CN100536100C - Resin sealing shaping device for electronic parts - Google Patents
Resin sealing shaping device for electronic parts Download PDFInfo
- Publication number
- CN100536100C CN100536100C CNB2007101485207A CN200710148520A CN100536100C CN 100536100 C CN100536100 C CN 100536100C CN B2007101485207 A CNB2007101485207 A CN B2007101485207A CN 200710148520 A CN200710148520 A CN 200710148520A CN 100536100 C CN100536100 C CN 100536100C
- Authority
- CN
- China
- Prior art keywords
- chamber
- resin
- heating panel
- electronic component
- mould
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011347 resin Substances 0.000 title claims abstract description 57
- 229920005989 resin Polymers 0.000 title claims abstract description 57
- 238000007493 shaping process Methods 0.000 title claims description 16
- 238000007789 sealing Methods 0.000 title claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 61
- 239000000758 substrate Substances 0.000 claims description 26
- 238000000465 moulding Methods 0.000 claims description 24
- 239000007788 liquid Substances 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract 3
- 230000000712 assembly Effects 0.000 description 33
- 238000000429 assembly Methods 0.000 description 33
- 239000004065 semiconductor Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 208000034189 Sclerosis Diseases 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
A resin seal forming device of an electronic element is disclosed, one or more projections formed in chamber are passed through and mounted separately at open-mouth of the heat radiation board into the chamber. Therefore, the heat radiation board is positioned in the chamber, using the present invention, can make the heat radiation board position in the chamber easily and highly precisely.
Description
Technical field
The present invention relates to electronic component and heating panel are carried out the resin sealing shaping device of the electronic component of seal molding.
Background technology
The known in the past mold assemblies that has a kind of resin-seal molding that comprises the electronic component of upper die and lower die to use.For example open in the flat 11-274196 communique, disclose to have and use this mold assemblies electronic component and heating panel to be carried out the scheme of seal molding at TOHKEMY 2001-110830 communique and spy
In TOHKEMY 2001-110830 communique and the special manufacture method of driving the semiconductor device that flat 11-274196 communique disclosed, at first heating panel is positioned in the chamber of counterdie.Secondly place the lead frame that electronic components such as semiconductor chip have been installed.Under this state, liquid resin is by in the resin channels injecting chamber.Its result can make the semiconductor device that is covered the semiconductor blank by resin.
In aforesaid TOHKEMY 2001-110830 communique, proposed under the state of mold assemblies closure, prevent the whole bag of tricks that heating panel moves in the time of in liquid resin flows into mold assemblies in chamber.In TOHKEMY 2001-110830 communique,, from protuberance being set on one's body, heating panel is fixed on the knock pin by this protuberance is engaged with knock pin at heating panel as an example of preceding method.In addition, open in the flat 11-274196 communique the spy, another example as preceding method, by the fulcrum post on the extended line of the resin inlet that is configured in mold assemblies the heating panel that is configured in the chamber is supported, while is at the lower surface of heating panel, in the recess of usefulness that prevents to misplace, fulcrum post is set, thereby heating panel is supported.
In addition, open in the flat 11-274196 communique at TOHKEMY 2001-110830 communique and spy, disclosed a kind of at substrate a side and the opposing party's first type surface separately on carry the assembly of semiconductor device.But, in recent years,, be only to make the assembly that on the either party of the first type surface of the first type surface of substrate upside and downside, carries semiconductor device mostly in order to expect the slimming of assembly product.In addition, be manufactured on the assembly that has the overlay structure of overlapping a plurality of semiconductor devices on a side the first type surface of this slimming in addition.And, also heating panel can be installed on assembly sometimes, be equipped with the thermal diffusivity of the assembly of semiconductor device on the first type surface with the side that only improves in this slimming.
In this situation, except the slimming of assembly itself, also expect the slimming of heating panel.
Patent documentation 1: TOHKEMY 2001-110830 communique
Patent documentation 2: Japanese kokai publication hei 11-274196 communique
If adopt above-mentioned TOHKEMY 2001-110830 communique and specially open the technology that flat 11-274196 communique is disclosed, owing to be in the chamber corresponding, not make heating panel movably with the fixed-site of heating panel, so following such problem is arranged with assembly.
