TWI487762B - 黏著劑用樹脂組成物、含有其之黏著劑、黏著性薄片及含有其作為黏著劑層之印刷配線板 - Google Patents

黏著劑用樹脂組成物、含有其之黏著劑、黏著性薄片及含有其作為黏著劑層之印刷配線板 Download PDF

Info

Publication number
TWI487762B
TWI487762B TW100112720A TW100112720A TWI487762B TW I487762 B TWI487762 B TW I487762B TW 100112720 A TW100112720 A TW 100112720A TW 100112720 A TW100112720 A TW 100112720A TW I487762 B TWI487762 B TW I487762B
Authority
TW
Taiwan
Prior art keywords
resin
thermoplastic resin
adhesive
parts
resin composition
Prior art date
Application number
TW100112720A
Other languages
English (en)
Chinese (zh)
Other versions
TW201207059A (en
Inventor
Shintaro Nanbara
Hiroko Asada
Takeshi Ito
Original Assignee
Toyo Boseki
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Boseki filed Critical Toyo Boseki
Publication of TW201207059A publication Critical patent/TW201207059A/zh
Application granted granted Critical
Publication of TWI487762B publication Critical patent/TWI487762B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
    • C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
    • C08G18/0823—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6633—Compounds of group C08G18/42
    • C08G18/6659—Compounds of group C08G18/42 with compounds of group C08G18/34
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
TW100112720A 2010-04-14 2011-04-13 黏著劑用樹脂組成物、含有其之黏著劑、黏著性薄片及含有其作為黏著劑層之印刷配線板 TWI487762B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010092938 2010-04-14

Publications (2)

Publication Number Publication Date
TW201207059A TW201207059A (en) 2012-02-16
TWI487762B true TWI487762B (zh) 2015-06-11

Family

ID=44798654

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100112720A TWI487762B (zh) 2010-04-14 2011-04-13 黏著劑用樹脂組成物、含有其之黏著劑、黏著性薄片及含有其作為黏著劑層之印刷配線板

Country Status (5)

Country Link
JP (1) JP4978753B2 (ko)
KR (1) KR101660083B1 (ko)
CN (1) CN102782074B (ko)
TW (1) TWI487762B (ko)
WO (1) WO2011129278A1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5304152B2 (ja) * 2008-09-30 2013-10-02 東洋紡株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着シート及びこれを接着層として含むプリント配線板
CN102822304B (zh) * 2010-04-14 2014-04-30 东洋纺织株式会社 胶粘剂用树脂组合物、含有该组合物的胶粘剂、胶粘性片及含有该片作为胶粘剂层的印制线路板
JP5850103B1 (ja) * 2014-07-25 2016-02-03 横浜ゴム株式会社 接着剤組成物
WO2016013621A1 (ja) * 2014-07-25 2016-01-28 横浜ゴム株式会社 接着剤組成物
JP5924383B2 (ja) * 2014-07-25 2016-05-25 横浜ゴム株式会社 接着剤組成物
JP5953391B1 (ja) * 2015-03-30 2016-07-20 株式会社フジクラ 熱硬化性接着剤組成物、カバーレイフィルム、接着剤フィルム、金属張積層板及びフレキシブルプリント配線板
JP6170211B1 (ja) * 2016-07-15 2017-07-26 株式会社フジクラ 熱硬化性接着剤組成物、カバーレイフィルム、接着剤フィルム、金属張積層板及びフレキシブルプリント配線板
KR102433526B1 (ko) * 2017-03-28 2022-08-17 도요보 가부시키가이샤 카르복실산 기 함유 폴리에스테르계 접착제 조성물
TWI779066B (zh) * 2017-07-19 2022-10-01 日商東洋紡股份有限公司 黏接劑組成物
JP7098350B2 (ja) * 2018-02-28 2022-07-11 キヤノン株式会社 接着シートを用いたインクジェット記録ヘッド及び製造方法
CN108587508B (zh) * 2018-03-29 2021-04-06 广东莱尔新材料科技股份有限公司 一种高粘金属力的热熔胶膜及其制备方法
CN116731500A (zh) * 2023-06-20 2023-09-12 国网湖北省电力有限公司孝感供电公司 一种电缆线路包覆材料及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010038733A1 (ja) * 2008-09-30 2010-04-08 東洋紡績株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着シートおよびこれを用いて接着したプリント配線板用積層体

