JP4959333B2 - 化学的不活性化を通じたリアクタ表面のパシベーション - Google Patents
化学的不活性化を通じたリアクタ表面のパシベーション Download PDFInfo
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- JP4959333B2 JP4959333B2 JP2006532497A JP2006532497A JP4959333B2 JP 4959333 B2 JP4959333 B2 JP 4959333B2 JP 2006532497 A JP2006532497 A JP 2006532497A JP 2006532497 A JP2006532497 A JP 2006532497A JP 4959333 B2 JP4959333 B2 JP 4959333B2
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Classifications
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
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- B05D3/0433—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being a reactive gas
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- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0466—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being a non-reacting gas
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
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- Nanotechnology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Composite Materials (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
Description
本発明は、化学気相成長(CVD)および原子層堆積(ALD)のリアクタ中のリアクタ表面上の堆積を抑制することに一般的に関連する。より詳細には、本発明は、後のリアクタを通るガスの流れによるコーティングを制限するためにリアクタの表面を不活性化することに関する。
原子層堆積(ALD)は、例えばシリコンウエハなどの基板上に材料の薄膜を形成するために、半導体業界に周知の方法である。ALDは、サイクルで実施される自己飽和反応(self-saturation reaction)を通して膜が蓄積される、気相成長の1タイプである。膜の厚みは実施されるサイクルの回数で決定される。ALD法において、ガス状の前駆体は、交互に且つ反復的に、ウエハ上に材料の薄膜を形成するために基板即ちウエハに供給される。ある反応物は、ウエハ上に自己制御プロセスにおいて吸着する。後の反応物パルス(reactant pulse)は、所望される材料の単分子層を形成するために吸着した材料と反応する。分解は、例えばリガンド交換またはゲッタリング反応におけるような適切に選択された試薬との反応を通して、起こり得る。典型的なALD反応において、一分子以下の単層がサイクル毎に形成する。より厚みのある膜は、目的の厚みが達成されるまで反復される成長サイクルを通して作られる。
本発明のシステムおよび方法は、幾つかの特徴を有し、そのどの1つも単独でその望ましい特性の原因とならない。続く本願特許請求の範囲によって明示される本発明の範囲を制限することなく、そのより顕著な特性がここで簡略に検討される。この検討を考慮した後に、そして特に“好ましい実施形態の詳細な説明”と題されるセクションを読んだ後、人は本発明の特徴がどのように気相成長の方法およびシステムに幾つかの利点を付与するのか理解する。
本発明の特徴、側面および利点はここで好適な実施形態の図面を参照して説明されるが、該実施形態は例証を意図し本発明を限定するのではない。
同様に、処理反応物が、反応スペース表面上の反応性部位上の吸着によって機能する場合、表面が前処理されたか、されていないかにかかわらず、立体障害は全ての存在する反応性部位の完全な占有を妨げ得る。従って、反応スペース表面の処理反応物への曝露を反復的にパルスすることは有利であり得る。例えば、インサイチュ処理において、処理は、処理化学物質への長期の曝露、またはパージングステップによって分けられた複数の処理反応物パルスを含み得る。
式(2)において、R7〜R9は、各々個別に、C1〜C20アルキルおよびC6〜C10アリールからなる群から選択され;ここでp、qおよびrは各々0,1,2、又は3(但し、1≦p+q+r≦3);およびここで各々のXはハロゲン原子である。式(2)は、R7〜R9がアルキルであるアルキルハロシラン、R7〜R9がアリールであるアリールハロシラン、およびR7〜R9の少なくとも1つがアルキルでありR7〜R9の少なくとも1つがアリールであるアルキルアリールハロシランを含む。
Claims (26)
- 有機化合物からなる処理化学物質に反応スペース表面を接触させ、それによって該反応スペース表面に保護層を形成し、ここで該保護層が自己組織化した単層(SAM)であること;
接触の後に該反応スペース中に基板をロードすること;および
反応物ガスを、該保護層と比較して優先的に該基板と反応させ、それによって該基板上に層を選択的に堆積すること;
を含む、反応スペース表面を有する成長リアクタを作動する方法。 - 堆積することが、同一の条件下での未処理の反応スペース表面上の堆積と比較して、接触された反応スペース表面上の顕著に軽減された堆積と共に基板上に該層を選択的に堆積することを含む請求項1に記載の方法。
- 堆積することが、選択的な原子層堆積プロセスを実施することを含む請求項2に記載の方法。