For example, the technology that adopts above-mentioned document to disclose for not making heating panel movably with fixed-site, must be used the knock pin (fulcrum post) more than 3.Therefore, must greatly improve the protuberance of heating panel and the dimensional accuracy of fulcrum post for corresponding with knock pin (fulcrum post) more than 3.In addition, for improving thermal diffusivity, heating panel is exposed from assembly.Therefore, must carry out the complicated processing of heating panel itself with high accuracy, its result has increased manufacturing cost.
In the time of in heating panel being positioned at ester moulding usefulness chamber, heating panel must be maintained in horizontal state.Therefore, must be with the knock pin in the High Accuracy Control chamber (fulcrum post), thus make the internal structure of mold assemblies very complicated.
Summary of the invention
The present invention makes in view of the above problems, its purpose be to provide a kind of can be easily and accurately heating panel is positioned at the resin sealing shaping device of the electronic component in the chamber.
The resin sealing shaping device of electronic component of the present invention has: the 1st mould that the substrate that has carried electronic component can be installed; Be configured to the 2nd relative with the 1st mould, as to have the chamber that can insert electronic component mould; Be formed on the protuberance more than 1 in the chamber; Have 1 with upper shed, make 1 above protuberance connect 1 heating panel that is positioned at upper shed in the chamber respectively.
Thus, can be easily and accurately heating panel is positioned in the chamber set on the mold assemblies that the resin-seal molding of electronic component uses.
At least 1 knock pin that also drip molding is unloaded usefulness from the 2nd mould of aforesaid protuberance more than 1.Thus, owing to can utilize knock pin to carry out the location of heating panel, so can prevent the increase of part number.In addition, at least 1 of the protuberance more than 1 also can constitute the resin channels that the injection liquid resin is used in chamber.Thus, resin channels is projected in the chamber, easily makes resin be full of the interior integral body of chamber.
The part of resin channels or integral body also can be installed on the 2nd mould from the 2nd mould with unloading.Thus, in the occasion that resin channels is sealed by hardening resin, replaceable resin channels.
Adopt the present invention, can further improve the productivity ratio of the assembly product (drip molding) that heating panel and electronic component have been installed.
Above-mentioned other purpose of the present invention, feature, technical scheme and advantage, from understand with reference to the accompanying drawings of the present invention below can understand describing in detail.
Description of drawings
Fig. 1 is the roughly cutaway view that carries the mold assemblies on the resin sealing shaping device of electronic component, the state that the expression mold assemblies is opened.
Fig. 2 represents to inject the state of liquid resin when mold assemblies shown in Figure 1 is closed.
Fig. 3 is the roughly cutaway view of the mold assemblies of the other example different with mold assemblies shown in Figure 1, the state of expression injection liquid resin when mold assemblies is closed.
Fig. 4 is the roughly cutaway view of the mold assemblies of the another example different with mold assemblies shown in Figure 1, the state of expression injection liquid resin when mold assemblies is closed.
Fig. 5 is the roughly cutaway view of the mold assemblies of an again example different with mold assemblies shown in Figure 1, the state of expression injection liquid resin when mold assemblies is closed.
Embodiment
Below, describe the resin sealing shaping device of example of the present invention in detail according to Fig. 1～Fig. 5.Fig. 1 and Fig. 2 are respectively the main portions of carrying the mold assemblies on the resin sealing shaping device of electronic component.Fig. 3～Fig. 5 carries the other example on resin sealing shaping device, another example and the main portion of the mold assemblies of an example again.
At first, the structure of the mold assemblies that the resin-seal molding of the electronic component of Figure 1 and Figure 2 is used is described, and the method for resin-seal molding that carries out with this mold assemblies of explanation.In Fig. 3～Fig. 5, for having the structure identical and the position of function with the drawn position of Fig. 1 and Fig. 2, put on Fig. 1 and Fig. 2 in the identical reference marks of institute's target reference marks.