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3376133B2 (ja) * 1994-10-21 2003-02-10 ダイセル化学工業株式会社 接着剤組成物
JP4423513B2 (ja) 1997-10-20 2010-03-03 東洋紡績株式会社 接着用樹脂組成物及び接着用フィルム
JP4865157B2 (ja) * 2001-07-19 2012-02-01 日東シンコー株式会社 耐湿熱性ホットメルト接着剤組成物
JP2005170999A (ja) * 2003-12-09 2005-06-30 Toyobo Co Ltd 接着剤及びそれを用いたポリエステルフィルムラミネート鋼板
JP4946080B2 (ja) 2006-02-06 2012-06-06 東洋紡績株式会社 接着剤組成物及びそれを用いたフレキシブル銅張積層板
JP5050429B2 (ja) * 2006-07-14 2012-10-17 東洋紡績株式会社 ポリエステル樹脂組成物及びそれを含む接着剤
JP5286084B2 (ja) * 2006-07-19 2013-09-11 積水化学工業株式会社 ダイシング・ダイボンディングテープ及び半導体チップの製造方法
JP2008205370A (ja) 2007-02-22 2008-09-04 Sumitomo Bakelite Co Ltd 樹脂組成物、支持基材付き接着剤および補強板付プリント回路板
JP2008260831A (ja) * 2007-04-11 2008-10-30 Mitsubishi Plastics Ind Ltd 水性接着剤および樹脂シート被覆金属板
JP5181601B2 (ja) * 2007-09-28 2013-04-10 東洋紡株式会社 溶剤可溶型結晶性ポリエステル樹脂を用いた接着剤組成物、積層体並びにフレキシブルフラットケーブル
WO2010035822A1 (ja) * 2008-09-29 2010-04-01 東洋紡績株式会社 ポリエステル樹脂組成物、これを含む接着剤、接着テープおよびフレキシブルフラットケーブル
JP5304152B2 (ja) * 2008-09-30 2013-10-02 東洋紡株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着シート及びこれを接着層として含むプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010038733A1 (ja) * 2008-09-30 2010-04-08 東洋紡績株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着シートおよびこれを用いて接着したプリント配線板用積層体

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Yu.A. Gorbatkina；Adhesion of modified polymers to fibres: Maxima on adhesive strength-modifier amount curves and the causes of their appearance；International Journal of Adhesion & Adhesives；29；Page 9-17；2007/11/01 *

Also Published As

Publication number Publication date
KR101660083B1 (ko) 2016-09-26
TW201207059A (en) 2012-02-16
KR20130057965A (ko) 2013-06-03
JPWO2011129278A1 (ja) 2013-07-18
WO2011129278A1 (ja) 2011-10-20
JP4978753B2 (ja) 2012-07-18
CN102782074B (zh) 2014-06-18
CN102782074A (zh) 2012-11-14

Similar Documents

Publication Publication Date Title
TWI487762B (zh) 黏著劑用樹脂組成物、含有其之黏著劑、黏著性薄片及含有其作為黏著劑層之印刷配線板
TWI614306B (zh) 聚胺酯樹脂組成物與利用此樹脂組成物之接著劑組成物、疊層體及印刷電路板
TWI504712B (zh) 黏著劑用樹脂組成物、含有其之黏著劑、黏著劑薄片及含有其作為黏著劑層之印刷配線板
TWI458797B (zh) 接著劑用樹脂組成物、含有其之接著劑、接著片及含其為接著層之印刷配線板
JP7156267B2 (ja) カルボン酸基含有ポリエステル系接着剤組成物
JP5304152B2 (ja) 接着剤用樹脂組成物、これを含有する接着剤、接着シート及びこれを接着層として含むプリント配線板
TWI731068B (zh) 導電性接著劑及遮蔽薄膜
JP6380710B1 (ja) カルボン酸基含有高分子化合物およびそれを含有する接着剤組成物
US20220306859A1 (en) Resin composition, bonding film, layered body including resin composition layer, layered body, and electromagnetic wave shielding film
WO2021106960A1 (ja) 樹脂組成物、樹脂組成物層付き積層体、積層体、フレキシブル銅張積層板、フレキシブルフラットケーブル、及び、電磁波シールドフィルム