九、發明說明： 【發明所屬之技術領城】 技術領域 本發明係有關於一種可將電子零件及散熱板填封成形 的電子零件之樹脂填封成形裝置。 【先前技J 背景技術 迄今，已知一種包含上模與下模之電子零件樹脂填封 成形用的模具組。例如’在特開200M10830號公報及特開 平Π-274196號公報中，便揭示有使用前述模具組將電子零 件及散熱板填封成形的裝置。 在特開2001 -110830號公報及特開平11 -274196號公報 所揭示之半導體裝置與製造方法中，首先，將散熱板定位 於下模之模穴内。接著，安置裝載有半導體晶片等電子零 件的引線框’並在前述狀態下，使流動性樹脂透過樹脂通 路注入模穴内。結果，可製造出以樹脂包覆住半導體元件 的半導體裝置。 在前述特開2001-110830號公報中，提出各種可在模具 、’且呈閉合狀態下將流動性樹脂流入模具組内時，防止散熱 板在模穴内移動的方法。特開2001-110830號公報中揭示之 月J述方法之一例，係於散熱板本身設置凸部’並藉由前述 凸部與頂出銷互相卡合，可使散熱板固定於頂出銷。又 特開平11-274196號公報中所揭示之前述方法之另—例，係 藉由配置於模具組之樹脂注入口之延長線上的支持銷支持 下 來支持散熱 住配置於模穴内的散熱板，.並且藉由在位於散熱板之 面、用於防止位置偏移的凹部内設置支持銷， 板。 又’特開2001-110830號公報及特開 中，揭示了在基板之一側及另一側之各個主表面上搭艮 半導體裝置的封裝體。然而，近年來，由於封骏體有 薄型化為佳，故大多製造出僅在基板上側之主表面及 之主表面中任一者搭載有半導體裝置的封裝體。π 瓶又，已製 造出一種在前述薄变化之一側主表面上具有複數積層半 體裝置之積層構造的封裝體。此外，為了提昇前述僅 型化之其中一主表面上搭載半導體裝置之封裝體 f 性，也可於封裝體安裝散熱板。 …' 在前述狀況中，除了封裝體本身的薄型化之外， 板也以薄型化為佳。 …、 專利文獻1 :特開2001-110830號公報 專利文獻2 :特開平11-274196號公報 【勞'明内容】 發明揭示 發明所欲解決之課題 根據上述特開2001-110830號公報及特開平丨丨^ 號公報所揭示之技術，為了使散熱板不會在對應於封事體 之模穴内移動而固定散熱板的位置’會產生下列問題。 例如，根據上述文獻所揭示的技術，為了使散熱板不 曰移動而固定位置，必須使用三根以上的頂出銷（或支持 1338342 銷），因此，為了可以對應於三根以上的頂出銷（或支持銷）， 必須大幅提高散熱板之凸部及支持銷的尺寸精準度。又， 為了提昇散熱性，必須使散熱板露出封裝體。因此，必須 以高精準度進行散熱板的複雜加工，結果，會使製造成本 5 增加。 又，當使散熱板定位於樹脂成形用模穴内時，必須將 散熱板維持為水平狀態。因此，必須以高精準度控制模穴 内之頂出銷（或支持銷），所以模具組之内部構造會變得非常 複雜。 10 本發明係鑒於上述問題而作成者，目的在於提供一種 可輕易地以高精準度將散熱板定位於模穴内的電子零件之 樹脂填封成形裝置。 解決課題之手段 本發明之電子零件之樹脂填封成形裝置包含有：第1 15 模，係可安裝搭載有電子零件之基板者；第2模，係配置成 相對於前述第1模，且具有可***前述電子零件之模穴者； 1個以上之突出部，係形成於前述模穴内者；及散熱板，係 具有1個以上之開口，並且藉由前述1個以上之突出部分別 貫通前述1個以上之開口，可相對於前述模穴而定位者。 20 根據上述，可輕易地以高精準度將散熱板定位於模穴 内的電子零件之樹脂填封成形用模具組。 前述1個以上之突出部中至少1個也可為用以使成形品 與前述第2模分離的頂出銷。藉此，由於可利用頂出銷進行 散熱板之定位，故可防止零件數增加。又，前述1個以上之 7 突出部中至少1個也可構成用以將流動性 穴内的樹脂通路。藉此，由於可使樹脂通路突出於模月穴内: 故玎使樹脂較容易流遍模穴内全體。 又’樹脂通路之一部分或全部也可安裝於前述第2模且 可與則述第2板分離。藉此，可在樹脂通路因硬化樹脂而閉 塞時交換樹脂通路。 發明之效果 根據本發明，可更提昇安裝有散熱板及電子零件之封 裝製品（成形品）的生產性。 與附力圖式{并參照以下關於本發明之詳細說明，應 可更清楚地理解本發明之上述及其他目的、雜、型態及 優點。 圖式簡單說明 第1圖係搭栽於電子零件之樹脂密封成形裝置之模組 品的概略截面圖’顯示模組品的開啟狀態。 第2圖係顯不第丨圖所示之模組品為閉合狀態時注入流 動性樹脂之狀態的圖。 第3圖係與第1圖所不之模組品不同之另外一例之模組 品的概略截關，顯示模組品為閉合狀Μ注人流動性樹 脂之狀態。 第4圖係與第1圖所示 丁之楔組品不同之另外一例之模組 品的概略截面圖，顯示槿6 巧丁姨組品為閉合狀態時注入流動性樹 脂之狀態。 第5圖係與第1圖所示 F 組品不同之另外一例之模組 品的概略載面圖， 脂之狀態。 顯示模組品為閉合狀態時注人流動性樹 【資施方式】 實施發明之最佳型態 「 ^弟1〜）_評細說明本發明之實施型 月曰填封成《置。第丨及2圖分別傭胁許料 ==的模具組的主要部分。第3〜5_係· 於娜填封成形裝置之其他例子的模具组的主要部分。 百^ ’ _第丨及2圖_之電子零件之删旨填封成形 ==造，並且說明使用前述模具組而進行的樹脂 填封成形方法。另外，對於第3〜5圖中具有與第…圖中 之部位同樣構造及祕的部位，附上與第1及 符號同樣的符號。 凡件 模具組包含有：作為第i模而為固定的上模ι;配置於 相對於上模丨而作為第2模的可動之中間模2;及配置於中間 模2下方的下模（未圖示）。 上模1具有凹部7，該凹部7係可設置安裝有電子零件* 的基板6者。中間模2具有樹脂成形用之模穴3，而模幻中 可設置散熱板5。此外，下模具有樹脂材料供給用之加^部 (未圖示），加熱部内則設有樹脂加壓用的活塞（未圖示卜 又，中間模2具有可連通加熱部與模穴3的樹脂移送用 之樹脂通路8。上模1及中間模2(或可動之下模19)分別包含 有：插褒加熱器及/或柔性加熱器等加熱機構(未圖示^ 以使在模六3内成形之樹脂成型體（成形品）9突出於模穴3的 1338342 頂出銷10;及使模穴3與模具組之外部空間相連通的通氣孔 (未圖示）。 模具組可為第1及2圖所示之上模丨、中間模2及下模（未 圖不)所構成的二模構造’也可為兩個或四個以上之模具所 5構成者。又，也可使用配置非單―數而為複數模具組的模 組方式的樹脂填封成形裝置。 如第1及2圖所示’電子零件4包含：作為安裝於基板6 上之ICdntegration Circuit :積體電路）等半導體元件的晶片 11 ’及可電氣性地連接晶片11與基板6的線體12。在第丨及二 1〇圖中，雖顯示為單一數之晶片U安裝於基板6的半成品但 也可使用將複數晶片11安裝於基板6的矩陣陣列封裝型或 矩陣型半成品。若使用矩陣陣列封裝型或矩陣型的基板6， 可一次對複數之晶片11進行樹脂填封成形。 又，第1及2圖中，雖顯示為打線接合基板，但本發明 15之基板並非限定於此，也可為倒裝晶片基板或晶圓級封裝 基板等其他基板。此外，也可使用複數樹脂填封成型體在 基板上於上下方向積層的積層型封裝基板。 為了貫現薄型化封裝製品’在第1及2圖中，將散熱板5 設置成在儘量接近電子零件4、但不接觸的狀態下，覆蓋住 20 電子零件4。散熱板5之水平部15在樹脂填封成形結束後， 會在樹脂成型體9之上面露出，電子零件4的熱便會從前述 露出之散熱板5的水平部15放出至外部。結果，可提升電子 零件的散熱性。 另外’散熱板5在樹脂填封成形前’並不固定於基板6， 10 散熱板5在樹脂填封成形時，會藉由樹脂材料而與安置於上 模1及中間模2内之電子零件4及基板6—體化。 如第1圖所不政熱板5具有水平部15 '及可支持水平 部15的支持部16。於水平部15及支持部16形成有開口，可 在樹月曰填封成糾’使因加熱崎融的樹脂材料(流動性樹 脂17)可順暢地流動。另外，散熱板5之水平部15的外形係 圓形或有角形。 樹脂通路7係由例如相對於加熱部配置的樹脂分配用 的筛選部、流道及洗口（賢淹道)所構成。