Mold assemblies has: as the fixing patrix 1 of the 1st mould; Be configured to the movable intermediate die 2 of conduct 2nd mould relative with patrix 1; Be configured in the counterdie (not shown) of the below of intermediate die 2.
Mold assemblies has three mode structures that are made of patrix 1, intermediate die 2 and counterdie (not shown) as shown in Figures 1 and 2, but the structure that also constitutes by the mould more than two or four.In addition, be not the resin sealing shaping device that individually uses the modular manner that has disposed a plurality of mold assemblies yet.
In addition, the leaded bonded substrate of expression among Fig. 1 and Fig. 2, but substrate of the present invention is not limited to this, also other substrates such as flip-chip substrate or wafer scale assembling substrates.In addition, also can use the stacked assembling substrates of stacked along the vertical direction a plurality of resin-seal molding bodies on substrate.
For realizing the completed knocked down products of slimming, in Fig. 1 and Fig. 2, heating panel 5 approaches electronic component 4 as far as possible, is arranged in overlay electronic element 4 under the discontiguous state.The horizontal part 15 of heating panel 5 upper surface from resin molded body 9 after resin-seal molding finishes exposes.The heat of electronic component 4 discharges to the outside from the horizontal part 15 of this heating panel that exposes 5, its result, the thermal diffusivity of raising electronic component.
Before resin-seal molding, heating panel 5 is not fixed on the substrate 6.When resin-seal molding, heating panel 5 by resin material with place electronic component 4 and substrate 6 in patrix 1 and the intermediate die 2 integrated.
As shown in Figure 1, heating panel 5 has the support 16 of horizontal part 15 and supporting horizontal part 15.On horizontal part 15 and support 16, form opening, so that the resin material (liquid resin 17) of fusion successfully flows by heating during resin-seal molding.The profile of the horizontal part 15 of heating panel 5 is circular or square.
The カ Le), runner and cast gate (casting nozzle) resin channels 8 for example comprises the collection unit that the resin distribution of relative configuration with crucible uses (Japanese:.Learn that from Fig. 2 liquid resin 17 is filled in the chamber 3 from being located at injecting as the cast gate 13 of opening of chamber 3 substantial middle portions.Cast gate 13 forms and connects the cast gate part 14 that is located in the intermediate die 2.Cast gate part 14 can be installed on the intermediate die 2 from intermediate die 2 with unloading.
The fore-end of the cast gate 13 of cast gate part 14 is outstanding from the bottom surface of chamber 3, and the opening of perforation heating panel 5 when heating panel 4 places chamber 3 in the time.The fore-end of this cast gate 13 is protuberance 18a as shown in Figure 2.Protuberance 18 more than 1 of the present invention is either party or the both sides that comprise among the fore-end 18b of fore-end 18a and knock pin 10, and fore-end 18a comprises the cast gate 13 of cast gate part 14.
So, in this example, protuberance 18a and 18b connect the opening of the horizontal part 15 of heating panel 5 separately, and heating panel 5 is positioned on the chamber 3, and at this moment, the bottom surface of chamber 3 contacts with the horizontal part 15 of heating panel 5.Therefore, can prevent the moving of this both direction of the above-below direction of heating panel 5 and horizontal direction.
More briefly, utilize 2 protuberances that constitute by protuberance 18a and another protuberance 18b that is different from protuberance 18a, thereby heating panel 5 can be positioned in the chamber 3 easily and accurately.The number of protuberance does not limit 2, more than 3 yet.
In the method for resin-seal molding of this example,, at first patrix 1 and intermediate die 2 (or movable counterdie 19) are opened for electronic component 4 and heating panel 5 are placed patrix 1 and intermediate die 2.Under this state, 2 protuberance 18a and 18b insert heating panel 15 respectively in the chambers 3 to connect 2 openings of horizontal part 15, then, the substrate 6 that electronic component 4 has been installed are placed recess 7.
In the occasion of heating panel 5 by protuberance 18a and 18b location, in Fig. 1 and Fig. 2,2 protuberance 18a that are made of the fore-end 18b of the fore-end 18a of cast gate part 14 and knock pin 10 and 18b connect 2 openings on the heating panel 5 respectively.
