JP5014602B2 - 印刷回路基板及びこれを利用した表示装置 - Google Patents
印刷回路基板及びこれを利用した表示装置 Download PDFInfo
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- JP5014602B2 JP5014602B2 JP2005211574A JP2005211574A JP5014602B2 JP 5014602 B2 JP5014602 B2 JP 5014602B2 JP 2005211574 A JP2005211574 A JP 2005211574A JP 2005211574 A JP2005211574 A JP 2005211574A JP 5014602 B2 JP5014602 B2 JP 5014602B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/114—Pad being close to via, but not surrounding the via
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
- H05K2201/09518—Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2072—Anchoring, i.e. one structure gripping into another
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
- Liquid Crystal (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Description
AIKOH社のプッシュプルゲージ(push-pull gauge)(モデル名:1605HTP)を利用して、PCBの接続パッドにハンダ付けで付着されたコネクタ両端の剥離強度を測定した。本発明で用いるプッシュプルゲージは、0〜50kgf範囲で剥離強度を測定することができる。また、1〜200mm/minに速度を可変することができる。プッシュプルゲージを利用してコネクタ両端に圧力を継続して増加させながら引くと剥離が発生する。この時の圧力のピーク値を求めて剥離強度を測定した。このような剥離強度の測定方法に関しては、本発明の属する技術分野における通常の知識を有する者であれば容易に理解できるので、その詳細な説明は省略する。
本発明では、図3に示した本発明の第1実施例に係るPCB10のように、側面の周囲にホールを設けた接続パッドにハンダ付けで付着されたコネクタに対する実験を行った。同一構造のPCBサンプル5個を用いて、コネクタの両端にプッシュプルゲージを固定して引き、コネクタがPCBから剥離するときの剥離強度をコネクタの左右両端で各々測定し、その平均値を算出した。各PCBサンプルの左右の剥離強度及びその平均値を表1に示す。
従来技術の場合、図9に示したように、側面周囲にホールを設けない接続パッドにハンダ付けで付着されたコネクタに対する実験を行った。同一構造のPCBサンプル5個を用いて、コネクタの両端にプッシュプルゲージを固定して引き、コネクタがPCBから剥離するときの剥離強度をコネクタの左右両端で各々測定し、その平均値を算出した。各PCBサンプルの左右の剥離強度及びその平均値を表1に示す。
70 バックライトアセンブリー、
60 液晶表示パネルアセンブリー、
80 液晶表示パネル、
81 TFT基板、
83 カラーフィルタ基板、
100 液晶表示装置、
130 コネクタ、
114、214、314、414、514、516 ホール、
112、212、312、512 接続パッド部、
115、215、315、415、515 導電層、
118、218、318、418 絶縁層、
111、211、213、311、411、511、513 支持部材。
Claims (18)
- 脱着可能なコネクタが実装される印刷回路基板であって、
前記コネクタが装着される、前記印刷回路基板の上面に一部面が露出して接続パッド部を形成する導電層、及び前記導電層に隣接して積層された絶縁層を備え、
前記接続パッド部から周囲に伸延する導電層と、前記接続パッド部の周囲に沿って形成され、前記絶縁層を開口して形成されるホールと、前記ホールの表面にコーティングされ、前記導電層と連結される支持部材と、をさらに備え、
前記導電層の端部から前記ホールまでの当該導電層の周辺部が、前記印刷回路基板の内部において突出した突出部を形成するように、前記ホールが、当該導電層の周辺に形成されることを特徴とする印刷回路基板。 - 前記支持部材は、前記ホールの表面コーティングから延長されて、前記印刷回路基板の表面上にコーティングされることによって前記支持部材の一部が前記ホールの外部に露出されることを特徴とする請求項1に記載の印刷回路基板。
- 前記ホールは、前記印刷回路基板の上面及び前記印刷回路基板の下面のいずれか一方にのみ開口されることを特徴とする請求項1または2に記載の印刷回路基板。
- 前記ホールは、前記印刷回路基板の上面から下面まで貫通して形成されることを特徴とする請求項1または2に記載の印刷回路基板。
- 前記支持部材は、前記導電層の素材と同一の素材で形成されることを特徴とする請求項1〜4のいずれか一項に記載の印刷回路基板。
- 前記支持部材及び前記導電層は、銅箔からなることを特徴とする請求項1〜5のいずれか一項に記載の印刷回路基板。
- 前記ホールは、前記接続パッド部の一の角を共有する二側面の周囲に沿って複数設けられていることを特徴とする請求項1〜6のいずれか一項に記載の印刷回路基板。
- 前記ホールは、前記接続パッド部の側面の周囲に沿って並んで複数設けられていることを特徴とする請求項1〜7のいずれか一項に記載の印刷回路基板。
- 前記ホールは2つ以上設けられ、前記支持部材は前記印刷回路基板の内部を通じて相互に連結されることを特徴とする請求項1〜8のいずれか一項に記載の印刷回路基板。
- 画像が表示される表示パネルと、
前記表示パネルに接続され、脱着可能に実装されたコネクタを通じて駆動信号の印加を受け、前記コネクタが装着される接続パッド部、及び前記コネクタが装着されない周辺部に伸延して形成される導電層を有する印刷回路基板と、を備え、
前記接続パッド部の周囲に沿って形成され、前記導電層の周辺部を開口して設けられるホールの表面にコーティングされ、前記接続パッド部における導電層と連結された支持部材をさらに備え、
前記導電層の端部から前記ホールまでの当該導電層の周辺部が、前記印刷回路基板の内部に突出した突出部を形成するように、前記ホールが、当該導電層の周辺に形成されることを特徴とする表示装置。 - 前記コネクタは、前記接続パッド部を覆いながら前記接続パッドの上側に固定されていることを特徴とする請求項10に記載の表示装置。
- 前記表示パネルは液晶表示パネルであることを特徴とする請求項10または11に記載の表示装置。
- 前記支持部材が、前記ホールの表面コーティングから延長されて前記印刷回路基板の表面上にコーティングされることによって、前記支持部材の一部が前記ホールの外部に露出されることを特徴とする請求項10〜12のいずれか一項に記載の表示装置。
- 前記ホールは、前記印刷回路基板の上面及び前記印刷回路基板の下面のいずれか一方にのみ開口されることを特徴とする請求項10〜13のいずれか一項に記載の表示装置。
