JP4912716B2 - 配線基板の製造方法、及び半導体装置の製造方法 - Google Patents
配線基板の製造方法、及び半導体装置の製造方法 Download PDFInfo
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Description
(第1の実施の形態)
図2は、本発明の第1の実施の形態に係る半導体装置の断面図である。
図23は、本発明の第2の実施の形態に係る半導体装置の断面図である。
図37は、本発明の第3の実施の形態に係る半導体装置の断面図である。図37において、第2の実施の形態の半導体装置100と同一構成部分には同一符号を付す。
11,11−1,11−2,101,101−1,101−2 配線基板
12,102 電子部品
13,91,103 多層配線構造体
14,24,36,104,124,136 絶縁層
14A,14B,24A〜24D,36A〜36D,104A,124A〜124C,136A〜136D 開口部
14C,14D,24E,36E,57A,104B,104C,124D,136E,160A,165A 面
16,17,117 第1のビア
19〜22,118〜120 第1の配線
26〜29,126〜128 第2のビア
31〜34,131〜134 第2の配線
38〜41,138〜141 第3のビア
43〜46,143〜146 第3の配線
43A〜46A,143A〜146A 接続部
48,148 保護膜
51,151 第1の外部接続端子
52〜54,152〜154 第2の外部接続端子
57,165,181 金属板
58 溝
60 スロットアンテナ
61,161 グラウンド用パッド
62,162 電源用パッド
63,163 信号用パッド
81,171 第1の金属板
82,172 第2の金属板
81A,82A,157A,172A 第1の面
81B,82B,171B,172B 第2の面
84,175 接着剤
85,174 補強板
121 グラウンド層
160 パッチアンテナ
182 円形パッチアンテナ
183 円形部
184 溝部
A,B,E,F 多層配線構造体形成領域
C,G 切断位置
M1〜M8 厚さ
W1〜W4 幅
L1 長さ
R 直径
Claims (13)
- 積層された絶縁層及び配線パターンを有する多層配線構造体と、該多層配線構造体の一方の面に設けられたアンテナとを備え、
前記多層配線構造体の前記一方の面とは反対側の他方の面に電子部品が実装される配線基板の製造方法であって、
前記多層配線構造体を形成するときの支持板となる金属板上に前記多層配線構造体を形成する多層配線構造体形成工程と、
前記多層配線構造体形成工程の後に、前記金属板をパターニングして前記アンテナを形成するアンテナ形成工程とを含むことを特徴とする配線基板の製造方法。 - 積層された絶縁層及び配線パターンを有する多層配線構造体と、該多層配線構造体の一方の面に設けられたアンテナとを備え、
前記多層配線構造体の前記一方の面とは反対側の他方の面に電子部品が実装される配線基板の製造方法であって、
前記多層配線構造体を形成するときの支持板となる第1及び第2の金属板を準備する金属板準備工程と、
前記多層配線構造体が形成される第1の金属板の面とは反対側の面と、前記多層配線構造体が形成される第2の金属板の面とは反対側の面とが対向するように、第1の金属板と第2の金属板とを貼り合わせる金属板貼り合わせ工程と、
前記第1及び第2の金属板に前記多層配線構造体を同時に形成する多層配線構造体形成工程と、
前記多層配線構造体形成工程後に、前記第1及び第2の金属板を切断して、前記多層配線構造体が形成された第1の金属板と前記多層配線構造体が形成された第2の金属板とを分離させる金属板切断工程と、
前記金属板切断工程の後に、前記第1及び第2の金属板をパターニングして、前記第1及び第2の金属板から前記アンテナを形成するアンテナ形成工程とを含むことを特徴とする配線基板の製造方法。 - 前記多層配線構造体形成工程は、前記アンテナに信号用の電流を供給する給電ラインを前記多層配線構造体の厚さ方向に形成する給電ライン形成工程を有することを特徴とする請求項1又は2記載の配線基板の製造方法。
- 前記給電ライン形成工程は、前記絶縁層上に前記配線パターンを形成する工程と、前記絶縁層を介して隣接する前記配線パターン同士を前記絶縁層を貫通するビアにより電気的に接続する工程と、を有することを特徴とする請求項3記載の配線基板の製造方法。