Fig. 3 has represented the mold assemblies of another example of the present invention.Learn that from Fig. 3 another fore-end 18c of the fore-end 18b of knock pin 10 and same knock pin 10 connects 2 openings of heating panel 5 respectively.As shown in Figure 3, the fore-end of cast gate part 14 is not projected in the chamber 3, and the bottom surface of chamber 3 and cast gate 13 are positioned at same plane.If heating panel 5 is overlooked for example positive toroidal of the profile seen, then the position of the fore-end 18a of cast gate part 14 just can be positioned at heating panel 5 in the chamber 3 as long as connect heating panel 5 in substantial middle (center) part of the chamber of overlooking to see 3.
In Fig. 1～Fig. 3, cast gate part 14 is formed on overlooks the substantial middle portion that is seen as chamber 3, but the configuration of cast gate part 14 is not limited to Fig. 1～structure shown in Figure 3, also Fig. 4 and structure shown in Figure 5.In Fig. 4 and Fig. 5, flip-chip substrate is by resin-sealed.In this occasion, inject (not being full of) liquid resin 17 between chip 11 and the substrate 7.In Fig. 4, cast gate 13 is configured in the end of the bottom surface of chamber 3.In addition, in Fig. 5, cast gate 13 is configured in the side of chamber 3, and is made of the part of substrate 7 and the side of chamber 3.In Fig. 3～Fig. 5, fore-end 18b, the 18c of 2 knock pins 10 connects 2 openings of heating panel 5 respectively and heating panel 3 is positioned in the chamber 3.
In the mold assemblies of Fig. 1～shown in Figure 4, the cast gate part 14 in the resin channels 7 is the structures that can install, unload, but in mold assemblies shown in Figure 5, does not need cast gate part 14.
As mentioned above, in the subassembly product that uses slimming and the occasion of heating panel 5, by the protuberance 18 of formation more than 1 in the chamber in the mold assemblies of using at the resin-seal molding of being located at electronic component 43, thereby heating panel 5 can be positioned in the chamber 3 easily and accurately.
When using the resin sealing shaping device of this example, at first, patrix 1 and intermediate die 2 (or movable counterdie 19) are heated to the ester moulding temperature by heater.Then, the horizontal component 15 of heating panel 5 is positioned in the assigned position of movable intermediate die 2 (or movable counterdie 19).At this moment, as shown in Figures 1 and 2,2 protuberance 18a and 18b connect the opening on the horizontal part 15 of heating panel 5.In addition, in the occasion of the mold assemblies of Fig. 3～Fig. 5,2 protuberance 18b and 18c connect 2 openings of the horizontal part 15 of heating panel 5 respectively.
Then, place under the state in the chamber 3 at heating panel 5 that will the location, the substrate 6 (or lead frame) that electronic component 4 has been installed is placed in the chamber 3.Then, resin material is supplied in the crucible.Then, intermediate die 2 (or movable counterdie 19) is moved upward.Thus, with patrix 1 and intermediate die 2 (or movable counterdie 19) closure, at this moment, electronic component 4 is inserted in the chamber 3.
Then, by plunger pressure is put on the resin material of fusion in the crucible, thus, in liquid resin injecting chamber 3, in chamber 3, wrap in the resin molded body corresponding (drip molding) 9 in the part on the surface of heating panel 5, electronic component 4 and substrate 6 quilt simultaneously with the shape of chamber 3.
For making stir-in resin sclerosis through after between in case of necessity, patrix 1 and intermediate die 2 (or movable counterdie 19) are opened, intermediate die 2 (or movable counterdie 19) is moved downwards.Then, utilization makes the knock pin 10 of heating panel 5 location usefulness and resin molded body 9 is taken off from chamber 3.Thus, from patrix 1 and intermediate die 2 (or movable counterdie 19), take off resin molded body 9 and substrate 6.
Adopt the resin sealing shaping device of this example, heating panel 5 can be positioned at easily and accurately electronic component 4 is carried out in the chamber 3 of mold assemblies 1 that resin-seal molding uses and 2.Therefore, can further improve the productivity ratio of the subassembly product (drip molding) that heating panel 5 and electronic component 4 have been installed.
