JP4933296B2 - 導電性接着剤組成物、導電性接着シート及び導電性接着テープ - Google Patents
導電性接着剤組成物、導電性接着シート及び導電性接着テープ Download PDFInfo
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- JP4933296B2 JP4933296B2 JP2007035421A JP2007035421A JP4933296B2 JP 4933296 B2 JP4933296 B2 JP 4933296B2 JP 2007035421 A JP2007035421 A JP 2007035421A JP 2007035421 A JP2007035421 A JP 2007035421A JP 4933296 B2 JP4933296 B2 JP 4933296B2
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- 239000000853 adhesive Substances 0.000 title claims description 97
- 230000001070 adhesive effect Effects 0.000 title claims description 97
- 239000000203 mixture Substances 0.000 title claims description 50
- 239000002390 adhesive tape Substances 0.000 title claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 62
- 239000002184 metal Substances 0.000 claims description 62
- 239000000843 powder Substances 0.000 claims description 45
- 239000004840 adhesive resin Substances 0.000 claims description 27
- 229920006223 adhesive resin Polymers 0.000 claims description 27
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 25
- 239000012790 adhesive layer Substances 0.000 claims description 16
- 239000004593 Epoxy Substances 0.000 claims description 15
- 230000003449 preventive effect Effects 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 12
- BNAFKNQBXIKNDQ-UHFFFAOYSA-N cyclohexanecarboxylate;dicyclohexylazanium Chemical compound [O-]C(=O)C1CCCCC1.C1CCCCC1[NH2+]C1CCCCC1 BNAFKNQBXIKNDQ-UHFFFAOYSA-N 0.000 claims description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 10
- 229920001971 elastomer Polymers 0.000 claims description 9
- 239000005060 rubber Substances 0.000 claims description 9
- WUGCLPOLOCIDHW-UHFFFAOYSA-N 2-aminoethanol;benzoic acid Chemical compound [NH3+]CCO.[O-]C(=O)C1=CC=CC=C1 WUGCLPOLOCIDHW-UHFFFAOYSA-N 0.000 claims description 8
- CIFYUXXXOJJPOL-UHFFFAOYSA-N cyclohexylazanium;benzoate Chemical compound [NH3+]C1CCCCC1.[O-]C(=O)C1=CC=CC=C1 CIFYUXXXOJJPOL-UHFFFAOYSA-N 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 description 35
- 229920000647 polyepoxide Polymers 0.000 description 21
- 239000003822 epoxy resin Substances 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 17
- 239000007787 solid Substances 0.000 description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 16
- 238000000576 coating method Methods 0.000 description 16
- 239000011888 foil Substances 0.000 description 16
- 239000004744 fabric Substances 0.000 description 14
- 239000003063 flame retardant Substances 0.000 description 14
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 13
- -1 n-octyl Chemical group 0.000 description 13
- 241000285023 Formosa Species 0.000 description 12
- DSSYKIVIOFKYAU-UHFFFAOYSA-N camphor Chemical compound C1CC2(C)C(=O)CC1C2(C)C DSSYKIVIOFKYAU-UHFFFAOYSA-N 0.000 description 12
