surface is separated and provided as a movable mold piece that can move in contact/separation, and the end of the workpiece intersecting with the resin path is sandwiched between the movable mold piece and the first mold when the mold is closed, A part of the resin path communicating with the cavity recess is formed between the movable mold and the opposing second mold clamping surface.
藉此，於閉模時，工件之與樹脂路徑交叉的端部被夾入可動模件與第一模具之間，由於模製樹脂會通過形成在可動模件與相對的第二模具的夾持面之間的樹脂路徑的一部分，故而變得不會有樹脂從工件端部漏洩。 Thereby, when the mold is closed, the end of the workpiece intersecting with the resin path is sandwiched between the movable mold and the first mold, since the molding resin will pass through the clamping formed between the movable mold and the opposite second mold. Part of the resin path between the surfaces, so there is no resin leakage from the workpiece end.
一種模製模具，係藉由支持工件的第一模具與形成有模穴凹部的第二模具夾持前述工件，供給到加熱室的模製樹脂通過樹脂路徑朝前述模穴凹部充填的轉送成形用的模製模具，其特徵為具備：工件推動機構，推動被支持於前述第一模具的前述工件的一端側面；工件返回機構，推抵被前述工件推動機構所推動的前述工件的另一端側面，並且與前述工件推動機構的推動解除動作連動地推回前述工件的另一端側面；及可動模件，在前述第一模具以與該第一模具夾持面分離並設置成可接觸/離開地移動，前述第一模具所支持的前述工件，係與閉模動作連動地藉由前述工件推動機構被推抵於前述工件返回機構並靠邊，並且前述工件的另一端側被夾入前述可動模件與前述第一模具之間，在前述可動模件與相對的前述第二模具的夾持面之間形成連通於前述模穴凹部之樹脂路徑。 A mold for transfer molding in which a first mold supporting a workpiece and a second mold formed with a cavity concave portion sandwich the workpiece, and a molding resin supplied to a heating chamber fills the cavity concave portion through a resin path. The molding die is characterized by having: a workpiece pushing mechanism, which pushes one end side of the aforementioned workpiece supported on the aforementioned first mold; a workpiece returning mechanism, which pushes against the other end side surface of the aforementioned workpiece pushed by the aforementioned workpiece pushing mechanism, and the other end side surface of the workpiece is pushed back in conjunction with the pushing and releasing action of the workpiece pushing mechanism; and the movable mold part is separated from the clamping surface of the first mold in the first mold and is arranged to be movable in contact/separation. The workpiece supported by the first mold is pushed against the workpiece returning mechanism by the workpiece pushing mechanism in conjunction with the mold closing action, and the other end side of the workpiece is clamped into the movable mold and the workpiece. Between the first molds, a resin path communicating with the cavity concave portion is formed between the movable mold piece and the clamping surfaces of the opposite second mold.
若使用上述模製模具，第一模具所支持的工件係在被第二模具夾持之前，藉由工件推動機構推抵於工件返回機構並使之靠邊。藉此能盡可能地縮小在模製模具和工件端面產生的間隙。又，在閉模的同時，工件的另一端側被夾入可動模件與第一模具之間，由於模製樹脂會通過在可動模件與第二模具之間的樹脂路徑，故而變得不會有樹脂從工件端面漏洩。 If the above-mentioned molding die is used, before the workpiece supported by the first die is clamped by the second die, the workpiece push mechanism pushes against the workpiece return mechanism and makes it close to the side. As a result, the gap created between the molding die and the end face of the workpiece can be reduced as much as possible. Also, the other end side of the workpiece is sandwiched between the movable mold and the first mold at the same time as the mold is closed, and the molding resin passes through the resin path between the movable mold and the second mold, so it becomes difficult to There will be resin leakage from the workpiece end face.
較佳為，前述可動模件係設於模具流道澆口，該模具流道澆口將設在前述第一模具的加熱室與前述模穴凹部連通。 Preferably, the movable mold part is set at a mold runner gate, and the mold runner gate communicates the heating chamber provided in the first mold with the cavity concave portion.
於此情況，由於可動模件係構成連通於模穴凹部的樹脂路徑的一部分，所以未必需要將工件靠往加熱室的附近，例如即便工件配置成地圖(map)狀或模製樹脂未通過工件端面上而模製樹脂的流動範圍變廣，亦可在不會有樹脂漏洩的情況下進行轉送成形。因此，模製模具的模穴布局之自由度變廣。 In this case, since the movable mold forms part of the resin path that communicates with the cavity recess, it is not always necessary to bring the workpiece to the vicinity of the heating chamber, even if the workpiece is arranged in a map shape or the molding resin does not pass through the workpiece. The flow range of the molding resin on the end face is widened, and transfer molding can be performed without resin leakage. Therefore, the degree of freedom of the cavity layout of the molding die becomes wider.
一種模製模具，係藉由支持工件的第一模具與形成有模穴凹部的第二模具將前述工件夾持而使模製樹脂從前述模穴凹部溢出於溢流模穴以進行壓縮成形之壓縮成形用的模製模具，其特徵為具備：工件推動機構，推動被支持於前述第一模具的前述工件的一端側面；工件返回機構，推抵被前述工件推動機構所推動的前述工件的另一端側面，並且與前述工件推動機構的推動解除動作連動地推回前述工件的另一端側面；及可動模件，在前述第一模具以與該第一模具夾持面分離並設置成可接觸/離開地移動，前述第一模具所支持的前述工件，係與閉模動作連動地藉前述工件推動機構推抵於前述工件返回機構並靠邊，並且前述工件的另一端側被夾入前述可動模件與前述第一模具之間，在前述可動模件與相對的前述第二模具的夾持面之間形成從前述模穴凹部往前述溢流模穴溢出的樹脂路徑。 A molding die for compression molding by clamping the workpiece by a first die supporting the workpiece and a second die formed with a cavity recess so that a molding resin overflows from the cavity cavity to an overflow cavity for compression molding. A molding die for compression molding is characterized by comprising: a workpiece pushing mechanism for pushing one end side surface of the workpiece supported by the first mold; and a workpiece returning mechanism for pushing against the other side of the workpiece pushed by the workpiece pushing mechanism One end side surface, and the other end side surface of the workpiece is pushed back in conjunction with the pushing and releasing action of the workpiece pushing mechanism; and a movable mold part, which is separated from the first mold clamping surface in the first mold and is arranged to be contactable/ Moving away, the workpiece supported by the first mold is pushed against the workpiece returning mechanism by the workpiece pushing mechanism in conjunction with the mold closing action, and the other end side of the workpiece is clamped into the movable mold. Between the first mold and the movable mold, a resin path overflowing from the cavity recess to the overflow cavity is formed between the clamp surface of the movable mold and the opposing second mold.
藉此，由於第一模具所支持的工件係與閉模動作連動地藉工件推動機構推抵於工件返回機構並靠邊，所以能盡可能地縮小在模製模具和工件端面產生的間隙。又，在閉模的同時，由於工件的另一端側被夾入可動模件與第一模具之間，會在可動模件與相對的第二模具的夾持面之間形成樹脂路徑，所以從模穴凹部往溢流模穴溢出的模製樹脂會通過在可動模件與第二模具之間的樹脂路徑，故而變得不會有樹脂從工件端部漏洩。 Thereby, since the workpiece supported by the first mold is pushed against the workpiece return mechanism by the workpiece push mechanism in conjunction with the mold closing action, the gap between the molding mold and the workpiece end surface can be reduced as much as possible. In addition, since the other end side of the workpiece is sandwiched between the movable mold and the first mold at the same time as the mold is closed, a resin path is formed between the movable mold and the clamping surface of the opposing second mold. The molding resin overflowing from the cavity recess to the overflow cavity passes through the resin path between the movable mold and the second mold, so that no resin leaks from the end of the workpiece.