- 前記アンテナ形成工程は、前記金属板に隣接する前記絶縁層を貫通する前記ビアの端面を露出する溝を形成するよう、前記金属板をパターニングする工程を有することを特徴とする請求項4記載の配線基板の製造方法。
- 前記アンテナ形成工程は、前記金属板に隣接する前記絶縁層を貫通する前記ビアの端面と接する部分を残すように前記金属板をパターニングする工程を有することを特徴とする請求項4記載の配線基板の製造方法。
- 積層された絶縁層及び配線パターンを有する多層配線構造体と、該多層配線構造体の一方の面に設けられたアンテナと、前記多層配線構造体の前記一方の面とは反対側の他方の面に設けられ、前記多層配線構造体と電気的に接続される電子部品と、を備えた半導体装置の製造方法であって、
前記多層配線構造体を形成するときの支持板となる金属板上に前記多層配線構造体を形成する多層配線構造体形成工程と、
前記多層配線構造体形成工程の後に、前記金属板をパターニングして前記アンテナを形成するアンテナ形成工程とを含むことを特徴とする半導体装置の製造方法。 - 積層された絶縁層及び配線パターンを有する多層配線構造体と、該多層配線構造体の一方の面に設けられたアンテナと、前記多層配線構造体の前記一方の面とは反対側の他方の面に設けられ、前記多層配線構造体と電気的に接続される電子部品と、を備えた半導体装置の製造方法であって、
前記多層配線構造体を形成するときの支持板となる第1及び第2の金属板を準備する金属板準備工程と、
前記多層配線構造体が形成される第1の金属板の面とは反対側の面と、前記多層配線構造体が形成される第2の金属板の面とは反対側の面とが対向するように、第1の金属板と第2の金属板とを貼り合わせる金属板貼り合わせ工程と、
前記第1及び第2の金属板に前記多層配線構造体を同時に形成する多層配線構造体形成工程と、
前記多層配線構造体形成工程後に、前記第1及び第2の金属板を切断して、前記多層配線構造体が形成された第1の金属板と前記多層配線構造体が形成された第2の金属板とを分離させる金属板切断工程と、
前記金属板切断工程の後に、前記第1及び第2の金属板をパターニングして、前記第1及び第2の金属板から前記アンテナを形成するアンテナ形成工程とを含むことを特徴とする半導体装置の製造方法。 - 前記多層配線構造体に前記電子部品を搭載する電子部品搭載工程を更に有することを特徴とする請求項7又は8記載の半導体装置の製造方法。
- 前記多層配線構造体形成工程は、前記アンテナに信号用の電流を供給する給電ラインを前記多層配線構造体の厚さ方向に形成する給電ライン形成工程を有することを特徴とする請求項7乃至9の何れか一項記載の半導体装置の製造方法。
- 前記給電ライン形成工程は、前記絶縁層上に前記配線パターンを形成する工程と、前記絶縁層を介して隣接する前記配線パターン同士を前記絶縁層を貫通するビアにより電気的に接続する工程と、を有することを特徴とする請求項10記載の半導体装置の製造方法。
- 前記アンテナ形成工程は、前記金属板に隣接する前記絶縁層を貫通する前記ビアの端面を露出する溝を形成するよう、前記金属板をパターニングする工程を有することを特徴とする請求項11記載の半導体装置の製造方法。
- 前記アンテナ形成工程は、前記金属板に隣接する前記絶縁層を貫通する前記ビアの端面と接する部分を残すように前記金属板をパターニングする工程を有することを特徴とする請求項11記載の半導体装置の製造方法。
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KR1020070029569A KR20070098568A (ko) | 2006-03-29 | 2007-03-27 | 배선 기판의 제조 방법 및 반도체 장치의 제조 방법 |
US11/727,547 US7841076B2 (en) | 2006-03-29 | 2007-03-27 | Manufacturing method of wiring substrate and manufacturing method of semiconductor device |
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