從第2圖可知，流 動性樹脂Π係從設置於模幻略中央部位而作為開口的液 口 13注入填充至模穴3内。洗口 13形成為可貫通設置於中間 核2之洗口構件14。X ’邊口構件14係可脫離中間模]地安 裝於中間模2。 洗口構件14之洗口 13的前端部分係突出於散3的底 面’並且當散熱板5安置於模穴3内之時，可貫通散熱板蝸 開口。如第2圖所示’前述洗口 13之前端部位係突出部此。 本發月之Ηϋ以上的突出部18係、包含有包括濟σ構件14之 澆口 13的則端部分(18 a)、與頂出銷10的前端部分(U b)中任 一方或雙方者。 如上所述，在本實施型態中，藉由突出部18a及18b分 別貫通散熱板5之水平部15的％ 口，散熱板5可相對於模穴3 而定位。此時，模穴3之底面與散熱板之水平部15相接觸， 因此，可防止散熱板5在上下方向及水平方向兩方向的移 1338342 更簡單地來說，藉由突出部18a、以及與突出部18a不 同之另一突出部18b所構成的突出部，散熱板5可輕易地以 高精準度定位於模穴3内。另外，突出部之數不限定於2個， 也可為3個以上。 5 關於本實施型態之樹脂填封成形方法，為了將電子零 件4及散熱板5安置於上模1及中間模2，首先，開啟上模1及 ' 中間模2(或可動之下模19)，並在前述狀態下，使2個突出部 18a及18b可分別貫通水平部15的2個開口，將散熱板5*** # 模穴3。然後，將安裝有電子零件4的基板6安置於凹部7。 10 在第1及2圖中，藉由突出部18a及18b將散熱板5定位 時，由洗口構件14之前端部分（18a)與頂出銷10之前端部分 (18b)所構成的2個突出部18a及18b，分別貫通於設在散熱板 5的2個開口《 又，本發明另一實施型態之模具組如第3圖所示。從第 I5 3圖可知，頂出銷1〇之前端部（i8b)及同樣為頂出銷10之其他 ^ 前端部分（18c)，分別貫通散熱板5的2個開口。如第3圖所 示，澆口構件14之前端部分並不突出於模穴3内，而模穴3 之底面與澆口 13位於同一平面。若散熱板5從平面看來的輪 廓為例如圓形，則僅藉由澆口構件14之前端部分（18a)之一 20處在平面看來模穴3之略中央（中心）部分為貫通散熱板5,即 可使散熱板5相對於模穴3而定位。 又，在第1〜3圖中，堯口構件14雖平面看來係形成於 模穴3的略中央部’但紗構件14的配置並不限定於第^ 圖所示者，也可為第4及5圖所示者。在第4及5圖中，係以 12 1338342 樹脂填封倒裝晶片基板。此時，在晶片11與基板7之間注入 流動性樹脂17(倒扣封裝(under-fill))。在第4圖中，濟口 13 係配置於模穴3之底面。又’在第5圖中，澆口 13係配置於 模穴3的側面，並藉由基板7之一部分與模穴3之側面所構 5成。在第3〜5圖中，藉由將2個頂出銷1〇之前端部分（1讣、 18c)分別貫通散熱板5的2個開口，而使散熱板5定位於模穴 3 ° 又，在第1〜4圖所示之模具組中，係構成為樹脂通路8 之洗口構件14為可安裝及可拆卸，但在第5圖所示之模具組 10 中，便無需澆口構件14。 如上所述，在使用薄型化之封裝製品及散熱板5時，藉 由在設置於電子零件4之樹脂填封成形用模組具的模穴3内 形成1個以上的突出部18，可輕易地以高精準度使散熱板5 在模穴3内定位。 15 在使用本實施型態之樹脂填封成形裝置時，首先，藉 由加熱機構將上模1及中間模2(或可動之下模19)加熱至樹 脂成形溫度。接著，散熱板5之水平部分15定位於可動之中 間模2(或可動之下模⑼的預定位置。此時，如第⑴圖所 示，兩個突出部18a及18b係貫通散熱板5之水平部15的開 20 口。又，在第3〜5圖之模具組中，兩個突出部娜及心則 係分別貫通散熱板5之水平部的2個開α。 接著，在已定位之散熱板5安置於模穴3内之狀態下， 將安裝有電子零件5之基板（或引線框）安置於模穴3内。然 後，將樹脂材料供給至加熱部内，接著，使中間模2(或可 13 1338342 動之下模19)往上方移動。藉此，上模丨及中間模2(或可動之 下模19)為閉合。此時，脖電子零件4***模穴3内。 接著，藉由活塞對於已在加熱部内熔融之樹脂材料施 加壓力，藉此，可將流動性樹脂17注入模穴3内，並且在模 5穴3中，散熱板5、電子零件4及基板6表面的一部分可包含 在對應於模穴3形狀的樹脂成型體（成形品)9内。 經過流動樹脂硬化所需的時間後，開啟上模丨及中間模 2(或可動之下模19)，使中間模2(或可動之下模19)移動至下 方。然後，利用用以將散熱板5定位之頂出銷丨〇，使樹脂成 10型體9脫離模穴3。藉此，可從上模1及中間模2(或可動之下 模19)取出樹脂成形體9及基板6。 根據本實施型態之樹脂填封成形裝置，可輕易地以高 精準度將散熱板5定位於用以將電子零件4樹脂填封成形之 核具組1及2的模穴3内。因此，可更提昇安裝有散熱板认 15電子零件4之封裝製品（成形品）的生產性。 以上詳細地說明本發明，但本發明不限定於所舉之 例，本發明之申請專利範圍所限定者僅為發明之精神與範 圍。 【阖式簡單說明】 2〇 帛1圖係搭載於電子零件之樹脂密封成形裝置之模組 品的概略截面圖，顯示模組品的開啟狀態。 第2圖係顯示第！圖所示之模組品為閉合狀態時注入流 動性樹脂之狀態的圖。 第3圖係與I圖所示之模組品不同之另外一例之模組 14 1338342 品的概略截面圖，顯示模組品為閉合狀態時注入流動性樹 脂之狀態。 ’ 第4圖係與第1圖所示之模組品不同之另外一例之模組 品的概略截面圖，顯示模組品為閉合狀態時注入流動性樹 5 脂之狀態。 第5圖係與第1圖所示之模組品不同之另外一例之模組 品的概略截面圖，顯示模組品為閉合狀態時注入流動性樹 脂之狀態。IX. Description of the Invention: [Technical Field] The present invention relates to a resin sealing and molding apparatus for an electronic component in which an electronic component and a heat dissipation plate are sealed and formed. [Prior Art J] Heretofore, a mold set for resin encapsulation molding of an electronic component including an upper mold and a lower mold has been known. For example, a device for sealing an electronic component and a heat sink using the above-described mold set is disclosed in Japanese Laid-Open Patent Publication No. Hei. No. Hei. In the semiconductor device and the manufacturing method disclosed in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. Next, a lead frame ‘ loaded with an electronic component such as a semiconductor wafer is placed, and in the above state, the fluid resin is injected into the cavity through the resin path. As a result, a semiconductor device in which a semiconductor element is covered with a resin can be manufactured. In the above-mentioned Japanese Laid-Open