又，較佳為，在前述第一模具的工件支持面，設有連結於空氣吸引/噴出機構的空氣吸引/噴出孔，在將前述工件對前述第一模具靠邊之際，一邊從前述空氣吸引/噴出孔噴出空氣一邊藉由工件推動機構將前述工件推抵於工件返回機構，在保持前述工件已靠邊的狀態下從前述空氣吸引/噴出孔吸引空氣而吸附保持。 Further, it is preferable that an air suction/discharge hole connected to an air suction/discharge mechanism is provided on the workpiece support surface of the first mold, and the workpiece is sucked from the air when the workpiece is brought to the side of the first mold. The workpiece is pushed against the workpiece return mechanism by the workpiece pushing mechanism while blowing air from the ejection hole, and air is sucked from the air suction/ejection hole while the workpiece is kept close to the side to be adsorbed and held.
因此，在藉由工件推動機構推動工件端面之際，可減少工件與第一模具之滑動摩擦而迅速地靠邊且在靠邊位置吸附保持於工件支持面。 Therefore, when the workpiece end face is pushed by the workpiece pushing mechanism, the sliding friction between the workpiece and the first mold can be reduced, and the workpiece can be quickly moved to the side, and the workpiece support surface can be adsorbed and held at the side position.
較佳為，在前述可動模件形成有架橋部，其在保持前述工件的另一端側面衝撞工件返回機構的狀態下將其上表面朝前述第一模具壓入，且藉由設於前述第一模具內的彈性構件而常時被偏置，俾使前述架橋部自前述第一模具分離。 Preferably, the movable mold is formed with a bridge portion, which press-fits the upper surface of the movable mold toward the first mold while keeping the other end side of the workpiece colliding with the workpiece returning mechanism, and is provided on the first mold. The elastic member in the mold is always biased to separate the bridge portion from the first mold.
藉此，當將模製模具閉模時，在架橋部與第一模具之間夾持藉第二模具抵抗彈性構件的偏置使可動模件被推回而往架橋部靠邊之工件的另一端側。因此，藉由模製樹脂通過可動模件與第一模具之間的樹脂路徑並進行模製，可防止樹脂朝工件端面繞入。 Thereby, when the molding die is closed, the other end of the workpiece which is pushed back by the second die against the bias of the elastic member is clamped between the bridging portion and the first die and the movable die is pushed back toward the bridging portion. side. Therefore, by molding the resin through the resin path between the movable mold and the first mold and molding, it is possible to prevent the resin from wrapping around toward the end face of the workpiece.
較佳為，前述工件推動機構的工件靠邊動作，係與頂出銷板(ejector pin plate)的升降動作連動，當前述頂出銷板自前述第一模具退避時，前述工件推動機構係推動前述第一模具所支持的工件的一端面，當前述頂出銷板接近於前述第一模具時，前述工件推動機構係自前述工件一端面退避。 Preferably, the workpiece edging action of the workpiece pushing mechanism is linked with the lifting action of the ejector pin plate. When the ejector pin plate retreats from the first mold, the workpiece pushing mechanism pushes the ejector pin plate. For one end face of the workpiece supported by the first mold, when the ejector pin plate is close to the first mold, the workpiece pushing mechanism retreats from the one end face of the workpiece.
藉此，形成為當頂出銷(ejector pin)自第一模具退避時，工件推動機構會推動第一模具所支持的工件的一端面使之靠邊，工件推動機構在頂出銷自第一模具突出之際會自工件一端面退避以容許工件之推回。因此，能配合成形前的工件的靠邊動作與成形後的澆口折斷及工件取出之時序來實現，可將成形品與不需要的樹脂在模具內有效率地分離並取出。 Thereby, when the ejector pin is retracted from the first mold, the workpiece pushing mechanism pushes one end face of the workpiece supported by the first mold to make it close, and the workpiece pushing mechanism ejects the pin from the first mold. When protruding, it retreats from one end face of the workpiece to allow the workpiece to be pushed back. Therefore, it can be realized in accordance with the edging action of the workpiece before molding and the timing of gate breakage and workpiece removal after molding, and the molded product and unnecessary resin can be efficiently separated and removed from the mold.
較佳為，成形後的工件係透過依開模動作使前述可動模件自前述工件分離，並且前述工件返回機構推動前述工件的另一端面，使不需要的樹脂與前述工件上的封裝部分離。 Preferably, the formed workpiece is separated from the movable mold part by the mold opening action, and the workpiece return mechanism pushes the other end face of the workpiece to separate the unnecessary resin from the encapsulation part on the workpiece. .
藉此，當進行開模動作時，由於在保持可動模件上有不需要的樹脂貼附的狀態下從工件分離之際澆口會被折斷而和封裝部分離，故可容易進行從成形品分離除去不需要的樹脂。 In this way, when the mold opening operation is performed, the gate is broken and separated from the package when the movable mold is separated from the workpiece while keeping the unnecessary resin adhered to the movable mold, so that the mold can be easily removed from the molded product. Unwanted resins are separated and removed.
一種樹脂模製方法，係以一對的模製模具夾持工件，供給到加熱室的模製樹脂通過樹脂路徑朝模穴 凹部充填而進行轉送模製，其特徵為包含：在已開模的前述模製模具中的第一模具支持工件的工程；工件推動構件推動前述工件的一端側面且將工件的另一端側面推抵於工件返回構件並靠邊之工程；在保持前述工件已靠邊的狀態下吸附保持於前述第一模具的工程；將前述模製模具閉模，以在和前述第一模具夾持面分離地設置的可動模件與前述第一模具之間夾入前述工件的另一端側之工程；包含形成在第二模具與前述可動模件之間的樹脂路徑在內，從前述加熱室通過前述樹脂路徑往與前述工件相對地形成在前述第二模具的前述模穴凹部，充填模製樹脂並使之加熱硬化的工程；加熱硬化後，使前述工件推動構件從前述工件的一端側面退避的工程；及從已開模的前述模製模具取出成形品之工程。 A resin molding method is to clamp a workpiece with a pair of molding dies, and the molding resin supplied to the heating chamber is filled toward the concave part of the cavity through a resin path to perform transfer molding, which is characterized by comprising: The process in which the first mold in the aforementioned molding dies supports the workpiece; the process in which the workpiece pushing member pushes one end side of the workpiece and pushes the other end side surface of the workpiece against the workpiece return member and moves to the side; in a state where the workpiece is kept sideways The process of adsorbing and holding the first mold; closing the molding mold to sandwich the other end side of the workpiece between the movable mold provided separately from the first mold clamping surface and the first mold The process; including the resin path formed between the second mold and the movable mold, from the heating chamber through the resin path to the cavity recess formed in the second mold opposite to the workpiece, filling the mold The process of making resin and heat-hardening it; the process of making the workpiece push member retreat from one end side of the workpiece after heat-hardening; and the process of taking out the molded product from the opened mold.
