JP4978753B2 - 接着剤用樹脂組成物、これを含有する接着剤、接着性シートおよびこれを接着剤層として含むプリント配線板 - Google Patents

接着剤用樹脂組成物、これを含有する接着剤、接着性シートおよびこれを接着剤層として含むプリント配線板 Download PDF

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Publication number
JP4978753B2
JP4978753B2 JP2011528129A JP2011528129A JP4978753B2 JP 4978753 B2 JP4978753 B2 JP 4978753B2 JP 2011528129 A JP2011528129 A JP 2011528129A JP 2011528129 A JP2011528129 A JP 2011528129A JP 4978753 B2 JP4978753 B2 JP 4978753B2
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Japan
Prior art keywords
resin
adhesive
thermoplastic resin
parts
resin composition
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English (en)
Japanese (ja)
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JPWO2011129278A1 (ja
Inventor
慎太郎 南原
裕子 麻田
武 伊藤
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Toyobo Co Ltd
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Toyobo Co Ltd
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Publication of JPWO2011129278A1 publication Critical patent/JPWO2011129278A1/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
    • C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
    • C08G18/0823—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6633—Compounds of group C08G18/42
    • C08G18/6659—Compounds of group C08G18/42 with compounds of group C08G18/34
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
JP2011528129A 2010-04-14 2011-04-08 接着剤用樹脂組成物、これを含有する接着剤、接着性シートおよびこれを接着剤層として含むプリント配線板 Active JP4978753B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011528129A JP4978753B2 (ja) 2010-04-14 2011-04-08 接着剤用樹脂組成物、これを含有する接着剤、接着性シートおよびこれを接着剤層として含むプリント配線板

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010092938 2010-04-14
JP2010092938 2010-04-14
JP2011528129A JP4978753B2 (ja) 2010-04-14 2011-04-08 接着剤用樹脂組成物、これを含有する接着剤、接着性シートおよびこれを接着剤層として含むプリント配線板
PCT/JP2011/058902 WO2011129278A1 (ja) 2010-04-14 2011-04-08 接着剤用樹脂組成物、これを含有する接着剤、接着性シートおよびこれを接着剤層として含むプリント配線板

Publications (2)

Publication Number Publication Date
JP4978753B2 true JP4978753B2 (ja) 2012-07-18
JPWO2011129278A1 JPWO2011129278A1 (ja) 2013-07-18

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JP2011528129A Active JP4978753B2 (ja) 2010-04-14 2011-04-08 接着剤用樹脂組成物、これを含有する接着剤、接着性シートおよびこれを接着剤層として含むプリント配線板

Country Status (5)

Country Link
JP (1) JP4978753B2 (ko)
KR (1) KR101660083B1 (ko)
CN (1) CN102782074B (ko)
TW (1) TWI487762B (ko)
WO (1) WO2011129278A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5688077B2 (ja) * 2010-04-14 2015-03-25 東洋紡株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着性シートおよびこれを接着剤層として含むプリント配線板