Patent Publication No. 2001-110830, there is proposed a method of preventing the heat radiating plate from moving in the cavity when the fluid resin is poured into the mold set in the mold and in a closed state. An example of the method disclosed in Japanese Laid-Open Patent Publication No. 2001-110830 is that the heat radiating plate itself is provided with a convex portion ′ and the convex portion and the ejector pin are engaged with each other to fix the heat radiating plate to the ejector pin. Another example of the above-described method disclosed in Japanese Laid-Open Patent Publication No. H11-274196 is to support the heat dissipating plate disposed in the cavity by supporting the support pin disposed on the extension line of the resin injection port of the mold set. And a support pin, a plate is provided in a recess located on the surface of the heat sink for preventing positional displacement. Further, JP-A-2001-110830 and JP-A No. 2001-110830 disclose a package in which a semiconductor device is stacked on each of the main surfaces on one side and the other side of the substrate. However, in recent years, since the sealing body is preferably thinned, a package in which a semiconductor device is mounted on only one of the main surface on the upper side of the substrate and the main surface is produced. Further, a π bottle has been produced with a laminated structure having a laminated structure of a plurality of laminated half devices on one side main surface of the aforementioned thin variation. Further, in order to enhance the package structure in which the semiconductor device is mounted on one of the main surfaces of the above-described type, the heat dissipation plate may be mounted on the package. ...' In the above situation, in addition to the thinning of the package itself, the plate is preferably thinned. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The technique disclosed in the Japanese Patent Publication No. discloses that the following problem arises in order to prevent the heat radiating plate from moving in a position corresponding to the cavity of the sealing body to fix the heat radiating plate. For example, according to the technique disclosed in the above documents, in order to fix the position of the heat sink without moving, it is necessary to use three or more ejector pins (or support 1338342 pins), so that it is possible to correspond to three or more ejector pins (or Support pin), the size accuracy of the convex part of the heat sink and the support pin must be greatly improved. Moreover, in order to improve heat dissipation, it is necessary to expose the heat sink to the package. Therefore, the complicated processing of the heat dissipation plate must be performed with high precision, and as a result, the manufacturing cost 5 is increased. Further, when the heat radiating plate is positioned in the cavity for molding the resin, the heat radiating plate must be maintained in a horizontal state. Therefore, the ejector pin (or the support pin) in the cavity must be controlled with high precision, so the internal structure of the die set becomes very complicated. The present invention has been made in view of the above problems, and an object thereof is to provide a resin sealing and molding apparatus for an electronic component which can easily position a heat dissipation plate in a cavity with high precision. Means