藉此，第一模具所支持的工件係在與另一模具之間被夾持之前，會藉工件推動構件推抵於工件返回構件並使之靠邊，所以能盡可能地縮小在模製模具和工件端面產生的間隙。又，當閉模完了時，工件的另一端側會被夾入以和第一模具夾持面分離地設置的可動模件與第一模具之間，由於在可動模件與相對的第二模具的夾持面之間形成有從加熱室連通於模穴凹部的樹脂路徑，所以模製樹脂會通過在可動模件與另一模具之間的樹脂路徑，故而變得不會有樹脂從工件端部漏洩。 In this way, before the workpiece supported by the first mold is clamped with another mold, the workpiece pushing member will push against the workpiece returning member and make it close to the edge, so the mold and the mold can be reduced as much as possible. The gap created by the end face of the workpiece. When the mold closing is completed, the other end side of the workpiece is sandwiched between the movable mold and the first mold provided separately from the first mold clamping surface. A resin path that communicates from the heating chamber to the cavity recess is formed between the clamping surfaces of the mold, so the molding resin will pass through the resin path between the movable mold and the other mold, so there will be no resin from the workpiece end. External leakage.
又，當進行開模時，透過可動模件自工件分離而對不需要的樹脂進行澆口折斷，並且使工件推動構件退避且藉工件返回構件推回工件並與不需要的樹脂分離，可 在模具內進行澆口折斷及成形品與不需要的樹脂之分離，故可有效率進行成形品之取出作業。 In addition, when the mold is opened, the movable mold is separated from the workpiece to break the gate of the unnecessary resin, and the workpiece pushing member is retracted and the workpiece is pushed back by the workpiece return member to be separated from the unnecessary resin. The gate is broken and the molded product is separated from the unnecessary resin in the mold, so the removal of the molded product can be performed efficiently.
在前述第二模具與前述可動模件之間的樹脂路徑係為將設於前述第一模具的前述加熱室與模穴凹部連通的模具流道澆口時，於轉送成形可防止樹脂漏洩使保養省工。 When the resin path between the second mold and the movable mold is a mold runner gate that communicates the heating chamber provided in the first mold with the cavity concave portion, resin leakage can be prevented during transfer molding and maintenance is facilitated. Save labor.
一種樹脂模製方法，係以一對的模製模具夾持工件及模製樹脂，使前述模製樹脂從模穴凹部溢出於溢流模穴而進行壓縮成形，該樹脂模製方法之特徵為包含：在已開模的模製模具中的第一模具支持工件的工程；以工件推動構件推動前述工件的一端側面且將工件的另一端側面推抵於工件返回構件並靠邊之工程；將前述模製模具閉模，以在和前述第一模具夾持面分離地設置的可動模件與前述第一模具之間夾入前述工件的另一端側之工程；包含形成在第二模具與前述可動模件之間的樹脂路徑在內，使前述模製樹脂從與前述工件相對地形成在前述第二模具的模穴凹部，通過前述樹脂路徑往前述溢流模穴溢出並使之加熱硬化之工程；加熱硬化後，使前述工件推動構件從前述工件的一端側面退避的工程；及從已開模的前述模製模具取出成形品之工程。 A resin molding method is to clamp a workpiece and a molding resin with a pair of molding dies, so that the aforementioned molding resin overflows from a cavity recess to an overflow cavity to perform compression molding, and the resin molding method is characterized by: Including: the process of supporting the workpiece with the first mold in the opened molding mold; the process of pushing one end side of the workpiece with the workpiece push member and pushing the other end side of the workpiece against the workpiece return member and sideways; A process of closing a molding die to sandwich the other end side of the workpiece between a movable die provided separately from the first die clamping surface and the first die; including forming the second die and the movable die The process of making the molding resin flow from the cavity concave portion formed in the second mold opposite to the workpiece, including the resin path between the mold parts, to the overflow cavity through the resin path, and to heat and harden it. ; The process of withdrawing the workpiece pushing member from one end side of the workpiece after heating and hardening; and the process of taking out the molded product from the mold-opened mold.
藉此，由於第一模具所支持的工件在與另一模具之間被夾持之前，藉工件推動構件被推抵於工件返回構件並使之靠邊，所以能盡可能地縮小在模製模具和工件端面產生的間隙。 Thereby, before the workpiece supported by the first mold is clamped with another mold, the workpiece pushing member is pushed against the workpiece return member and brought to the side, so that the size of the mold and the mold can be reduced as much as possible. The gap created by the end face of the workpiece.
又，在閉模的同時，工件的另一端側會在以與第一模具夾持面分離設置的可動模件與第一模具之間被夾入，會在可動模件與相對的第二模具的夾持面之間形成樹脂路徑。因此，從模穴凹部往溢流模穴溢出的模製樹脂會通過在可動模件與另一模具之間的樹脂路徑，故而變得不會有樹脂從工件端部漏洩。 In addition, at the same time as the mold is closed, the other end side of the workpiece is sandwiched between the movable mold and the first mold provided separately from the first mold clamping surface, and the movable mold and the opposing second mold are sandwiched between the movable mold and the opposing second mold. A resin path is formed between the clamping surfaces. Therefore, the molding resin overflowing from the cavity recess to the overflow cavity passes through the resin path between the movable mold and the other mold, so that no resin leaks from the workpiece end.
前述第二模具與前述可動模件之間的前述樹脂路徑係模具流道，其將前述模穴凹部與前述溢流模穴連通，於壓縮成形可防止樹脂漏洩使保養省工。 The resin path between the second mold and the movable mold is a mold runner, which communicates the cavity concave portion with the overflow cavity, preventing resin leakage during compression molding and saving labor in maintenance.
較佳為，透過保持從前述第一模具對前述工件噴出空氣之狀態下用前述工件推動構件推動工件一端側面，以將前述工件的另一端側面推抵於前述工件返回構件並靠邊。藉此，減少工件與第一模具之摩擦阻力而順暢地使工件靠邊而可減少工件端面部的間隙之發生。 Preferably, the other end of the workpiece is pushed against the workpiece returning member by pushing one side of the workpiece with the workpiece pushing member while keeping the air ejected from the first mold to the workpiece. Thereby, the frictional resistance between the workpiece and the first mold can be reduced, the workpiece can be smoothly moved to the side, and the occurrence of gaps in the end surface of the workpiece can be reduced.
若使用上述模製模具，即便為轉送成形用模具或壓縮成形用模具任一者，不論工件端面精度、工件的階差精度或樹脂黏度為如何，亦可防止樹脂從工件與模具間之間隙漏洩。因此，防止樹脂漏洩使模製模具的保養省工，可維持高成形品質。又，即便在不想讓樹脂行走於工件上的情況，亦可防止樹脂從工件與模具間之間隙漏洩。 If the above-mentioned molding die is used, even if it is a transfer molding die or a compression molding die, the resin can be prevented from leaking from the gap between the workpiece and the die regardless of the workpiece end surface accuracy, the step accuracy of the workpiece, or the resin viscosity. . Therefore, resin leakage is prevented, maintenance of the molding die is saved, and high molding quality can be maintained. In addition, even when the resin is not allowed to run on the workpiece, it is possible to prevent the resin from leaking from the gap between the workpiece and the mold.
又，關於樹脂模製方法，即便為轉送成形方法或壓縮成形方法任一者，不論工件端面精度或樹脂黏度為如何，都可使成形品質穩定，可確實地進行成形品的脫膜動作、澆口折斷。 Also, with regard to the resin molding method, even if it is a transfer molding method or a compression molding method, the molding quality can be stabilized irrespective of the workpiece end surface accuracy and the resin viscosity, and the mold release operation and casting of the molded product can be reliably performed. Mouth is broken.