- 239000012948 isocyanate Substances 0.000 description 12
- 150000002513 isocyanates Chemical class 0.000 description 12
- 239000003431 cross linking reagent Substances 0.000 description 10
- 239000000178 monomer Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 229920006243 acrylic copolymer Polymers 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 7
- 229920000459 Nitrile rubber Polymers 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229920006332 epoxy adhesive Polymers 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 239000000123 paper Substances 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000003085 diluting agent Substances 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- LTURHSAEWJPFAA-UHFFFAOYSA-N sulfuric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OS(O)(=O)=O.NC1=NC(N)=NC(N)=N1 LTURHSAEWJPFAA-UHFFFAOYSA-N 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 3
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 229920006271 aliphatic hydrocarbon resin Polymers 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- VAYGVODTVNMVPV-UHFFFAOYSA-N carbamic acid;cyclohexanamine Chemical compound NC([O-])=O.[NH3+]C1CCCCC1 VAYGVODTVNMVPV-UHFFFAOYSA-N 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 239000002738 chelating agent Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- ZFAKTZXUUNBLEB-UHFFFAOYSA-N dicyclohexylazanium;nitrite Chemical compound [O-]N=O.C1CCCCC1[NH2+]C1CCCCC1 ZFAKTZXUUNBLEB-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical group CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- PDDANVVLWYOEPS-UHFFFAOYSA-N nitrous acid;n-propan-2-ylpropan-2-amine Chemical compound [O-]N=O.CC(C)[NH2+]C(C)C PDDANVVLWYOEPS-UHFFFAOYSA-N 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- VPRKRUFGGSNGDZ-UHFFFAOYSA-N (cyclohexylamino) cyclohexanecarboxylate Chemical compound C1CCCCC1C(=O)ONC1CCCCC1 VPRKRUFGGSNGDZ-UHFFFAOYSA-N 0.000 description 1
- YBBLOADPFWKNGS-UHFFFAOYSA-N 1,1-dimethylurea Chemical compound CN(C)C(N)=O YBBLOADPFWKNGS-UHFFFAOYSA-N 0.000 description 1
- FTVFPPFZRRKJIH-UHFFFAOYSA-N 2,2,6,6-tetramethylpiperidin-4-amine Chemical compound CC1(C)CC(N)CC(C)(C)N1 FTVFPPFZRRKJIH-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical group C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- JJRUAPNVLBABCN-UHFFFAOYSA-N 2-(ethenoxymethyl)oxirane Chemical compound C=COCC1CO1 JJRUAPNVLBABCN-UHFFFAOYSA-N 0.000 description 1
- WZFUQSJFWNHZHM-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical group C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 WZFUQSJFWNHZHM-UHFFFAOYSA-N 0.000 description 1