for Solving the Problem A resin sealing and molding apparatus for an electronic component according to the present invention includes: a first 15th mold for mounting a substrate on which an electronic component is mounted; and a second mold disposed to be opposite to the first mold; a cavity in which the electronic component can be inserted; one or more protruding portions are formed in the cavity; and the heat dissipation plate has one or more openings, and the one or more protruding portions respectively penetrate the aforementioned More than one opening can be positioned relative to the aforementioned cavity. 20 According to the above, the heat-dissipating plate can be easily positioned with high precision in the resin-sealing molding die set of the electronic parts in the cavity. At least one of the one or more protruding portions may be an ejector pin for separating the molded article from the second mold. Thereby, since the positioning of the heat radiating plate can be performed by the ejector pin, the number of parts can be prevented from increasing. Further, at least one of the one or more protrusions may constitute a resin passage for the fluidity hole. Thereby, since the resin passage can be protruded into the mold moon hole, the resin is more likely to flow through the entire cavity. Further, part or all of the resin passage may be attached to the second mold and may be separated from the second plate. Thereby, the resin passage can be exchanged when the resin passage is closed by the hardened resin. Advantageous Effects of Invention According to the present invention, the productivity of a packaged product (molded article) to which a heat dissipation plate and an electronic component are mounted can be further improved. The above and other objects, aspects, aspects and advantages of the present invention will become more apparent from the detailed description of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view of a module of a resin sealing and molding apparatus built on an electronic component, showing the open state of the module. Fig. 2 is a view showing a state in which a fluid resin is injected when the module shown in Fig. 1 is in a closed state. Fig. 3 is a schematic cross-sectional view of another module different from the module product of Fig. 1, showing the state in which the module product is closed and the fluidity of the human body. Fig. 4 is a schematic cross-sectional view showing another example of a module different from the Ding wedge component shown in Fig. 1, showing a state in which a fluidity resin is injected when the 槿6 巧丁姨 component is in a closed state. Fig. 5 is a schematic plan view of a module of another example different from the F group shown in Fig. 1, the state of the grease. When the display module is in the closed state, the liquidity tree is injected. [Implementation mode] The best mode of the invention is implemented. "^弟1~"_Explanation Description The embodiment of the present invention is sealed into "Set. And the main part of the mold set of the 2nd and 5th series of the other parts of the mold seal forming apparatus. The hundred ^ ' _ 丨 and 2 pictures _ The electronic component is deleted and sealed, and the resin sealing molding method using the mold group described above is described. Further, in the third to fifth embodiments, the structure and the structure are the same as those