T‧‧‧半導體晶片 T‧‧‧Semiconductor chip
PKG‧‧‧封裝 PKG‧‧‧Package
1、14‧‧‧下模 1. 14‧‧‧Die
2、12、13‧‧‧上模 2, 12, 13‧‧‧ Upper die
2a‧‧‧上模殘料廢品 2a‧‧‧Residual scraps of upper mold
2b、12d、12f‧‧‧上模流道 2b, 12d, 12f‧‧‧ Upper mold runner
2c、12e‧‧‧上模架橋凹部 2c, 12e‧‧‧Concave part of upper die bridge
2d‧‧‧上模澆口溝 2d‧‧‧Sprue groove of upper die
2e、12c‧‧‧上模模穴凹部 2e, 12c‧‧‧The concave part of the upper die cavity
2f‧‧‧頂面澆口 2f‧‧‧Top gate
3‧‧‧模製模具 3‧‧‧Molding mold
4‧‧‧加熱室 4‧‧‧heating chamber
5‧‧‧柱塞 5‧‧‧Plunger
6‧‧‧下模嵌件塊 6‧‧‧Lower die insert block
6a、15a‧‧‧空氣吸引/噴出孔 6a, 15a‧‧‧Air suction/spray hole
R‧‧‧模製樹脂 R‧‧‧Molding resin
R’‧‧‧不需要的樹脂 R’‧‧‧Unwanted resin
W‧‧‧工件 W‧‧‧Workpiece
7‧‧‧工件推動機構 7‧‧‧Workpiece Pushing Mechanism
7a‧‧‧工件推動構件 7a‧‧‧Workpiece pushing member
7b、8b‧‧‧支點 7b, 8b‧‧‧Pivot
7c、8c、10、12i、14i‧‧‧螺旋彈簧 7c, 8c, 10, 12i, 14i‧‧‧coil spring
7d、8d‧‧‧突出頂桿 7d, 8d‧‧‧Protruding ejector
8‧‧‧工件返回機構 8‧‧‧Workpiece return mechanism
8a‧‧‧工件返回構件 8a‧‧‧Workpiece return member
9‧‧‧可動模件 9‧‧‧Moveable modules
9a‧‧‧架橋部 9a‧‧‧Bridge Department
9b‧‧‧架橋溝 9b‧‧‧ bridge ditch
9c‧‧‧軸部 9c‧‧‧Shaft
9d‧‧‧側面部 9d‧‧‧Side
11‧‧‧脫膜片 11‧‧‧Remove film
12a‧‧‧上模模穴模件 12a‧‧‧Cavity module of upper die
12b‧‧‧上模夾持器 12b‧‧‧Die holder
12g‧‧‧上模溢流模穴 12g‧‧‧Overflow mold cavity
12h、14h‧‧‧溢流模穴模件 12h, 14h‧‧‧Overflow Cavity Module
14a‧‧‧下模模穴模件 14a‧‧‧Lower die cavity module
14b‧‧‧下模夾持器 14b‧‧‧Die Holder
14c‧‧‧下模模穴凹部 14c‧‧‧Lower die cavity concave part
14d、14f‧‧‧下模流道 14d, 14f‧‧‧Lower mold runner
14e‧‧‧下模架橋凹部 14e‧‧‧Bridge recess of lower die
14g‧‧‧下模溢流模穴 14g‧‧‧Lower die overflow cavity
15‧‧‧上模嵌件塊 15‧‧‧Insert block for upper die
圖1係依據轉送模製裝置的樹脂模製動作之工程說明圖。 FIG. 1 is a process explanatory diagram of a resin molding operation by a transfer molding apparatus.
圖2係接於圖1之後的樹脂模製動作之工程說明圖。 FIG. 2 is a process explanatory diagram of the resin molding operation following FIG. 1 .
圖3係接於圖2之後的樹脂模製動作之工程說明圖。 FIG. 3 is a process explanatory diagram of the resin molding operation following FIG. 2 .
圖4係上模及下模的平面布局圖。 Figure 4 is a plan layout of the upper die and the lower die.
圖5係半導體封裝的上視圖。 Figure 5 is a top view of the semiconductor package.
圖6係顯示轉送模製裝置的其他例之說明圖。 FIG. 6 is an explanatory diagram showing another example of the transfer molding apparatus.
圖7係顯示壓縮成形裝置的構成之說明圖。 FIG. 7 is an explanatory diagram showing the structure of a compression molding apparatus.
圖8係顯示圖7的模具布局之上視圖。 FIG. 8 is a top view showing the mold layout of FIG. 7 .
圖9係顯示其他例的模製模具的構成之說明圖。 FIG. 9 is an explanatory diagram showing the structure of another example of the molding die.
以下，針對本發明的模製模具及使用模製模具的樹脂模製方法之適宜的實施形態，連同附件圖面一起詳細述明。在以下實施形態中，使用矩形狀的有機基板(工件)作為工件，且使用經晶粒接合將多個半導體晶片連接於該工件上而成的工件作說明。 Hereinafter, suitable embodiments of the molding die and the resin molding method using the molding die of the present invention will be described in detail together with the attached drawings. In the following embodiments, a rectangular organic substrate (workpiece) is used as a workpiece, and a plurality of semiconductor wafers are connected to the workpiece by die bonding for description.
圖5顯示被樹脂密封的封裝上視圖。顯示配置在被樹脂密封的封裝部(樹脂密封部)的最外周之半導體晶片T及將其縱橫地包圍的切斷線L1、L2。又，樹脂模製裝置係作成具備開閉模製模具的模具開閉機構(電動馬達、螺旋軸、肘節連桿(toggle link)機構等；未圖示)及於轉送成形的情況使***加熱室(pot)的柱塞作動之轉送機構，主要以模製模具的構成作說明。 Figure 5 shows a top view of the resin-sealed package. The semiconductor wafer T arranged on the outermost periphery of the resin-sealed package portion (resin-sealed portion) and the cutting lines L1 and L2 surrounding it vertically and horizontally are shown. In addition, the resin molding apparatus is equipped with a mold opening and closing mechanism (electric motor, screw shaft, toggle link mechanism, etc.; not shown) that opens and closes the molding mold, and is inserted into a heating chamber (not shown) in the case of transfer molding. The transfer mechanism of the plunger operation of pot) is mainly explained by the structure of the molding die.
首先，針對轉送成形用的模製模具及樹脂模製方法，與樹脂模製裝置之構成一起作說明。 First, a mold for transfer molding and a resin molding method will be described together with the configuration of a resin molding apparatus.