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5304152B2 (ja) * 2008-09-30 2013-10-02 東洋紡株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着シート及びこれを接着層として含むプリント配線板
JP5850103B1 (ja) * 2014-07-25 2016-02-03 横浜ゴム株式会社 接着剤組成物
WO2016013621A1 (ja) * 2014-07-25 2016-01-28 横浜ゴム株式会社 接着剤組成物
JP5924383B2 (ja) * 2014-07-25 2016-05-25 横浜ゴム株式会社 接着剤組成物
JP5953391B1 (ja) * 2015-03-30 2016-07-20 株式会社フジクラ 熱硬化性接着剤組成物、カバーレイフィルム、接着剤フィルム、金属張積層板及びフレキシブルプリント配線板
JP6170211B1 (ja) * 2016-07-15 2017-07-26 株式会社フジクラ 熱硬化性接着剤組成物、カバーレイフィルム、接着剤フィルム、金属張積層板及びフレキシブルプリント配線板
KR102433526B1 (ko) * 2017-03-28 2022-08-17 도요보 가부시키가이샤 카르복실산 기 함유 폴리에스테르계 접착제 조성물
TWI779066B (zh) * 2017-07-19 2022-10-01 日商東洋紡股份有限公司 黏接劑組成物
JP7098350B2 (ja) * 2018-02-28 2022-07-11 キヤノン株式会社 接着シートを用いたインクジェット記録ヘッド及び製造方法
CN108587508B (zh) * 2018-03-29 2021-04-06 广东莱尔新材料科技股份有限公司 一种高粘金属力的热熔胶膜及其制备方法
CN116731500A (zh) * 2023-06-20 2023-09-12 国网湖北省电力有限公司孝感供电公司 一种电缆线路包覆材料及其制备方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08120250A (ja) * 1994-10-21 1996-05-14 Daicel Chem Ind Ltd 接着剤組成物
JP2003027030A (ja) * 2001-07-19 2003-01-29 Nitto Shinko Kk 耐湿熱性ホットメルト接着剤組成物
JP2005170999A (ja) * 2003-12-09 2005-06-30 Toyobo Co Ltd 接着剤及びそれを用いたポリエステルフィルムラミネート鋼板
JP2007204715A (ja) * 2006-02-06 2007-08-16 Toyobo Co Ltd 接着剤組成物及びそれを用いたフレキシブル銅張積層板
JP2008019375A (ja) * 2006-07-14 2008-01-31 Toyobo Co Ltd ポリエステル樹脂組成物及びそれを含む接着剤
JP2008260831A (ja) * 2007-04-11 2008-10-30 Mitsubishi Plastics Ind Ltd 水性接着剤および樹脂シート被覆金属板
JP2009084348A (ja) * 2007-09-28 2009-04-23 Toyobo Co Ltd 溶剤可溶型結晶性ポリエステル樹脂を用いた接着剤組成物、積層体並びにフレキシブルフラットケーブル
WO2010035822A1 (ja) * 2008-09-29 2010-04-01 東洋紡績株式会社 ポリエステル樹脂組成物、これを含む接着剤、接着テープおよびフレキシブルフラットケーブル
WO2010038733A1 (ja) * 2008-09-30 2010-04-08 東洋紡績株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着シートおよびこれを用いて接着したプリント配線板用積層体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4423513B2 (ja) 1997-10-20 2010-03-03 東洋紡績株式会社 接着用樹脂組成物及び接着用フィルム
JP5286084B2 (ja) * 2006-07-19 2013-09-11 積水化学工業株式会社 ダイシング・ダイボンディングテープ及び半導体チップの製造方法
JP2008205370A (ja) 2007-02-22 2008-09-04 Sumitomo Bakelite Co Ltd 樹脂組成物、支持基材付き接着剤および補強板付プリント回路板
JP5304152B2 (ja) * 2008-09-30 2013-10-02 東洋紡株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着シート及びこれを接着層として含むプリント配線板

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08120250A (ja) * 1994-10-21 1996-05-14 Daicel Chem Ind Ltd 接着剤組成物
JP2003027030A (ja) * 2001-07-19 2003-01-29 Nitto Shinko Kk 耐湿熱性ホットメルト接着剤組成物
JP2005170999A (ja) * 2003-12-09 2005-06-30 Toyobo Co Ltd 接着剤及びそれを用いたポリエステルフィルムラミネート鋼板
JP2007204715A (ja) * 2006-02-06 2007-08-16 Toyobo Co Ltd 接着剤組成物及びそれを用いたフレキシブル銅張積層板
JP2008019375A (ja) * 2006-07-14 2008-01-31 Toyobo Co Ltd ポリエステル樹脂組成物及びそれを含む接着剤
JP2008260831A (ja) * 2007-04-11 2008-10-30 Mitsubishi Plastics Ind Ltd 水性接着剤および樹脂シート被覆金属板
JP2009084348A (ja) * 2007-09-28 2009-04-23 Toyobo Co Ltd 溶剤可溶型結晶性ポリエステル樹脂を用いた接着剤組成物、積層体並びにフレキシブルフラットケーブル
WO2010035822A1 (ja) * 2008-09-29 2010-04-01 東洋紡績株式会社 ポリエステル樹脂組成物、これを含む接着剤、接着テープおよびフレキシブルフラットケーブル
WO2010038733A1 (ja) * 2008-09-30 2010-04-08 東洋紡績株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着シートおよびこれを用いて接着したプリント配線板用積層体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5688077B2 (ja) * 2010-04-14 2015-03-25 東洋紡株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着性シートおよびこれを接着剤層として含むプリント配線板
US9133300B2 (en) 2010-04-14 2015-09-15 Toyo Boseki Kabushiki Kaisha Resin composition for adhesive, adhesive containing resin composition for adhesive, adhesive sheet containing resin composition for adhesive, and printed wiring board including adhesive or adhesive sheet as adhesive layer

Also Published As

Publication number Publication date
KR101660083B1 (ko) 2016-09-26
TW201207059A (en) 2012-02-16
KR20130057965A (ko) 2013-06-03
JPWO2011129278A1 (ja) 2013-07-18
TWI487762B (zh) 2015-06-11
WO2011129278A1 (ja) 2011-10-20
CN102782074B (zh) 2014-06-18
CN102782074A (zh) 2012-11-14

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