in the first embodiment. The parts are attached with the same symbols as the first and the symbols. The mold set includes the upper mold ι which is fixed as the i-th mold, and the movable intermediate mold 2 which is disposed as the second mold with respect to the upper mold. And a lower mold (not shown) disposed under the intermediate mold 2. The upper mold 1 has a concave portion 7 which can be provided with a substrate 6 on which an electronic component* is mounted. The intermediate mold 2 has a cavity for resin molding. 3, and the heat sink 5 can be provided in the phantom. In addition, the lower mold has a supply of resin material. (not shown), a piston for pressurizing the resin is provided in the heating portion (not shown), the intermediate mold 2 has a resin passage 8 for resin transfer that can communicate the heating portion and the cavity 3. The upper mold 1 and the middle The mold 2 (or the movable lower mold 19) respectively includes a heating mechanism such as a plug heater and/or a flexible heater (not shown) so that the resin molded body (molded article) 9 molded in the mold 6 is protruded. The ejector pin 10 of the 1338342 of the cavity 3; and the vent hole (not shown) for communicating the cavity 3 with the outer space of the die set. The die set can be the upper die and the middle of the first and second figures. The two-mode structure constituting the mold 2 and the lower mold (not shown) may also be composed of two or more molds 5. Alternatively, a mold having a non-single-number and a plurality of mold sets may be used. A resin encapsulation molding apparatus of the group type. The wafer 11' of the semiconductor element such as the "electronic component 4 includes an IC dntegration circuit mounted on the substrate 6" as shown in Figs. 1 and 2 and can be electrically connected The wafer 11 and the wire body 12 of the substrate 6. In the second and second figures, although shown as a single number of wafers U A semi-finished product mounted on the substrate 6 may be a matrix array package type or a matrix type semi-finished product in which a plurality of wafers 11 are mounted on the substrate 6. If a matrix array package type or a matrix type substrate 6 is used, the plurality of wafers 11 may be resin-processed at one time. Further, in the first and second drawings, the substrate is shown as a wire bonding substrate, but the substrate of the present invention 15 is not limited thereto, and may be another substrate such as a flip chip substrate or a wafer level package substrate. It is also possible to use a plurality of resin-sealed molded bodies in a stacked-type package substrate which is laminated on the substrate in the vertical direction. In order to realize the thinned packaged article, in the first and second figures, the heat dissipation plate 5 is disposed as close as possible to the electronic component 4 In the state of no contact, cover 20 electronic parts 4. After the resin sealing molding is completed, the horizontal portion 15 of the heat radiating plate 5 is exposed on the upper surface of the resin molded body 9, and the heat of the electronic component 4 is discharged to the outside from the horizontal portion 15 of the exposed heat radiating plate 5. As a result, the heat dissipation of the electronic parts can be improved. In addition, the 'heat dissipation plate 5' is not fixed to the substrate 6 before the resin is filled and formed. 