圖1A中，樹脂模製裝置具備：具有例如是可動模的下模1(第一模具)及是固定模的上模2(第二模具)之模製模具3；對模製模具3進行開閉的模具開閉機構(電動馬達、螺旋軸、肘節連桿機構等；未圖示)；及使被***下模1所具備的加熱室4的柱塞5作動之轉送機構。以下，具體說明模製模具3之構成。
In FIG. 1A , the resin molding apparatus includes a
在下模1設有：與模穴凹部對位而將工件W載置固定之下模嵌件塊6及與下模嵌件塊6鄰接設置且裝填有要朝模穴凹部供給之模製樹脂R的加熱室4。模製樹脂R亦可為錠樹脂(固形樹脂)、顆粒狀樹脂、粉狀樹脂、液狀樹脂中任一者。
The
在嵌件塊6設有推動工件W的一端面之工件推動機構7。於嵌件塊6的工件支持面，在嵌件塊6的外周側(與加熱室4分離的既定位置)，工件推動構件7a被支持成能以設於基端部(下端部)的支點7b為中心進行搖動。工件推動構件7a的基端部係藉由螺旋彈簧7c(彈性構件)以支點7b為中心，在本圖中例如是被往逆時鐘方向(由於在從紙面裏側所見的情況是順時鐘方向，故以下省略本圖之記載)搖動的方向偏置。又，工件推動構件7a的基端部係藉由突出頂桿7d以支點7b為中心，例如被往順時鐘方向搖動的方向支持。工件推動構件7a的前端部係以從下模嵌件塊6的夾持面突出且可推動被載置於下模嵌件塊6的工件W之一端面。
The
工件推動機構7的工件推抵動作係與設於下模嵌件塊6下方之未圖示的頂出銷板的升降動作連動。此外，頂出銷板可透過單獨另外驅動的馬達、致動器等而上下移動，但亦可形成在藉由豎設於下固定盤的頂桿使下可動盤(下模)向下移動之際，頂桿與頂出銷板抵接，在下可動盤(下模)向下移動的同時，頂出銷板會相對地往上移動的機構。
The workpiece pushing action of the
具體言之，複數個頂出銷在頂出銷板上豎起並被支持，各頂出銷係設成貫通下模嵌件塊6並可由夾持面突出。頂出銷係成為藉由樹脂模製後之開模動作而自分模面、模製樹脂下面或依情況自工件搭載位置下表面各自突出以將工件從模具脫膜的機構。在此頂出銷板繫接有突出頂桿7d，由於當頂出銷板從下模嵌件塊6退避(向下移動)(頂出銷亦從下模夾持面退避)時突出頂桿7d會下降，所以藉由工件推動構件7a被螺旋彈簧7c偏置而推動下模嵌件塊6所載置的工件W的一端側面，可使工件W從工件載置位置移動至推動位置。又，由於當頂出銷板接近(往上移動)下模嵌件塊6時突出頂桿7d會上升(頂出銷從下模夾持面突出)，所以工件推動構件7a會抵抗螺旋彈簧7c而從推動工件W的一端側面的推動位置往退避位置(工件載置位置)移動。
Specifically, a plurality of ejector pins are erected and supported on the ejector pin plate, and each ejector pin is arranged to pass through the lower
又，在下模嵌件塊6設有工件返回機構8，會推抵被工件推動機構7所推動的工件W的另一端面，並且與自工件推動機構7的推動位置的退避動作連動地將成形後的工件的另一端側面推回。
In addition, the lower
具體言之，在加熱室4與下模嵌件塊6的工件支持面之間的既定位置，設有工件返回機構8。工件返回構件8a被支持成能以設於基端部(下端部)的支點8b為中心搖動。工件返回構件8a的前端部係設置成從下模嵌件塊6的夾持面突出。工件返回構件8a的基端部係藉由螺旋彈簧8c以支點8b為中心，例如被往順時鐘方向搖動的方向偏置。此外，採用螺旋彈簧7c的彈簧力係大於螺旋彈簧8c的彈簧力者。
Specifically, a
當藉由工件推動機構7推動之工件W的另一端側面被推抵於工件返回構件8a時，抵抗螺旋彈簧8c的偏置力以支點8b為中心往逆時鐘方向搖動，並在工件返回構件8a豎起的位置使工件W靠邊。又，當工件推動機構7從推動位置退避時，工件返回構件8a係藉由螺旋彈簧8c的偏置以支點8b為中心往順時鐘方向搖動而將工件的另一端側面朝工件推動構件7a推同。
When the other end side surface of the workpiece W pushed by the
在下模嵌件塊6，可動模件9是設置成與模具開閉動作連動地可相對於下模嵌件塊6接觸/離開地移動(升降)。具體言之，在與下模嵌件塊6的加熱室4與工件支持面之間的樹脂路徑相對應之既定位置，可動模件9的軸部9c的基端側是被推縮地設置於下模嵌件塊6內的螺旋彈簧10常時朝上方偏置。
In the lower mold-
又，在可動模件9的軸部9c的前端側，以與該軸部9c交叉(正交)的方式形成有形成樹脂路徑的一部分之架橋部9a。亦可於架橋部9a形成作為樹脂路徑的架橋溝9b。此架橋部9a係在保持工件的另一端側面衝撞
工件返回構件8a的狀態將工件上表面朝下模嵌件塊6壓入。可動模件9係常時被螺旋彈簧10偏置，俾使架橋部9a自嵌件塊6分離，透過閉模用上模2抵抗螺旋彈簧10的偏置而被壓下以將工件的另一端側夾入架橋部9a的相對面與下模嵌件塊6之間。架橋部9a係以可動模件9的軸部9c為中心對稱地形成T字狀，但未必受限於對稱形狀。
Moreover, on the front end side of the
本實施例中，可動模件9係採用藉由螺旋彈簧10而常時被偏置，且於閉模的同時，可動模件9往相對的模具壓下的簡易的構造，但可動模件9亦可採用藉由具備另外驅動源的移動機構來配合模具開閉動作而獨立地對工件支持面接觸/離開地移動的構成。
In this embodiment, the
藉由上述構成，被下模嵌件塊6所支持的工件W係與閉模動作連動而藉由工件推動機構7推抵於工件返回機構8，當閉模完了時，可動模件9藉上模2而被壓下使工件的另一端側被夾入架橋部9a，且在可動模件9與相對的上模夾持面之間形成樹脂路徑。
With the above configuration, the workpiece W supported by the lower
又，較佳為，在嵌件塊6的工件支持面，設有複數個連結於空氣吸引/噴出機構的空氣吸引/噴出孔6a。藉此，在將工件W對嵌件塊6靠邊之際，一邊從空氣吸引/噴出孔6a噴出空氣一邊使工件W上浮，可藉由工件推動機構7使之推抵於工件返回機構8並靠邊。又，可在保持工件W靠邊的狀態下從空氣吸引/噴出孔6a進行空氣吸引並保持將工件W靠邊的狀態下進行吸附保持。Moreover, it is preferable that the workpiece|work support surface of the
又，工件W為，伴隨開模動作一邊使空氣從空氣吸引/噴出孔6a噴出，工件推動機構7(工件推動構件7a)一邊從推動位置退避，並且工件的另一端側面被工件返回機構8(工件返回構件8a)推動而被推回。 In addition, the workpiece W is evacuated from the pushing position by the workpiece pushing mechanism 7 (
較佳為，在下模嵌件塊6的工件支持面施以讓工件W滑動的表面處理，例如施以DLC(類鑽石鍍膜；Diamond-Like Carbon)等之滑動塗布。藉此，工件W可進行順暢的靠邊動作。又，工件W及模具面亦變得不易因工件W之移動而損傷。 Preferably, the workpiece supporting surface of the lower
又，成形後的工件W係為透過模製模具3的開模動作使可動模件9上升，並且工件返回機構8推動工件的另一端側面，藉以使樹脂路徑的不需要的樹脂R’與工件W上的封裝部PKG進行澆口折斷(參照圖3B)。 In addition, the molded workpiece W is caused by the mold opening action of the molding die 3 to raise the