- LODWDQOANQTUGD-UHFFFAOYSA-N 2-carboxyphenolate;dicyclohexylazanium Chemical compound OC(=O)C1=CC=CC=C1[O-].C1CCCCC1[NH2+]C1CCCCC1 LODWDQOANQTUGD-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 1
- CXXSQMDHHYTRKY-UHFFFAOYSA-N 4-amino-2,3,5-tris(oxiran-2-ylmethyl)phenol Chemical compound C1=C(O)C(CC2OC2)=C(CC2OC2)C(N)=C1CC1CO1 CXXSQMDHHYTRKY-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- SJIXRGNQPBQWMK-UHFFFAOYSA-N DEAEMA Natural products CCN(CC)CCOC(=O)C(C)=C SJIXRGNQPBQWMK-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- LLEAXQFNJCFIBG-UHFFFAOYSA-N azanium;1-nitronaphthalene;nitrite Chemical compound [NH4+].[O-]N=O.C1=CC=C2C([N+](=O)[O-])=CC=CC2=C1 LLEAXQFNJCFIBG-UHFFFAOYSA-N 0.000 description 1
- BAPVPOOWCZUVGA-UHFFFAOYSA-N benzoic acid;n-propan-2-ylpropan-2-amine Chemical compound CC(C)[NH2+]C(C)C.[O-]C(=O)C1=CC=CC=C1 BAPVPOOWCZUVGA-UHFFFAOYSA-N 0.000 description 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- FNPGYAQZEUKTCV-UHFFFAOYSA-N cyclohexanamine;prop-2-enoic acid Chemical compound OC(=O)C=C.NC1CCCCC1 FNPGYAQZEUKTCV-UHFFFAOYSA-N 0.000 description 1
- CYYRAVBQFCQGFE-UHFFFAOYSA-N dicyclohexylazanium;prop-2-enoate Chemical compound [O-]C(=O)C=C.C1CCCCC1[NH2+]C1CCCCC1 CYYRAVBQFCQGFE-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- CJMZLCRLBNZJQR-UHFFFAOYSA-N ethyl 2-amino-4-(4-fluorophenyl)thiophene-3-carboxylate Chemical compound CCOC(=O)C1=C(N)SC=C1C1=CC=C(F)C=C1 CJMZLCRLBNZJQR-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
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- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
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Description
接着剤樹脂中に金属粉末を分散させてなる導電性接着剤組成物において、前記接着剤樹脂にジシクロヘキシルアンモニウムシクロヘキサンカルボキシレート、モノエタノールアミンベンゾエート、シクロヘキシルアミンベンゾエートから選ばれる気化性防錆剤を少なくとも1種を混合してなることを特徴とする導電性接着剤組成物。
前記接着剤樹脂は、重量平均分子量10,000以上のアクリル系、ゴム系、アクリル/エポキシ系又はエポキシ/ゴム系の接着剤樹脂であることを特徴とする請求項1記載の導電性接着剤組成物。
導電性を有する基材の片面又は両面に、請求項1又は2記載の導電性接着剤組成物からなる接着剤層を有することを特徴とする導電性接着シート。
導電性を有する基材の片面又は両面に、請求項1又は2記載の導電性接着剤組成物からなる接着剤層を有することを特徴とする導電性接着テープ。
アクリル酸−2−エチルヘキシルを主成分とするアクリル系共重合体(サイデン化学社製サイビノールAT−D48)固形分100重量部に、架橋剤としてイソシアネート系硬化剤(サイデン化学社製M2)を1重量部、銅粉(福田金属箔粉工業社製FCC−115)を10重量部、ニッケル粉(インコ社製287)を10重量部、ジシクロヘキシルアンモニウムシクロヘキサンカルボキシレート(DICHA−CHC)を0.05重量部配合し、均一になるまで、十分に撹拌・混合し、導電性接着剤組成物を調整した。
スチレンイソプレンブロック系共重合体(日本ゼオン社製クインタック3520)60重量部、脂肪族炭化水素樹脂(日本ゼオン社製クイントンM100)39.5重量部、酸化防止剤(チバ・スペシャルティ・ケミカルズ社製イルガノックスB225)0.5重量部、トルエン100重量部からなるゴム系粘着剤に、銅粉(福田金属箔粉工業社製FCC−115)を10重量部、銀粉(福巳金属箔粉工業社製AgC−239)を10重量部、ジシクロヘキシルアンモニウムシクロヘキサンカルボキシレート(DICHA−CHC)を0.05重量部配合し、均一になるまで、十分に攪拌・混合し、導電性接着剤組成物を調整した。
アクリル酸−2−エチルヘキシルを主成分とするアクリル系共重合体(サイデン化学社製サイビノールAT−D48)固形分100重量部に架橋剤としてイソシアネート系硬化剤(サイデン化学社製M2)を1重量部、導電性粒子として銅粉(福田金属箔粉工業社製FCC−115)を50重量部、ニッケル粉(インコ社製287)を50重量部、気化性防錆剤としてジシクロヘキシルアンモニウムシクロヘキサンカルボキシレート(DICHA−CHC)を0.1重量部配合し、均一になるまで、十分に攪拌・混合し、導電性接着剤組成物を調整した。