10 The heat dissipation plate 5 is formed by the resin material and the electronic components disposed in the upper mold 1 and the intermediate mold 2 when the resin is filled and formed. 4 and the substrate 6 - body. The non-political plate 5 as shown in Fig. 1 has a horizontal portion 15' and a support portion 16 which can support the horizontal portion 15. An opening is formed in the horizontal portion 15 and the support portion 16, and the resin material (fluid resin 17) which is heated and melted can be smoothly flowed in the tree. Further, the horizontal portion 15 of the heat radiating plate 5 has a circular or angular shape. The resin passage 7 is composed of, for example, a screening portion for distributing the resin disposed in the heating portion, a flow path, and a washing mouth. As is apparent from Fig. 2, the fluid resin enthalpy is injected into the cavity 3 from the liquid port 13 which is provided as an opening in the center of the phantom of the mold. The mouthpiece 13 is formed to be able to pass through the mouthwash member 14 provided in the intermediate core 2. The X' edge member 14 is attached to the intermediate mold 2 so as to be detachable from the intermediate mold. The front end portion of the mouthpiece 13 of the mouthwashing member 14 protrudes from the bottom surface of the dispersion 3 and penetrates the heat sink vortex opening when the heat dissipation plate 5 is placed in the cavity 3. As shown in Fig. 2, the front end portion of the above-mentioned washing port 13 is a protruding portion. The protruding portion 18 of the present month or more includes one or both of the end portion (18a) including the gate 13 of the zirconia member 14, and the front end portion (Ub) of the ejector pin 10. . As described above, in the present embodiment, the heat radiating plate 5 can be positioned with respect to the cavity 3 by the projections 18a and 18b respectively penetrating the % of the horizontal portion 15 of the heat radiating plate 5. At this time, the bottom surface of the cavity 3 is in contact with the horizontal portion 15 of the heat dissipation plate, so that the movement of the heat dissipation plate 5 in both the up and down direction and the horizontal direction can be prevented, 1338342, more simply, by the protrusion 18a, and The protruding portion formed by the other protruding portion 18b of the protruding portion 18a is different, and the heat radiating plate 5 can be easily positioned in the cavity 3 with high precision. Further, the number of the protruding portions is not limited to two, and may be three or more. 5 Regarding the resin sealing forming method of the present embodiment, in order to place the electronic component 4 and the heat radiating plate 5 in the upper mold 1 and the intermediate mold 2, first, the upper mold 1 and the intermediate mold 2 (or the movable lower mold 19) are opened. In the above state, the two protruding portions 18a and 18b can pass through the two openings of the horizontal portion 15, respectively, and the heat dissipation plate 5 can be inserted into the # cavity 3. Then, the substrate 6 on which the electronic component 4 is mounted is placed in the recess 7. 