圖1A中，在上模2刻設有在上模夾持面的加熱室4之相對位置的上模殘料廢品(cull)2a、連通上模殘料廢品2a的上模流道2b、和可動模件9相對配置的連通上模流道2b之架橋凹部2c、連通架橋凹部2c的上模澆口溝2d、連通上模澆口溝2d的上模模穴凹部2e等之樹脂路徑。含有上述樹脂路徑的上模夾持面係吸附保持脫膜片11而被覆蓋。脫膜片11係厚度50μm左右、具耐熱性且從模具面可容易剝離並且具柔軟性、伸展性者，例如，適宜地採用以PTFE、ETFE、PET、FEP膜、含浸氟的玻璃布、聚丙烯膜、聚偏二氯乙烯等為主成分的單層或複層膜。此外，在工件端面精度高之情況或使用填料(filler)徑大的模製樹脂之情況，亦可省略脫膜片11。 In FIG. 1A, the
如圖4B所示，工件推動機構7與工件返回機構8係在呈矩形狀的工件W之相對的邊緣部各設置2組。工件推動機構7及工件返回機構8不限定為2組，可為1組或大於2組。且可動模件9不限單數亦可設置在複數部位。
As shown in FIG. 4B , two sets of each of the
如圖4B所示，可動模件9及工件返回機構8在轉送成形用模具的情況，係設在和連通設於下模1的加熱室4及上模模穴凹部2e的上模流道2b與上模澆口溝2d之間相對應的位置(與架橋凹部2c相對的位置：參照圖4A)。在設於架橋部9a的上表面之架橋溝9b與相對的架橋凹部2c之間形成樹脂路徑。此外，作為樹脂路徑，亦可不在架橋部9a的上表面設置架橋溝9b，而在架橋凹部2c側設置凹溝。於此情況，由於在上模2張緊設置脫膜片11，故而在上模2設置樹脂路徑的溝者比起在架橋部9a設置架橋溝9b者來得容易脫膜。又，樹脂路徑用的溝亦可設於上模2與架橋部9a雙方。
As shown in FIG. 4B , the
此處，參照圖1至圖3說明使用轉送成形用的模製模具之樹脂模製動作的一例。此外，設成在上模2的夾持面吸附保持有脫膜片11。
Here, an example of the resin molding operation using the mold for transfer molding will be described with reference to FIGS. 1 to 3 . In addition, it is assumed that the
圖1A中，藉由未圖示的裝載器等往已開模的模製模具3中之下模1的下模嵌件塊6供給工件W(工件載置位置)。又，模製樹脂R亦連同工件W一起或者另外被供給於加熱室4內。此時，又，工件推動構件7a的基端部係處在藉由突出頂桿7d抵抗螺旋彈簧7c的偏置並以支點7b為中心往順時鐘方向搖動的位置。
In FIG. 1A, the workpiece|work W (workpiece mounting position) is supplied to the lower
在由下模嵌件塊6的空氣吸引/噴出孔6a噴出空氣以減少工件W與下模嵌件塊6之滑動摩擦(sliding friction)的狀態下，透過突出頂桿7d與未圖示的頂出銷板的下降動作連動而下降，而利用工件推動構件7a推動工件W的一端側面。
In the state where the air is ejected from the air suction/
此時，透過螺旋彈簧7c的偏置使工件推動構件7a以支點7b為中心逆時鐘方向搖動，以推動工件W的一端側面。如圖1B所示，由於工件W係透過來自於從空氣吸引/噴出孔6a之空氣噴出而處在與下模嵌件塊6之摩擦阻力小的狀態，所以在加熱室4側滑動既定量(例如4~5mm左右)使工件的另一端側面被推抵於工件返回構件8a。此時，工件返回構件8a係抵抗螺旋彈簧8c的偏置並以支點8b為中心逆時鐘方向搖動並停止。藉此，工件W係在保持藉工件推動構件7a被推抵於工件返回構件8a的狀態下靠邊。
At this time, the
當工件W靠邊時，從空氣吸引/噴出孔6a向下模嵌件塊6進行空氣吸引而在下模嵌件塊6將工件W吸附保持。此時，可動模件9係藉螺旋彈簧10的偏置而處在架橋部9a是自下模嵌件塊6分離的狀態。
When the workpiece W is brought to the side, the air suction is performed from the air suction/
在圖2A中，將模製模具3閉模並以上模2抵抗螺旋彈簧10的偏置而將可動模件9往下模1側壓下。此時架橋部9a是藉由相對的架橋凹部2c而被壓下，使工件的另一端側夾入架橋部9a與下模嵌件塊6之間。接著，如圖2B所示，使柱塞5上升，將在加熱室4內熔融的模製樹脂R通過上模殘料廢品2a、上模流道2b、架
橋凹部2c、上模澆口溝2d朝上模模穴凹部2e充填。接著，對充填於上模模穴凹部2e的模製樹脂R進行加熱硬化。
In FIG. 2A , the molding die 3 is closed and the
因此，透過模製樹脂R通過可動模件9(架橋部9a)與上模2(架橋凹部2c)之間的樹脂路徑(架橋溝9b)進行模製，可防止樹脂朝工件端面繞入。
Therefore, the resin R is molded through the resin path (bridging
在圖3A中，解除加熱硬化後工件W的吸附保持，開始模製模具3的開模。接著，如圖3B所示，在保持著使空氣從下模嵌件塊6的空氣吸引/噴出孔6a對工件W噴出的狀態，伴隨著開模動作，可動模件9藉由螺旋彈簧10的偏置而從工件W分離，藉以折斷澆口。又，透過未圖示的頂出銷板向下模嵌件塊6接近(往上移動)的方式移動而使突出頂桿7d上升，使工件推動構件7a抵抗螺旋彈簧7c的偏置並以支點7b為中心順時鐘方向搖動而自推動位置退避。此時，透過未圖示的頂出銷突出使樹脂殘料廢品及樹脂流道(不需要的樹脂R’)從下模1脫膜，並且工件返回構件8a藉由螺旋彈簧8c的偏置而將工件的另一端側面推回，工件W因不需要的樹脂R’與澆口被折斷而分離。藉由未圖示的卸載器等從已開模的模製模具3將成形後的工件W與不需要的樹脂R’分離並取出。
In FIG. 3A , the adsorption and holding of the workpiece W after the heat-hardening is released, and the mold opening of the molding die 3 is started. Next, as shown in FIG. 3B , the
藉此，由於界被支持於下模1的工件W係在下模1與上模2之間被夾持前，藉工件推動構件7a推抵於工件返回構件8a並靠邊，所以能盡可能地縮小在模製模具3和工件端面產生的間隙。又，當閉模完了時，可
動模件9被上模2壓下而使工件W夾入可動模件9與下模嵌件塊6之間，在與可動模件9相對的上模2的夾持面之間形成樹脂路徑，故而模製樹脂R會通過在可動模件9與上模2之間的樹脂路徑，不會有樹脂從工件端面漏洩的情形。
As a result, the workpiece W supported by the
又，當進行開模時，因可動模件9從工件W分離而折斷澆口，並使工件推動構件7a退避且藉由工件返回構件8a推回工件W而與不需要的樹脂R’分離，由於可在模具內進行折斷澆口以與成形品及不需要的樹脂R’之分離，故能有效率地進行成形品之取出作業。
In addition, when the mold is opened, the
此外，欲將工件W與不需要的樹脂R’一體取出的情況，因為將使可動模件9可動的螺旋彈簧10及工件返回機構8的螺旋彈簧8c設為稍弱，而使工件W與不需要的樹脂R’成為一體。之後，只要透過將工件W及不需要的樹脂R’維持一體地脫模而從模製模具取出，再從模製模具取出後並折斷澆口將不需要的樹脂R’從工件W取外即可。
In addition, when the workpiece W and the unnecessary resin R' are to be taken out integrally, the
圖6A、圖6B係顯示轉送成形用模製模具的其他例。對與圖1同一構件者賦予相同編號並沿用說明。 6A and 6B show other examples of transfer molding molds. The same reference numerals are assigned to the same members as in FIG. 1 and the descriptions will be followed.