Though describe the present invention in detail, it just is used for not limiting for example, can be interpreted as clearly that scope of the present invention only is limited to the appended claims.
Claims (3)
1. the resin sealing shaping device of an electronic component is characterized in that, has:
The 1st mould of the substrate that has carried electronic component can be installed;
Be configured to the 2nd relative with described the 1st mould, as to have the chamber that can insert described electronic component mould;
Be formed on the protuberance more than 1 in the described chamber;
Have 1 with upper shed, make described 1 above protuberance connect described 1 heating panel that is positioned at upper shed in the described chamber respectively,
At least 1 formation of described protuberance more than 1 is injected the resin channels that liquid resin is used in described chamber.
2. the resin sealing shaping device of electronic component as claimed in claim 1 is characterized in that, at least 1 of described protuberance more than 1 is the branch mould pin that drip molding is unloaded usefulness from described the 2nd mould.
3. the resin sealing shaping device of electronic component as claimed in claim 1 is characterized in that, the part of described resin channels or integral body can be installed on described the 2nd mould from described the 2nd mould with unloading.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006228941 | 2006-08-25 | ||
| JP2006228941A JP5128095B2 (en) | 2006-08-25 | 2006-08-25 | Resin sealing molding equipment for electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101131946A CN101131946A (en) | 2008-02-27 |
| CN100536100C true CN100536100C (en) | 2009-09-02 |
Family
ID=39129145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007101485207A Expired - Fee Related CN100536100C (en) | 2006-08-25 | 2007-08-22 | Resin sealing shaping device for electronic parts |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5128095B2 (en) |
| KR (1) | KR100848746B1 (en) |
| CN (1) | CN100536100C (en) |
| TW (1) | TW200811968A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105269744A (en) * | 2014-06-09 | 2016-01-27 | 东和株式会社 | Resin sealing apparatus and resin sealing method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6027569B2 (en) * | 2014-03-26 | 2016-11-16 | エムテックスマツムラ株式会社 | Hollow package manufacturing method and hollow package |
| JP6549531B2 (en) * | 2016-06-30 | 2019-07-24 | Ｔｏｗａ株式会社 | Resin molding apparatus and method of manufacturing resin molded article |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3304513B2 (en) * | 1993-06-29 | 2002-07-22 | アピックヤマダ株式会社 | Semiconductor device with heat radiator and method of manufacturing the same |
| SG50009A1 (en) * | 1996-03-14 | 1998-06-15 | Towa Corp | Method of sealing electronic component with molded resin |
| JPH11274196A (en) | 1998-03-26 | 1999-10-08 | Seiko Epson Corp | Manufacture of semiconductor device, molding system and the semiconductor device |
| JP4273592B2 (en) | 1999-10-08 | 2009-06-03 | 株式会社デンソー | Manufacturing method of resin-encapsulated semiconductor device |
| JP2003197664A (en) * | 2001-12-28 | 2003-07-11 | Seiko Epson Corp | Semiconductor device, its manufacturing method, circuit board, and electronic instrument |
-
2006
- 2006-08-25 JP JP2006228941A patent/JP5128095B2/en active Active
-
2007
- 2007-06-07 TW TW096120517A patent/TW200811968A/en unknown
- 2007-07-04 KR KR1020070066899A patent/KR100848746B1/en active IP Right Grant
- 2007-08-22 CN CNB2007101485207A patent/CN100536100C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105269744A (en) * | 2014-06-09 | 2016-01-27 | 东和株式会社 | Resin sealing apparatus and resin sealing method |
| CN105269744B (en) * | 2014-06-09 | 2018-04-20 | 东和株式会社 | Resin encapsulation equipment and resin encapsulation method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100848746B1 (en) | 2008-07-25 |
| TW200811968A (en) | 2008-03-01 |
| JP5128095B2 (en) | 2013-01-23 |
| TWI338342B (en) | 2011-03-01 |
| KR20080018791A (en) | 2008-02-28 |
| JP2008053509A (en) | 2008-03-06 |
| CN101131946A (en) | 2008-02-27 |
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