10 In the first and second figures, when the heat radiating plate 5 is positioned by the protruding portions 18a and 18b, two of the front end portion (18a) of the mouthwashing member 14 and the front end portion (18b) of the ejector pin 10 are formed. The protruding portions 18a and 18b are respectively penetrated through the two openings provided in the heat dissipation plate 5. Further, the mold set according to another embodiment of the present invention is as shown in Fig. 3. As can be seen from Fig. 3, the front end portion (i8b) of the ejector pin 1 and the other front end portion (18c) of the ejector pin 10 are respectively penetrated through the two openings of the heat dissipation plate 5. As shown in Fig. 3, the front end portion of the gate member 14 does not protrude into the cavity 3, and the bottom surface of the cavity 3 is located in the same plane as the gate 13. If the profile of the heat sink 5 from the plane is, for example, a circular shape, only a portion of the front end portion (18a) of the gate member 14 is in a plane which is slightly central (center) of the cavity 3 for heat dissipation. The plate 5 allows the heat sink 5 to be positioned relative to the cavity 3. Further, in the first to third figures, the mouthpiece member 14 is formed in a substantially central portion of the cavity 3 in a plan view, but the arrangement of the yarn member 14 is not limited to the one shown in the first figure, and may be the first Figures 4 and 5 are shown. In Figures 4 and 5, the flip chip substrate is filled with 12 1338342 resin. At this time, a fluid resin 17 (under-fill) is injected between the wafer 11 and the substrate 7. In Fig. 4, the jikou 13 is disposed on the bottom surface of the cavity 3. Further, in Fig. 5, the gate 13 is disposed on the side surface of the cavity 3, and is formed by a portion of the substrate 7 and the side surface of the cavity 3. In the third to fifth figures, the front end portions (1讣, 18c) of the two ejector pins 1 are respectively passed through the two openings of the heat dissipation plate 5, whereby the heat dissipation plate 5 is positioned at the cavity 3°. In the mold set shown in Figs. 1 to 4, the mouthwashing member 14 configured as the resin passage 8 is detachable and detachable, but in the mold set 10 shown in Fig. 5, the gate member 14 is not required. . As described above, when the thinned packaged product and the heat dissipation plate 5 are used, it is easy to form one or more protruding portions 18 in the cavity 3 of the resin sealing molding module provided in the electronic component 4. The ground plate is positioned in the cavity 3 with high precision. In the case of using the resin sealing and molding apparatus of the present embodiment, first, the upper mold 1 and the intermediate mold 2 (or the movable lower mold 19) are heated to a resin forming temperature by a heating mechanism. Next, the horizontal portion 15 of the heat dissipation plate 5 is positioned at a predetermined position of the movable intermediate mold 2 (or the movable lower mold (9). At this time, as shown in the figure (1), the two protruding portions 18a and 18b penetrate the heat dissipation plate 5 Further, in the mold group of the third to fifth embodiments, the two protrusions Na and the heart are respectively penetrated through two opening α of the horizontal portion of the heat dissipation plate 5. Next, in the positioned The heat sink 5 is placed in the cavity 3, and the substrate (or lead frame) on which the electronic component 5 is mounted is placed in the cavity 3. Then, the