- 該原子層堆積プロセスが複数のサイクルを含み、各々のサイクルが以下を含む、請求項3に記載の方法:
第一反応物を該反応スペースに導入し、該第一反応物の少なくとも一部を該基板上に吸着させること;
過剰な第一反応物を該反応スペースから除去すること;
第二反応物ガスを該反応スペース中に導入すること;
該第二反応物ガス及び該第一反応物ガスの吸着した部分から、該基板の表面上に材料の第一単層を形成すること;および
過剰な第二反応物を該反応スペースから除去すること。 - 各々のサイクルが、第三反応物を該反応スペースに導入すること、及び過剰な第三反応物を該反応スペースから除去することを更に含む、請求項4に記載の方法。
- 堆積することが、選択的な化学気相成長プロセスを実施することを含む、請求項2に記載の方法。
- 接触することが、該反応スペースを通ってインサイチュで気相の処理化学物質を流動することを含む、請求項1に記載の方法。
- 接触することが、リアクタパーツをエクスサイチュで該処理化学物質に曝露することを含む、請求項1に記載の方法。
- 接触することの後且つロードすること及び堆積の前にエクスサイチュで処理されたリアクタパーツを該反応スペースを形成するために組立てることを更に含む、請求項8に記載の方法。
- 該反応スペース表面および該処理化学物質の間の反応を最大限にするために接触することの前に、反応スペース表面を前処理することをさらに含む、請求項1に記載の方法。
- 前処理をすることが、該処理化学物質によって残された保護層の充填密度を向上させるために、該反応スペース表面上の反応性部位の密度を上昇させることを含む、請求項10に記載の方法。
- 前処理をすることが、該反応スペース表面を酸素保有反応物に曝露することを含む、請求項11に記載の方法。
- 該処理化学物質が、オクタデシルトリクロロシランを含む、請求項1に記載の方法。
- 複数の基板上で複数の堆積を実施することの後に、該反応スペース表面を再処理することを更に含む、請求項1に記載の方法。
- 以下を含む気相成長装置:
反応スペースを明確にする複数の反応スペース表面;
該反応スペース中に収容された基板支持構造;および
該反応スペースを気相成長プロセスのために適した気相反応物の供給源に接続している複数のフィードライン、
ここで、該反応スペース表面の少なくともいくらかは、改質された表面が該気相成長プロセスに対して不活性化するような表面の改質を含み、該改質された表面が自己組織化した単層(SAM)の保護層からなり、該保護層が吸着した有機反応物に由来する。 - 該保護層が、吸着した処理化学物質を含む、請求項16に記載の装置。
- 該保護層が、該気相成長プロセスに曝露される疎水性表面を提供する、請求項16に記載の装置。
- 該表面の改質が、該気相成長プロセスを該改質された反応スペース表面と比較して、半導体基板に選択的であるようにする、請求項16に記載の装置。
- 交互に行われ且つ反復される該気相反応物のパルス(pulses)による原子層堆積のために構成された、請求項16に記載の装置。
- 処理反応物の供給源から該反応スペースに導くインレットを更に含み、該処理反応物が、該改質された反応スペース表面に表面の改質を与える、請求項16に記載の装置。
- 該処理反応物が有機ケイ素前駆体である請求項21に記載の装置。
- 前処理反応物の供給源から該反応スペースへ導くインレットを更に含み、該前処理反応物が、少なくとも幾らかの表面を該処理反応物に対してより反応性があるようにする、請求項21に記載の装置。
- 該前処理反応物が、酸素含有反応物を含む、請求項23に記載の装置。
- 該表面の改質が、該反応スペース表面を覆う反応性部位を含み、該反応性部位が、−OH、窒素、水素及びハロゲン化物の表面基、並びに反応性部位を占める非反応性表面末端からなる群から選択される、請求項16に記載の装置。
- 反応表面の一部を形成する原子層堆積(ALD)リアクタの処理されたコンポーネントであって、該コンポーネントがその上に自己組織化した単層(SAM)の保護層を有する表面の一部を含み、該保護層が、吸着した有機反応物に由来し、且つALD堆積反応物との反応を抑制するように構成されるコンポーネント。
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USD980813S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
JP2023002200A (ja) | 2021-06-22 | 2023-01-10 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
USD990441S1 (en) | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
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- 2004-04-29 EP EP04750869A patent/EP1623454A2/en not_active Withdrawn
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EP1623454A2 (en) | 2006-02-08 |
WO2004102648A2 (en) | 2004-11-25 |
KR101090895B1 (ko) | 2011-12-08 |
KR20060004976A (ko) | 2006-01-16 |
US20070084404A1 (en) | 2007-04-19 |
US7799135B2 (en) | 2010-09-21 |
TWI394862B (zh) | 2013-05-01 |
TW200502427A (en) | 2005-01-16 |
JP2007501902A (ja) | 2007-02-01 |
WO2004102648A3 (en) | 2005-03-24 |
US7118779B2 (en) | 2006-10-10 |
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