アクリル酸−2−エチルヘキシルを主成分とするアクリル系共重合体(サイデン化学社製サイビノールAT−D48)固形分100重量部に、架橋剤としてイソシアネート系硬化剤(サイデン化学社製M2)を1重量部、銅粉(福田金属箔粉工業社製FCC−115)を10重量部、ニッケル粉(インコ社製287)を10重量部、ジシクロヘキシルアンモニウムシクロヘキサンカルボキシレート(DICHA−CHC)を0.1重量部、難燃剤として硫酸メラミン(三和ケミカル社製アピノン901)50重量部、赤リン系難燃剤(燐化学工業社製ノーバクエルFST100)50重量部を配合し、均一になるまで、十分に攪拌・混合し、導電性接着剤組成物を調整した。
アクリル酸−ブチル(BA)80重量%、メタクリル酸−グリシジル(GMA)10重量%、メタクリル酸−2−ヒドロキシエチル(HO)10重量%、酢酸エチル100重量%からなるアクリル系共重合体の固形分48重量部、エポキシ樹脂(ジャパンエポキシレジン社製j ER5050)48重量部、エポキシ硬化剤としてジシアンジアミド(Dicy)4重量部からなるアクリル・エポキシ系接着剤の固形分100重量部に、銅粉(福田金属箔粉工業社製FCC−115)を50重量部、銀粉(福田金属箔粉工業社製AgC−239)を50重量部、ジシクロヘキシルアンモニウムシクロヘキサンカルボキシレート(DICHA−CHC)を0.1重量部、難燃剤として硫酸メラミン(三和ケミカル社製アピノン901)25重量部、赤リン系難燃剤(燐化学工業社製ノーバクエルFST100)25重量部配合し、均一になるまで、十分に攪拌・混合し、導電性接着剤組成物を調整した。
アクリロニトリルブタジエンゴム(日本ゼオン社製ニポール1072J)48重量部、エポキシ樹脂(ジャパンエポキシレジン社製j ER828)48重量部、エポキシ硬化剤としてジシアンジアミド(Dicy)4重量部、希釈溶剤メチルエチルケトン100重量部からなるエポキシ系接着剤の固形分100重量部に、銀粉(福田金属箔粉工業社製AgC−239)を200重量部、ジシクロヘキシルアンモニウムシクロヘキサンカルボキシレート(DICHA−CHC)を0.1重量部配合し、均一になるまで、十分に攪拌・混合し、導電性接着剤組成物を調整した。
アクリル酸−2−エチルヘキシルを主成分とするアクリル系共重合体(サイデン化学社製サイビノールAT−D48)固形分100重量部に、架橋剤としてイソシアネート系硬化剤(サイデン化学社製M2)を1重量部、銀粉(福田金属箔粉工業社製AgC−239)を50重量部、ニッケル粉(インコ社製287)を50重量部、モノエタノールアミンベンゾエート(MEA−BA)0.1重量部を配合し、均一になるまで、十分に撹拌・混合し、導電性接着剤組成物を調整した。
アクリル酸−2−エチルヘキシルを主成分とするアクリル系共重合体(サイデン化学社製サイビノールAT−D48)固形分100重量部に、架橋剤としてイソシアネート系硬化剤(サイデン化学社製M2)を1重量部、銅粉(福田金属箔粉工業社製FCC−115)を50重量部、ニッケル粉(インコ社製287)を50重量部、シクロヘキシルアミンベンゾエート(CHA−BA)を0.1重量部を配合し、均一になるまで、十分に撹拌・混合し、導電性接着剤組成物を調整した。
アクリル酸−2−エチルヘキシルを主成分とするアクリル系共重合体(サイデン化学社製サイビノールAT−D48)固形分100重量部に、架橋剤としてイソシアネート系硬化剤(サイデン化学社製AL)を0.5重量部、銅粉(福田金属箔粉工業社製FCC−115)を10重量部、ニッケル粉(インコ社製287)を10重量部、ジシクロヘキシルアンモニウムシクロヘキサンカルボキシレート(DICHA−CHC)を0.1重量部、難燃剤として硫酸メラミン(三和ケミカル社製アピノン901)50重量部、赤リン系難燃剤(燐化学工業社製ノーバクエルFST100)50重量部を配合し、均一になるまで、十分に撹拌・混合し、導電性接着剤組成物を調整した。
アクリル酸−2−エチルヘキシルを主成分とするアクリル系共重合体(サイデン化学社製サイビノールAT−D48)固形分100重量部に、架橋剤としてイソシアネート系硬化剤(サイデン化学社製M2)を1重量部、銅粉(福田金属箔粉工業社製FCC−115)を50重量部、ニッケル粉(インコ社製287)を50重量部配合し、均一になるまで、十分に撹拌・混合し、導電性接着剤組成物を調整した。
スチレンイソプレンブロック系共重合体(日本ゼオン社製クインタック3520)60重量部、脂肪族炭化水素樹脂(日本ゼオン社製クイントンM100)39.5重量部、酸化防止剤(チバ・スペシャルティ・ケミカルズ社製イルガノックスB225)0.5重量部、トルエン100重量部からなるゴム系粘着剤に、銅粉(福田金属箔粉工業社製FCC−115)を10重量部、銀粉(福田金属箔粉工業社製AgC−239)を10重量部配合し、均一になるまで、十分に撹拌・混合し、導電性接着剤組成物を調整した。
アクリロニトリルブタジエンゴム(日本ゼオン社製ニポール1072J)48重量部、エポキシ樹脂(ジャパンエポキシレジン社製j ER828)48重量部、エポキシ硬化剤としてジシアンジアミド(Dicy)4重量部、希釈溶剤メチルエチルケトン100重量部からなるエポキシ系接着剤の固形分100重量部に、銀粉(福田金属箔粉工業社製AgC−239)を200重量部配合し、均一になるまで、十分に撹拌・混合し、導電性接着剤組成物を調整した。
アクリル酸−2−エチルヘキシルを主成分とするアクリル系共重合体(サイデン化学社製サイビノールAT−D48)固形分100重量部に、架橋剤としてイソシアネート系硬化剤(サイデン化学社製M2)を1重量部、導電性粒子として銅粉(福田金属箔粉工業社製FCC−115)を10重量部、ニッケル粉(インコ社製287)を10重量部、ジノニルナフタレンスルホン酸を主成分とする防錆剤(キング・インアストリー社製NA−SUL)を0.05重量部配合し、均一になるまで十分に攪拌・混合し、導電性接着剤組成物を調整した。
以上、実施例1〜9及び比較例1〜4で得られた各々の導電性接着シートの接着力、抵抗値、保存性、塩水噴霧性について、以下の測定及び評価方法に基づいて測定・評価した。その結果を表1に示す。
2:導電性接着剤層
3:離型シート
Claims (4)