resin material is supplied into the heating portion, and then the intermediate mold 2 is Alternatively, the upper die 19) can be moved upward. Thereby, the upper die and the intermediate die 2 (or the movable lower die 19) are closed. At this time, the neck electronic component 4 is inserted into the cavity 3. Next, The pressure is applied to the resin material which has been melted in the heating portion by the piston, whereby the fluid resin 17 can be injected into the cavity 3, and in the cavity 3 of the die 5, the surface of the heat dissipation plate 5, the electronic component 4, and the substrate 6 A part may be contained in a resin molded body (molded article) 9 corresponding to the shape of the cavity 3. After the time required for the resin to harden, the upper die and the intermediate die 2 (or the movable lower die 19) are opened to move the intermediate die 2 (or the movable lower die 19) to the lower side. Then, the heat sink 5 is used. The ejector pin is positioned to disengage the resin into the cavity 3 from the cavity 10. Thereby, the resin molded body 9 and the substrate 6 can be taken out from the upper die 1 and the intermediate die 2 (or the movable lower die 19). In the resin sealing and forming device of the present embodiment, the heat dissipation plate 5 can be easily positioned with high precision in the cavity 3 of the core sets 1 and 2 for sealing the electronic component 4 by resin. Further, the productivity of the packaged product (molded article) in which the heat sink 15 electronic component 4 is mounted is improved. The present invention is described in detail above, but the present invention is not limited to the examples, and only the scope of the patent application of the present invention is limited. The spirit and scope of the invention. [Simplified description of the 阖] The 2〇帛1 diagram is a schematic cross-sectional view of a module product mounted on a resin sealing and molding device for electronic components, showing the open state of the module product. Injecting fluidity when the module shown in the figure is closed Figure 3 is a schematic cross-sectional view of another example of a module 14 1338342 which is different from the module shown in Figure I, showing the state in which the fluid resin is injected when the module is in the closed state. Fig. 4 is a schematic cross-sectional view showing another example of a module product different from the module product shown in Fig. 1, showing the state in which the fluidity tree 5 is injected when the module product is in a closed state. 1 is a schematic cross-sectional view of another example of a module product having a different module product, showing a state in which a fluid resin is injected when the module product is in a closed state.
【主要元件符號說明】 11.. .半導體晶片 12".線體 13.. .漁口 14···澆口構件[Description of main component symbols] 11.. Semiconductor wafer 12". Wire body 13.. . Fishing port 14···Gate member
1…上模 2.. .中間模 3.. .模穴 4.. .電子零件 5…放熱板 7.. .凹部 8".樹脂通路 9…樹脂成形體(成形品) 10.. .頂出銷(脫模銷） 15...水平部 16··.支持部 17…流動性樹脂 18(18a、18b、18c)···突出部 19…下模 151...Upper mold 2.. intermediate mold 3.. mold cavity 4.. electronic part 5...heat release plate 7..recess 8". resin passage 9...resin molded body (molded article) 10.. Delivery (release pin) 15... horizontal portion 16·. support portion 17... fluid resin 18 (18a, 18b, 18c)··· protruding portion 19... lower mold 15