- 前記ホールは、前記印刷回路基板の上面から下面まで貫通して形成されることを特徴とする請求項10〜13のいずれか一項に記載の表示装置。
- 前記ホールは、前記接続パッド部の一の角を共有する二側面の周囲に複数設けられていることを特徴とする請求項10〜15のいずれか一項に記載の表示装置。
- 前記ホールは、前記接続パッド部の側面の周囲に沿って並んで複数設けられていることを特徴とする請求項10〜16のいずれか一項に記載の表示装置。
- 前記ホールは2つ以上設けられ、前記支持部材が前記印刷回路基板の内部を通じて相互に連結されていることを特徴とする請求項10〜17のいずれか一項に記載の表示装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR10-2004-0057669 | 2004-07-23 | ||
KR1020040057669A KR20060008021A (ko) | 2004-07-23 | 2004-07-23 | 인쇄회로기판 및 이를 이용한 평판표시장치 |
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JP2006041521A JP2006041521A (ja) | 2006-02-09 |
JP5014602B2 true JP5014602B2 (ja) | 2012-08-29 |
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JP2005211574A Expired - Fee Related JP5014602B2 (ja) | 2004-07-23 | 2005-07-21 | 印刷回路基板及びこれを利用した表示装置 |
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US (2) | US7432450B2 (ja) |
JP (1) | JP5014602B2 (ja) |
KR (1) | KR20060008021A (ja) |
CN (1) | CN100539802C (ja) |
TW (1) | TWI386706B (ja) |
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US7477521B2 (en) * | 2007-05-15 | 2009-01-13 | Acterna Llc | Isolating stress on a printed circuit board |
KR101420825B1 (ko) * | 2007-10-15 | 2014-07-21 | 삼성디스플레이 주식회사 | 인쇄회로기판 및 이를 갖는 표시장치 |
TWI383201B (zh) * | 2008-02-26 | 2013-01-21 | Chimei Innolux Corp | 顯示裝置及背光模組之電路板之固定方法 |
KR101480356B1 (ko) * | 2008-06-09 | 2015-01-09 | 삼성디스플레이 주식회사 | 연성 인쇄 회로 기판 및 이를 포함하는 액정 표시 장치 |
US8294037B2 (en) * | 2009-07-20 | 2012-10-23 | Sony Ericsson Mobile Communications Ab | Method for arranging a component on a circuit board |
JP2012164750A (ja) * | 2011-02-04 | 2012-08-30 | Canon Inc | 電子機器 |
CN102621726A (zh) * | 2012-04-26 | 2012-08-01 | 深圳市华星光电技术有限公司 | 液晶显示模组、液晶显示装置及背板 |
KR102127508B1 (ko) * | 2013-08-23 | 2020-06-30 | 삼성디스플레이 주식회사 | 인쇄 회로 기판 어셈블리 및 그것을 포함하는 표시 장치 |
KR102252077B1 (ko) * | 2014-10-20 | 2021-05-18 | 삼성디스플레이 주식회사 | 표시 장치 |
CN107831610A (zh) * | 2017-10-26 | 2018-03-23 | 惠科股份有限公司 | 信号传输装置及显示装置 |
CN107831609A (zh) * | 2017-10-26 | 2018-03-23 | 惠科股份有限公司 | 信号传输装置的制造方法及显示装置的制造方法 |
KR102657249B1 (ko) | 2018-08-27 | 2024-04-15 | 삼성디스플레이 주식회사 | 표시 패널, 및 이를 포함하는 표시 장치 |
JP7202202B2 (ja) * | 2019-02-01 | 2023-01-11 | 株式会社ジャパンディスプレイ | 表示装置及びプリント回路基板 |
KR20210145025A (ko) | 2020-05-22 | 2021-12-01 | 삼성디스플레이 주식회사 | 전자 장치 |
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-
2004
- 2004-07-23 KR KR1020040057669A patent/KR20060008021A/ko not_active Application Discontinuation
-
2005
- 2005-07-13 TW TW094123722A patent/TWI386706B/zh not_active IP Right Cessation
- 2005-07-14 US US11/181,097 patent/US7432450B2/en active Active
- 2005-07-21 JP JP2005211574A patent/JP5014602B2/ja not_active Expired - Fee Related
- 2005-07-22 CN CNB2005100874196A patent/CN100539802C/zh not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
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TW200609585A (en) | 2006-03-16 |
JP2006041521A (ja) | 2006-02-09 |
TWI386706B (zh) | 2013-02-21 |
US20060016618A1 (en) | 2006-01-26 |
CN100539802C (zh) | 2009-09-09 |
US20080316415A1 (en) | 2008-12-25 |
US7432450B2 (en) | 2008-10-07 |
KR20060008021A (ko) | 2006-01-26 |
CN1735314A (zh) | 2006-02-15 |
US8144300B2 (en) | 2012-03-27 |
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