圖6A係採用設於下模1的工件推動機構7與工件返回機構8是同一構成者。即，工件推動機構7的工件推抵動作及工件返回機構8的工件返回動作，係和設於下模嵌件塊6下方的未圖示的頂出銷板的升降動作連動。具體言之，在頂出銷板繫接有突出頂桿7d、8d，由於當頂出銷板從下模嵌件塊6退避時，突出頂桿7d、8d會各
自下降，所以工件推動構件7a被螺旋彈簧7c偏置而推動被載置於下模嵌件塊6的工件W的一端側面。採用螺旋彈簧7c的彈簧力係大於螺旋彈簧8c者，又，由於當頂出銷板接近於下模嵌件塊6時，突出頂桿7d、8d各自會上升，所以工件返回構件8a抵抗螺旋彈簧7c、8c的偏置將工件的另一端側面推回，同時工件推動構件7a從推動位置退避。
In FIG. 6A , the
圖6B係顯示未於可動模件9的架橋部9a設置作為樹脂路徑的架橋溝，而在與架橋部9a相對的上模2之架橋凹部2c刻設有深的凹溝之實施例。其他的模具構成係與圖1相同。
6B shows an embodiment in which a bridging groove as a resin path is not provided in the bridging
圖7係針對適用於壓縮成形用的模製模具之實施例作說明。圖7A顯示上模模穴凹部，圖7B顯示形成下模模穴凹部的模具。 FIG. 7 illustrates an embodiment of a molding die suitable for compression molding. FIG. 7A shows the cavity concave portion of the upper mold, and FIG. 7B shows the mold for forming the cavity concave portion of the lower mold.
圖7A中，設於下模1(第一模具)的工件推動機構7、工件返回機構8及可動模件9之構成係與圖1相同。
In FIG. 7A , the structures of the
上模12(第二模具)具備形成上模模穴凹部12c的上模模穴模件12a與上模夾持器12b。上模模穴模件12a係形成上模模穴底部而包圍其周圍的上模夾持器12b係形成上模模穴側部。上模模穴模件12a與上模夾持器12b亦可任一者藉由螺旋彈簧被懸掛支持於未圖示的上模基座部，亦可雙方藉由螺旋彈簧被懸掛支持。
The upper mold 12 (second mold) includes an upper
於上模夾持器12b的夾持面，在上模模穴凹部12c形成有經由上模流道12d連通的架橋凹部12e。此上模架橋凹部12e係和下模1的可動模件9相對地設
置，形成在以上模架橋凹部12e夾持架橋部9a之際會在與架橋溝9b之間形成樹脂路徑。上模溢流模穴12g隔介上模流道12f而與此上模架橋凹部12e連通設置。上模溢流模穴12g係為溢流模穴模件12h藉由螺旋彈簧12i懸掛支持於上模夾持器12b而形成。脫膜片11被吸附保持於含有樹脂路徑的上模夾持面。
On the clamping surface of the
在藉由工件推動機構7及工件返回機構8使供給到下模1的工件W靠邊的狀態下，模製樹脂被供給到工件W上。此外，亦可在工件W上載放模製樹脂R並對下模同時作供給。當將上模12與下模1閉模時，藉由上模12抵抗螺旋彈簧10的偏置使可動模件9被壓下，當架橋部9a被嵌合於上模架橋凹部12e的同時將工件W上夾持。此時，隨著上模模穴凹部12c的容積縮小，自上模流道12d溢出的模製樹脂R係通過形成在架橋部9a的架橋溝9b與上模架橋凹部12e之間而經由上模流道12f充填於溢流模穴12g。此時，形成當溢流模穴模件12h抵抗螺旋彈簧12i的彈簧力被壓入時，利用該螺旋彈簧12i的彈簧力推回而能施加樹脂壓力。
The molding resin is supplied onto the workpiece W in a state where the workpiece W supplied to the
壓縮成形後，當模製模具3開模時，可動模件9上升，由於工件W會藉由工件推動機構7及工件返回機構8而從靠邊位置返回，所以澆口在模具內被進行折斷，使工件W與不需要的樹脂分離。
After compression molding, when the
圖7B顯示形成有下模模穴凹部的壓縮成形用的模製模具。對比圖7A是調換了第一模具及第二模具之配置。FIG. 7B shows a molding die for compression molding in which a lower die cavity concave portion is formed. Compared to FIG. 7A , the configurations of the first mold and the second mold are exchanged.
圖7B中，設於上模13(第一模具)的工件推動機構7、工件返回機構8及可動模件9的構成係與圖1的下模1相同。此外，工件W係藉由設於上模嵌件塊15的空氣吸引/噴出孔15a而被吸附保持。在考慮到靠邊動作時，工件W係以利用夾盤爪等來保持者較理想。 In FIG. 7B , the structures of the
下模14(第二模具)具備形成下模模穴凹部14c的下模模穴模件14a與下模夾持器14b。下模模穴模件14a係形成下模模穴底部而包圍其周圍的下模夾持器14b係形成下模模穴側部。下模模穴模件14a一般為固定模件，下模夾持器14b係藉由彈簧而被浮動支持，但亦可為下模模穴模件14a與下模夾持器14b係雙方藉由螺旋彈簧而被浮動支持，可為任一種。在此情況，下模模穴模件14a的彈簧有必要作得比下模夾持器14b的彈簧還強。 The lower mold 14 (second mold) includes a lower
在下模夾持器14b的夾持面形成有經由下模流道14d與下模模穴凹部14c連通之下模架橋凹部14e。此下模架橋凹部14e係和上模13的可動模件9相對地設置，形成在以下模架橋凹部14e夾持架橋部9a之際會在與架橋溝9b之間形成樹脂路徑。下模溢流模穴14g隔介下模流道14f和此下模架橋凹部14e連通設置。下模溢流模穴14g係為溢流模穴模件14h藉由螺旋彈簧14i懸掛支持於下模夾持器14b而形成。脫膜片11被吸附保持於含有樹脂路徑的下模夾持面。 A lower die bridge
在藉由工件推動機構7及工件返回機構8使供給到上模13的工件W靠邊的狀態下，向下模模穴凹 部14c內供給模製樹脂(未圖示)。此外，工件W與模製樹脂之供給可同時地進行，亦可先供給模製樹脂。又，有必要以固定於上模的工件可從搭載位置移動的方式將工件吸引孔作成長孔、或者作成工件吸引孔本身會橫向滑動、或者將工件夾持器(夾盤爪等)設在不影響工件移動方向的位置或者作成可移動。當將上模13與下模14閉模時，藉由下模14抵抗螺旋彈簧10的彈推使可動模件9被壓下，架橋部9a被推回下模架橋凹部14e而夾持工件上表面。此時，隨著下模模穴凹部14c的容積縮小，經由下模流道14d溢出的模製樹脂R係通過形成於架橋部9a的架橋溝9b與架橋凹部14e之間並通過下模流道14f充填於溢流模穴14g。此時，形成當溢流模穴模件14h抵抗螺旋彈簧14i的彈簧力被壓入時，藉該螺旋彈簧14i的彈簧力推回而能施加樹脂壓力。此外，在本實施例的溢流模穴14g雖放入有利用螺旋彈簧14i的加壓機構，但未必需要加壓，溢流模穴亦可為單純的空間或開放狀態。 In a state where the workpiece W supplied to the
壓縮成形後，當模製模具3開模時，由於可動模件9下降，藉由工件推動機構7及工件返回機構8使工件W從靠邊位置返回，所以在模具內進行折斷澆口，使工件W與不需要的樹脂分離。 After compression molding, when the molding die 3 is opened, since the
圖8A、圖8B顯示使用壓縮成形的模製模具之工件支持側(上模13或下模14)及模穴凹部側(下模14或上模13)的平面布局之一例。 8A and 8B show an example of the plane layout of the workpiece support side (
圖8A係工件支持側的布局。沿著矩形工件W相鄰的兩邊設有工件推動機構7，成為透過設於各邊2處上的工件推動構件7a來推動工件一端側面。透過相鄰的兩邊朝相對的兩邊推動，結果是以轉角(corner)為基準使工件W靠邊。
Figure 8A shows the layout of the workpiece support side. A
又，在工件W的設有工件推動機構7的邊與相對邊，分別設有工件返回機構8，工件的另一端側面被推抵於設在各邊2個部位的工件返回構件8a。又，在工件返回機構8的附近，可動模件9藉由螺旋彈簧10而常時被往自夾持面突出的方向偏置。
In addition, the side and the opposite side of the workpiece W where the
可動模件9係形成當模製模具閉模時，工件是在保持工件的另一端側面被推抵於工件返回構件8a的狀態下被架橋部9a所夾持。又，圖8A中雖於架橋部9a形成作為樹脂路徑的架橋溝9b，但亦可於架橋凹部14e設置作為樹脂路徑的凹溝，亦可於雙方設置作為樹脂路徑的溝。
The
圖8B係模穴凹部(12c、14c)側的布局。在與圖8A的可動模件9對應的位置分別串接地刻設形成有流道(12d、14d)及架橋凹部(12e、14e)、流道(12f、14f)及溢流模穴(12g、14g)。 Fig. 8B shows the layout on the side of the cavity concave portions (12c, 14c). Runners (12d, 14d), bridging recesses (12e, 14e), runners (12f, 14f) and overflow cavities (12g, 14g).