- 接着剤樹脂中に金属粉末を分散させてなる導電性接着剤組成物において、前記接着剤樹脂にジシクロヘキシルアンモニウムシクロヘキサンカルボキシレート、モノエタノールアミンベンゾエート、シクロヘキシルアミンベンゾエートから選ばれる気化性防錆剤を少なくとも1種を混合してなることを特徴とする導電性接着剤組成物。
- 前記接着剤樹脂は、重量平均分子量10,000以上のアクリル系、ゴム系、アクリル/エポキシ系又はエポキシ/ゴム系の接着剤樹脂であることを特徴とする請求項1記載の導電性接着剤組成物。
- 導電性を有する基材の片面又は両面に、請求項1又は2記載の導電性接着剤組成物からなる接着剤層を有することを特徴とする導電性接着シート。
- 導電性を有する基材の片面又は両面に、請求項1又は2記載の導電性接着剤組成物からなる接着剤層を有することを特徴とする導電性接着テープ。
Priority Applications (6)
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JP2007035421A JP4933296B2 (ja) | 2007-02-15 | 2007-02-15 | 導電性接着剤組成物、導電性接着シート及び導電性接着テープ |
US12/525,478 US20100028672A1 (en) | 2007-02-15 | 2008-02-15 | Conductive Adhesive Composition, Conductive Adhesive Sheet and Conductive Adhesive Tape |
EP08711374.2A EP2116583A4 (en) | 2007-02-15 | 2008-02-15 | CONDUCTIVE ADHESIVE COMPOSITION, CONDUCTIVE ADHESIVE SHEET, AND CONDUCTIVE ADHESIVE RIBBON |
CN2008800041004A CN101605860B (zh) | 2007-02-15 | 2008-02-15 | 导电性胶粘剂组合物、导电性胶粘片及导电性胶粘带 |
PCT/JP2008/052544 WO2008099925A1 (ja) | 2007-02-15 | 2008-02-15 | 導電性接着剤組成物、導電性接着シート及び導電性接着テープ |
TW097124257A TWI427135B (zh) | 2007-02-15 | 2008-06-27 | A conductive adhesive composition, a conductive adhesive sheet, and a conductive adhesive tape |
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JP5798980B2 (ja) * | 2012-05-30 | 2015-10-21 | 信越ポリマー株式会社 | 導電性粘着シート、その製造方法およびプリント配線板 |
CN103928077B (zh) | 2013-01-10 | 2017-06-06 | 杜邦公司 | 含有共混弹性体的导电粘合剂 |
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JP6594606B2 (ja) * | 2013-01-31 | 2019-10-23 | 日東電工株式会社 | 粘着剤組成物および粘着シート |
US20140226085A1 (en) * | 2013-02-14 | 2014-08-14 | Nitto Denko Corporation | Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, pressure-sensitive adhesive sheet, optical component and touch panel |
JP2015010111A (ja) * | 2013-06-26 | 2015-01-19 | 日東電工株式会社 | 導電性粘着テープ |
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WO2015119221A1 (ja) * | 2014-02-05 | 2015-08-13 | 積水テクノ商事西日本株式会社 | 導電性粘着テープ |
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-
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-
2008
- 2008-02-15 US US12/525,478 patent/US20100028672A1/en not_active Abandoned
- 2008-02-15 CN CN2008800041004A patent/CN101605860B/zh active Active
- 2008-02-15 WO PCT/JP2008/052544 patent/WO2008099925A1/ja active Application Filing
- 2008-02-15 EP EP08711374.2A patent/EP2116583A4/en not_active Withdrawn
- 2008-06-27 TW TW097124257A patent/TWI427135B/zh active
Also Published As
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EP2116583A1 (en) | 2009-11-11 |
TW201000589A (en) | 2010-01-01 |
US20100028672A1 (en) | 2010-02-04 |
EP2116583A4 (en) | 2015-01-28 |
TWI427135B (zh) | 2014-02-21 |
JP2008195904A (ja) | 2008-08-28 |
WO2008099925A1 (ja) | 2008-08-21 |
CN101605860B (zh) | 2011-11-02 |
CN101605860A (zh) | 2009-12-16 |
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