當模製模具閉模時，因模穴凹部(12c、14c)內的模製樹脂經由流道(12d、14d)在可動模件9與架橋凹部(12e、14e)之間溢出，並通過流道(12f、14f)朝溢流模穴(12g、14g)充填，藉由溢流模穴模件(12h、14h)而施加樹脂壓力。
When the molding die is closed, the molding resin in the cavity recesses (12c, 14c) overflows between the
圖9係顯示轉送成形用的模製模具3的其他例。對和圖1相同構件者賦予相同編號並沿用說明。圖9係顯示變更下模1的可動模件9的架橋部9a與上模架橋凹部2c之形態的實施例。架橋部9a係相對於軸部9c的中心呈非對稱形狀。又，可動模件9的架橋部9a的側面部9d係以形成上模模穴凹部2e的側部之方式作設置。
FIG. 9 shows another example of the
此外，亦可在架橋部9a設置作為樹脂路徑的架橋溝9b，亦可為在上模架橋凹部2c刻設有深的樹脂路徑，亦可為在雙方刻設有溝。
In addition, a
當將模製模具3閉模時，可動模件9抵抗螺旋彈簧10的偏置而被推回，且與下模嵌件塊6將靠邊的工件W夾入並在上模模穴凹部2e的側面形成頂面澆口2f。
When the molding die 3 is closed, the
如此，不僅從形成在上模夾持面側的開口部之上模澆口溝2d充填模製樹脂，亦可作成從形成在模穴側面之頂面澆口2f充填模製樹脂。
In this way, the molding resin can be filled not only from the upper
在上述的各實施例中，係針對在作為工件W的有機基板上經晶粒接合有複數個半導體晶片且流道跨越基板的模製模具之構成作了例示，但有關使用在金屬板貼合熱剝離片並將單數或複數個半導體晶片T經晶粒接合於該熱剝離片而成的工件W，且流道跨越基板上的階差之模製模具的構成也可適用。 In each of the above-mentioned embodiments, the configuration of a molding die in which a plurality of semiconductor wafers are die-bonded to an organic substrate as the workpiece W and the flow channels extend across the substrate has been exemplified. It is also applicable to the structure of a mold in which a single or a plurality of semiconductor wafers T are thermally peeled and bonded to the workpiece W through the thermal peeling sheet, and the flow channel spans the level difference on the substrate.
又，在嵌件塊上使工件靠邊或於成形後將工件取出之際，雖可從形成於嵌件塊的空氣吸引/噴出孔噴出空氣，但依工件W而異，亦可省略噴出空氣。In addition, when placing the workpiece on the insert block or taking out the workpiece after forming, air can be blown from the air suction/ejection holes formed in the insert block, but depending on the workpiece W, air blowing may be omitted.
又，亦可併用空氣的噴出與嵌件塊的工件支持面的表面處理。 In addition, blowing of air and surface treatment of the workpiece support surface of the insert block may be used in combination.
上述模製模具中，將上模2設為固定模，下模1設為可動模，但亦可上模2是可動模，下模1是固定模，亦可將雙方設為可動模。又，亦可加熱室4形成在上模2，模穴凹部形成在下模1。又，工件W不限於LED元件封裝用的金屬基板，亦可為樹脂基板，亦可為半導體晶片被以倒裝晶片方式連接或以打線接合方式連接於基板上者等之其他的工件。又，模製樹脂不限於LED用樹脂(矽氧樹脂)，亦可為環氧系的樹脂等。 In the above-mentioned molding die, the
1‧‧‧下模 1‧‧‧Die
2‧‧‧上模 2‧‧‧Top die
2a‧‧‧上模殘料廢品 2a‧‧‧Residual scraps of upper mold
2b‧‧‧上模流道 2b‧‧‧Top mold runner
2c‧‧‧上模架橋凹部 2c‧‧‧Concave part of upper die set-up bridge
2d‧‧‧上模澆口溝 2d‧‧‧Sprue groove of upper die
2e‧‧‧上模模穴凹部 2e‧‧‧Concave part of upper die cavity
3‧‧‧模製模具 3‧‧‧Molding mold
4‧‧‧加熱室 4‧‧‧heating chamber
5‧‧‧柱塞 5‧‧‧Plunger
6‧‧‧下模嵌件塊 6‧‧‧Lower die insert block
6a‧‧‧空氣吸引/噴出孔 6a‧‧‧Air suction/ejection holes
7‧‧‧工件推動機構 7‧‧‧Workpiece Pushing Mechanism
7a‧‧‧工件推動構件 7a‧‧‧Workpiece pushing member
7b、8b‧‧‧支點 7b, 8b‧‧‧Pivot
7c、8c、10‧‧‧螺旋彈簧 7c, 8c, 10‧‧‧coil spring
7d‧‧‧突出頂桿 7d‧‧‧Protruding ejector
8‧‧‧工件返回機構 8‧‧‧Workpiece return mechanism
8a‧‧‧工件返回構件 8a‧‧‧Workpiece return member
9‧‧‧可動模件 9‧‧‧Moveable modules
9a‧‧‧架橋部 9a‧‧‧Bridge Department
9b‧‧‧架橋溝 9b‧‧‧ bridge ditch
9c‧‧‧軸部 9c‧‧‧Shaft
11‧‧‧脫膜片 11‧‧‧Remove film
R‧‧‧模製樹脂 R‧‧‧Molding resin
W‧‧‧工件 W‧‧‧Workpiece
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| JP4426880B2 (en) * | 2004-03-12 | 2010-03-03 | Ｔｏｗａ株式会社 | Resin sealing device and resin sealing method |
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- 2018-04-20 WO PCT/JP2018/016286 patent/WO2018211909A1/en active Application Filing
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| JP2015051557A (en) * | 2013-09-06 | 2015-03-19 | アピックヤマダ株式会社 | Molding die, resin molding device and resin molding method |
| TW201709359A (en) * | 2015-07-15 | 2017-03-01 | Apic Yamada Corp | Molding die and resin molding device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018211909A1 (en) | 2018-11-22 |
| KR102342209B1 (en) | 2021-12-22 |
| JP6742273B2 (en) | 2020-08-19 |
| KR20200008597A (en) | 2020-01-28 |
| JP2018192712A (en) | 2018-12-06 |
| TW201902650A (en) | 2019-01-16 |
| CN110621463B (en) | 2021-10-15 |
| CN110621463A (en) | 2019-12-27 |
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